Assembly for solder ball forming and welding of antenna radio frequency head

Abstract

The utility model discloses a solder ball forming welding assembly of an antenna radio frequency head, which comprises a steel sheet and a fixing jig, a plurality of accommodating holes for accommodating solder paste are arranged on the steel sheet, and the solder paste is melted in the accommodating holes and then cooled to form solder balls, so that the solder ball forming welding assembly is light and flexible, and the solder balls can be formed by controlling the aperture and depth of the accommodating holes. Secondly, as the solder paste is melted in the accommodating hole and then cooled to form the solder ball, gas in the solder paste is discharged, and after the antenna radio frequency head and the solder ball are fixedly connected through reflow soldering to form the solder joint point, the solder joint point and the solder joint point are separated from each other; and almost no soldering-aid paste volatile matter is left, unnecessary manual cleaning cost is saved, welding spots are bright and smooth, no void bubble is left, and the IPC standard is completely met.

Description

Technical Field

[0001] The utility model relates to the technical field of antenna RF connectors, and more specifically, to a component for forming and soldering solder balls of an antenna RF connector. Background Art

[0002] With the rapid progress of 5G communication technology and RF technology, as one of the core components of wireless communication devices, the manufacturing quality of small antenna RF connectors is directly related to the performance and stability of the overall communication system.

[0003] Currently, the soldering of small antenna RF connectors usually adopts the methods of dot soldering and tin injection. When dot soldering, the solder is prone to wire drawing, and it is difficult to control the amount of tin during the needle tube tin injection method, resulting in an increased risk of uncontrollable tin injection volume; when the tin injection contaminates the silver-plated layer on the inner wall of the RF interface, it cannot be reworked or repaired, causing product scrapping. After tin injection reflow soldering, since the flux gas of the paste cannot be discharged from the solder joints, a large number of voids will be formed inside the solder joints, affecting the reliability of the solder joints. When the tin injection volume increases, the black flux compound residue generated after soldering is extremely difficult to clean, increasing unnecessary rework and repair man-hours. Summary of the Utility Model

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a component for forming and soldering solder balls of an antenna RF connector to solve the problem that small antenna RF connectors are prone to damage during soldering.

[0005] The technical solution of the utility model is as follows: A component for forming and soldering solder balls of an antenna RF connector includes:

[0006] A steel sheet, on which a plurality of accommodating holes for accommodating solder paste are provided, and the solder paste melts and cools in the accommodating holes to form solder balls;

[0007] A fixing fixture for installing an antenna RF connector. A soldering point for placing a solder ball is provided inside the antenna RF connector, and the antenna RF connector and the solder ball are fixedly connected by reflow soldering to form a solder joint.

[0008] Further, the accommodating holes of the steel sheet are circular holes, and the diameter of the accommodating holes of the steel sheet is 3.0 mm to 10.0 mm.

[0009] Further, the diameters of the accommodating holes of the steel sheet are 3.4 mm, 5.8 mm, and 10 mm

[0010] Further, the thickness of the steel sheet is 0.20 mm.

[0011] Further, a plurality of placement areas are provided on the fixed fixture, and the plurality of placement areas are arranged in a matrix on the fixed fixture. An avoidance hole and limiting holes located around the avoidance hole are provided in each placement area. The avoidance hole penetrates through the thickness of the fixed fixture, and the limiting holes are used to cooperate and engage with the protrusions at the bottom of the antenna RF head.

[0012] Further, the placement area is square.

[0013] Further, the length of the placement area is 60 mm, and the width of the placement area is 60 mm.

[0014] Further, a plurality of through holes are provided on the fixed fixture, and the plurality of through holes are arranged in sequence around the placement area.

