Laser etching equipment

Abstract

The utility model discloses laser etching equipment. The laser etching equipment comprises a working platform, the adsorption platform comprises an adsorption surface, a plurality of adsorption holes are formed in the adsorption surface, and an adsorption cavity communicated with the adsorption holes is formed in the adsorption platform; the shifting mechanism is arranged on the working face and used for driving the adsorption platform to move in the X-axis direction and the Y-axis direction. The vacuum mechanism communicates with the adsorption cavity so as to form negative pressure in the adsorption cavity, and at least part of the connecting pipeline can be arranged in a telescopic mode in the X-axis direction and the Y-axis direction; the mechanical alignment mechanisms are arranged on the two sides of the adsorption platform and used for adjusting and limiting the position of the workpiece located on the adsorption face. The connecting pipeline of the vacuum mechanism can keep negative pressure in the adsorption cavity in the movement process of the adsorption platform, the mechanical alignment mechanisms are arranged on the two sides of the adsorption platform, the position of a workpiece located on the adsorption face can be adjusted and limited, the fixing stability and the position precision of the workpiece are guaranteed when the adsorption platform moves, and the machining precision is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of photovoltaic laser processing equipment, and specifically relates to a laser etching device. Background Art

[0002] Laser scribing of photovoltaic cells is one of the key steps in the manufacturing process of solar cells, mainly used to construct the series circuit of the cells. Laser scribing usually includes fine scribing on different layers of perovskite cells through laser etching technology, and these layers may include FTO conductive glass (P1), perovskite layer (P2), and gold or silver plating materials (P3). The purpose of scribing is to divide the cell area, so as to connect multiple cell units in series to increase the voltage. High-precision laser scribing is crucial for the mass production of large-area perovskite cells. Especially when forming the series structure of sub-cells, precise etching of different film layers at different positions is required, which requires that the laser process, system stability, and precision must all reach extremely high standards.

[0003] Currently, in order to ensure the stability of the laser light path, the laser scribing is often achieved by driving the movement of the cell. However, the existing laser etching equipment cannot ensure the fixed stability and position accuracy of the cell during the movement, resulting in the accuracy of the laser scribing process being affected, and the performance and yield of the photovoltaic cell being affected. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a laser etching device, which can solve the technical problem that the existing laser etching equipment cannot ensure the fixed stability and position accuracy of the cell during the movement, resulting in the accuracy of the laser scribing process being affected, and the performance and yield of the photovoltaic cell being affected.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] Provide a laser etching device, including:

[0007] An operation platform, including an operation surface;

[0008] An adsorption platform, arranged on the operation surface. The adsorption platform includes an adsorption surface for carrying a workpiece, and a plurality of adsorption holes are arranged on the adsorption surface. An adsorption cavity communicating with the adsorption holes is formed inside the adsorption platform;

[0009] A displacement mechanism, arranged on the operation surface. The displacement mechanism is used to drive the adsorption platform to move along the X-axis direction and the Y-axis direction;

[0010] A vacuum mechanism is connected to the adsorption cavity to form a negative pressure inside the adsorption cavity. The vacuum mechanism includes a vacuum generating element and a connecting pipe that connects the output end of the vacuum generating element and the adsorption cavity. At least part of the connecting pipe can be telescopically arranged along the X-axis direction and the Y-axis direction to maintain the negative pressure in the adsorption cavity during the movement of the adsorption platform.

[0011] A mechanical alignment mechanism is arranged on both sides of the adsorption platform. The mechanical alignment mechanism is used to adjust and limit the position of the workpiece located on the adsorption surface.

[0012] In one or more embodiments, the mechanical alignment mechanism includes:

[0013] A limiting plate is arranged on the side of the adsorption platform. A limiting surface located above the adsorption surface is arranged on the side of the limiting plate facing the adsorption platform.

[0014] An alignment telescopic cylinder is arranged on the side of the adsorption platform. The alignment telescopic cylinder is used to drive the limiting plate to make a reciprocating motion away from or close to the adsorption platform, so that the limiting surface can contact the edge of the workpiece to adjust the position of the workpiece.

[0015] In one or more embodiments, limiting ridges are arranged on the limiting surface so that the workpiece can be pressed and limited by the limiting ridges.

