Processing system for continuous automatic substrate forming
By designing a processing system for continuous automated substrate molding, the problems of inaccurate manual operation and low production efficiency in the substrate molding process in the prior art are solved, and efficient and accurate substrate molding and continuous production are achieved.
Patent Information
- Application Number
- CN202421622243.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-09
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-07-09
AI Technical Summary
The prior art has problems such as inaccurate manual operation, low production efficiency, and inability to achieve continuous production and automated connection during substrate forming.
A continuous automated substrate forming processing system is designed, including conveying lines, detection devices, automated robots, cleaning devices, cutting devices and drying devices, realizing automatic stacking, cutting, cleaning and drying, and precise positioning is carried out through vacuum adsorption devices and automated robots.
It improves the efficiency of substrate forming, realizes the accuracy of plate positioning and production continuity, and reduces the defect rate and production costs.
Smart Images
Figure CN222967161U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a processing system for continuous automatic substrate forming. Background Art
[0002] At present, for the substrate forming using BGA packaging in the industry, a ROUTER cutting machine is generally used. Before the production of this type of machine, the upper cover plate, lower cover plate and substrate need to be manually placed, and the substrate is positioned by using pin holes. After the substrate is formed, it needs to be manually removed, and a certain amount of processing operations are carried out in batches. The processing method using this type of equipment has the following disadvantages: 1. Under manual operation, it is difficult to accurately place the board, and it is easy to collide between the substrate and the upper and lower cover plates, resulting in scratched appearance and increased defect rate; 2. The production efficiency of batch quantitative production is low, and continuous production cannot be achieved, which means that it cannot be connected to the subsequent process for automation, and the production matching is limited; 3. After the substrate is formed, it needs to be transferred to a cleaning device for cleaning, further reducing the efficiency. Content of the Utility Model
[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides a processing system for continuous automatic substrate forming, which can effectively improve the efficiency of substrate forming.
[0004] A processing system for continuous automatic substrate forming according to the first aspect embodiment of the utility model includes:
[0005] A conveyor line, which is sequentially provided with a first detection device, an automatic manipulator, a cleaning device, a cutting device and a drying device along the conveying direction. The conveyor line is also provided with a vacuum adsorption device, and the vacuum adsorption device can move along the conveying direction. The first detection device is used to detect the position of the substrate at the feeding end of the conveyor line and can transmit the detection result to the vacuum adsorption device and the automatic manipulator to position the substrate and the upper and lower cover plates. The cutting device is used to cut the substrate, the cleaning device is used to clean the impurities on the surface of the substrate, and the drying device is used to remove the water stains on the surface of the substrate.
[0006] A processing system for continuous automatic substrate forming according to the embodiment of the utility model has at least the following beneficial effects: The processing system for continuous automatic substrate forming can realize automatic stacking of plates, cutting of plates, cleaning of plates and drying of plates, with high production efficiency and accurate plate positioning.
[0007] According to some embodiments of the present utility model, the cleaning device is configured as an ultrasonic cleaning device, a plurality of water washing devices, and a surface impurity removing device. The ultrasonic cleaning device is located at the front end of the water washing devices along the conveying direction, the surface impurity removing device is located at the rear end of the water washing devices along the conveying direction, and the plurality of water washing devices are arranged along the conveying direction.
[0008] According to some embodiments of the present utility model, the surface impurity removing device is provided with a water knife type cleaning structure and an air knife type cleaning structure. The water knife type cleaning structure is used for flushing stubborn dirt on the surface of the board, and the air knife type cleaning structure is used for drying the water droplets on the surface of the board.
[0009] According to some embodiments of the present utility model, a second detection device is further provided between the ultrasonic cleaning device and the water washing devices. The second detection device is used for detecting impurities on the surface of the substrate.
[0010] According to some embodiments of the present utility model, a positioning device is further provided at the feeding end of the conveying line. The positioning device is movably arranged on the conveying line, and the positioning device is used for adjusting the angle of the substrate.
[0011] According to some embodiments of the present utility model, the positioning device is provided with a rotatable movable plate. The movable plate is located on both sides of the conveying line along the conveying direction. The first detection device can also transmit the detection result to the positioning device to adjust the angle of the substrate.
[0012] According to some embodiments of the present utility model, a buffer portion is provided on the surface of the movable plate.
[0013] According to some embodiments of the present utility model, the buffer portion is made of rubber material.
[0014] According to some embodiments of the present utility model, a third detection device is further provided between the cleaning device and the drying device. The third detection device is used for detecting the substrate after flushing.
