High-temperature bending device for PVC plate processing

Abstract

The utility model relates to the field of PVC (polyvinyl chloride) board processing, and discloses a high-temperature bending device for PVC board processing, which comprises a base, the top of the base is fixedly connected with a rack, the surface of the rack is fixedly connected with an air cylinder through a shell, the output end of the air cylinder is fixedly connected with an upper pressing die, the top of the base is fixedly connected with a lower pressing die, and the upper pressing die is fixedly connected with the lower pressing die. A bending structure is arranged on the surface of the base and comprises a supporting frame, a heating plate is fixedly connected to the inner wall of the supporting frame, a heat conduction assembly is arranged on the surface of the base, a material taking assembly is arranged on the surface of the base, and a heat dissipation assembly is arranged on the surface of the base. The bottom of the supporting frame is fixedly connected to the upper surface of the base, and the side, away from the supporting frame, of the heating plate is fixedly connected to the outer wall of the lower pressing die. According to the high-temperature bending device for the PVC board, the bending structure is arranged, the bent PVC board can be rapidly cooled, a worker can conveniently take the PVC board, and then the high-temperature bending efficiency of the PVC board is improved.

Description

Technical Field

[0001] The utility model relates to the field of PVC board processing, in particular to a high-temperature bending device for PVC board processing. Background Art

[0002] In the semiconductor industry, PVC boards are favored due to their specific properties and uses. PVC boards also have the characteristics of being difficult to catch fire and spread fire. Even in the case of fire, the amount of fog generated is very small. In addition, this kind of board meets the environmental requirements and has less "gloss fading" phenomenon during heating. The application of PVC boards in the semiconductor industry further proves the demand for PVC boards in the semiconductor industry.

[0003] After retrieval, Chinese Patent Publication No.: CN211660806U discloses a bending device for hook plate processing. Through the setting of the adjusting rod and the connecting plate, the position of the upper bending rod can be adjusted by rotating the adjusting rod, and then the distance between the upper bending rod and the lower bending rod can be adjusted, which can ensure that when bending hook plates with different thicknesses, the hook plates will not have cracks or fractures, ensuring the smooth processing of the hook plates.

[0004] In the above technical solution, the distance between the upper and lower bending rods is adjusted by using the adjusting rod, so as to facilitate the bending of PVC boards with different thicknesses. However, for hard PVC boards, relying solely on pressure without high-temperature heating for bending, the hardness and rigidity of the PVC boards will not change, resulting in a decrease in bending efficiency. At the same time, when the PVC board is bent at high temperature, it lacks heat conduction and heat dissipation functions, which makes it inconvenient to take the heated PVC board. Therefore, a high-temperature bending device for PVC board processing is proposed to solve the above problems. Summary of the Utility Model

[0005] In order to make up for the above deficiencies, the utility model provides a high-temperature bending device for PVC board processing, aiming to improve the problem that the high-temperature bending device for PVC board processing in the prior art lacks heating for the PVC board during bending, resulting in a decrease in bending efficiency.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme: A high-temperature bending device for PVC board processing, including a base, a frame is fixedly connected to the top of the base, a cylinder is fixedly connected to the surface of the frame through a housing, the output end of the cylinder is fixedly connected to an upper pressing die, a lower pressing die is fixedly connected to the top of the base, a bending structure is arranged on the surface of the base, the bending structure includes a support frame, a heating plate is fixedly connected to the inner wall of the support frame, a heat conduction component is arranged on the surface of the base, a material taking component is arranged on the surface of the base, and a heat dissipation component is arranged on the surface of the base.

[0007] As a further description of the above technical solution:

[0008] A gas pump is fixedly connected to the top of the base. The output end of the gas pump is fixedly connected to a transmission pipe. The outer wall of the transmission pipe is threadedly connected to a one-way pipe. An exhaust pipe is fixedly connected to the inner wall of the one-way pipe. A collar is arranged on the outer wall of the one-way pipe.

