Gluing tool for chip and processing equipment

Abstract

The utility model discloses a gluing tool for a chip. The gluing tool comprises a bearing disc and a gluing plate. The bearing disc is detachably connected to the workpiece table, and a plurality of gluing positions are arranged on one side of the bearing disc; a plurality of gluing holes are formed in the gluing plate, and the gluing plate is constructed to be controllably contacted with and separated from the bearing disc; when the gluing plate makes contact with the bearing disc, the gluing plate covers the side, provided with the gluing positions, of the bearing disc, and the multiple gluing holes correspond to the multiple gluing positions in a one-to-one mode. When the gluing device is used, the gluing plate is placed on the side, provided with the gluing position, of the bearing disc, then gluing is conducted on the gluing position through the gluing holes, the gluing plate is separated from the bearing disc after gluing is completed, and then the bearing disc is connected with the workpiece table. Due to the fact that the gluing process is carried out on the bearing disc, the bearing disc and the workpiece table are detachably arranged, gluing does not need to be carried out on the workpiece table, and gluing is more convenient. And the gluing mode is safer for the workpiece table with higher height. The utility model further discloses processing equipment for the chip.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a processing device for chips. Background Art

[0002] During ion beam etching and ion implantation, ions bombard the chip surface and continuously generate heat. Chips are usually not heat-resistant, so thermal conductive glue needs to be applied under the chip during processing to ensure that the chip temperature does not get too high. Currently, during processing, glue is usually applied on the glue application position on the workpiece table. However, the workpiece table is used to carry the chip during processing, so the position of the workpiece table is fixed, and some workpiece tables are at a high height, which makes glue application inconvenient. Utility Model Content

[0003] The technical problem to be solved by the present application is that: the existing workpiece table is fixed in position, and it is inconvenient to apply glue on the workpiece table. In order to solve the above technical problem, a gluing tool and processing equipment for chips with convenient gluing are provided.

[0004] The technical solution proposed in this application is:

[0005] A gluing tool for chips, comprising:

[0006] A carrying plate is detachably connected to the workpiece table, and a plurality of gluing positions are provided on one side of the carrying plate;

[0007] A glue coating plate, which is provided with a plurality of glue coating holes and is configured to be controllably contactable with and separable from the carrier plate;

[0008] Wherein, when the glue coating plate contacts the carrying plate, the glue coating plate covers a side of the carrying plate where the glue coating positions are provided, and the plurality of glue coating holes correspond one-to-one to the plurality of glue coating positions to expose the glue coating positions.

[0009] Furthermore, the glue coating plate is also provided with a glue scraping hole, the radial dimension of the glue scraping hole is larger than the radial dimension of the glue coating hole, and the glue coating hole and the glue scraping hole respectively penetrate the opposite sides of the glue coating plate, and the glue coating hole penetrates the bottom wall of the glue scraping hole.

[0010] Furthermore, the scraper hole is a rectangular hole.

[0011] Furthermore, the glue coating hole is a rectangular hole.

[0012] Furthermore, the glue coating hole is located at the geometric center of the glue scraping hole.

[0013] Furthermore, a side of the glue coating plate facing away from the glue scraping hole is in contact with the carrying plate.

[0014] Further, the carrier plate is provided with a through connection hole, and the carrier plate is connected to the workpiece table through the connection hole.

[0015] A processing device for a chip, comprising a workpiece table and the glue coating tooling for the chip as described above.

[0016] Further, the carrier plate is provided with a through connection hole;

[0017] The processing device further includes a connecting column, and the connecting column is inserted through the connection hole and connected to the workpiece table to limit the carrier plate on the workpiece table.

[0018] Further, the connection hole includes a limiting section and a passing section that communicate with each other. The connecting column has a head and a rod portion that are connected to each other. One end of the rod portion away from the head is connected to the workpiece table;

[0019] The radial dimension of the head is larger than the radial dimension of the limiting section and smaller than the radial dimension of the passing section, and the radial dimension of the rod portion is smaller than the radial dimension of the limiting section.

