Deep processing control system and circuit board drilling equipment

Abstract

The utility model relates to the technical field of machining, in particular to a controlled deep processing system and circuit board drilling equipment, and the controlled deep processing system comprises a cutter detector, a processing assembly, a speed detection device and a position measurement device; the machining assembly comprises a main shaft and a scrap suction cover which can move up and down and is arranged at the lower end of the main shaft, and when the main shaft clamps the cutter, the cutter has an initial position where the cutter retracts into the scrap suction cover and a first position and a second position where the cutter extends out of the scrap suction cover; the first position is the position where the tool nose reaches the measuring point of the tool detector, and the second position is the position where the tool nose reaches the depth control depth of the workpiece; the position measuring device is used for measuring the distance between the initial position and the first position and measuring the distance between the initial position and the second position; and the speed detection device is used for indicating the position measurement device to start measuring the distance of the cutter moving from the initial position to the first position and indicating the position measurement device to start measuring the distance of the cutter moving from the initial position to the second position.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board machining, in particular to a controlled deep processing system and a circuit board drilling device. Background Art

[0002] The following technical problems existing in the controlled deep processing system of the existing circuit board drilling device will lead to insufficient controlled deep processing accuracy:

[0003] (1) During the tool change process of the spindle, each tool change will cause a difference in the position where the spindle nozzle holds the tool shank, which will cause the distance between the tool tip and the pressure foot of the chip suction cover to change dynamically.

[0004] (2) The pressure foot of the chip suction cover is made of plastic, and it will wear and become thinner during the processing, which will also cause the distance between the spindle tool tip and the pressure foot of the chip suction cover to change dynamically.

[0005] To solve the above technical problems, a conductive aluminum foil is often covered on the upper layer of the PCB board to be processed. The spindle tool tip conducts with the aluminum foil to form a trigger electrical signal. The first grating of the Z-axis takes the position of the trigger electrical signal as the origin to control the drilling depth of the spindle, so as to realize the controlled depth function of the PCB board. However, there is a shortcoming in the above method, that is, a conductive aluminum foil must be covered on the PCB board to be processed, otherwise the trigger electrical signal cannot be formed, and the controlled depth function cannot be realized. Adding an additional conductive aluminum foil not only increases the customer's production cost, but also cannot meet the PCB board production process in the scenario where the conductive aluminum foil cannot be covered. Summary of the Utility Model

[0006] This application provides a controlled deep processing system, aiming to solve the problem of insufficient controlled depth accuracy caused by the dynamic change in the use process between the spindle tool tip and the bottom of the pressure foot of the chip suction cover.

[0007] In a first aspect, an embodiment of this application provides a controlled deep processing system, including:

[0008] A tool detector;

[0009] A processing component, the processing component includes a spindle and a chip suction cover that can move up and down at the lower end of the spindle. In the state where the spindle holds the tool, the tool has an initial position retracted into the chip suction cover, and a first position and a second position extending out of the chip suction cover; wherein,

[0010] The first position is the position where the tool tip of the tool reaches the measurement point of the tool detector, and the second position is the position where the tool tip of the tool reaches the controlled depth of the workpiece.

[0011] A position measuring device for measuring the distance between the initial position and the first position, and for measuring the distance between the initial position and the second position;

[0012] A speed detection device for detecting whether there is a sudden change in the moving speed of the tool relative to the bottom of the chip suction cover, so as to indicate the position measuring device to start measuring the distance that the tool moves from the initial position to the first position when the bottom of the chip suction cover abuts against the tool detector, and to indicate the position measuring device to start measuring the distance that the tool moves from the initial position to the second position when the bottom of the chip suction cover abuts against the workpiece.

[0013] In some embodiments, the tool detector includes a detection seat and an abutting table. The detection seat is provided with a detection groove for the tool to pass through, the measurement point is located in the detection groove, and the abutting table is arranged above the detection seat.

[0014] In some embodiments, an induction device is arranged in the detection seat. The induction device includes a transmitting end and a receiving end. The transmitting end and the receiving end are respectively arranged on opposite sides of the detection groove. The side wall of the detection groove is provided with a first opening corresponding to the transmitting end and a second opening corresponding to the receiving end.

[0015] In some embodiments, it further includes a processing platform and a cross beam. The processing platform is used for carrying the workpiece. The processing component is movably arranged on the cross beam, and the tool detector is arranged on the side of the processing platform away from the cross beam.

