Wire welding device for integrated circuit chip production

Abstract

The utility model relates to the technical field of integrated circuit chip production equipment, in particular to a wire welding device for integrated circuit chip production. According to the utility model, the chip can be clamped and positioned during wire bonding, so that the wire bonding process is more accurate, the laser wire bonding machine can be moved according to a set path and wire bonding can be carried out on a plurality of welding points on the chip in sequence, and the wire bonding efficiency and effect of the chip are improved. The device comprises a bottom frame, a transparent protection box, a control panel and the like, a transparent protection box is arranged on the bottom frame, and a control panel is arranged on the bottom frame. A chip is manually placed on the sliding plate, a wire welding path is set through the control panel, the first motor, the second motor, the third motor, the first electric push rod, the second electric push rod and the laser wire welding machine are started, the chip is clamped through the clamping plate, and therefore the chip can be clamped and positioned, and the chip is more stable in the wire welding process; and the laser wire welding machine can be moved according to a set path and wire welding is carried out on a plurality of welding points on the chip in sequence.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip production equipment, in particular to a wire bonding device for integrated circuit chip production. Background Art

[0002] An integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one protection ring. The basic preparation process of an integrated circuit chip often requires the use of a wire bonding device. However, most of the existing wire bonding devices cannot well position the chip, making the wire bonding process of the chip inaccurate, affecting the wire bonding effect. Moreover, there may be several welding points on the chip, and the chip is small, so it is easy to miss during welding. In this case, wire bonding needs to be redone, resulting in relatively low wire bonding efficiency of the chip. Summary of the Utility Model

[0003] In view of this, the utility model provides a wire bonding device for integrated circuit chip production, which can clamp and position the chip during wire bonding, making the wire bonding process more accurate. It can also move the laser wire bonder according to the set path and sequentially wire bond several welding points on the chip, improving the wire bonding efficiency and effect of the chip.

[0004] The technical solution is: A wire bonding device for integrated circuit chip production, comprising a chassis, a transparent protective box, a control panel, a positioning component and a wire bonding component. The upper part of the chassis is provided with a transparent protective box, the upper part of the chassis is provided with a control panel, the positioning component is arranged on the chassis, the wire bonding component is arranged on the chassis, and the wire bonding component is located inside the transparent protective box.

[0005] Further, the positioning component includes a first motor, a lead screw, a sliding plate, a sliding frame, a long rod, a spring, a clamping plate, a long plate, a second motor and a cam. The upper part of the chassis is provided with a first motor, the first motor is electrically connected to the control panel, the upper part of the chassis is rotatably connected with a lead screw, the lead screw is fixedly connected to the output shaft of the first motor, the upper part of the chassis is slidably connected with a sliding plate, the sliding plate is in threaded connection with the lead screw, two sliding frames are slidably connected to the upper part of the sliding plate, the two sliding frames are symmetrically arranged, two long rods are arranged on one of the sliding frames, the two long rods pass through the other sliding frame, two springs are connected between the two sliding frames, the springs are sleeved on the long rods, clamping plates are arranged on the sides of the two sliding frames close to each other, a long plate is arranged between the two long rods, a second motor is arranged on the upper part of the sliding plate, the second motor is electrically connected to the control panel, a cam is arranged on the output shaft of the second motor, the cam is rotatably connected to the sliding plate, and the cam contacts both one of the sliding frames and the long plate.

