Supply equipment for semiconductor grinding fluid

Abstract

The utility model relates to the technical field of chemical mechanical polishing, and discloses a supply device for semiconductor polishing liquid, which comprises a main liquid supply pipe, one end of the main liquid supply pipe is provided with a U-shaped branch liquid supply pipe I, a horizontal pipe on one side of the branch liquid supply pipe I is provided with a pneumatic valve I, and a horizontal pipe on the other side of the branch liquid supply pipe I is provided with a pneumatic valve II. U-shaped second branch liquid supply pipes are arranged at the two ends of the first branch liquid supply pipe, a liquid drainage pipe is arranged in the middle of each second branch liquid supply pipe, and a flushing pipe is arranged on the surface of the main liquid supply pipe. The U-shaped branch liquid supply pipe I and the U-shaped branch liquid supply pipe II are arranged to realize double liquid supply pipelines, and are matched with the pneumatic valve I and the pneumatic valve II, so that the pipelines can be automatically switched to ensure that liquid supply is not influenced, and shutdown is not needed when the pipelines are abnormal; and the problems of deposition and caking of the grinding liquid are avoided through the automatic cleaning design after clean water is added and then switching is conducted through the arranged flushing pipe.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical mechanical polishing, in particular to a supply device for semiconductor polishing liquid. Background Art

[0002] The polishing liquid is a key consumable in the chemical mechanical polishing process and plays an important role in the chemical mechanical polishing of chips. The polishing liquid, also known as "suspension", refers to solid particles stirred into water, which are not dissolved and dispersed in the liquid. Once the mixture stops shaking, it will precipitate, and it is a non-uniform and heterogeneous mixture.

[0003] However, currently, a single pipeline is usually used for supplying semiconductor polishing liquid. However, when the pipeline supply is abnormal, it is necessary to stop the machine for maintenance, resulting in low supply efficiency. Content of the Utility Model

[0004] The purpose of the utility model is to provide a supply device for semiconductor polishing liquid, which has the effect of automatically switching pipelines and automatically flushing pipelines when an abnormality occurs in the liquid supply pipeline.

[0005] The above technical purpose of the utility model is achieved through the following technical solutions: A supply device for semiconductor polishing liquid includes a main supply pipe. One end of the main supply pipe is provided with a U-shaped sub-supply pipe one. A pneumatic valve one is provided on the horizontal pipe on one side of the sub-supply pipe one. A pneumatic valve two is provided on the horizontal pipe on the other side of the sub-supply pipe one. Both ends of the sub-supply pipe one are provided with U-shaped sub-supply pipes two. A drain pipe is provided in the middle of the sub-supply pipe two. A flushing pipe is provided on the surface of the main supply pipe.

[0006] The further setting of the utility model is: A manual valve is provided on the surface of the main supply pipe, and the manual valve is arranged between the sub-supply pipe one and the flushing pipe.

[0007] The further setting of the utility model is: A pneumatic valve three is provided on the surface of the flushing pipe.

[0008] The further setting of the utility model is: One end of the main supply pipe away from the sub-supply pipe one is provided with a flange one. One end of the drain pipe away from the sub-supply pipe two is provided with a flange four. The top end of the flushing pipe is provided with a flange five.

[0009] The further setting of the utility model is: Both ends of the sub-supply pipe one are provided with flanges two. Both ends of the sub-supply pipe two are provided with flanges three, and the flange three and the flange two are connected by connecting bolts.

[0010] The further setting of the utility model is: A flow meter is provided on the side of the sub-supply pipe one, and the flow meter is arranged at a position close to the sub-supply pipe two.