[0016] In one or more embodiments, the side of the limiting ridge facing the workpiece is an inclined surface, so that the thickness of the limiting ridge gradually increases in the direction away from the adsorption platform.

[0017] In one or more embodiments, the adsorption platform further includes a plurality of positioning pins arranged at the edge of the adsorption surface.

[0018] In one or more embodiments, the displacement mechanism includes:

[0019] An X-axis guide rail is arranged on the working surface;

[0020] An X-axis slide plate is slidably installed on the X-axis guide rail;

[0021] A Y-axis guide rail is arranged on the X-axis slide plate;

[0022] Wherein, the adsorption platform is slidably installed on the Y-axis guide rail.

[0023] In one or more embodiments, the displacement mechanism further includes a transportation fixing plate, and both ends of the transportation fixing plate are detachably connected to the X-axis slide plate and the adsorption platform respectively.

[0024] In one or more embodiments, the connecting pipe includes:

[0025] The Y-axis telescopic pipe is arranged on the X-axis slide plate and extends along the Y-axis direction. The Y-axis telescopic pipe includes a first end communicating with the adsorption cavity and a second end extending outside the Y-axis guide rail.

[0026] The X-axis telescopic pipe is arranged on the working surface and extends along the X-axis direction. The X-axis telescopic pipe includes a third end communicating with the second end and a fourth end communicating with the output end of the vacuum generating element.

[0027] In one or more embodiments, the vacuum mechanism further includes:

[0028] The Y-axis pipe guide rail is arranged below the Y-axis telescopic pipe;

[0029] The Y-axis slider is slidably mounted on the Y-axis pipe guide rail, and the Y-axis slider is fixed to the Y-axis telescopic pipe through a pipe clamp.

[0030] The X-axis pipe guide rail is arranged below the X-axis telescopic pipe;

[0031] The X-axis slider is slidably mounted on the X-axis pipe guide rail, and the X-axis slider is fixed to the X-axis telescopic pipe through a pipe clamp.

[0032] In one or more embodiments, the connecting pipe further includes right-angle elbows arranged between the first end and the adsorption cavity, between the second end and the third end, and between the fourth end and the output end of the vacuum generating element.

[0033] In one or more embodiments, a loading / unloading station and a processing station are sequentially arranged along the X-axis direction on the working surface, and the laser etching equipment further includes:

[0034] The laser processing mechanism is arranged above the processing station, and the laser processing mechanism includes a laser output end facing the processing station;

[0035] The housing covers the working surface, and an artificial loading / unloading door and an automatic loading / unloading port are respectively arranged on two side surfaces of the housing close to the loading / unloading station.

[0036] In one or more embodiments, the laser processing mechanism includes:

[0037] The Z-axis guide rail;

[0038] The Z-axis slide plate is slidably mounted on the Z-axis guide rail;

[0039] The laser head is arranged on the Z-axis slide plate, and the laser output end is arranged at one end of the laser head facing the processing station;

[0040] A vision positioning camera is arranged on the Z-axis slide plate, and the vision positioning camera is used to collect the corner images of the workpiece to obtain the actual position of the workpiece.

[0041] Different from the prior art, the beneficial effects of this application are:

[0042] In the adsorption platform of the laser etching equipment of this application, the internal adsorption cavity is connected with a vacuum mechanism. The connecting pipe of the vacuum mechanism can maintain the negative pressure in the adsorption cavity during the movement of the adsorption platform, ensuring the fixing stability and position accuracy of the workpiece when the adsorption platform moves, and improving the processing accuracy;

[0043] Mechanical alignment mechanisms are arranged on both sides of the adsorption platform of the laser etching equipment of this application. The mechanical alignment mechanisms can adjust and limit the position of the workpiece located on the adsorption surface, ensuring the fixing stability and position accuracy of the workpiece, and improving the processing accuracy;

[0044] The laser etching equipment of this application can be compatible with manual loading and unloading and automatic loading and unloading, facilitating the loading and unloading operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0046] Figure 1 It is a schematic structural diagram of an embodiment of the laser etching equipment of this application;

[0047] Figure 2 It is a schematic top view structural diagram of an embodiment of the laser etching equipment of this application after removing the housing;

[0048] Figure 3 It is a schematic structural diagram of an embodiment of the laser processing mechanism of this application;

[0049] Figure 4 It is a schematic structural diagram of an embodiment of the shifting mechanism of this application;

[0050] Figure 5 It is a schematic structural diagram of an embodiment of the mechanical alignment mechanism of this application;

[0051] Figure 6 It is a schematic structural diagram of an embodiment of the connecting pipe of this application;

[0052] Figure 7 is Figure 6Schematic diagram of the structure after removing the Y-axis telescopic pipe and the X-axis telescopic pipe.

