Pressing strip, splitting assembly and splitting device

Abstract

The utility model relates to a pressing strip, a splitting assembly and a splitting device.The pressing strip comprises a first abutting part and a second abutting part, the first abutting part and the second abutting part both extend in the length direction of the pressing strip, the second abutting part is arranged on one side of the first abutting part, and a preset distance exists between the first abutting part and the second abutting part in the width direction of the pressing strip; the first abutting part and the second abutting part are both made of elastic materials. The pressing strip provided by the utility model can be applied to an automatic splitting device, the first abutting part is used for abutting a product area in a workpiece to be split, and a product is prevented from moving in the splitting process; the second abutting part is arranged on one side of the first abutting part and used for abutting waste materials such as a frame on one side of a product, the first abutting part and the second abutting part can elastically deform in the downward pressing process, the elastic force of the second abutting part acts on the frame, separation of the frame and the edge of the product can be achieved, and therefore automatic piece splitting is achieved, and the production efficiency is improved. And the production efficiency and the product yield can be improved.

Description

Technical Field

[0001] This application relates to the technical field of component production and manufacturing, and particularly relates to a pressing strip, a chip splitting assembly, and a chip splitting device. Background Art

[0002] In the field of consumer electronics, it is often necessary to laser cut a substrate through a laser processing device, or perform chemical etching or CNC machining and then manually split the chips to separate the product from the waste.

[0003] The existing chip splitting methods have the problem of low chip splitting efficiency. Moreover, during the chip splitting process, due to the uneven proficiency of operators, when the operator's chip splitting technique is not proficient, it is easy to cause the product to have edge collapse or surface scratches, resulting in a low product yield and poor production consistency. Utility Model Content

[0004] This application provides a pressing strip, a chip splitting assembly, and a chip splitting device to solve the technical problems of low production efficiency and low product yield when manually splitting chips.

[0005] In a first aspect, this application provides a pressing strip, including:

[0006] A first abutting portion, which extends along the length direction of the pressing strip;

[0007] A second abutting portion, which extends along the length direction of the pressing strip, and the second abutting portion is arranged on one side of the first abutting portion. There is a preset distance between the first abutting portion and the second abutting portion in the width direction of the pressing strip. Both the first abutting portion and the second abutting portion are made of elastic materials.

[0008] Optionally, the second abutting portion has an abutting surface and an inclined surface arranged towards the first abutting portion, and the inclined surface is connected to the abutting surface on the side far from the first abutting portion.

[0009] In a second aspect, this application provides a chip splitting assembly, including the pressing strip provided in the first aspect of this application, and further including a relatively arranged pressing plate module and a base module. The pressing strip is arranged on the pressing plate module, the first abutting portion and the second abutting portion face the base module, and the pressing plate module is movable relative to the base module.

[0010] Optionally, the pressing plate module includes a pressing plate main body, and a fixing groove is provided on the pressing plate main body. A plurality of pressing strips are detachably connected to the fixing groove.

[0011] Optionally, the number of fixing grooves is multiple, the fixing grooves are annular grooves, and two adjacent annular grooves are arranged on the pressing plate main body in a zigzag pattern;

[0012] Alternatively, the fixing grooves are linear grooves, and the multiple linear grooves are divided into multiple groups of fixing structures. The multiple linear grooves in any one group of fixing structures are arranged in a ring on the pressing plate body, and the adjacent two groups of fixing structures are arranged in a zigzag pattern on the pressing plate body.

[0013] Optionally, a first guiding portion is provided on the pressing plate module, and a second guiding portion is provided on the base module, and the first guiding portion and the second guiding portion are arranged to be matched with each other.

[0014] Optionally, the base module includes a base body and a semi-surrounding frame protruding from the upper surface of the base body, and the second guiding portion is provided on the semi-surrounding frame;

[0015] The base body further has a supporting portion protruding from the upper surface of the base body, and the supporting portion is arranged opposite to the first abutting portion.

[0016] Optionally, the base module includes a plurality of positioning components, and each positioning component includes a positioning block, and the positioning block has a workpiece positioning surface;

[0017] The base body has a plurality of mounting portions respectively extending along its transverse and longitudinal directions, and a positioning block is correspondingly arranged on each mounting portion, and the workpiece positioning surfaces on at least two positioning blocks are perpendicular to each other.