[0016] In some embodiments, the deep processing control system further includes a first substrate and a second substrate. The first substrate is arranged on the cross beam, the processing component is arranged on the second substrate, the second substrate is connected to the first substrate in a liftable manner, and the speed detection device includes a first scale tape and a first reading head that are adapted to each other. One of the first scale tape and the first reading head is arranged on the second substrate, and the other is arranged on the processing component.

[0017] In some embodiments, the processing component further includes a guide post and a telescopic mechanism. The main shaft and the telescopic mechanism are arranged on the second substrate. Both ends of the guide post are respectively connected to the chip suction cover and the telescopic mechanism. The telescopic mechanism drives the guide post to move up and down to drive the chip suction cover to move up and down relative to the main shaft, and the first reading head is fixed on the guide post.

[0018] In some embodiments, the processing component further includes a bottom plate and a base that are connected to each other. The bottom plate is sleeved on the guide post, the base is arranged on the second substrate, and the first reading head is arranged on the base.

[0019] In some embodiments, the position measuring device includes a second scale tape and a second reading head that are adapted to each other. The second reading head is disposed on a side of the first substrate facing the second substrate, and the second scale tape is disposed on a side edge of the second substrate.

[0020] In some embodiments, the distance from the initial position to the first position is D 1 , and the distance to the second position is D 3 , the upper end of the tool detector has a contact surface for abutting against the bottom of the chip suction hood, and the distance from the contact surface to the tool measuring point of the tool detector is D 2 , the controlled depth of the workpiece is D 4 , D 4 = D 3 -(D 1 -D 2 ).

[0021] In a second aspect, an embodiment of the present application further provides a circuit board drilling device, including the controlled depth processing system as described in the first aspect. The controlled depth processing system includes a plurality of processing components and a plurality of tool detectors, and the processing components and the tool detectors are arranged in one-to-one correspondence.

[0022] Compared with the prior art, the technical solution of the present invention has at least the following technical effects:

[0023] The technical solution of this application provides a controlled deep processing system equipped with a tool detector. By setting a speed detection device and a position detection device on the processing component of the controlled deep processing system, the technical problem of insufficient controlled deep processing accuracy of the controlled deep processing system caused by the dynamic change of the distance between the tip of the tool and the bottom of the chip suction cover pressing foot is solved. In the technical solution of this application, before processing the workpiece, it is necessary to first use the tool detector in cooperation with the processing component to measure the distance between the tip of the tool in the processing component and the bottom of the chip suction cover pressing foot: move the processing component above the tool detector and move the processing component downward. When the bottom of the chip suction cover abuts against the tool detector, the speed detection device detects a sudden change in the moving speed of the tool relative to the bottom of the chip suction cover, indicating that the position measurement device starts to measure the distance that the tool moves from the initial position to the first position. The position from the abutting position of the tool detector and the bottom of the chip suction cover to the measurement point of the tool detector is a measurable fixed value. Subtracting this fixed value from the distance from the initial position to the first position can calculate the distance between the tip of the tool and the bottom of the chip suction cover pressing foot; then use the processing component to perform controlled deep processing on the workpiece: move the processing component above the workpiece and move the processing component downward. When the bottom of the chip suction cover abuts against the workpiece, the speed detection device detects a sudden change in the moving speed of the tool relative to the bottom of the chip suction cover, indicating that the position measurement device starts to measure the distance that the tool moves from the initial position to the second position. Subtracting the distance between the tip of the tool and the bottom of the chip suction cover pressing foot from the distance from the initial position to the second position can obtain the actual controlled deep processing depth of the workpiece. The controlled deep processing system of this application can achieve precise controlled deep processing without adding additional conductive aluminum foil to the workpiece during the controlled deep processing process, and has the advantages of low cost and wide application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present utility model will be further described below with reference to the drawings and embodiments.

[0025] Figure 1 It is a schematic structural diagram of the circuit board drilling equipment of this application in an embodiment;

[0026] Figure 2 It is a schematic structural diagram of the controlled deep processing system of this application in an embodiment;

[0027] Figure 3 is Figure 2 exploded view of;

[0028] Figure 4 It is a schematic structural diagram of the tool detector of this application in an embodiment;

[0029] Figure 5Schematic diagram of the cooperation between the processing component and the tool detector of the present application;

[0030] Figure 6 is Figure 5 partial sectional view of;

[0031] Figure 7 is Figure 6 enlarged view of part A of.