[0053] As shown in the figure:

[0054] Workbench 100; working surface 101; loading and unloading station 102; processing station 103

[0055] Shell 200; manual loading and unloading door 201; automatic loading and unloading port 202;

[0056] Laser processing mechanism 300; Z-axis guide rail 301; Z-axis slide plate 302; laser head 303; vision positioning camera 304;

[0057] Shifting mechanism 400; X-axis guide rail 401; X-axis slide plate 402; Y-axis guide rail 403; transportation fixing plate 404;

[0058] Adsorption platform 500; adsorption holes 501; positioning pins 502;

[0059] Mechanical alignment mechanism 600; limit plate 601; limit surface 6011; limit convex rib 6012; alignment telescopic cylinder 602;

[0060] Vacuum mechanism 700; Y-axis telescopic pipe 701; first end 7011; second end 7012; X-axis telescopic pipe 702; third end 7021; fourth end 7022; right-angle elbow 703; Y-axis pipe guide rail 704; X-axis pipe guide rail 705; Y-axis slider 706; X-axis slider 707; pipe clamp 708. Detailed implementation manners

[0061] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0062] In order to solve the technical problem that the existing laser etching equipment cannot ensure the fixed stability and position accuracy of the battery during movement, resulting in the accuracy of the laser scribing process being affected and the performance and yield rate of the photovoltaic battery being affected, the applicant has developed a new type of laser etching equipment, which can ensure the fixed stability and position accuracy of the workpiece during movement, thereby ensuring the processing accuracy and device performance.

[0063] Specifically, please refer to Figure 1 , Figure 1It is a schematic structural diagram of an embodiment of the laser etching equipment of the present application. As Figure 1 shown, the laser etching equipment includes an operating table 100, an operating surface 101 is provided on the operating table 100, and a housing 200 is arranged on the operating surface 101 to form a sealed space inside the housing 200.

[0064] Among them, an artificial loading and unloading door 201 and an automatic loading and unloading port 202 are respectively arranged on two adjacent side surfaces of the housing 200, so that manual loading and unloading and automatic loading and unloading can be compatible.

[0065] Please refer to Figure 2 , Figure 2 It is a schematic top view structural diagram of an embodiment of the laser etching equipment of the present application after removing the housing. As Figure 2 shown, a loading and unloading station 102 and a processing station 103 are formed on the operating surface 101 and arranged in sequence along the X-axis direction, and the artificial loading and unloading door 201 and the automatic loading and unloading port 202 are arranged on one side close to the loading and unloading station 102.

[0066] A laser processing mechanism 300 is arranged at the processing station 103, and the laser processing mechanism 300 is used for laser processing of workpieces.

[0067] A displacement mechanism 400 and an adsorption platform 500 are arranged on the operating surface 101, and the adsorption platform 500 includes an adsorption surface for carrying workpieces.

[0068] The displacement mechanism 400 is used to drive the adsorption platform 500 to move along the X-axis direction and the Y-axis direction, so as to transport the adsorption platform 500 between the loading and unloading station 102 and the processing station 103, and adjust the position of the adsorption platform 500 at the processing station 103, so as to realize the laser processing operation of workpieces.

[0069] The structure of the laser processing mechanism 300 of the present application will be introduced below. Please refer to Figure 3 , Figure 3 It is a schematic structural diagram of an embodiment of the laser processing mechanism of the present application. As Figure 3 shown, the laser processing mechanism 300 includes a Z-axis guide rail 301 arranged above the processing station 103, a Z-axis slide plate 302 is slidably installed on the Z-axis guide rail 301, a laser head 303 is arranged on the Z-axis slide plate 302, and a laser output end is arranged at one end of the laser head 303 facing the processing station 103.