[0018] Optionally, the number of the supporting portions is multiple, and any one of the supporting portions is arranged in a ring on the base body, and the adjacent two supporting portions are arranged in a zigzag pattern on the base body; the mounting portion has a plurality of positioning block mounting positions, and the plurality of positioning block mounting positions are arranged in one-to-one correspondence with the plurality of supporting portions.

[0019] In a third aspect, the present application provides a chip separating device, which includes the chip separating component provided in the second aspect of the present application, and further includes a driving mechanism drivingly connected to the pressing plate module.

[0020] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0021] The caulking strip provided by the embodiment of the present application can be applied to an automatic chip separation device. The first abutting portion in the caulking strip can be used to abut against the product area of the workpiece to be chipped, avoiding the movement of the product during the chipping process and affecting the product yield after chipping. Both the first abutting portion and the second abutting portion extend along the length direction of the caulking strip, and the second abutting portion is arranged on one side of the first abutting portion, which can be used to abut against waste materials such as the frame on one side of the product. During automatic chipping, a supporting component is provided in the product area, while the bottom area of the frame is suspended. When the driving mechanism in the chipping device drives the caulking strip to press down, the first abutting portion and the supporting component at the bottom of the product fix the product, and the second abutting portion applies force to the waste material area such as the frame. Both the first abutting portion and the second abutting portion are made of elastic materials and can undergo elastic deformation during the pressing process. Since the bottom of the waste material area such as the frame is suspended, the elastic force of the second abutting portion acts on the frame, enabling the separation of the frame from the edge of the product, thereby realizing automatic chipping, which is beneficial to ensuring production consistency, improving production efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present application and, together with the specification, are used to explain the principles of the present application.

[0023] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] One or more embodiments are exemplarily illustrated by the pictures in the corresponding accompanying drawings. These exemplary illustrations do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, unless otherwise stated, and the drawings in the drawings do not constitute a proportional limitation.

[0025] Figure 1 Structural schematic of the caulking strip provided by the embodiment of the present application Figure 1 ;

[0026] Figure 2 Structural schematic of the caulking strip provided by the embodiment of the present application Figure 2 ;

[0027] Figure 3 Exploded view of the chip separation device provided by the embodiment of the present application;

[0028] Figure 4 Connection schematic of the caulking strip and the pressing plate main body provided by the embodiment of the present application;

[0029] Figure 5Provided by the embodiment of the present application Figure 4 Enlarged view of part A in

[0030] Figure 6 Schematic structural diagram of the base body and the adsorption component provided by the embodiment of the present application

[0031] Figure 7 Schematic structural diagram of the positioning component provided by the embodiment of the present application

[0032] Figure 8 Top view of the base module provided by the embodiment of the present application

[0033] Figure 9 Schematic diagram of the cooperation between the workpiece and the base module provided by the embodiment of the present application

[0034] Figure 10 Schematic diagram of the contact between the pressing strip and the workpiece provided by the embodiment of the present application

[0035] Figure 11 Schematic diagram of the state change of the pressing strip during the chip breaking process provided by the embodiment of the present application

[0036] Explanation of reference numerals

[0037] 1. Pressing strip; 11. First abutting portion; 12. Second abutting portion; 121. Abutting surface; 122. Inclined surface; 13. Connecting portion

[0038] 2. Pressing plate body; 21. Fixed groove; 22. Limiting ring; 221. Countersunk hole; 23. First mounting hole

[0039] 3. First guiding portion

[0040] 4. Second guiding portion

[0041] 5. Base body; 51. Semi-enclosed frame; 52. Support portion; 52a. First support portion; 52b. Second support portion; 52c. Third support portion; 53. Second mounting hole; 54. Mounting portion

[0042] 6. Adsorption component; 61. Negative pressure groove; 62. Communication hole; 63. Negative pressure channel

[0043] 7. Positioning component; 71. Positioning block, 711. Strip-shaped hole; 712. Workpiece positioning surface; 72. Fastener

[0044] 8. Workpiece; 8a. First workpiece; 8b. Second workpiece; 8c. Third workpiece; 81. Product; 82. Frame

[0045] 9. Connecting plate Detailed implementation manners

[0046] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0047] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0048] For ease of description, spatially relative relationship terms may be used in the text to describe the relative positional relationship or movement of one element or feature shown in the figure with respect to another element or feature. These relative relationship terms such as "inner", "outer", "inner side", "outer side", "below", "beneath", "above", "upper", "front", "rear", etc. This spatially relative relationship term is intended to include different orientations of the device in use or operation other than the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip, attitude change, or motion state change, then these directional indications will also change accordingly. For example, an element described as "below other elements or features" or "beneath other elements or features" will subsequently be oriented as "above other elements or features" or "on top of other elements or features". Therefore, the example term "below" can include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other directions) and the spatially relative relationship descriptors used in the text are interpreted accordingly.