[0015] For the utility model according to the above solution, its beneficial effects are as follows: A component for the solder ball forming and soldering of an antenna RF head includes a steel sheet and a fixed fixture. By providing a plurality of accommodation holes for accommodating solder paste on the steel sheet, the solder paste melts and cools in the accommodation holes to form solder balls. It is not only light and flexible, but also can ensure that the sizes of the formed solder balls are uniform by controlling the aperture and depth of the accommodation holes, thereby ensuring that the solder intake amounts of the interface pins of the antenna RF head are standard and consistent. Secondly, when the solder paste melts and cools in the accommodation holes to form solder balls, the gas inside the solder paste is discharged. After the antenna RF head and the solder balls are fixedly connected by reflow soldering to form solder joints, there is almost no residue of the flux volatiles, saving unnecessary manual cleaning costs, and the solder joints are bright and smooth, without voids and bubbles remaining, fully meeting the IPC standard. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 It is a schematic structural diagram of the steel sheet in the embodiment of the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the fixed fixture in the embodiment of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the antenna RF head in the embodiment of the present utility model.

[0020] In the figure, 1 is a steel sheet; 11 is a receiving hole; 2 is a fixing fixture; 21 is a placing area; 211 is an avoidance hole; 212 is a limiting hole; 213 is a through hole; 3 is an antenna RF head; 31 is a protrusion. Specific embodiments

[0021] The following further describes in detail the embodiments of the present invention in conjunction with the drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principle of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0022] To better understand the present invention, the present invention will be further described below in conjunction with the drawings and embodiments:

[0023] With the rapid development of 5G and RF technologies, small antenna RF head welding usually adopts the methods of dot soldering and tin injection. The dot soldering technology directly applies solder at the welding point by holding a soldering tool. The operation is simple but difficult to control the accuracy. Its main problem is that the solder is easy to draw wire during dot soldering, and it is difficult to control the amount of tin in the syringe tin injection method, resulting in an increased risk of uncontrollable tin injection volume; when the tin injection contaminates the silver-plated layer on the inner wall of the RF interface, it cannot be reworked or repaired, resulting in product scrapping. After tin injection reflow soldering, since the flux gas of the paste cannot be discharged from the solder joint, a large number of voids will be formed inside the solder joint. These voids not only weaken the mechanical strength of the solder joint, but may also become obstacles to signal transmission, reducing the electrical performance of the RF connector, thereby affecting the reliability of the entire antenna RF system. When the tin injection volume increases, the black flux compound residue generated after welding is extremely difficult to clean, increasing unnecessary rework and repair man-hours.

[0024] See Figures 1 to 3 As shown, a component for solder ball forming welding of an antenna RF head provided by an embodiment of the present invention includes a steel sheet 1 and a fixing fixture 2. A plurality of receiving holes 11 for receiving solder paste are provided on the steel sheet 1. The solder paste melts in the receiving holes 11 and then cools to form solder balls; the fixing fixture 2 is used to install the antenna RF head 3. A welding point for placing the solder balls is provided inside the antenna RF head 3. The antenna RF head 3 and the solder balls are fixedly connected by reflow soldering to form a solder joint.

[0025] Specifically, by providing a plurality of accommodation holes 11 for accommodating solder paste on the steel sheet 1, the solder paste melts in the accommodation holes 11 and then cools to form solder balls. This is not only light and flexible, but also by controlling the aperture and depth of the accommodation holes 11, the size of the formed solder balls can be ensured to be uniform, thereby ensuring that the solder amount standard of the interface pins of the antenna RF head 3 is consistent. Secondly, when the solder paste melts in the accommodation holes 11 and cools to form solder balls, the gas inside the solder paste is discharged. After the antenna RF head 3 and the solder balls are fixedly connected by reflow soldering to form solder joints, there is almost no residue of the flux volatiles, saving unnecessary manual cleaning costs, and the solder joints are bright, smooth and free of voids and bubbles, fully meeting the IPC standard.