[0070] In order to realize the visual positioning of workpieces, the laser processing mechanism 300 further includes a visual positioning camera 304 arranged on the Z-axis slide plate 302. The visual positioning camera 304 is used to collect the corner images of workpieces to obtain the actual positions of workpieces, so as to judge in real time whether the positions of workpieces are offset during workpiece processing.

[0071] The structure of the shifting mechanism 400 of the present application will be introduced below. Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of an embodiment of the shifting mechanism of the present application. As Figure 4 shown, in this embodiment, the shifting mechanism 400 includes an X-axis guide rail 401, an X-axis slide plate 402, and a Y-axis guide rail 403. The X-axis guide rail 401 is arranged on the working surface 101; the X-axis slide plate 402 is slidably mounted on the X-axis guide rail 401; the Y-axis guide rail 403 is arranged on the X-axis slide plate 402; the adsorption platform 500 is slidably mounted on the Y-axis guide rail 403.

[0072] Among them, the X-axis slide plate 402 and the adsorption platform 500 can be slidably controlled by any linear motion driving device commonly used in the art, so as to realize the shifting operation of the adsorption platform 500. Exemplarily, in this embodiment, the linear motors arranged beside the X-axis guide rail 401 and the Y-axis guide rail 403 are respectively used to control the movement of the X-axis slide plate 402 and the adsorption platform 500, which will not be elaborated here.

[0073] In order to prevent the adsorption platform 500 from shaking along the Y-axis guide rail 403 during transportation, the moving mechanism 400 in this embodiment further provides a transportation fixing plate 404. The two ends of the transportation fixing plate 404 are detachably connected to the X-axis slide plate 402 and the adsorption platform 500 respectively, so as to play a role in temporarily fixing the adsorption platform 500 during the transportation of the equipment.

[0074] In order to ensure the fixing stability of the workpiece on the adsorption platform 500, mechanical alignment mechanisms 600 are further arranged on both sides of the adsorption platform 500 in the Y-axis direction. The mechanical alignment mechanisms 600 are used to adjust and limit the position of the workpiece located on the adsorption surface.

[0075] Specifically, please refer to Figure 5 , Figure 5 which is a schematic structural diagram of an embodiment of the mechanical alignment mechanism of the present application.

[0076] As Figure 5 shown, the mechanical alignment mechanism 600 includes a limit plate 601 and an alignment telescopic cylinder 602. The limit plate 601 is arranged on the side of the adsorption platform 500, and a limit surface 6011 located above the adsorption surface is arranged on the side of the limit plate 601 facing the adsorption platform 500; the alignment telescopic cylinder is arranged on the side of the adsorption platform 500 and is used to drive the limit plate 601 to make a reciprocating motion away from or close to the adsorption platform 500, so that the limit surface 6011 can contact the edge of the workpiece to adjust the position of the workpiece.

[0077] It can be understood that by driving the limit plate 601 to move by the alignment telescopic cylinder 602, the workpiece can be completely pushed onto the adsorption surface by the contact between the limit surface 6011 and the edge of the workpiece, realizing the mechanical alignment of the workpiece and ensuring the position accuracy of the workpiece.

[0078] In order to limit the workpiece during movement, in this embodiment, limiting ridges 6012 are arranged on the limiting surface 6011 so that the workpiece can be pressed and limited by the limiting ridges 6012. Among them, the surface of the limiting ridge 6012 facing the workpiece is an inclined surface, so that the thickness of the limiting ridge 6012 gradually increases in the direction away from the adsorption platform 500, thereby being able to adapt to workpieces of different thicknesses.

[0079] Based on this mechanical alignment mechanism 600, the alignment operation of the workpiece and the limitation during the processing can be realized, avoiding the displacement of the workpiece during the processing and improving the processing accuracy.

[0080] To improve the alignment efficiency, as Figure 5 shown, in this embodiment, a plurality of positioning pins 502 are also arranged on the surface of the adsorption platform 500. The positioning pins 502 are located at the edge of the adsorption surface and are arranged in a circle at intervals. A space for placing the workpiece is formed by surrounding the circle of positioning pins 502, thereby realizing rough positioning when the workpiece is placed.