[0011] In summary, the utility model has the following beneficial effects: The utility model realizes a dual liquid supply pipeline through the provided U-shaped liquid supply branch pipe 1 and liquid supply branch pipe 2, and in cooperation with pneumatic valve 1 and pneumatic valve 2, it can automatically switch the pipeline to ensure that the liquid supply is not affected and there is no need to stop the machine when an abnormality occurs in the pipeline; and through the provided flushing pipe configured with the addition of clean water and the automatic cleaning design after switching, the problem of grinding liquid deposition and caking can be avoided. At the same time, a manual valve is provided at the pipeline switching place to ensure that the liquid medicine can be manually blocked before maintenance, and a pressure holding test can be carried out after maintenance to avoid the problem of liquid supply pipeline leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a three-dimensional structure diagram of the utility model;

[0013] Figure 2 is a three-dimensional structure diagram of the nozzle seat and the nozzle body of the utility model;

[0014] Figure 3 For the utility model Figure 1 is an enlarged structure diagram at position A of the utility model.

[0015] In the figure: 1, main liquid supply pipe; 101, flange 1; 102, manual valve; 2, liquid supply branch pipe 1; 201, pneumatic valve 1; 202, pneumatic valve 2; 203, flange 2; 204, flow meter; 3, liquid supply branch pipe 2; 301, flange 3; 4, connecting bolt; 5, drain pipe; 501, flange 4; 6, flushing pipe; 601, flange 5; 602, pneumatic valve 3. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following will further illustrate the utility model in conjunction with the drawings in the embodiments of the utility model.

[0017] Please refer to Figures 1 to 3 , in the embodiment of the utility model, a supply device for semiconductor grinding liquid includes a main liquid supply pipe 1. One end of the main liquid supply pipe 1 is provided with a U-shaped liquid supply branch pipe 1 to form a dual liquid supply pipeline. A pneumatic valve 1 201 is provided on the horizontal pipe on one side of the liquid supply branch pipe 1, and a pneumatic valve 2 202 is provided on the horizontal pipe on the other side of the liquid supply branch pipe 1. When an abnormality occurs in one of the liquid supply pipelines, the pipeline can be automatically switched without the need to stop the machine for maintenance. Both ends of the liquid supply branch pipe 1 are provided with a U-shaped liquid supply branch pipe 2. A drain pipe 5 is provided in the middle of the liquid supply branch pipe 2. A flushing pipe 6 is provided on the surface of the main liquid supply pipe 1. Clean water is added through the flushing pipe 6 to flush the liquid supply pipeline to avoid the problem of grinding liquid deposition and caking. A pneumatic valve 3 602 is provided on the surface of the flushing pipe 6 to control the opening and closing of the flushing pipe 6;

[0018] In this embodiment, preferably, a manual valve 102 is provided on the surface of the main liquid supply pipe 1, and the manual valve 102 is arranged between the first sub-liquid supply pipe 2 and the flushing pipe 6. When it is necessary to repair the liquid supply pipeline, the manual valve 102 is closed to manually block the liquid medicine before maintenance, and to perform a pressure holding test after maintenance to avoid liquid leakage problems in the liquid supply pipeline;

[0019] In this embodiment, preferably, a first flange 101 is provided at one end of the main liquid supply pipe 1 away from the first sub-liquid supply pipe 2, so that the main liquid supply pipe 1 can be connected to the liquid outlet pipe of the semiconductor grinding liquid. A fourth flange 501 is provided at one end of the drain pipe 5 away from the second sub-liquid supply pipe 3, so that the drain pipe 5 can be connected to the liquid inlet pipe of the equipment to introduce the grinding liquid into the equipment. A fifth flange 601 is provided at the top of the flushing pipe 6, so that the flushing pipe 6 can be connected to a water pipe to introduce cleaning water through the flushing pipe 6 to flush the pipeline;

[0020] In this embodiment, preferably, second flanges 203 are provided at both ends of the first sub-liquid supply pipe 2, and third flanges 301 are provided at both ends of the second sub-liquid supply pipe 3, and the third flange 301 and the second flange 203 are connected by connecting bolts 4, so that the first sub-liquid supply pipe 2 and the second sub-liquid supply pipe 3 can be quickly assembled and disassembled;

[0021] In this embodiment, preferably, a flow meter 204 is provided on the side of the first sub-liquid supply pipe 2, and the flow meter 204 is arranged at a position close to the second sub-liquid supply pipe 3. The liquid supply conditions of each liquid supply pipeline can be detected in real time through the provided flow meter 204 to prevent the pipeline from being blocked and affecting the liquid supply of the grinding liquid.