[0032] Reference numerals:

[0033] Label Name Label Name 1000 Circuit board drilling equipment 100 Processing platform 200 Processing component 210 First substrate 221 Second substrate 2211 Slider 2221 Spindle 2222 Chip suction hood 2223 Tool 2224 Guide post 223 Telescopic mechanism (fourth driving part) 230 Speed detection device 231 First tape 232 First reading head 240 Position measurement device 241 Second tape 242 Second reading head 250 Mounting seat 251 Bottom plate 252 Base 300 Tool detector 310 Detection seat 311 Detection groove 312 Opening 320 Induction device 330 Abutting table Specific embodiments

[0034] In order to better understand the technical solution of the present utility model, the embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.

[0035] It should be clear that the described embodiments are only part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0036] The terms used in the embodiments of the present utility model are only for the purpose of describing specific embodiments, and are not intended to limit the present utility model. The singular forms of "a", "the" and "said" used in the embodiments of the present utility model and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0037] It should be understood that the term " / and / " used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0038] The present application proposes a circuit board drilling device 1000.

[0039] For the convenience of description, the length direction of the circuit board drilling device 1000 is defined as the X-axis direction, the width direction of the circuit board drilling device 1000 is defined as the Y-axis direction, and the height direction of the circuit board drilling device 1000 is defined as the Z-axis direction. The X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other in pairs.

[0040] When describing the circuit board drilling device 1000 in the embodiments of the present application, the orientation terms such as "upper", "lower", "top", "bottom", "left", "right", "front" and "rear" are mainly based on the circuit board drilling device 1000 in the attached Figure 1 and attachedFigure 2 The display orientation in [reference] is described as follows: facing the positive direction of the Z-axis is "top" and "upper", facing the negative direction of the Z-axis is "bottom" and "lower", facing the positive direction of the X-axis is "right", facing the negative direction of the X-axis is "left", facing the positive direction of the Y-axis is "rear", and facing the negative direction of the Y-axis is "front". It does not limit the orientation of the circuit board drilling device 1000 in the actual application scenario.

[0041] Please refer to Figure 1 and Figure 2 In the embodiment of the present application, the circuit board drilling device 1000 includes a precision processing system. The precision processing system includes a processing platform 100, a cross beam, and a processing component 200. Among them, the processing platform 100 is used to carry the workpiece, the cross beam is arranged on the processing platform 100, and the processing component 200 is movably arranged on the cross beam.

[0042] In the embodiment of the present application, a plurality of processing positions arranged along the X-axis direction are provided on the processing platform 100. A first driving member and a second driving member are provided on the cross beam. The processing component 200 is arranged above the processing platform 100. The first driving member is used to drive the processing component 200 to move along the X-axis direction relative to the processing platform 100, and the second driving member is used to drive the processing component 200 to move along the Y-axis direction relative to the processing platform 100.

[0043] In the embodiment of the present application, specifically, the precision processing system further includes a first substrate 210 and a second substrate 221. The processing component 200 is arranged on the front side of the second substrate 221. The second substrate 221 is installed on the cross beam through the first substrate 210. The second substrate 221 is vertically movable relative to the first substrate 210. The first driving member is used to drive the first substrate 210 to move along the X-axis direction relative to the processing platform 100, and the second driving member is used to drive the first substrate 210 to move along the Y-axis direction relative to the processing platform 100.

[0044] Please refer to Figure 2, in the embodiment of the present application, the processing component 200 includes a main shaft 2221, a chip suction cover 2222 and a tool 2223, and the precision deep processing system further includes a third driving member and a fourth driving member 223. The second substrate 221 is vertically movable and arranged on the front side of the first substrate 210, and the third driving member is used to drive the second substrate 221 to move up and down along the Z-axis direction relative to the first substrate 210. The main shaft 2221 is arranged on the front side of the second substrate 221, and a clamping portion is arranged at the lower end of the main shaft 2221. The head of the tool 2223 is detachably fixed to the clamping portion of the main shaft 2221. The chip suction cover 2222 is arranged below the main shaft 2221, the chip suction cover 2222 is sleeved on the tool 2223, and a pressing foot (i.e., the pressing foot of the chip suction cover 2222) is arranged below the chip suction cover 2222. The chip suction cover 2222 can contract upward from the natural elongation state. The fourth driving member 223 is arranged on the front side of the second substrate 221, and the fourth driving member 223 is in transmission connection with the chip suction cover 2222 and is used to drive the chip suction cover 2222 to move up and down relative to the main shaft 2221. During the process of replacing the tool 2223 of the processing component 200, the fourth driving member 223 drives the chip suction cover 2222 to move upward to extend the tip of the tool 2223 to be replaced from the bottom of the chip suction cover 2222, and then the tool 2223 is replaced.

