PCB electroless plating copper cleaning mechanism

Abstract

The utility model discloses a PCB electroless plating copper cleaning mechanism, and relates to the technical field of PCB electroless plating copper cleaning, the PCB electroless plating copper cleaning mechanism comprises a base, the top of the base is provided with a cleaning mechanism, one side of the base is provided with a water tank, the top of the water tank is provided with two pipelines, and the two pipelines are collinearly arranged. According to the PCB electroless plating copper cleaning mechanism, a material can be clamped through movement of a clamping plate, the material can be rotated through use of a motor, comprehensive cleaning of the material is facilitated, a lifting plate moves upwards through use of an electric push rod, and when the material rotates, the material can make contact with the lifting plate and a sponge plate, so that the material can be conveniently cleaned. The material is pushed to move upwards through upward movement of the lifting plate, the clamping plate can clamp other positions of the material, the original clamping position is exposed, cleaning work is facilitated, comprehensive cleaning can be achieved, manual operation is not needed, and manpower is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB electroless copper plating cleaning, and specifically relates to a PCB electroless copper plating cleaning mechanism. Background Technique

[0002] PCB, whose Chinese name is printed circuit board, also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. In the prior art, during the cleaning process of materials, the materials are clamped to prevent them from shaking. The manual cleaning method wastes manpower. During the clamping process, the materials cannot be comprehensively cleaned, and the clamped part is not convenient to come into contact with the liquid, making cleaning inconvenient.

[0003] For example, the patent application number is CN202221603040.1. This utility model relates to a cleaning machine for PCB electroless copper plating, which solves the problems in the existing patents that the cleaning steps for PCB boards are relatively cumbersome, consuming a large amount of time and cost, and there is no drying process after cleaning the PCB boards, greatly prolonging the processing time of PCB boards, etc. When in use, the manual cleaning method is adopted, wasting manpower. During the clamping process, the materials cannot be comprehensively cleaned, and the clamped part is not convenient to come into contact with the liquid, making cleaning inconvenient.

[0004] For example, the patent application number is CN202223052852.4. This utility model discloses a cleaning device for PCB electroless copper plating lines. By setting a motor, a spring, a connecting block, a round bar, and a wire mesh frame, when soaking and cleaning the electroless copper plating lines on the surface of the printed circuit board, the connecting block is driven to rotate by the output end of the motor, which can squeeze the round bar. Under the action of the spring, the wire mesh frame can be continuously shaken, and then the printed circuit board inside the wire mesh frame can be shaken, facilitating the shaking off of the loosened oxides and oil stains on the surface of the electroless copper plating lines on the printed circuit board. When in use, the manual cleaning method is adopted, wasting manpower. During the clamping process, the materials cannot be comprehensively cleaned, and the clamped part is not convenient to come into contact with the liquid, making cleaning inconvenient. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a PCB electroless copper plating cleaning mechanism, which solves the problems of wasting manpower by using the manual cleaning method, being unable to comprehensively clean the materials during the clamping process, the clamped part being inconvenient to come into contact with the liquid, and the cleaning being inconvenient.

[0006] To achieve the above object, the utility model is realized by the following technical solutions: A PCB copper deposition cleaning mechanism includes a base, a cleaning mechanism is arranged on the top of the base, a water tank is arranged on one side of the base, a pipeline is arranged on the top of the water tank, the number of the pipelines is two, the two pipelines are arranged collinearly, and a water inlet is arranged on the top surface of the water tank.

[0007] The cleaning mechanism includes a motor, a rotating plate is arranged at the end of the output shaft of the motor, a groove is arranged on the surface of the rotating plate close to the motor, a threaded rod is arranged inside the groove, and the top end of the threaded rod extends to the top of the rotating plate. An elevating plate is arranged below the rotating plate, both ends of the elevating plate are movably connected to the base, an electric push rod is arranged at the bottom of the elevating plate, a sponge plate is fixedly arranged at the top of the elevating plate, the number of the rotating plates is two, and clamping plates are arranged on one side of the top and one side of the bottom of each rotating plate.

[0008] Preferably, the cross-sectional shape of the base is U-shaped, a water pump is arranged on one side of the base, and both of the two pipelines are connected to the water pump.

[0009] Preferably, the threads on the surface of the threaded rod are arranged in two sections, and the two sections of threads are arranged in opposite directions.

[0010] Preferably, a connecting spring is arranged on the side of the clamping plate close to the motor, and a buffer plate is arranged on the side of the connecting spring away from the clamping plate.

[0011] Preferably, an extension plate is arranged above the sponge plate, the number of the extension plates is two, and a spray head is arranged between the two extension plates.

[0012] Preferably, a telescopic pipe is arranged on the top of the spray head, one end of the telescopic pipe is in contact with the top pipeline, and the other end of the telescopic pipe is communicated with the connection part of the spray head.

[0013] Preferably, a cross plate is fixedly arranged on the top of the spray head, and the cross plate is in contact with the top of the base. A connecting rod is arranged at the top of one end of the cross plate.