[0022] During use, first connect the main liquid supply pipe 1 to the liquid outlet pipe of the semiconductor grinding liquid through the first flange 101, and open the manual valve 102 to discharge the semiconductor grinding liquid through the main liquid supply pipe 1, the first sub-liquid supply pipe 2, the second sub-liquid supply pipe 3 and the drain pipe 5 for liquid supply;

[0023] The flow of the two liquid supply pipelines is detected through the flow meter 204. When an abnormality occurs in the liquid supply pipeline, the opening and closing of the first pneumatic valve 201 and the second pneumatic valve 202 are controlled to automatically switch the pipeline to ensure that the liquid supply is not affected and there is no need to stop the machine when an abnormality occurs in the pipeline; after the liquid supply is completed, connect the flushing pipe 6 to the water pipe through the fifth flange 601, and open the third pneumatic valve 602 to add clean water through the flushing pipe 6 to flush the liquid supply pipeline to avoid the problem of grinding liquid deposition and caking;

[0024] When it is necessary to repair the liquid supply pipeline, close the manual valve 102 to manually block the liquid medicine before maintenance, and to perform a pressure holding test after maintenance to avoid liquid leakage problems in the liquid supply pipeline.

[0025] The above are only the preferred embodiments of the present utility model. Therefore, all equivalent changes or modifications made according to the structures, features and principles described in the scope of the patent application of the present utility model are included in the scope of the patent application of the present utility model.

Claims

1. A supply device for semiconductor polishing liquid, comprising a main liquid supply pipe (1), characterized in that: A U-shaped branch liquid supply pipe (2) is provided at one end of the main liquid supply pipe (1); a pneumatic valve (201) is provided on a transverse pipe on one side of the branch liquid supply pipe (2); a pneumatic valve (202) is provided on a transverse pipe on the other side of the branch liquid supply pipe (2); U-shaped branch liquid supply pipes (3) are provided at both ends of the branch liquid supply pipe (2); a drain pipe (5) is provided in the middle of the branch liquid supply pipe (3); and a flushing pipe (6) is provided on the surface of the main liquid supply pipe (1).

2. The semiconductor polishing liquid supply device according to claim 1, characterized in that: A manual valve (102) is provided on the surface of the main liquid supply pipe (1), and the manual valve (102) is arranged between the branch liquid supply pipe 1 (2) and the flushing pipe (6).

3. The semiconductor polishing liquid supply device according to claim 1, characterized in that: A pneumatic valve three (602) is provided on the surface of the flushing pipe (6).

4. The semiconductor polishing liquid supply device according to claim 1, characterized in that: The end of the main liquid supply pipe (1) away from the branch liquid supply pipe (2) is provided with a flange plate one (101), the end of the discharge pipe (5) away from the branch liquid supply pipe (3) is provided with a flange plate four (501), and the top end of the flushing pipe (6) is provided with a flange plate five (601).

5. The semiconductor polishing liquid supply device according to claim 1, characterized in that: The two ends of the liquid distribution pipe 1 (2) are provided with flange 2 (203), the two ends of the liquid distribution pipe 2 (3) are provided with flange 3 (301), and the flange 3 (301) and flange 2 (203) are connected by connecting bolts (4).

6. The semiconductor polishing liquid supply device according to claim 1, characterized in that: A flow meter (204) is provided on the side of the first liquid supply pipe (2), and the flow meter (204) is arranged at a position close to the second liquid supply pipe (3).

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