[0045] In the embodiment of the present application, the precision deep processing system further includes a control system, and the control system is electrically connected to the first driving member, the second driving member, the third driving member and the fourth driving member 223 to control the operating states of the first driving member, the second driving member, the third driving member and the fourth driving member 223.

[0046] During the operation process, the PCB to be processed is placed on the processing position of the processing platform. The control system first controls the first driving member, the second driving member and the third driving member to drive the processing component 200 to move to the pre-drilling position above the corresponding processing position (at this time, the tip of the tool 2223 does not extend from the pressing foot of the chip suction cover 2222, and the tool 2223 is at its initial position where the tip retracts into the chip suction cover 2222), and then the control system controls the third driving member to drive the whole processing component 200 to move downward for precision deep drilling.

[0047] In the precision deep processing system, since the material of the pressing foot of the chip suction cover 2222 in the processing component 200 is plastic and the tool 2223 needs to be replaced regularly, the distance between the tip of the tool 2223 and the pressing foot of the chip suction cover 2222 will change dynamically, and this dynamic change will lead to insufficient precision of the precision deep processing system.

[0048] In the prior art, in order to solve the technical problem of insufficient depth control accuracy caused by the dynamic change of the distance between the tip of the tool and the chip suction cover pressing foot, a conductive aluminum foil is often covered on the upper layer of the PCB board to be processed. The tip of the tool is conducted with the aluminum foil to form a trigger electrical signal, and the depth of the spindle drilling is controlled with the position of the trigger electrical signal as the origin, so as to realize the depth control function of the PCB board. However, there is a shortcoming in the above method, that is, a conductive aluminum foil must be covered on the PCB board to be processed, otherwise the trigger electrical signal cannot be formed, and the depth control function cannot be realized. Adding a conductive aluminum foil not only increases the production cost of customers, but also cannot meet the PCB board production process in scenarios where the conductive aluminum foil cannot be covered.

[0049] Please refer to 2 and Figure 3 To solve the above technical problems, in the embodiments of the present application, the depth control processing system further includes a tool detector 300, a speed detection device 230, and a position measurement device 240; the tool detector 300 is disposed on the processing platform 100; in the processing assembly 200, when the tool 2223 is clamped by the spindle 2221, the tool 2223 has an initial position retracted into the chip suction cover 2222, and a first position and a second position extending out of the chip suction cover 2222, wherein the first position is the position where the tip of the tool 2223 reaches the measurement point of the tool detector 300, and the second position is the position where the tip of the tool 2223 reaches the depth control depth of the workpiece; the position measurement device 240 is used to measure the distance between the initial position and the first position, and to measure the distance between the initial position and the second position; the speed detection device 230 is used to detect whether the moving speed of the tool 2223 relative to the bottom of the chip suction cover 2222 changes suddenly, so as to indicate the position measurement device 240 to start measuring the distance that the tool 2223 moves from the initial position to the first position when the bottom of the chip suction cover 2222 abuts against the tool detector 300, and to indicate the position measurement device 240 to start measuring the distance that the tool 2223 moves from the initial position to the second position when the bottom of the chip suction cover 2222 abuts against the workpiece.

[0050] In the embodiments of the present application, the distance from the initial position to the first position is D 1 , and the distance to the second position is D 3 , the upper end of the tool detector 300 has a contact surface for abutting against the bottom of the chip suction cover 2222, and the distance from the contact surface to the tool measurement point of the tool detector 300 is D 2 , the depth control depth of the workpiece is D 4 , D 4 = D 3 -(D 1-D 2 )。

[0051] Please refer to Figure 1 、 Figure 2 and Figure 5 During the operation process, first, the distance D between the tip of the cutting tool 2223 and the bottom of the pressure foot of the chip suction cover 2222 is measured by the cooperation of the processing component 200 and the tool detector 300 0 , and then the processing component 200 is used to drill the PCB board. During the drilling process, according to the measured distance D between the tip of the cutting tool 2223 and the bottom of the pressure foot of the chip suction cover 2222 0 accurate depth control can be achieved. The specific steps are as follows:

[0052] (1) The control system first controls the first driving member, the second driving member, and the third driving member to drive the processing component 200 to move above the tool detector 300 (at this time, the bottom of the pressure foot of the chip suction cover 2222 is not in contact with the upper end of the tool detector 300, the chip suction cover 2222 is in a natural elongation state, and the cutting tool 2223 is located at its initial position where the tip retracts into the chip suction cover 2222), and then controls the third driving member to drive the processing component 200 to move downward. The moment the pressure foot at the bottom of the chip suction cover 2222 contacts the pushing surface of the tool detector 300, the speed detection device 230 detects a sudden change in the downward movement speed of the cutting tool 2223 and generates a first signal

[0053] (2) The control system controls the third driving member to continue driving the processing component 200 to move downward until the tool detector 300 detects the tip of the cutting tool 2223. The tool detector 300 generates a second signal (at this time, the bottom of the chip suction cover 2222 is compressed, and the cutting tool 2223 is located at its first position where the tip extends out of the chip suction cover 2222). The position measuring device 240 measures the moving distance D of the tip of the cutting tool 2223 from the triggering of the first signal to the triggering of the second signal 1 (that is, the distance between the initial position and the first position of the tip of the cutting tool 2223 is measured). Since the distance D between the contact site of the tool detector 300 and the bottom of the pressure foot of the chip suction cover 2222 and the tool measuring site of the tool detector 300 2 is fixed (this distance can be obtained by calculating and compensating the errors of multiple processing test pieces or provided by the purchasing manufacturer), the distance D from the bottom of the pressure foot of the chip suction cover 2222 to the tip of the cutting tool 2223 can be calculated 0 = D 1 - D 2 。

[0054] (3) The control system controls the first driving member, the second driving member, and the third driving member to drive the processing assembly 200 to move to a pre-drilling position above the PCB board to be processed on the processing platform 100 (at this time, the bottom of the chip suction cover 2222 pressing foot is not in contact with the upper end of the tool detector 300, the chip suction cover 2222 is in a natural extension state, and the tool 2223 is located at its initial position where the tool tip retracts into the chip suction cover 2222). Then, the control system controls the third driving member to drive the processing assembly 200 to move downward for drilling operations. When the bottom of the chip suction cover 2222 pressing foot contacts the PCB board, the speed detection device 230 generates a third signal. Taking the position where the processing assembly 200 (tool tip of the tool 2223) is located when the third signal is generated as the origin, the control system continues to control the processing assembly 200 (tool tip of the tool 2223) to move downward by a distance D3, and the position measuring device 240 measures the downward movement distance D 3 , and the actual drilling depth is D 4 , D 4 = D 3 - D 0 .

[0055] In the above step (3), when the control system controls the processing assembly 200 to just move downward by a distance D3, at this time, the chip suction cover 2222 is compressed from bottom to top, the tool 2223 is located at its second position where the tool tip extends out of the chip suction cover 2222, and the position measuring device 240 measures the distance between the second position and the initial position; after the drilling depth of the tool 2223 reaches the depth control requirement, the position measuring device 240 sends a signal to the control system, and the control system will control the third driving member to stop driving the processing assembly 200 to move downward, and the tool 2223 stops drilling further downward.

[0056] The technical solution of the present application solves the technical problem of insufficient precision in the controlled deep processing of the controlled deep processing system due to the dynamic change in the distance between the tip of the cutting tool 2223 and the bottom of the pressing foot of the chip suction hood 2222 by providing a speed detection device 230 and a position measurement device 240 on the processing component 200, and by cooperating the processing component 200 with the tool detector 300. In the technical solution of the present application, before processing the workpiece, first use the tool detector 300 to measure the distance between the tip of the cutting tool 2223 in the processing component 200 and the bottom of the pressing foot of the chip suction hood 2222: move the processing component 200 above the tool detector 300 and move the processing component 200 downward. When the bottom of the chip suction hood 2222 abuts against the tool detector 300, the speed detection device 230 detects a sudden change in the moving speed of the cutting tool 2223 relative to the bottom of the chip suction hood 2222, indicating that the position measurement device 240 starts to measure the distance that the cutting tool 2223 moves from the initial position to the first position. The position from the abutting position of the tool detector 300 and the bottom of the chip suction hood 2222 to the measurement point of the tool detector 300 is a measurable fixed value. Subtracting this fixed value from the distance from the initial position to the first position can calculate the distance between the tip of the cutting tool 2223 and the bottom of the pressing foot of the chip suction hood 2222; then use the processing component 200 to perform controlled deep processing on the workpiece: move the processing component 200 above the workpiece and move the processing component 200 downward. When the bottom of the chip suction hood 2222 abuts against the workpiece, the speed detection device 230 detects a sudden change in the moving speed of the cutting tool 2223 relative to the bottom of the chip suction hood 2222, indicating that the position measurement device 240 starts to measure the distance that the cutting tool 2223 moves from the initial position to the second position. Subtracting the distance between the tip of the cutting tool 2223 and the bottom of the pressing foot of the chip suction hood 2222 from the distance from the initial position to the second position gives the actual controlled deep processing depth of the workpiece. The controlled deep processing system of the present application can achieve precise controlled deep processing without additionally adding conductive aluminum foil to the PCB board during the drilling operation, and has the advantages of low cost and wide application range.