[0020] With the above glue coating tooling, first place the glue coating plate on one side of the carrier plate where the glue coating position is provided, then perform glue coating on the glue coating position through the glue coating hole. After the glue coating is completed, separate the glue coating plate from the carrier plate, and then connect the carrier plate to the workpiece table. Since the glue coating process is carried out on the carrier plate and the carrier plate and the workpiece table are detachably arranged, there is no need to perform glue coating at the workpiece table, making the glue coating more convenient. Moreover, for a workpiece table with a relatively high height, this glue coating method is safer.

[0021] In addition, when performing glue coating at the glue coating position on the carrier plate, the glue coating plate can be placed on the carrier plate, and then glue coating is carried out in the glue coating hole, which can further facilitate glue coating and ensure the accuracy of the glue coating position. Description of the Drawings

[0022] The drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application.

[0023] Figure 1 It is a schematic structural diagram of a processing device for a chip provided by an embodiment of the present application;

[0024] Figure 2 It is Figure 1 a schematic structural diagram of the glue coating tooling in the shown processing device;

[0025] Figure 3 It is Figure 2 a schematic structural diagram of the glue coating plate in the shown glue coating tooling.

[0026] Description of Reference Numerals:

[0027] 10. Processing equipment; 100. Glue application tooling; 200. Workpiece table; 110. Carrier plate; 111. Connecting hole; 112. Limiting section; 113. Passing section; 120. Glue application plate; 121. Glue application hole; 122. Glue scraping hole; 300. Connecting column. Detailed Implementation Manner

[0028] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0029] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0030] On the one hand, the present application provides a glue application tooling for a chip, which can realize the coating of thermal conductive glue and make the glue application more convenient.

[0031] As Figures 1 to 3 shown, in one embodiment, the glue application tooling 100 includes a carrier plate 110 and a glue application plate 120. The carrier plate 110 is detachably connected to the workpiece table 200, and a plurality of glue application positions are provided on one side of the carrier plate 110. The glue application plate 120 is provided with a plurality of glue application holes 121, and the glue application plate 120 is configured to be controllably in contact with and separated from the carrier plate 110.

[0032] Among them, when the glue application plate 120 is in contact with the carrier plate 110, the glue application plate 120 covers the side of the carrier plate 110 where the glue application positions are provided, and the plurality of glue application holes 121 correspond to the plurality of glue application positions one by one to expose the glue application positions.

[0033] With the above-mentioned gluing tool 100, the gluing plate 120 is first placed on the side of the carrier plate 110 where the gluing position is provided, and then the gluing position is gluing through the gluing hole 121. After the gluing is completed, the gluing plate 120 is separated from the carrier plate 110, and then the carrier plate 110 is connected to the workpiece table 200. Since the gluing process is carried out on the carrier plate 110, the carrier plate 110 and the workpiece table 200 are detachably arranged, and there is no need to apply glue at the workpiece table 200, making the gluing more convenient. Moreover, for the workpiece table 200 with a higher height, this gluing method is safer.

[0034] In addition, when applying glue at the glue application position on the carrier plate 110 , the glue application plate 120 can be placed on the carrier plate 110 , and then glue is applied in the glue application holes 121 , which can further facilitate glue application and ensure that the glue application position is accurate.

[0035] It should be noted that, during the gluing process, a scraper can be used to scrape the thermally conductive glue in the gluing hole 121 back and forth to smooth the thermally conductive glue in the gluing hole 121, so that the thermally conductive glue is distributed more evenly, so that the chip and the thermally conductive glue are in more full contact, and the heat dissipation effect is improved. In addition, in order to ensure that when the gluing plate 120 is placed on the carrier plate 110, multiple gluing holes 121 correspond to multiple gluing positions, a first positioning portion and a second positioning portion can be respectively provided on the carrier plate 110 and the gluing plate 120, and the first positioning portion and the second positioning portion can be connected to each other to position the gluing plate 120. Optionally, one of the first positioning portion and the second positioning portion can be a protrusion, and the other can be a recessed hole.