[0006] Furthermore, the wire bonding component includes a fixed plate, Motor III, a threaded rod, a guide rod, a slider, a support rod, a limiting rod, Electric Push Rod I, a fixing bracket, a fixing block, Electric Push Rod II, and a laser wire bonder. The fixed plate is provided on the chassis. On one side of the fixed plate is provided Motor III, which is electrically connected to the control panel. The threaded rod is rotatably connected to the fixed plate. The guide rod is provided on the fixed plate. The slider is slidably connected to the fixed plate. The slider is threadedly connected to the threaded rod and passes through the guide rod. The support rod is provided on the upper part of the slider. The limiting rod is provided in the transparent protective box and is slidably connected to the support rod. Electric Push Rod I is provided on the support rod and is electrically connected to the control panel. The fixing bracket is slidably connected to the transparent protective box and is fixedly connected to the support rod. The fixing block is slidably connected to the fixing bracket and is fixedly connected to the telescopic rod of Electric Push Rod I. Electric Push Rod II is provided on the upper part of the fixing block and is electrically connected to the control panel. The telescopic rod of Electric Push Rod II passes through the fixing block, and the laser wire bonder is provided on the telescopic rod of Electric Push Rod II and is electrically connected to the control panel.

[0007] The beneficial effects are as follows: First, the operator places the chip to be processed on the slide plate, and then the operator sets the wire bonding path through the control panel and starts Motor I, Motor II, Motor III, Electric Push Rod I, Electric Push Rod II, and the laser wire bonder. The two clamping plates will clamp the chip, and the laser wire bonder will perform wire bonding on the chip in sequence along the path set by the control panel. In this way, the chip can be clamped and positioned during wire bonding, making the chip more stable during the wire bonding process, thus making the wire bonding process more accurate, improving the wire bonding effect of the chip, and being able to move the laser wire bonder according to the set path and perform wire bonding on several welding points on the chip in sequence, making the wire bonding efficiency of the chip higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a three-dimensional structural diagram of the present utility model.

[0009] Figure 2 is a first partially sectional three-dimensional structural diagram of the present utility model.

[0010] Figure 3 is a second partially sectional three-dimensional structural diagram of the present utility model.

[0011] Figure 4 is the present utility model Figure 3 is an enlarged three-dimensional structural diagram of part I in the present utility model.

[0012] Attached drawing reference numerals: 1 - chassis, 2 - transparent protective box, 3 - control panel, 41 - motor 1, 42 - lead screw, 43 - slide plate, 44 - carriage, 45 - long rod, 46 - spring, 47 - clamping plate, 48 - long plate, 49 - motor 2, 410 - cam, 51 - fixing plate, 52 - motor 3, 53 - threaded rod, 54 - guide rod, 55 - slider, 56 - support rod, 57 - limiting rod, 58 - electric push rod 1, 59 - fixing frame, 510 - fixing block, 511 - electric push rod 2, 512 - laser wire bonding machine. Detailed implementation mode

[0013] The present utility model will be further described below in conjunction with the attached drawings and embodiments.

[0014] Embodiment 1: A wire bonding device for integrated circuit chip production, as Figures 1-4 shown, comprising a chassis, a transparent protective box, a control panel, a positioning component and a wire bonding component. The transparent protective box is welded to the upper part of the chassis, the control panel is arranged on the upper part of the chassis, the positioning component is arranged on the chassis, the wire bonding component is arranged on the chassis, and the wire bonding component is located inside the transparent protective box.

[0015] Furthermore, the positioning component includes a motor 1, a lead screw, a slide plate, a carriage, a long rod, a spring, a clamping plate, a long plate, a motor 2 and a cam. The motor 1 is connected to the upper part of the chassis by rivets, the motor 1 is electrically connected to the control panel, the lead screw is rotatably connected to the upper part of the chassis, the lead screw is fixedly connected to the output shaft of the motor 1, the slide plate is slidably connected to the upper part of the chassis, the slide plate is threadedly connected to the lead screw, two carriages are slidably connected to the upper part of the slide plate, the two carriages are symmetrically arranged, two long rods are arranged on one of the carriages, the two long rods both pass through the other carriage, two springs are connected between the two carriages by hooks, the springs are sleeved on the long rods, clamping plates are welded on the sides of the two carriages close to each other, a long plate is bolted between the two long rods, the motor 2 is arranged on the upper part of the slide plate, the motor 2 is electrically connected to the control panel, a cam is key-connected to the output shaft of the motor 2, the cam is rotatably connected to the slide plate, and the cam contacts both one of the carriages and the long plate.