[0009] As a further description of the above technical solution:

[0010] The bottom of the support frame is fixedly connected to the upper surface of the base. The side of the heating plate away from the support frame is fixedly connected to the outer wall of the lower pressing die.

[0011] As a further description of the above technical solution:

[0012] The heat conduction component includes a heat conduction shell. A heat conduction plate is fixedly connected to the inner wall of the heat conduction shell. Through holes are formed on the surface of the heat conduction plate.

[0013] As a further description of the above technical solution:

[0014] The material taking component includes a chute. A slider is slidably connected to the inner wall of the chute. An electric push rod is hinged to the bottom of the slider.

[0015] As a further description of the above technical solution:

[0016] The heat dissipation component includes a tee pipe. A circulation pump is fixedly connected to the port of the tee pipe. The circulation pump is fixedly connected to a liquid storage tank through a pipe. A refrigeration fan is fixedly connected to the outer wall of the liquid storage tank.

[0017] As a further description of the above technical solution:

[0018] The interior of the heat conduction shell is hollow. The heat conduction shell is located on the side opposite to the support frame and the lower pressing die.

[0019] As a further description of the above technical solution:

[0020] The chute is formed on the lower surface of the heat conduction shell. The fixed end of the electric push rod is fixedly connected to the upper surface of the base.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, the PVC board is heated by arranging a heating plate. After heating, the rigidity and hardness of the PVC board are reduced, which is convenient for bending. The heat conduction component conducts heat to the PVC board and provides support for it at the same time. The cooperation of the material taking component, the heat conduction component and the heat dissipation component enables the bent PVC board to cool down quickly, which is convenient for the staff to take, thereby improving the efficiency of high-temperature bending of the PVC board.

[0023] 2. In the present utility model, an air pump is provided to transfer the air source into the one-way pipe, and then the PVC board is blown by the exhaust air pipe. Rotating the one-way pipe can change the orientation of the exhaust air pipe, thereby adjusting the angle of blowing and heat dissipation, and further improving the cooling efficiency of the PVC board after bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a front view schematic diagram of the main structure of a high-temperature bending device for PVC board processing proposed by the present utility model;

[0025] Figure 2 It is a left view schematic diagram of the main structure of a high-temperature bending device for PVC board processing proposed by the present utility model;

[0026] Figure 3 It is a side view schematic diagram of the heat-conducting housing structure of a high-temperature bending device for PVC board processing proposed by the present utility model;

[0027] Figure 4 It is a high-temperature bending device for PVC board processing proposed by the present utility model Figure 2 The enlarged schematic diagram of area A in

[0028] Legend:

[0029] 1. Base; 2. Frame; 3. Cylinder; 4. Upper pressing die; 5. Lower pressing die; 6. Support frame; 7. Heating plate; 8. Heat-conducting housing; 9. Heat-conducting plate; 10. Through hole; 11. Slide groove; 12. Slide block; 13. Electric push rod; 14. Three-way pipe; 15. Circulation pump; 16. Liquid storage tank; 17. Refrigeration fan; 18. Air pump; 19. Transmission pipe; 20. One-way pipe; 21. Exhaust air pipe; 22. Collar. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0031] Refer to Figures 1 - 3, an embodiment provided by the present utility model: a high-temperature bending device for PVC board processing, including a base 1, a frame 2 is fixedly connected to the top of the base 1, a cylinder 3 is fixedly connected to the surface of the frame 2 through a housing, two groups of cylinders 3 are provided, and the two groups of cylinders 3 are distributed at both ends of the upper pressing die 4 to maintain the balance of the lifting of the upper pressing die 4. The output end of the cylinder 3 is fixedly connected to the upper pressing die 4. A lower pressing die 5 is fixedly connected to the top of the base 1. A bending structure is arranged on the surface of the base 1. The bending structure includes a support frame 6. A heating plate 7 is fixedly connected to the inner wall of the support frame 6. A heat conduction component is arranged on the surface of the base 1. A material taking component is arranged on the surface of the base 1. A heat dissipation component is arranged on the surface of the base 1.