[0057] In the embodiment of the present application, the tool detector 300 can be a non-contact tool detector or a contact tool detector used in the machine tool industry.

[0058] Please refer to Figure 4, in one embodiment, the tool detector 300 is a non-contact tool detector. The non-contact tool detector includes a detection base 310 and an induction device 320. The detection base 310 is provided with a detection slot 311 for the tool 2223 to pass through. The measurement point of the tool detector 300 is located in the detection slot 311. The induction device 320 is arranged on the side of the detection slot 311, and an opening 312 corresponding to the induction device 320 is provided on the side of the detection slot 311.

[0059] Specifically, the induction device 320 includes a transmitting end and a receiving end. The transmitting end and the receiving end are respectively arranged on opposite sides of the detection slot 311 for emitting the tool inspection opposed light. Two openings 312 corresponding to the tool inspection opposed light are provided on the side wall of the detection slot 311. The two openings 312 are respectively denoted as a first opening and a second opening. The first opening is correspondingly arranged with the transmitting end, and the second opening is correspondingly arranged with the receiving end.

[0060] More specifically, the tool detector 300 further includes an abutting platform 330. The abutting platform 330 is arranged above the detection base 310. The abutting surface is located on the abutting platform 330. The abutting platform 330 is provided with a through hole facing the detection slot 311 for the tool 2223 to pass through.

[0061] In the embodiment of the present application, there are various selections for the fourth driving member 223, as long as it can drive the chip suction cover 2222 to move up and down. Please refer to Figure 2 and Figure 3 , in a preferred embodiment, the fourth driving member 223 is a telescopic mechanism 223. The processing assembly 200 further includes a guide post 2224. The guide post 2224 extends in the vertical direction. The two ends of the guide post 2224 are respectively connected to the upper end of the chip suction cover 2222 and the driving end of the telescopic mechanism 223. A slider 2211 sleeved on the guide post 2224 is arranged on the second substrate 221. The telescopic mechanism 223 drives the guide post 2224 to move up and down to drive the chip suction cover 2222 to move up and down relative to the main shaft. Specifically, installation parts are formed by extending outward from the left and right sides of the peripheral edge of the upper end of the chip suction cover 2222, and the lower end of the guide post 2224 is fixed to the installation parts.

[0062] In the embodiments of the present application, the speed detection device 230 is a grating scale, a magnetic grating scale, an acceleration sensor, or other devices that can detect a sudden change in the moving speed of the processing component 200 relative to the first substrate 210. The present application does not limit this. The position measurement device 240 can be a grating scale, a magnetic grating scale, or other devices that can measure the distance between the initial position and the first position, as well as the distance between the initial position and the second position. The present application does not limit this.

[0063] Please refer to Figure 2 and Figure 3 , in an embodiment, the speed detection device 230 is a first grating scale or a first magnetic grating scale. The speed detection device 230 includes a first scale tape 231 and a first reading head 232 that are adapted to each other. One of the first scale tape 231 and the first reading head 232 is disposed on the second substrate 221, and the other is disposed on the processing component 200.

[0064] Please continue to refer to Figure 2 and Figure 3 , based on the above embodiment, in an embodiment, the first reading head 232 is fixed to the guide post 2224. Specifically, the processing component 200 further includes a mounting base 250. The first reading head 232 is fixed to the guide post 2224 through the mounting base 250, and the first scale tape 231 is disposed on the front side of the second substrate 221. Such a setting can improve the installation convenience of the speed detection device 230, and can improve the structural compactness and aesthetics of the processing component 200.