[0015] The additional aspects and advantages of the present utility model will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present utility model. Description of the Drawings
[0016] The following further describes the present utility model in conjunction with the drawings and embodiments, where:
[0017] Figure 1 is a schematic diagram of a continuous automatic substrate forming processing system according to an embodiment of the present utility model;
[0018] Figure 2 is a schematic diagram of substrate cutting according to an embodiment of the present utility model;
[0019] Figure 3 Schematic diagram of a positioning device according to an embodiment of the present utility model.
[0020] Reference numerals:
[0021] Conveyor line 100, first detection device 110, second detection device 120, third detection device 130, automated manipulator 140, cleaning device 150, ultrasonic cleaning device 151, water washing device 152, surface impurity removal device 153, cutting device 160, drying device 170, positioning device 180, movable plate 181, buffer portion 182, vacuum adsorption device 190, substrate 200. Specific embodiments
[0022] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.
[0023] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model.
[0024] In the description of the present utility model, the meaning of "several" is one or more, the meaning of "multiple" is two or more, "greater than", "less than", "exceeding", etc. are understood as not including the present number, and "above", "below", "within", etc. are understood as including the present number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0025] In the description of the present utility model, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.
[0026] At present, the substrates formed by BGA packaging in the industry generally use a ROUTER cutting machine. Before the production of this type of machine, the upper cover plate, lower cover plate and substrate need to be manually placed, and the substrate is positioned by pin holes. After the substrate is formed, it needs to be manually removed and a certain amount of processing operations are carried out in batches. The processing method using this type of equipment has the following disadvantages: 1. Under manual operation, it is difficult to accurately place the board, and it is easy to bump between the substrate and the upper and lower cover plates, resulting in scratched appearance and increased defect rate; 2. The production efficiency of batch quantitative production is low, and continuous production cannot be achieved, which means that it cannot be connected to the subsequent process for automation, and the production matching is limited; 3. After the substrate is formed, it needs to be transferred to a cleaning device for cleaning, which further reduces the efficiency.
[0027] In view of the technical problems existing in the prior art, the present utility model proposes a processing system for continuous automatic substrate forming, which can realize automatic stacking of plates, cutting of plates, cleaning of plates and drying of plates, with high production efficiency and accurate positioning of plates.
[0028] Referring to Figure 1 , the processing system for continuous automatic substrate forming provided by the first aspect embodiment of the present utility model includes a conveying line 100, a first detection device 110, an automatic manipulator 140, a cleaning device 150, a cutting device 160 and a drying device 170. Among them, the first detection device 110, the automatic manipulator 140, the cleaning device 150, the cutting device 160 and the drying device 170 are arranged in sequence along the conveying direction of the conveying line 100. The cleaning device 150 is used to clean the impurities on the surface of the substrate 200. The cutting device 160 is used to cut the substrate 200. The drying device 170 is used to remove the water stains on the surface of the substrate 200.
[0029] It can be understood that, in order to improve the fixing effect during the conveying of the plates, the conveying line 100 is also provided with a vacuum adsorption device 190. The vacuum adsorption device 190 can move along the conveying direction, that is, the vacuum adsorption device 190 moves along with the conveying line 100. The conveying line is generally a roller conveying line. The vacuum adsorption device 190 is installed in the middle of the conveying line by means of a linear slide rail. The first detection device 110 is used to detect the position of the substrate 200 at the feeding end of the conveying line 100 and can transmit the detection result to the vacuum adsorption device 190 and the automatic manipulator 140 to position the substrate 200 and the upper and lower cover plates.
[0030] It can be understood that the cleaning device 150 is provided with an ultrasonic cleaning device 151, a plurality of water washing devices 152 and a surface impurity removing device 153. The ultrasonic cleaning device 151 is located at the front end of the water washing devices 152 along the conveying direction. The surface impurity removing device 153 is located above the plurality of water washing devices. The plurality of water washing devices 152 are arranged in sequence along the conveying direction.
[0031] It should be noted that the ultrasonic cleaning device 151 uses a predetermined cleaning solution to clean the substrate 200. Specifically, this device can separate and dissolve pollutants by generating microbubbles and eddy currents, and the cleaning temperature is usually between 40°C and 65°C. After the ultrasonic cleaning device 151 finishes cleaning, the substrate 200 is conveyed by the conveyor line 100 to the water washing device 152 for cleaning. After being cleaned by multiple water washing devices 152, there is basically no residue of the cleaning solution on the surface of the substrate 200. After cleaning, the substrate 200 is continuously conveyed to the surface impurity removal device 153. The surface impurity removal device 153 is provided with a water knife cleaning structure and an air knife cleaning structure. The water knife cleaning structure is used to wash the stubborn dirt on the surface of the plate, and the air knife cleaning structure is used to blow dry the water droplets on the surface of the plate.