[0032] Referring to Figures 1 - 3 , the bottom of the support frame 6 is fixedly connected to the upper surface of the base 1. Two groups of the support frame 6, the heating plate 7, and the heat conduction housing 8 are provided, and the above structures are arranged in a mirror image with the central axis of the lower pressing die 5 as the symmetry axis. The side of the heating plate 7 away from the support frame 6 is fixedly connected to the outer wall of the lower pressing die 5. The heat conduction component includes a heat conduction housing 8. A heat conduction plate 9 is fixedly connected to the inner wall of the heat conduction housing 8. The heat conduction housing 8 and the heat conduction plate 9 are both made of metal materials, which is convenient for transferring the heat of the heating plate 7. At the same time, several groups of heat conduction plates 9 are provided, and several groups of heat conduction plates 9 are respectively located inside the two groups of heat conduction housings 8. Through holes 10 are formed on the surface of the heat conduction plate 9. The setting of the through holes 10 is convenient for the coolant to flow inside the heat conduction housing 8. The material taking component includes a chute 11. Chutes 11 are respectively opened at the left and right ends of each group of heat conduction housings 8. A slider 12 is slidably connected to the inner wall of the chute 11. An electric push rod 13 is hinged to the bottom of the slider 12. The heat dissipation component includes a three-way pipe 14. The two ends of the three-way pipe 14 away from the circulation pump 15 are respectively communicated with the inner walls of the two groups of heat conduction housings 8. A circulation pump 15 is fixedly connected to the port of the three-way pipe 14. A part of the three-way pipe 14 is telescopically arranged. The circulation pump 15 is fixedly connected to a liquid storage tank 16 through a pipeline. The inside of the liquid storage tank 16 is convenient for placing the coolant. A refrigeration fan 17 is fixedly connected to the outer wall of the liquid storage tank 16. The refrigeration fan 17 cools the coolant inside the liquid storage tank 16. The inside of the heat conduction housing 8 is hollow. The heat conduction housing 8 is located on the side opposite to the support frame 6 and the lower pressing die 5. The chute 11 is opened on the lower surface of the heat conduction housing 8. The fixed end of the electric push rod 13 is fixedly connected to the upper surface of the base 1.

[0033] Referring to Figure 4, a air pump 18 is fixedly connected to the top of the base 1. The output end of the air pump 18 is fixedly connected to a transmission pipe 19. The outer wall of the transmission pipe 19 is threadedly connected to a one-way pipe 20. There is an end area where the transmission pipe 19 and the one-way pipe 20 are connected. Rotating the one-way pipe 20 clockwise can make it rotate on the transmission pipe 19, facilitating the adjustment of the orientation of the exhaust pipe 21. And one end of the one-way pipe 20 away from the transmission pipe 19 is sealed. An exhaust pipe 21 is fixedly connected to the inner wall of the one-way pipe 20. There are several groups of exhaust pipes 21, and several groups of exhaust pipes 21 are equidistantly distributed on the one-way pipe 20. A collar 22 is arranged on the outer wall of the one-way pipe 20. There are two groups of collars 22, and the two groups of collars 22 are respectively sleeved on the outer wall of the one-way pipe 20.