[0081] To further improve the fixing stability of the workpiece, in this embodiment, a plurality of adsorption holes 501 are arranged on the adsorption surface. An adsorption cavity (not shown in the figure) communicating with the adsorption holes 501 is formed inside the adsorption platform 500. The laser etching equipment further includes a vacuum mechanism 700 communicating with the adsorption cavity, thereby forming a negative pressure inside the adsorption cavity.

[0082] Specifically, the vacuum mechanism 700 includes a vacuum generating element (not shown in the figure) and a connecting pipe connecting the output end of the vacuum generating element and the adsorption cavity. To enable the adsorption platform 500 to continuously maintain a negative pressure during movement, please refer to Figure 6 , Figure 6 which is a schematic structural diagram of an embodiment of the connecting pipe of the present application.

[0083] As Figure 6 shown, the connecting pipe includes a Y-axis telescopic pipe 701 and an X-axis telescopic pipe 702. The Y-axis telescopic pipe 701 is arranged on the X-axis slide plate 402 and extends along the Y-axis direction. It includes a first end 7011 communicating with the adsorption cavity and a second end 7012 extending outside the Y-axis guide rail 403. The X-axis telescopic pipe 702 is arranged on the working surface 101 and extends along the X-axis direction. It includes a third end 7021 communicating with the second end 7012 and a fourth end 7022 communicating with the output end of the vacuum generating element.

[0084] Understandably, when the adsorption platform 500 moves along the X-axis, since the X-axis telescopic pipe 702 is telescopically arranged, the vacuum pumping operation can be continuously carried out; when the adsorption platform 500 moves along the Y-axis, since the Y-axis telescopic pipe 701 is telescopically arranged, the vacuum pumping operation can be continuously carried out, so as to ensure the negative pressure inside the adsorption cavity during the movement of the adsorption platform 500 and ensure the fixing stability of the workpiece.

[0085] In order to ensure the connection stability of each pipeline, in this embodiment, the connecting pipeline further includes a right-angle elbow 703 arranged between the first end 7011 and the adsorption cavity, between the second end 7012 and the third end 7021, and between the fourth end 7022 and the output end of the vacuum generating element.

[0086] Further, in order to limit the movement of the Y-axis telescopic pipe 701 and the X-axis telescopic pipe 702, please refer to Figure 7 , Figure 7 is Figure 6 the schematic structural diagram after removing the Y-axis telescopic pipe 701 and the X-axis telescopic pipe 702 in

[0087] As Figure 7 shown, the vacuum mechanism 700 further includes a Y-axis pipe guide 704 and an X-axis pipe guide 705. Among them, the Y-axis pipe guide 704 is arranged below the Y-axis telescopic pipe 701, and a plurality of Y-axis sliders 706 are slidably installed on the Y-axis pipe guide 704. The Y-axis sliders 706 are fixed to the Y-axis telescopic pipe 701 through pipe clamps 708.

[0088] The X-axis pipe guide 705 is arranged below the X-axis telescopic pipe 702, and a plurality of X-axis sliders 707 are slidably installed on the X-axis pipe guide 705. The X-axis sliders 707 are fixed to the X-axis telescopic pipe 702 through pipe clamps 708.

[0089] Based on the above structure, the X-axis telescopic pipe 702 or the Y-axis telescopic pipe 701 can limit its telescopic direction under the combined action of the pipe clamp 708, the slider and the pipe guide, avoiding displacement.

[0090] Based on the laser etching equipment of the above embodiments, it can be compatible with both manual loading and unloading and automatic loading and unloading, ensure the fixing stability and position accuracy of the workpiece during the processing, and ensure the processing effect.

[0091] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any aspect, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.