[0032] It can be understood that a second detection device 120 is also provided between the ultrasonic cleaning device 151 and the water washing device 152. The second detection device 120 is used to detect whether there is a substrate 200 on the conveyor line 100 between the ultrasonic cleaning device 151 and the water washing device 152, and can monitor the conveying situation of the substrate 200.
[0033] Refer to Figure 2 , the substrate 200 is first cut into multiple pieces, and then four chamfers are cut. This cutting process is fixed by the vacuum adsorption device 190, with accurate positioning, precise cutting and high efficiency.
[0034] Refer to Figure 3 , a positioning device 180 is also provided at the feeding end of the conveyor line 100. The positioning device 180 is movably arranged on the conveyor line 100. The positioning device 180 is used to adjust the angle of the substrate 200 so that the vacuum adsorption device 190 can fix the substrate 200. The positioning device 180 can rotate by itself to adjust the angle of the substrate 200, and the first detection device 110 can also transmit the detection result to the positioning device 180 to adjust the angle of the substrate 200.
[0035] It should be noted that the first detection device 110 is configured as a detection camera. After the detection camera takes a picture of the position of the substrate 200, it transmits the data to the positioning device 180. The positioning device 180 adjusts the angle of the substrate 200, and then the vacuum adsorption device 190 adsorbs and fixes the substrate 200. The automatic manipulator 140 simultaneously receives the signal and covers the upper and lower covers on the substrate 200 to complete the stacking of the plates. The automatic equipment has accurate positioning and high efficiency.
[0036] It should be noted that a third detection device 130 is also provided between the cleaning device 150 and the drying device 170. The third detection device 130 is used to detect the position of the substrate 200 after rinsing.
[0037] The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings. However, the present utility model is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present utility model within the scope of knowledge possessed by those of ordinary skill in the relevant technical field.
Claims
1. A continuous automated substrate forming processing system, characterized in that: include: A conveyor line is provided with a first detection device, an automated robot, a cleaning device, a cutting device and a drying device in sequence along the conveying direction. The conveyor line is also provided with a vacuum adsorption device, which can move along the conveying direction. The first detection device is used to detect the position of the substrate at the feeding end of the conveyor line and can transmit the detection result to the vacuum adsorption device and the automated robot to position the substrate and the upper and lower cover plates. The cutting device is used to split the substrate, the cleaning device is used to clean impurities on the surface of the substrate, and the drying device is used to remove water stains on the surface of the substrate.
2. A continuous automated substrate forming processing system according to claim 1, characterized in that: The cleaning device is configured as an ultrasonic cleaning device, multiple water washing devices and a surface impurity removal device. The ultrasonic cleaning device is located at the front end of the water washing device along the conveying direction, and the surface impurity removal device is located at the rear end of the water washing device along the conveying direction. The multiple water washing devices are arranged in an array along the conveying direction.
3. A continuous automated substrate forming processing system according to claim 2, characterized in that: The surface impurity removal device is provided with a water-jet cleaning structure and an air-jet cleaning structure. The water-jet cleaning structure is used to wash away stubborn dirt on the surface of the plate, and the air-jet cleaning structure is used to blow dry water drops on the surface of the plate.
4. A continuous automated substrate forming processing system according to claim 2, characterized in that: A second detection device is also provided between the ultrasonic cleaning device and the water cleaning device, and the second detection device is used to detect impurities on the surface of the substrate.
5. The continuous automated substrate forming processing system according to claim 1, characterized in that: The feeding end of the conveying line is also provided with a positioning device, and the positioning device can be movably arranged on the conveying line, and the positioning device is used to adjust the angle of the substrate.
6. A continuous automated substrate forming processing system according to claim 5, characterized in that: The positioning device is provided with a rotatable movable plate, and the movable plate is located on both sides of the conveying line along the conveying direction. The first detection device can also transmit the detection result to the positioning device to adjust the angle of the substrate.
7. A continuous automated substrate forming processing system according to claim 6, characterized in that: A buffer portion is provided on the surface of the movable plate.
8. A continuous automated substrate forming processing system according to claim 7, characterized in that: The buffer part is made of rubber material.
9. The continuous automated substrate forming processing system according to claim 1, characterized in that: A third detection device is further provided between the cleaning device and the drying device, and the third detection device is used to detect the rinsed substrate.