[0049] To solve the technical problems of low production efficiency and low product yield in the prior art when splitting wafers manually, the present application provides a pressing strip, a wafer splitting assembly, and a wafer splitting device, which can achieve automatic wafer splitting and are beneficial to improving the production efficiency and product yield of wafer splitting.

[0050] Please refer to Figures 1 to 11 , a first aspect of the embodiments of the present application provides a pressing strip 1, which can be applied to an automatic wafer splitting device, including a first abutting portion 11 and a second abutting portion 12, as Figure 1 and Figure 2As shown, the first abutting portion 11 extends along the length direction of the pressing strip 1 and can be used to abut against the product 81 in the workpiece 8 to be split, so as to prevent the product 81 from moving during the splitting process and affecting the yield of the split product. The second abutting portion 12 extends along the length direction of the pressing strip 1. The second abutting portion 12 is arranged on one side of the first abutting portion 11. There is a preset distance L between the first abutting portion 11 and the second abutting portion 12 in the width direction of the pressing strip 1. As Figure 10 shown, the existence of the preset distance L can make a gap exist between the first abutting portion 11 and the second abutting portion 12, so that the first abutting portion 11 and the second abutting portion 12 respectively abut against the product 81 and the waste materials such as the frame 82 on one side of the product 81. During automatic splitting, a supporting component is provided in the area of the product 81, while the bottom area of the frame 82 is suspended. When the driving mechanism drives the pressing strip 1 to press down, the first abutting portion 11 and the supporting component at the bottom of the product 81 fix the product 81, and the second abutting portion 12 applies force to the waste material area such as the frame 82. Both the first abutting portion 11 and the second abutting portion 12 are made of elastic materials and can undergo elastic deformation during the pressing process. Since the bottom area of the waste material area such as the frame 82 is suspended, the elastic force of the second abutting portion 12 acts on the frame 82, and the separation of the frame 82 from the edge of the product 81 can be realized, thus realizing automatic splitting, which is beneficial to ensuring the consistency of production, improving production efficiency and product yield.

[0051] It should be noted that since both the first abutting portion 11 and the second abutting portion 12 are made of elastic materials, rigid contact between the pressing strip 1 and the workpiece 8 can be avoided, thereby preventing the product 81 from being scratched, and also preventing the frame 82 from being severely cracked due to rigid contact and causing damage to the product 81, resulting in a decrease in product yield. Preferably, the elastic material can be rubber, which is elastic and has good wear resistance and is not easily hardened during use, and can improve the service life of the pressing strip 1.

[0052] Please refer to Figure 10 and Figure 11 , when there is a chamfer on the edge of the product 81, if only a downward force is applied to the frame 82, it will cause the waste material of the frame 82 to scrape the chamfer of the product 81, resulting in defects such as chamfer chipping; during splitting, the broken debris scraped by the waste material of the frame 82 splashes, which is likely to cause defects such as scratches on the surface of the product 81.

[0053] To solve the above problems, in some embodiments of the present application, please refer to Figure 1 、 Figure 2 、 Figure 10 and Figure 11, the second abutting portion 12 has an abutting surface 121 and an inclined surface 122 facing the first abutting portion 11. Among them, the abutting surface 121 is used to contact the upper surface of the frame 82, so as to apply force to the frame 82 to achieve chip separation. The side of the inclined surface 122 away from the first abutting portion 11 is connected to the abutting surface 121. When the driving mechanism drives the pressing strip 1 to press down, due to the existence of the inclined surface 122 on one side of the second abutting portion 12, before the frame 82 falls off, the second abutting portion 12 will deform downward and rightward after being stressed, that is, the second abutting portion 12 will deform toward the side away from the inclined surface 122 when being pressed. At this time, the elastic force applied by the second abutting portion 12 to the upper surface of the frame 82 is inclined downward (toward the lower right). According to the principle of interaction of forces, during the chip separation process, the second abutting portion 12 will continuously apply downward and rightward component forces to the frame 82. At the critical moment, the frame 82 will fall off to the right and downward, as Figure 11 shown. Since the falling-off direction of the frame 82 is away from the product 81, it can avoid the waste of the frame 82 scraping the chamfer of the product 81, causing defects such as chamfer chipping, and can also avoid the waste of the frame 82 scraping and the broken chips splashing during chip separation, causing defects such as scratches on the surface of the product 81.