[0034] Working principle: Place the PVC board on the lower pressing die 5 and two groups of heat-conducting shells 8. Start the two groups of heating plates 7. The heat source of the heating plates 7 is transmitted to the PVC board through the heat-conducting plate 9 and the heat-conducting shell 8, making the whole PVC board heated. Then start the cylinder 3 to drive the upper pressing die 4 to descend to extrude the PVC board, and cooperate with the lower pressing die 5 to bend the PVC board. After the PVC board is heated, its hardness and rigidity will decrease, improving the bending effect. When the bending is completed, the electric push rods 13 in pairs push the heat-conducting shells 8 upward. At the moment of continuous upward movement, they contact the PVC board. Since both sides of the PVC board are warped after bending, after the heat-conducting shell 8 is attached to the PVC board, due to the driving force of the electric push rod 13, the slider 12 slides inside the chute 11, ensuring the degree of fit between the heat-conducting shell 8 and the PVC board. Then start the circulating pump 15 to extract the coolant cooled by the refrigeration fan 17, and then transmit the coolant to the two groups of heat-conducting shells 8 through the three-way pipe 14. Through several groups of through holes 10, the coolant can flow and fill the two groups of heat-conducting shells 8. Due to the heat-conducting effect of the heat-conducting plate 9 and the heat-conducting shell 8, the heated PVC board can be quickly cooled. Then start the air pump 18, and the air source is transmitted to the exhaust pipe 21 through the one-way pipe 20 to dissipate heat from the surface of the PVC board. Cooperating with the coolant can quickly cool the PVC board, thus facilitating the staff to take the material.

[0035] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-temperature bending device for processing PVC boards, comprising a base (1), the top of the base (1) is fixedly connected to a frame (2), the surface of the frame (2) is fixedly connected to a cylinder (3) through a shell, the output end of the cylinder (3) is fixedly connected to an upper die (4), and the top of the base (1) is fixedly connected to a lower die (5), characterized in that: The surface of the base (1) is provided with a bending structure, the bending structure includes a support frame (6), the inner wall of the support frame (6) is fixedly connected with a heating plate (7), the surface of the base (1) is provided with a heat conduction component, the surface of the base (1) is provided with a material taking component, and the surface of the base (1) is provided with a heat dissipation component.

2. A high temperature bending device for PVC board processing according to claim 1, characterized in that: The top of the base (1) is fixedly connected to an air pump (18), the output end of the air pump (18) is fixedly connected to a transmission pipe (19), the outer wall of the transmission pipe (19) is threadedly connected to a one-way pipe (20), the inner wall of the one-way pipe (20) is fixedly connected to an exhaust pipe (21), and the outer wall of the one-way pipe (20) is provided with a collar (22).

3. A high temperature bending device for PVC board processing according to claim 1, characterized in that: The bottom of the support frame (6) is fixedly connected to the upper surface of the base (1), and the side of the heating plate (7) away from the support frame (6) is fixedly connected to the outer wall of the lower die (5).

4. A high temperature bending device for PVC board processing according to claim 1, characterized in that: The heat-conducting assembly comprises a heat-conducting shell (8), the inner wall of which is fixedly connected to a heat-conducting plate (9), and a through hole (10) is provided on the surface of the heat-conducting plate (9).

5. A high temperature bending device for PVC board processing according to claim 1, characterized in that: The material taking component comprises a slide groove (11), the inner wall of the slide groove (11) is slidably connected with a slider (12), and the bottom of the slider (12) is hinged with an electric push rod (13).

6. A high temperature bending device for PVC board processing according to claim 1, characterized in that: The heat dissipation component comprises a three-way pipe (14), a port of the three-way pipe (14) is fixedly connected to a circulation pump (15), the circulation pump (15) is fixedly connected to a liquid storage tank (16) via a pipeline, and an outer wall of the liquid storage tank (16) is fixedly connected to a refrigeration fan (17).

7. A high temperature bending device for PVC board processing according to claim 4, characterized in that: The interior of the heat-conducting shell (8) is hollow, and the heat-conducting shell (8) is located on the side of the support frame (6) opposite to the lower pressing die (5).

8. A high temperature bending device for PVC board processing according to claim 5, characterized in that: The slide groove (11) is provided on the lower surface of the heat-conducting housing (8), and the fixed end of the electric push rod (13) is fixedly connected to the upper surface of the base (1).

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