[0065] Specifically, the mounting base 250 includes a bottom plate 251 and a base 252. The bottom plate 251 is sleeved on the guide post 2224, the base 252 is disposed on the second substrate 221, and the first reading head 232 is disposed on the base 252. Such a setting makes the mechanical structure design of the speed detection device 230 reasonable, can reduce the failure rate of the speed detection device 230 under high-frequency use, and can improve the reliability of the speed detection device 230.

[0066] In the above embodiment, a plurality of mounting positions arranged in the Y-axis direction are provided on the base 252, and the first reading head 232 is fixed to the mounting position by bolts. By providing a plurality of mounting positions on the base 252, it is convenient to adjust the front and back positions of the first reading head 232, and it is convenient to adjust the signal of the first reading head 232.

[0067] A plurality of sleeve holes adapted to the guide posts 2224 are provided on the bottom plate 251, and at least some of the sleeve holes are arranged at intervals in the X-axis direction. By providing a plurality of sleeve holes adapted to the guide posts 2224 on the bottom plate 251, the installation position of the bottom plate 251 can be selectively adjusted, so as to facilitate the left-right adjustment of the installation position of the first reading head 232 and facilitate the adjustment of the signal of the first reading head 232.

[0068] Please continue to refer to Figure 2 and Figure 3 In an embodiment, the position measuring device 240 is a second grating scale or a second magnetic grating scale. The position measuring device 240 includes a second scale tape 241 and a second reading head 242. One of the second scale tape 241 and the second reading head 242 is arranged on the first substrate 210, and the other is arranged on the second substrate 221. Preferably, the second reading head 242 is arranged on the front side of the first substrate 210 facing the second substrate 221, and the second scale tape 241 is arranged on the left or right side of the second substrate 221. Such an arrangement can improve the installation convenience of the position measuring device 240, and can improve the structural compactness and aesthetics of the processing assembly 200.

[0069] Please refer to Figure 1 、 Figure 2 、 Figure 6 and Figure 7 The specific steps of the PCB processing assembly 200 working are as follows:

[0070] (1) The control system first controls the first driving member, the second driving member and the third driving member to drive the processing assembly 200 to move above the tool detector 300 (at this time, the bottom of the pressing foot of the chip suction cover 2222 does not contact the upper end of the tool detector 300, the chip suction cover 2222 is in a natural elongation state, and the tool 2223 is located at its initial position where the tool tip retracts into the chip suction cover 2222), and then controls the third driving member to drive the processing assembly 200 to move downward. The moment the bottom of the pressing foot of the chip suction cover 2222 contacts the abutting table 330, the speed detection device 230 detects a sudden change in the downward movement speed of the chip suction cover 2222, generates a first signal, and the position measuring device 240 records the initial position of the tool tip of the tool 2223 when the first signal is generated.

[0071] (2) The control system controls the third driving member to continue driving the processing assembly 200 to move downward. When the tip of the cutting tool 2223 touches the tip opposed light, the tool detector 300 generates a second signal, and the position measuring device 240 records the first position of the tip of the cutting tool 2223 when recording the second signal. The control system obtains the distance D between the initial position and the first position. 1 . Since the distance D between the abutting table and the tool inspection opposed light 2 is fixed (this distance can be obtained by calculating and compensating the errors of multiple processing test pieces or provided by the purchasing manufacturer), the distance D from the lower plane of the chip suction cover 2222 pressing foot to the tip of the cutting tool 2223 can be calculated therefrom. 0 = D 1 - D 2 .

[0072] (3) The control system controls the first driving member, the second driving member, and the third driving member to drive the processing assembly 200 to move to a pre-drilling position above the PCB board to be processed on the processing platform 100 (at this time, the bottom of the chip suction cover 2222 pressing foot is not in contact with the upper end of the tool detector 300, the chip suction cover 2222 is in a natural elongation state, and the cutting tool 2223 is located at its initial position where the tip of the cutting tool retracts into the chip suction cover 2222). Then the control system controls the third driving member to drive the processing assembly 200 to move downward for drilling operation. When the bottom of the chip suction cover 2222 pressing foot contacts the PCB board, the speed detection device 230 sends a third signal to the control system. Taking the position where the processing assembly 200 (the tip of the cutting tool 2223) is located when the third signal is generated as the origin, the control system controls the tip of the cutting tool 2223 to move down to a second position according to the customer's depth control requirement. The distance from the second position to the origin (the initial position) is D 3 , and the actual drilling depth is D 4 , D 4 = D 3 - D 0 .