[0054] Specifically, the cross-section of the first abutting portion 11 is rectangular, and it will undergo uniform expansion deformation when pressed down, as Figure 11 shown, and it can abut and fix the edge of the product 81. The cross-section of the second abutting portion 12 is trapezoidal, so that the second abutting portion 12 forms a cross-sectional structure with a wider upper part and a sharper lower part, thereby undergoing irregular deformation. Furthermore, during the elastic deformation process, the second abutting portion 12 changes from the Figure 11 dotted line state in to the solid line state, and applies an inclined downward acting force to the frame 82, causing the frame 82 to crack in the direction away from the chamfer of the product 81, avoiding damage to the chamfer of the product 81.

[0055] In some embodiments of the present application, please refer to Figure 1 , Figure 2 , Figure 10 and Figure 11 , the pressing strip 1 further includes a connecting portion 13, and the connecting portion 13 is connected to the first abutting portion 11 and the second abutting portion 12 as a whole, facilitating the overall movement along with the driving mechanism.

[0056] It should be noted that the lengths of the pressing strip 1, the first abutting portion 11, and the second abutting portion 12 can all be set as required, and the lengths of the three can be the same or different, as Figure 1 and Figure 2 shown, and no limitation is made here.

[0057] In some embodiments of the present application, multiple sections of the first abutting portion 11 can be provided on the same pressing strip 1, and there is a spacing between two adjacent sections of the first abutting portion 11, as Figure 2As shown in the figure. By arranging the multiple first abutting parts 11 in the pressing strip 1 into a discontinuous long strip structure, the first abutting parts 11 are more likely to deform during the downward pressing process, which can reduce the pressure required for the pressing strip 1 to deform downward, reduce the pressing time, and is beneficial to improving the chip separation efficiency.

[0058] Please refer to Figures 1 to 11 , in the second aspect of the embodiment of the present application, a chip separation assembly is provided, which includes the pressing strip 1 in the above embodiment, and further includes a pressing plate module and a base module arranged oppositely. The pressing strip 1 is arranged on the pressing plate module, and the first abutting part 11 and the second abutting part 12 face the base module, as Figure 3 and Figure 4 shown. During chip separation, the workpiece 8 is arranged on the base module, and the pressing plate module can move relative to the base module, so that the first abutting part 11 and the second abutting part 12 press down on the workpiece 8 arranged on the base module, realizing automatic chip separation.

[0059] In the embodiment of the present application, the chip separation assembly is used for chip separation of the glass cover plate, so as to realize the separation of the glass cover plate product 81 and the frame 82.

[0060] It should be noted that in order to enable the pressing plate module to drive the pressing strip 1 to move, the driving mechanism of the chip separation device is connected to the connecting plate 9 at the top of the pressing plate module. Specifically, the driving mechanism includes a lifting module, which can drive the pressing plate module to move in the vertical direction, so that the pressing strip 1 can press down on the workpiece 8 in the vertical direction. The product 81 in the workpiece 8 is fixed under the cooperation of the first abutting part 11 and the base module, and the frame 82 in the workpiece 8 is separated from the edge of the product 81 under the action of the second abutting part 12.

[0061] In some embodiments of the present application, please refer to Figure 4 , the pressing plate module includes a pressing plate main body 2, and a fixing groove 21 is provided on the pressing plate main body 2. The multiple pressing strips 1 are detachably connected to the fixing groove 21, which is convenient for replacing the pressing strips 1.