[0016] Further, the wire bonding component includes a fixing plate, a motor three, a threaded rod, a guide rod, a slider, a support rod, a limiting rod, an electric push rod one, a fixing frame, a fixing block, an electric push rod two and a laser wire bonder. The fixing plate is provided on the chassis. One side of the fixing plate is welded with a motor three, and the motor three is electrically connected to the control panel. The threaded rod is rotatably connected to the fixing plate. The guide rod is provided on the fixing plate. The slider is slidably connected to the fixing plate. The slider is threadedly connected to the threaded rod. The slider passes through the guide rod. The upper part of the slider is connected with the support rod by a rivet. The limiting rod is bolted in the transparent protection box. The limiting rod is slidably connected to the support rod. The electric push rod one is provided on the support rod. The electric push rod one is electrically connected to the control panel. The fixing frame is slidably connected to the transparent protection box. The fixing frame is fixedly connected to the support rod. The fixing block is slidably connected to the fixing frame. The fixing block is fixedly connected to the telescopic rod of the electric push rod one. The upper part of the fixing block is welded with an electric push rod two. The electric push rod two is electrically connected to the control panel. The telescopic rod of the electric push rod two passes through the fixing block. The laser wire bonder is bolted to the telescopic rod of the electric push rod two. The laser wire bonder is electrically connected to the control panel.

[0017] First, manually place the chip to be processed on the skateboard. Then, manually start Motor 1 and Motor 2 through the control panel. The output shaft of Motor 2 drives the cam to rotate. The cam contacts both one carriage and the long board. The cam will drive the long board and one carriage to move away from each other. One carriage drives one clamping plate to move towards the control panel. The long board drives two long rods to move away from the control panel. Two long boards drive the other carriage and the other clamping plate to move away from the control panel. Two springs are compressed, and the two clamping plates will clamp the chip. After that, Motor 2 stops rotating. The output shaft of Motor 1 drives the lead screw to rotate. The rotation of the lead screw will drive the skateboard, two carriages, two long rods, two clamping plates, the long board, Motor 2, and the cam to move towards the transparent protective box. Then, manually set the welding path through the control panel and start Motor 3, Electric Push Rod 1, Electric Push Rod 2, and the laser wire bonder. The output shaft of Motor 3 drives the threaded rod to rotate. The rotation of the threaded rod will drive the slider, support rod, Electric Push Rod 1, fixed frame, fixed block, Electric Push Rod 2, and the laser wire bonder to move to the pre-set position. The telescopic rod of Electric Push Rod 1 will extend. The telescopic rod of Electric Push Rod 1 drives the fixed block, Electric Push Rod 2, and the laser wire bonder to move towards Motor 1. The telescopic rod of Electric Push Rod 2 will extend. The telescopic rod of Electric Push Rod 2 will drive the laser wire bonder to move downward. The laser wire bonder will wire the chip below. When it is necessary to move to the next welding point, the telescopic rod of Electric Push Rod 1 will continuously contract or extend. The telescopic rod of Electric Push Rod 1 drives the fixed block, Electric Push Rod 2, and the laser wire bonder to continuously move away from or towards Motor 1. The telescopic rod of Electric Push Rod 2 will continuously contract or extend. The telescopic rod of Electric Push Rod 2 will drive the laser wire bonder to continuously move up and down reciprocally. At the same time, the output shaft of Motor 3 drives the threaded rod to continuously rotate. The rotation of the threaded rod will drive the slider, support rod, Electric Push Rod 1, fixed frame, fixed block, Electric Push Rod 2, and the laser wire bonder to move to the next pre-set position. In this way, the laser wire bonder will wire the chips in sequence along the path set by the control panel. When the chip processing is completed, the telescopic rod of Electric Push Rod 2 will contract. The telescopic rod of Electric Push Rod 2 will drive the laser wire bonder to move upward. The telescopic rod of Electric Push Rod 1 will contract. The telescopic rod of Electric Push Rod 1 drives the fixed block, Electric Push Rod 2, and the laser wire bonder to move away from Motor 1. At this time, the output shaft of Motor 1 starts to rotate in the reverse direction. The output shaft of Motor 1 drives the lead screw to rotate in the reverse direction. The reverse rotation of the lead screw will drive the skateboard, two carriages, two long rods, two clamping plates, the long board, Motor 2, and the cam to move away from the transparent protective box. The output shaft of Motor 2 drives the cam to rotate in the reverse direction. The two springs will reset and drive the two carriages and the two clamping plates to move away from each other. The two clamping plates no longer clamp the chip. The other carriage drives the two long rods and the long board to move towards the control panel. Then, manually remove the chip and place the next chip on the skateboard again. Repeat this process in sequence.It can clamp and position the chip during wire bonding, making the chip more stable during the wire bonding process, thus making the wire bonding process more precise, improving the wire bonding effect of the chip, and can also move the laser wire bonder according to the set path and wire bond several welding points on the chip in sequence, making the wire bonding efficiency of the chip higher.