[0036] In one embodiment, the carrier plate 110 is provided with a connecting hole 111, and the carrier plate 110 is connected to the workpiece stage 200 through the connecting hole 111. As an example, a bolt can be used, which passes through the connecting hole 111 and is threadedly connected to the workpiece stage 200 to fix the carrier plate 110 on the workpiece stage 200.

[0037] In one embodiment, the glue coating plate 120 is further provided with a scraping glue hole 122, the radial dimension of the scraping glue hole 122 is larger than the radial dimension of the glue coating hole 121, and the glue coating hole 121 and the scraping glue hole 122 respectively penetrate the opposite sides of the glue coating plate 120, and the glue coating hole 121 penetrates the bottom wall of the scraping glue hole 122. In this way, the side of the glue coating plate 120 away from the scraping glue hole 122, that is, the side of the glue coating plate 120 penetrated by the glue coating hole 121, can be brought into contact with the carrier plate 110, and then the thermal conductive glue is dotted into the glue coating hole 121, and then the scraper is scraped back and forth in the scraping glue hole 122, so as to flatten the thermal conductive glue in the glue coating hole 121.

[0038] In other embodiments, if the side of the glue coating plate 120 penetrated by the glue scraping hole 122 is in contact with the carrier plate 110, a glue coating space is formed between the glue scraping hole 122 and the carrier plate 110, and the glue coating hole 121 is connected to the glue coating space, and thermal conductive glue can be poured into the glue coating space through the glue coating hole 121. Of course, it is preferred that the side of the glue coating plate 120 away from the glue scraping hole 122 is in contact with the carrier plate 110.

[0039] In addition, in other embodiments, if the positioning hole is only provided with a glue coating hole 121, the glue coating hole 121 passes through both sides of the glue coating plate 120, and the scraper can scrape back and forth on the side of the glue coating plate 120 away from the supporting plate 110 to flatten the thermal conductive glue in the glue coating hole 121.

[0040] In one embodiment, the glue coating hole 121 is located at the geometric center of the glue scraping hole 122 , so that the glue scraping blade can scrape the thermal conductive glue in the glue coating hole 121 flat while moving in the glue scraping hole 122 .

[0041] In one embodiment, the scraping hole 122 is a rectangular hole, and the length dimension of the scraper matches the length dimension or width dimension of the scraping hole 122, so that the scraper can easily reciprocate along the width direction or length direction of the scraping hole 122. Further, the glue coating hole 121 is a rectangular hole, so that after the thermal conductive glue in the glue coating hole 121 is scraped flat, the shape of the thermal conductive glue corresponds to the shape of the chip.

[0042] In other embodiments, the shapes of the glue scraping holes 122 and the glue coating holes 121 may also be other shapes, as long as they can facilitate glue coating and scraping, and can ensure the heat dissipation effect after the thermal conductive glue is coated and scraped.

[0043] On the other hand, the present application also provides a processing device 10 for a chip, wherein the processing device 10 includes a workpiece table 200 and the glue coating tool 100 in the above embodiment.

[0044] In one embodiment, the processing device 10 further includes a connecting column 300, which is passed through the connecting hole 111 and connected to the workpiece stage 200 to limit the carrier plate 110 to the workpiece stage 200. As described above, the connecting column 300 can be a bolt, and the connecting column 300 is threadedly connected to the workpiece stage 200.

[0045] In one embodiment, the connection hole 111 includes a limiting section 112 and a passing section 113 that communicate with each other; the connecting rod includes a head and a rod portion that are connected to each other, and one end of the rod portion away from the head is connected to the workpiece table 200. The radial dimension of the head is larger than the radial dimension of the limiting section 112 and smaller than the radial dimension of the passing section 113, and the radial dimension of the rod portion is smaller than the radial dimension of the limiting section 112. In this way, the passing section 113 can be aligned with the connecting column 300 first, and then the carrier plate 110 is placed on the workpiece table 200. The head of the connecting column 300 passes through the passing section 113, and at this time, the rod portion is located in the passing section 113; subsequently, the carrier plate 110 is moved so that the rod portion enters the limiting section 112, and the radial dimension of the head is larger than the radial dimension of the limiting section 112, thereby realizing the limitation of the carrier plate 110.