[0026] In this embodiment, the accommodation holes 11 of the steel sheet 1 are circular holes, and the diameter of the accommodation holes 11 of the steel sheet 1 is 3.0 mm to 10.0 mm. Among them, the diameters of the plurality of accommodation holes 11 are equal, and the center distance between any two adjacent accommodation holes 11 is a certain value, so that the plurality of accommodation holes 11 are arranged in a matrix. In one embodiment, the diameter of the accommodation holes 11 of the steel sheet 1 is 3.4 mm, and the center distance between any two adjacent accommodation holes 11 is 5 mm. In another embodiment, the diameter of the accommodation holes 11 of the steel sheet 1 is 5.8 mm, and the center distance between any two accommodation holes 11 is 8 mm. In another embodiment, the diameter of the accommodation holes 11 of the steel sheet 1 is 10 mm, and the center distance between any two accommodation holes 11 is 12 mm.

[0027] In this embodiment, the thickness of the steel sheet 1 is 0.20 mm. It should be noted that the thickness of the steel sheet 1 includes but is not limited to 0.20 mm, and the thickness of the steel sheet 1 can also be 0.15 mm.

[0028] As shown in FIG. 2, a plurality of placement areas 21 are provided on the fixing jig 2. The plurality of placement areas 21 are arranged in a matrix on the fixing jig 2. Each placement area 21 is provided with an avoidance hole 211 and limit holes 212 located around the avoidance hole 211. The avoidance hole 211 penetrates through the thickness of the fixing jig 2, and the limit holes 212 are used to cooperate with the protrusions 31 at the bottom of the antenna RF head 3 for snap connection.

[0029] Specifically, by providing a plurality of placement areas 21 arranged in a matrix on the fixing jig 2, a plurality of antenna RF heads 3 can be fixed. Compared with the single fixing method, the production efficiency is significantly improved. At the same time, such a design is conducive to realizing automated or semi-automated operation, thereby reducing manual intervention and further improving the production efficiency. Among them, the limit holes 212 in each placement area 21 cooperate with the protrusions 31 at the bottom of the antenna RF head 3 for snap connection. Such a design ensures the precise positioning of the antenna RF head 3 on the fixing jig 2 and improves the installation firmness of the antenna RF head 3.

[0030] In this embodiment, the placement area 21 is square.

[0031] Preferably, the length of the placement area 21 is 60 mm, and the width of the placement area 21 is 60 mm.

[0032] In this embodiment, a plurality of through holes 213 are provided on the fixing fixture 2, and the plurality of through holes 213 are arranged in sequence around the placement area 21. The plurality of through holes 213 serve as identifiers to facilitate quickly installing the antenna RF head 3 at the corresponding position of the fixing fixture 2. At the same time, the design of the plurality of through holes 213 can reduce the weight of the fixing fixture 2, making the fixing fixture 2 light and flexible for easy handling. Secondly, during the heating process, the design of the plurality of through holes 213 helps heat transfer, enabling the antenna RF head 3 to be evenly heated, prompting the solder balls to quickly melt to form solder joints.

[0033] For further explanation, the embodiment of the present utility model also provides a solder ball forming and soldering process for an antenna RF head, which is as follows:

[0034] Step 1: Use stainless steel material to make the steel sheet 1 for printing solder paste, and open a plurality of accommodation holes 11 with equal diameters on the steel sheet 1;

[0035] Step 2: Use synthetic stone to make the fixing fixture 2. The length of the fixing fixture 2 is 200 mm, and the width is 155 mm. A plurality of through holes 213 are provided on the fixing fixture 2, and the plurality of through holes 213 are arranged in a surrounding manner to enclose and form the placement area 21. There are a plurality of placement areas 21, and the plurality of placement areas 21 are arranged in a matrix on the fixing fixture 2. Each placement area 21 is provided with an avoidance hole 211 and limit holes 212 located around the avoidance hole 211. The avoidance hole 211 penetrates the thickness of the fixing fixture 2, and the limit holes 212 are used to cooperate with and snap onto the protrusions 31 at the bottom of the antenna RF head 3;