[0073] In the embodiment of the present application, the depth control processing system includes a plurality of processing assemblies and a plurality of tool detectors, and the processing assemblies, the tool detectors, and the processing positions are arranged in one-to-one correspondence.

[0074] It should be noted that the depth control processing system provided in the embodiment of the present application can be applied not only in circuit board drilling equipment, but also in other depth control processing equipment such as milling machines, etc., which will not be elaborated one by one herein.

[0075] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present utility model shall be included within the scope of protection of the present utility model.

Claims

1. A controlled deep processing system, characterized in that: include: Tool detector; A machining component, the machining component comprises a spindle and a chip suction cover which can move up and down and is arranged at the lower end of the spindle. When the spindle clamps the tool, the tool has an initial position in which the chip suction cover is retracted, and a first position and a second position in which the chip suction cover is extended; wherein, The first position is the position where the tool tip reaches the measuring point of the tool detector, and the second position is the position where the tool tip reaches the controlled depth of the workpiece; a position measuring device, for measuring the distance between the initial position and the first position, and for measuring the distance between the initial position and the second position; A speed detection device is used to detect whether the moving speed of the tool relative to the bottom of the chip hood changes suddenly, so as to instruct the position measurement device to start measuring the distance the tool moves from the initial position to the first position when the bottom of the chip hood abuts against the tool detector, and to instruct the position measurement device to start measuring the distance the tool moves from the initial position to the second position when the bottom of the chip hood abuts against the workpiece.

2. The controlled depth processing system according to claim 1, characterized in that: The tool detector comprises a detection seat and an abutment platform. The detection seat is provided with a detection slot for the tool to pass through. The measuring point is located in the detection slot. The abutment platform is arranged above the detection seat.

3. The controlled depth processing system according to claim 2, characterized in that: The detection seat is provided with a sensing device, which includes a transmitting end and a receiving end. The transmitting end and the receiving end are respectively arranged on opposite sides of the detection slot. The side wall of the detection slot is provided with a first opening corresponding to the transmitting end and a second opening corresponding to the receiving end.

4. The controlled depth processing system according to claim 1, characterized in that: It also includes a processing platform and a crossbeam, wherein the processing platform is used to carry the workpiece, the processing assembly can be movably arranged on the crossbeam, and the tool detector is arranged on the side of the processing platform away from the crossbeam.

5. The controlled depth processing system according to claim 4, characterized in that: The depth-controlled processing system also includes a first substrate and a second substrate, the first substrate is arranged on the crossbeam, the processing assembly is arranged on the second substrate, the second substrate can be lifted and connected to the first substrate, and the speed detection device includes a matching first tape ruler and a first reading head, one of the first tape ruler and the first reading head is arranged on the second substrate, and the other is arranged on the processing assembly.

6. The controlled depth processing system according to claim 5, characterized in that: The processing assembly also includes a guide column and a telescopic mechanism. The main shaft and the telescopic mechanism are arranged on the second substrate. The two ends of the guide column are respectively connected to the chip suction cover and the telescopic mechanism. The telescopic mechanism drives the guide column to move up and down to drive the chip suction cover to move up and down relative to the main shaft. The first reading head is fixed on the guide column.

7. The controlled depth processing system according to claim 6, characterized in that: The processing assembly also includes a bottom plate and a base that are connected to each other, the bottom plate is sleeved on the guide column, the base is arranged on the second substrate, and the first reading head is arranged on the base.

8. The controlled depth processing system according to claim 7, characterized in that: The position measuring device comprises a second ruler tape and a second reading head adapted to each other. The second reading head is arranged on the side of the first substrate facing the second substrate, and the second ruler tape is arranged on the side of the second substrate.

9. The controlled depth processing system according to claim 1, characterized in that: The distance from the initial position to the first position is D1, and the distance to the second position is D3. The upper end of the tool detector has an abutment surface for abutting against the bottom of the chip suction cover. The distance from the abutment surface to the tool measuring position of the tool detector is D2. The controlled depth of the workpiece is D4, and D4=D3-(D1-D2).

10. A circuit board drilling device, characterized in that: It comprises a controlled depth processing system as described in any one of claims 1 to 9, wherein the controlled depth processing system comprises a plurality of processing components and a plurality of tool detectors, and the processing components and the tool detectors are arranged in a one-to-one correspondence.

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