[0046] Specifically Figure 1 In the illustrated embodiment, the cross-sectional shape of the passing section 113 is circular, the limiting section 112 extends along the circumferential direction of the carrier plate 110, and one end of the limiting section 112 communicates with the passing section 113.

[0047] In one embodiment, the carrier plate 110 is provided with a plurality of connection holes 111, and the plurality of connection holes 111 are arranged at intervals along the circumferential direction of the carrier plate 110. The processing device 10 includes a plurality of connecting rods, and each connecting rod corresponds to a connection hole 111 to improve the connection stability between the carrier plate 110 and the workpiece table 200.

[0048] To facilitate understanding of the technical solution of the present application, the working processes of the glue application tooling 100 and the processing device 10 in the above embodiments are described herein:

[0049] First, the glue application plate 120 is placed on one side surface of the carrier plate 110 where the glue application positions are provided, so that the plurality of glue application holes 121 correspond to the plurality of glue application positions. Subsequently, heat-conducting glue is injected into each glue application hole 121, and a scraper is used to scrape back and forth in the glue scraping hole 122, thereby scraping the heat-conducting glue in the glue application hole 121 flat to ensure the uniformity of the heat-conducting glue. After the heat-conducting glue is scraped flat, the glue application plate 120 is removed, and the chip is placed on the corresponding heat-conducting glue. Next, the carrier plate 110 is connected to the workpiece table 200, and subsequent processing steps can be carried out.

[0050] It can be determined that the material of the carrier plate 110 is preferably the same as the material of the workpiece table 200.

[0051] Although the embodiments of the present application have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A gluing tool for chips, characterized in that: include: A carrying plate is detachably connected to the workpiece table, and a plurality of gluing positions are provided on one side of the carrying plate; A glue coating plate, which is provided with a plurality of glue coating holes and is configured to be controllably contactable with and separable from the carrier plate; Wherein, when the glue coating plate contacts the carrying plate, the glue coating plate covers a side of the carrying plate where the glue coating positions are provided, and the plurality of glue coating holes correspond one-to-one to the plurality of glue coating positions to expose the glue coating positions.

2. The gluing tool for chips according to claim 1, characterized in that: The glue coating plate is also provided with a glue scraping hole, the radial dimension of the glue scraping hole is larger than the radial dimension of the glue coating hole, and the glue coating hole and the glue scraping hole respectively penetrate the opposite sides of the glue coating plate, and the glue coating hole penetrates the bottom wall of the glue scraping hole.

3. The gluing tool for chips according to claim 2, characterized in that: The scraping glue hole is a rectangular hole.

4. The gluing tool for chips according to claim 3, characterized in that: The glue coating hole is a rectangular hole.

5. The gluing tool for chips according to claim 2, characterized in that: The glue coating hole is located at the geometric center of the glue scraping hole.

6. The gluing tool for chips according to claim 2, characterized in that: The side of the glue coating plate facing away from the glue scraping hole is in contact with the carrying plate.

7. The gluing tool for chips according to claim 1, characterized in that: The carrying plate is provided with a connecting hole through which the carrying plate is connected to the workpiece platform.

8. A chip processing device, characterized in that: It comprises a workpiece table and the gluing tool for chips as described in any one of claims 1 to 7.

9. The chip processing equipment according to claim 8, characterized in that: The carrying plate is provided with a connecting hole extending therethrough; The processing equipment further includes a connecting column, which is passed through the connecting hole and connected to the workpiece table to limit the carrying plate to the workpiece table.

10. The chip processing equipment according to claim 9, characterized in that: The connecting hole comprises a limiting section and a passing section which are interconnected, the connecting column comprises a head and a rod which are interconnected, and an end of the rod which is away from the head is connected to the workpiece platform; The radial dimension of the head portion is larger than the radial dimension of the limiting section and smaller than the radial dimension of the passing section, and the radial dimension of the rod portion is smaller than the radial dimension of the limiting section.

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