[0062] In some embodiments of the present application, please refer to Figure 4 , the number of the fixing grooves 21 is multiple, the fixing grooves 21 are annular grooves, and two adjacent annular grooves are arranged in a zigzag shape on the pressing plate main body 2. Since the sizes of the multiple annular grooves are different, they can be used for chip separation processing of workpieces 8 with different structural sizes, as Figure 4 and Figure 9 shown.

[0063] In some other embodiments of the present application, the fixing groove 21 is a straight groove, and the multiple straight grooves are divided into multiple groups of fixing structures. The multiple straight grooves in any one group of fixing structures are arranged in a ring on the pressing plate main body 2, and two adjacent groups of fixing structures are arranged in a zigzag shape on the pressing plate main body 2, and can also be used for chip separation processing of workpieces 8 with different structural sizes.

[0064] It should be noted that the "adjacent" in the above embodiments refers to being adjacent inside and outside. The inner side is the side close to the center of the pressing plate body 2, and the outer side is the side close to the edge of the pressing plate body 2.

[0065] It should be noted that when the fixing groove 21 is an annular groove, the plurality of pressing strips 1 are evenly arranged in the annular fixing groove 21 so as to apply uniform circumferential pressure to the workpiece 8, so that the frame 82 falls off under the action of the pressing strips 1. When the fixing groove 21 is a straight groove, the fixing groove 21 and the pressing strips 1 can be arranged in a one-to-one correspondence, or a plurality of pressing strips 1 can be arranged in one straight groove at the same time, as long as the plurality of pressing strips 1 are evenly distributed along the circumference of the workpiece 8, so as to apply uniform pressure to the workpiece 8.

[0066] It should be noted that since the connection between the pressing strip 1 and the fixing groove 21 is detachable, and the size and length of the pressing strip 1 can be designed according to needs. When the size of the workpiece 8 changes, different lengths of the pressing strips 1 can be combined to match the length of the fixing groove 21, and a contact area matching the workpiece 8 is formed by enclosing with a plurality of pressing strips 1.

[0067] In the above embodiments, the pressing strips 1 of different lengths can be modularly designed, and the pressing strips 1 of different lengths can be combined according to the size of the workpiece 8. In some embodiments of the present application, the length dimension range of the pressing strips 1 is preferably 20 mm - 80 mm, which is not only convenient for the production of the pressing strips 1, but also convenient for using and matching the pressing strips 1 of various sizes according to the sizes of different workpieces 8.

[0068] In the above embodiments, the detachable connection between the pressing strip 1 and the fixing groove 21 can be realized by screw connection or by snap connection. However, when connecting by screws, there are problems such as a large number of screw assemblies (at least one screw needs to be provided for each pressing strip 1) and low assembly efficiency. When realized by snap connection, there is a problem that the pressing strip 1 is easily dropped.

[0069] To solve the above problems, in some embodiments of the present application, the pressing plate body 2 further has a detachable limiting ring 22, such as Figure 4 and Figure 5As shown in the figure. After embedding the connecting portion 13 of the pressing strip 1 into the fixing groove 21, the limiting ring 22 is assembled on the pressing plate main body 2. The limiting ring 22 forms a block for the connecting portion 13 to prevent the connecting portion 13 from disengaging from the fixing groove 21, which can improve the connection reliability between the pressing strip 1 and the pressing plate main body 2. Countersunk holes 221 are provided along the circumferential direction of the limiting ring 22 to facilitate the fixation of the limiting ring 22 on the pressing plate main body 2. The minimum number of the countersunk holes 221 can be two (symmetrically arranged on both sides of the limiting ring 22), which can effectively reduce the number of screw assemblies. It can not only improve the assembly efficiency between the pressing strip 1 and the fixing groove 21, but also improve the connection reliability between the pressing strip 1 and the fixing groove 21.

[0070] In some embodiments of the present application, please refer to Figure 3 、 Figure 4 and Figure 6 , a first guiding portion 3 is provided on the pressing plate module, and a second guiding portion 4 is provided on the base module. The first guiding portion 3 and the second guiding portion 4 are arranged in a matching manner. During the chip splitting process, the alignment between the pressing plate module and the base module can be realized, so as to realize the alignment between the pressing strip 1 and the workpiece 8.