[0018] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wire bonding device for integrated circuit chip production, characterized in that: The invention comprises a base frame, a transparent protective box, a control panel, a positioning component and a welding wire component. The transparent protective box is arranged on the upper part of the base frame, the control panel is arranged on the upper part of the base frame, the positioning component is arranged on the base frame, the welding wire component is arranged on the base frame, and the welding wire component is located inside the transparent protective box.

2. A wire bonding device for integrated circuit chip production according to claim 1, characterized in that: The positioning component includes motor 1, screw rod, skateboard, slide, long rod, spring, splint, long board, motor 2 and cam. Motor 1 is provided on the upper part of the base frame, and motor 1 is electrically connected to the control panel. A screw rod is rotatably connected to the upper part of the base frame, and the screw rod is fixedly connected to the output shaft of motor 1. A skateboard is slidably connected to the upper part of the base frame, and the skateboard is threadedly connected to the screw rod. Two slides are slidably connected to the upper part of the skateboard, and the two slides are symmetrically arranged. Two long rods are provided on one of the slides, and the two long rods pass through the other slide. Two springs are connected between the two slides, and the springs are sleeved on the long rods. Splints are provided on the sides of the two slides close to each other, and a long board is provided between the two long rods. Motor 2 is provided on the upper part of the skateboard, and motor 2 is electrically connected to the control panel. A cam is provided on the output shaft of motor 2, and the cam is rotatably connected to the skateboard, and the cam will contact one of the slides and the long board.

3. A wire bonding device for integrated circuit chip production according to claim 1, characterized in that: The welding wire components include a fixed plate, a motor three, a threaded rod, a guide rod, a slider, a support rod, a limit rod, an electric push rod one, a fixed frame, a fixed block, an electric push rod two and a laser wire welding machine. A fixed plate is provided on the bottom frame, a motor three is provided on one side of the fixed plate, the motor three is electrically connected to the control panel, a threaded rod is rotatably connected to the fixed plate, a guide rod is provided on the fixed plate, a slider is slidably connected to the fixed plate, the slider is connected to the threaded rod by threads, the slider passes through the guide rod, a support rod is provided on the upper part of the slider, a limit rod is provided in the transparent protective box, and the limit rod is connected to the support rod. The support rod is slidably connected, and an electric push rod 1 is provided on the support rod, and the electric push rod 1 is electrically connected to the control panel. A fixed frame is slidably connected to the transparent protective box, and the fixed frame is fixedly connected to the support rod. A fixed block is slidably connected to the fixed frame, and the fixed block is fixedly connected to the telescopic rod of the electric push rod 1. An electric push rod 2 is provided on the upper part of the fixed block, and the electric push rod 2 is electrically connected to the control panel. The telescopic rod of the electric push rod 2 passes through the fixed block, and a laser wire welding machine is provided on the telescopic rod of the electric push rod 2, and the laser wire welding machine is electrically connected to the control panel.

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