[0036] Step 3: Print the low-temperature solder paste on the flat solder mask green oil surface of the scrap PCB board through the steel sheet 1;

[0037] It should be noted that in the above step 3, due to the high heat resistance and chemical resistance of the solder mask green oil surface, when heated, it will not directly chemically react with or directly adhere to the low-temperature solder paste. Therefore, it can ensure that the low-temperature solder paste shrinks into solder balls of the same size under the action of surface tension when cooled; using a scrap PCB board can reduce production costs and make full use of resources. Those skilled in the art can also print the low-temperature solder paste on other plates through the steel sheet 1, as long as it is ensured that the low-temperature solder paste does not chemically react with or directly adhere to it during the heating process.

[0038] Step 4: Set the heating temperature of the low-temperature solder paste soldering reflow oven or heating platform so that the low-temperature solder paste melts and cools into solder balls of uniform size;

[0039] Step 5: Dip the formed solder ball into a proper amount of flux and place it into the soldering point of the antenna RF head 3 using tweezers;

[0040] Step 6: Place the antenna RF head 3 on the fixing fixture 2, and then set the temperature of the dedicated soldering furnace. The antenna RF head 3 and the solder ball are fixedly connected by reflow soldering to form a solder joint.

[0041] It should be noted that the indicated orientation or position relationship is based on the orientation or position relationship shown in the drawings, or is the orientation or position relationship in which the application product is usually placed when used, or is the orientation or position relationship commonly understood by technical personnel in this field, or is the orientation or position relationship in which the application product is usually placed when used. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0042] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0043] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A solder ball forming welding component for an antenna radio frequency head, characterized in that: include: A steel sheet (1), wherein a plurality of receiving holes (11) for receiving solder paste are provided on the steel sheet (1), wherein the solder paste is melted in the receiving holes (11) and then cooled to form solder balls; A fixing fixture (2) is used to install an antenna radio frequency head (3), wherein a soldering point for placing a solder ball is arranged inside the antenna radio frequency head (3), and the antenna radio frequency head (3) and the solder ball are fixedly connected by reflow soldering to form a solder joint.

2. The solder ball forming welding assembly of an antenna radio frequency head according to claim 1, characterized in that: The accommodating hole (11) of the steel sheet (1) is a circular hole, and the diameter of the accommodating hole (11) of the steel sheet (1) is 3.0 mm to 10.0 mm.

3. The solder ball forming welding assembly of the antenna radio frequency head according to claim 2, characterized in that: The diameters of the receiving hole (11) of the steel sheet (1) are 3.4 mm, 5.8 mm and 10 mm.

4. The solder ball forming welding assembly of an antenna radio frequency head according to claim 1, characterized in that: The thickness of the steel sheet (1) is 0.20 mm.

5. The solder ball forming welding assembly of an antenna radio frequency head according to claim 1, characterized in that: The fixing jig (2) is provided with a plurality of placement areas (21), the plurality of placement areas (21) being arranged in a matrix on the fixing jig (2), each of the placement areas (21) being provided with an avoidance hole (211) and limiting holes (212) located around the avoidance hole (211), the avoidance hole (211) penetrating the thickness of the fixing jig (2), and the limiting holes (212) being used for engaging with a protrusion (31) at the bottom of the antenna radio frequency head (3) for clamping.

6. The solder ball forming welding assembly of the antenna radio frequency head according to claim 5, characterized in that: The placement area (21) is a square.

7. The solder ball forming welding assembly of the antenna radio frequency head according to claim 6, characterized in that: The length of the placement area (21) is 60 mm, and the width of the placement area (21) is 60 mm.

8. The solder ball forming welding assembly of an antenna radio frequency head according to claim 6, characterized in that: The fixing fixture (2) is provided with a plurality of through holes (213), and the plurality of through holes (213) are arranged in sequence around the placement area (21).

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