[0014] Preferably, a fixing plate is arranged below the connecting rod, a vertical rod is arranged at the bottom of the connecting rod, and the vertical rod penetrates through the fixing plate and is movably connected to the fixing plate.

[0015] Beneficial effects

[0016] The utility model provides a PCB copper deposition cleaning mechanism. Compared with the prior art, the following beneficial effects are achieved:

[0017] 1. The PCB electroless copper plating cleaning mechanism can clamp materials through the movement of the clamping plate, and can rotate the materials by using the motor, which is convenient for comprehensively cleaning the materials. In addition, by using the electric push rod, the lifting plate moves upward. When the materials rotate, they can contact with the lifting plate and the sponge plate. Through the upward movement of the lifting plate, the materials are pushed upward, enabling the clamping plate to clamp other positions of the materials, and the originally clamped position is exposed, which is convenient for cleaning work. It can be comprehensively cleaned without manual operation, saving manpower.

[0018] 2. For the PCB electroless copper plating cleaning mechanism, since one end of the telescopic tube contacts the pipeline at the top, and the vertical rod passes through the fixed plate and is movably connected to the fixed plate, it can prevent blocking the materials when they rotate, ensuring the position adjustment of the materials. Description of the Drawings

[0019] Figure 1 is the overall structural schematic diagram of the present invention;

[0020] Figure 2 is the schematic diagram of the cleaning mechanism of the present invention;

[0021] Figure 3 is the schematic diagram of the rotating plate and the buffer plate of the present invention;

[0022] Figure 4 is the top view of the extension plate and the nozzle of the present invention.

[0023] In the figure: 1. Base; 2. Cleaning mechanism; 201. Motor; 202. Rotating plate; 203. Groove; 204. Threaded rod; 205. Lifting plate; 206. Electric push rod; 207. Sponge plate; 208. Clamping plate; 209. Water pump; 210. Buffer plate; 211. Extension plate; 212. Nozzle; 213. Telescopic tube; 214. Cross plate; 215. Connecting rod; 216. Fixed plate; 217. Vertical rod; 3. Water tank; 4. Pipeline. Detailed Embodiments

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figure 1-24, the present utility model provides a technical solution: a PCB copper deposition cleaning mechanism, including a base 1, a cleaning mechanism 2 is provided on the top of the base 1, a water tank 3 is provided on one side of the base 1, a pipe 4 is provided on the top of the water tank 3, the number of the pipes 4 is two, the two pipes 4 are arranged collinearly, and a water inlet is provided on the top surface of the water tank 3.

[0026] The cleaning mechanism 2 includes a motor 201, a rotating plate 202 is provided at the end of the output shaft of the motor 201, a groove 203 is provided on the surface of the rotating plate 202 close to the motor 201, a threaded rod 204 is provided inside the groove 203, and the top end of the threaded rod 204 extends to the top of the rotating plate 202. A lifting plate 205 is provided below the rotating plate 202. Both ends of the lifting plate 205 are movably connected to the base 1. An electric push rod 206 is provided at the bottom of the lifting plate 205. A sponge plate 207 is fixedly provided at the top of the lifting plate 205. The number of the rotating plates 202 is two. Clamping plates 208 are provided on one side of the top and one side of the bottom of each rotating plate 202.

[0027] The cross-sectional shape of the base 1 is U-shaped. A water pump 209 is provided on one side of the base 1. Both pipes 4 are connected to the water pump 209. An extension plate 211 is provided above the sponge plate 207. The number of the extension plates 211 is two. A spray head 212 is provided between the two extension plates 211.

[0028] A telescopic pipe 213 is provided at the top of the spray head 212. One end of the telescopic pipe 213 is in contact with the pipe 4 at the top, and the other end of the telescopic pipe 213 is communicated with the connection part of the spray head 212. A cross plate 214 is fixedly provided at the top of the spray head 212, and the cross plate 214 is in contact with the top of the base 1. A connecting rod 215 is provided at the top of one end of the cross plate 214.

[0029] A fixing plate 216 is provided below the connecting rod 215. A vertical rod 217 is provided at the bottom of the connecting rod 215. The vertical rod 217 passes through the fixing plate 216 and is movably connected to the fixing plate 216.

[0030] Please refer to Figure 3 , the thread on the surface of the threaded rod 204 is provided in two sections, and the two sections of threads are arranged in opposite directions. A connecting spring is provided on the side of the clamping plate 208 close to the motor 201, and a buffer plate 210 is provided on the side of the connecting spring away from the clamping plate 208.