[0092] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A laser etching device, characterized in that: include: Working platform, including working surface; An adsorption platform is arranged on the working surface, the adsorption platform comprises an adsorption surface for carrying the workpiece, the adsorption surface is arranged with a plurality of adsorption holes, and an adsorption cavity connected with the adsorption holes is formed inside the adsorption platform; A shift mechanism is arranged on the working surface, and is used to drive the adsorption platform to move along the X-axis direction and the Y-axis direction; A vacuum mechanism is connected to the adsorption chamber to form a negative pressure inside the adsorption chamber, the vacuum mechanism includes a vacuum generating element and a connecting pipe connecting the output end of the vacuum generating element and the adsorption chamber, at least a portion of the connecting pipe can be telescopically arranged along the X-axis direction and the Y-axis direction to maintain the negative pressure in the adsorption chamber during the movement of the adsorption platform; The mechanical alignment mechanism is arranged on both sides of the adsorption platform, and the mechanical alignment mechanism is used to adjust and limit the position of the workpiece located on the adsorption surface.

2. The laser etching device according to claim 1, characterized in that: The mechanical alignment mechanism comprises: A limiting plate is arranged on the side of the adsorption platform, and a limiting surface located above the adsorption surface is arranged on the side of the limiting plate facing the adsorption platform, and a limiting ridge is arranged on the limiting surface, so that the workpiece can be pressed and limited by the limiting ridge, and the side of the limiting ridge facing the workpiece is an inclined surface, so that the thickness of the limiting ridge gradually increases in the direction away from the adsorption platform; The alignment telescopic cylinder is arranged on the side of the adsorption platform, and is used to drive the limit plate to make a reciprocating motion away from or close to the adsorption platform, so that the limit surface can contact the edge of the workpiece to adjust the position of the workpiece.

3. The laser etching device according to claim 1, characterized in that: The adsorption platform further includes a plurality of positioning pins arranged at the edge of the adsorption surface.

4. The laser etching device according to claim 1, characterized in that: The shifting mechanism comprises: An X-axis guide rail is arranged on the working surface; An X-axis slide plate is slidably mounted on the X-axis guide rail; A Y-axis guide rail is arranged on the X-axis slide; Wherein, the adsorption platform can be slidably mounted on the Y-axis guide rail.

5. The laser etching device according to claim 4, characterized in that: The shifting mechanism also includes a transport fixing plate, and two ends of the transport fixing plate are detachably connected to the X-axis slide plate and the adsorption platform respectively.

6. The laser etching device according to claim 4, characterized in that: The connecting pipeline comprises: A Y-axis telescopic pipe is extended along the Y-axis direction and arranged on the X-axis slide, wherein the Y-axis telescopic pipe includes a first end communicating with the adsorption chamber and a second end extending to the outside of the Y-axis guide rail; An X-axis telescopic pipe is extended along the X-axis direction and arranged on the working surface. The X-axis telescopic pipe includes a third end connected to the second end and a fourth end connected to the output end of the vacuum generating element.

7. The laser etching device according to claim 6, characterized in that: The vacuum mechanism also includes: A Y-axis pipeline guide rail, arranged below the Y-axis telescopic pipeline; A Y-axis slider is slidably mounted on the Y-axis pipeline guide rail, and the Y-axis slider is fixed to the Y-axis telescopic pipeline through a pipe clamp; An X-axis pipeline guide rail is arranged below the X-axis telescopic pipeline; The X-axis slider is slidably mounted on the X-axis pipeline guide rail, and the X-axis slider is fixed to the X-axis telescopic pipeline through a pipe clamp.

8. The laser etching device according to claim 6, characterized in that: The connecting pipe further includes right-angle elbows arranged between the first end and the adsorption chamber, between the second end and the third end, and between the fourth end and the output end of the vacuum generating element.

9. The laser etching device according to claim 1, characterized in that: The working surface is formed with loading and unloading stations and processing stations arranged in sequence along the X-axis direction, and the laser etching equipment also includes: A laser processing mechanism is arranged above the processing station, and the laser processing mechanism includes a laser output end facing the processing station; The shell body is covered on the working surface, and two sides of the shell body close to the loading and unloading stations are respectively provided with manual loading and unloading doors and automatic loading and unloading ports.

10. The laser etching device according to claim 9, characterized in that: The laser processing mechanism comprises: Z-axis guide rail; A Z-axis slide plate, slidably mounted on the Z-axis guide rail; A laser head is arranged on the Z-axis slide, and the laser output end is arranged at one end of the laser head facing the processing station; The visual positioning camera is arranged on the Z-axis slide, and the visual positioning camera is used to collect images of corners of the workpiece to obtain the actual position of the workpiece.

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