[0031] During operation, the liquid in the water tank 3 is replenished through the water inlet, and then the material is placed on both sides of the rotating plate 202, and then the threaded rod 204 is rotated. Since the thread on the surface of the threaded rod 204 is arranged in two sections, the two sections of the thread are arranged oppositely, and the threaded rod 204 is threadedly connected with the clamping plate 208, the distance between the two clamping plates 208 is reduced by the rotation of the threaded rod 204, and the buffer plate 210 and the connecting spring are driven to move, so that the buffer plate 210 gradually contacts with the material, and the connecting spring can achieve a buffering effect to prevent excessive extrusion and to improve the material. After the clamping is completed, the water pump 209, the motor 201 and the electric push rod 206 are used. Through the use of the water pump 209, the liquid in the water tank 3 enters the pipe 4 and flows in the pipe 4. Because one end of the telescopic tube 213 is located inside the top pipe 4, the liquid can flow in the telescopic tube 213. Since the other end of the telescopic tube 213 is connected to the connection of the nozzle 212, the liquid can be released through the nozzle 212. The nozzle 212 is installed on the rotating plate 202, so that the liquid is released on the material to clean the material. When the motor 201 is used When in use, since the output shaft end of the motor 201 is in transmission connection with the rotating plate 202, the rotating plate 202 is driven by the motor 201 to rotate, so that the material of the clamping plate 208 rotates at the same time, and the position of the material can be adjusted through the rotation of the material, so that the other surface of the material is in contact with the liquid, which is convenient for cleaning the material. When the electric push rod 206 starts to be used, the lifting plate 205 and the sponge plate 207 are moved upward by the electric push rod 206. In this way, when the material rotates, it can contact the lifting plate 205 and the sponge plate 207, and the lifting plate 205 can be adjusted to adjust the position of the material. The upward movement pushes the material to move upward, allowing the clamping plate 208 to clamp other positions of the material, and the original clamping position is exposed, which is convenient for cleaning and can be fully cleaned without manual operation, saving manpower. When the material moves upward, the nozzle 212 and the extension plate 211 can move upward at the same time, and push the telescopic tube 213 and the vertical rod 217 to move upward. Since one end of the telescopic tube 213 is in contact with the top pipe 4 and the vertical rod 217 passes through the fixed plate 216 and is movably connected to the fixed plate 216, the upward movement of the horizontal plate 214 is guaranteed.

[0032] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

Claims

1. A PCB copper deposition cleaning mechanism, comprising a base (1), characterized in that: A cleaning mechanism (2) is arranged on the top of the base (1), a water tank (3) is arranged on one side of the base (1), a pipe (4) is arranged on the top of the water tank (3), two pipes (4) are arranged in a co-linear manner, and a water inlet is arranged on the top surface of the water tank (3); The cleaning mechanism (2) comprises a motor (201), a rotating plate (202) is arranged at the end of the output shaft of the motor (201), a groove (203) is arranged on the surface of one side of the rotating plate (202) close to the motor (201), a threaded rod (204) is arranged inside the groove (203), and the top end of the threaded rod (204) extends to the top of the rotating plate (202), a lifting plate (205) is arranged below the rotating plate (202), both ends of the lifting plate (205) are movably connected to the base (1), an electric push rod (206) is arranged at the bottom of the lifting plate (205), and a sponge plate (207) is fixedly arranged on the top of the lifting plate (205), and the number of the rotating plates (202) is two, and a clamping plate (208) is arranged on the top side and the bottom side of each rotating plate (202).

2. A PCB copper deposition cleaning mechanism according to claim 1, characterized in that: The cross-sectional shape of the base (1) is U-shaped, a water pump (209) is provided on one side of the base (1), and the two pipes (4) are both connected to the water pump (209).

3. A PCB copper deposition cleaning mechanism according to claim 1, characterized in that: The thread on the surface of the threaded rod (204) is arranged in two sections, and the two sections of the thread are arranged oppositely.

4. A PCB copper deposition cleaning mechanism according to claim 1, characterized in that: A connecting spring is provided on a side of the clamping plate (208) close to the motor (201), and a buffer plate (210) is provided on a side of the connecting spring away from the clamping plate (208).

5. A PCB copper deposition cleaning mechanism according to claim 1, characterized in that: An extension plate (211) is arranged above the sponge plate (207), the number of the extension plates (211) is two, and a nozzle (212) is arranged between the two extension plates (211).

6. A PCB copper deposition cleaning mechanism according to claim 5, characterized in that: A telescopic tube (213) is provided at the top of the spray head (212), one end of the telescopic tube (213) is in contact with the pipe (4) at the top, and the other end of the telescopic tube (213) is connected to the connection point of the spray head (212).

7. A PCB copper deposition cleaning mechanism according to claim 5, characterized in that: A transverse plate (214) is fixedly arranged on the top of the spray head (212), and the transverse plate (214) is in contact with the top of the base (1), and a connecting rod (215) is arranged on the top of one end of the transverse plate (214).

8. A PCB copper deposition cleaning mechanism according to claim 7, characterized in that: A fixing plate (216) is arranged below the connecting rod (215), and a vertical rod (217) is arranged at the bottom of the connecting rod (215). The vertical rod (217) penetrates the fixing plate (216) and is movably connected to the fixing plate (216).

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