[0071] Specifically, one of the first guiding portion 3 and the second guiding portion 4 is a guiding structure extending in the vertical direction, which can realize the guiding of the pressing plate module and the base module in the vertical direction. Under the action of the guiding structure, the pressing plate module can drive the pressing strip 1 to descend vertically, so that the first abutting portion 11 and the second abutting portion 12 of the pressing strip 1 respectively abut against the product 81 and the frame 82.

[0072] In some embodiments of the present application, please refer to Figure 3 , the first guiding portion 3 is a guiding pin, and the second guiding portion 4 is a guiding cylinder. When the pressing plate module moves downward, the guiding pin is inserted into the guiding cylinder, and the guiding cylinder extends in the vertical direction, which can realize the vertical guiding of the pressing plate module.

[0073] In some embodiments of the present application, please refer to Figure 3 、 Figure 6 and Figure 9 , the base module includes a base main body 5 and a semi-surrounding frame body 51 protruding from the upper surface of the base main body 5. The second guiding portion 4 is arranged on the semi-surrounding frame body 51, which can enable the second guiding portion 4 to contact the first guiding portion 3 in the pressing plate module first. After forming a stable sliding connection, the alignment between the pressing plate module and the base module is realized, the position of the pressing strip 1 is correspondingly adjusted above the workpiece 8, and then the first abutting portion 11 and the second abutting portion 12 are brought into contact with the upper surface of the workpiece 8.

[0074] It should be noted that in some embodiments of the present application, the semi - enclosed frame body 51 is arranged at the edge of the base body 5. Since the upper surface of the workpiece 8 is lower than the upper surface of the semi - enclosed frame body 51, if the edge frame is a fully enclosed structure, it is not conducive to the picking and placing of the workpiece 8. Therefore, the semi - enclosed frame body 51 structure in the present application not only facilitates the setting of the second guiding part 4, but also facilitates the picking and placing of the workpiece 8 in the opening area (i.e., the area without the protruding frame) of the semi - enclosed frame body 51.

[0075] In some embodiments of the present application, the semi - enclosed frame body 51 can be an L - shaped or U - shaped structure. As a preferred embodiment of the present application, the semi - enclosed frame body 51 is an L - shaped structure, and the workpiece 8 can be picked and placed from both sides of the base body 5.

[0076] As a specific embodiment of the present application, the pressing plate body 2 is provided with a first mounting hole 23 for installing a guide pin; the semi - enclosed frame body 51 is provided with a second mounting hole 53 for installing a guide cylinder, which can respectively realize the setting of the first guiding part 3 and the second guiding part 4.

[0077] In some embodiments of the present application, please refer to Figure 3 、 Figure 6 、 Figure 8 、 Figure 9 and Figure 11 , the base body 5 also has a support part 52 protruding from the upper surface of the base body 5. The support part 52 is correspondingly arranged with the fixing groove 21, and the support part 52 is oppositely arranged with the first abutting part 11, which can be used to support the bottom of the product 81 in the workpiece 8, so as to cooperate with the first abutting part 11 to fix the product 81, which is beneficial to separating the product 81 from the frame 82.

[0078] In order to support workpieces 8 of different specifications, the number of the support parts 52 is multiple, and they are correspondingly arranged one - to - one with the multiple fixing grooves 21 in the pressing plate body 2, as shown in Figure 4 and Figure 6 shown. In order to support the circumferential edge of the product 81, the support parts 52 are arranged in a ring shape on the base body 5, and two adjacent support parts 52 are arranged in a zigzag pattern on the base body 5; as shown in Figure 6 、 Figure 8 and Figure 9 shown, while realizing the circumferential support of the product 81, the contact area between the support part 52 and the lower surface of the product 81 can be reduced, and the risk of the support part 52 scratching the product 81 can be reduced.

[0079] Specifically, when the workpiece 8 includes three specifications of different sizes, they are sequentially recorded as the first workpiece 8a, the second workpiece 8b, and the third workpiece 8c from largest to smallest. Corresponding first support portion 52a, second support portion 52b, and third support portion 52c are provided on the base body 5, which can be used to support the edges of the products 81 in the first workpiece 8a, the second workpiece 8b, and the third workpiece 8c respectively, such as Figure 8 and Figure 9 shown.

[0080] In some embodiments of the present application, please refer to Figure 3 、 Figure 6 、 Figure 7 and Figure 8 , the base module includes a plurality of positioning components 7. The positioning component 7 includes a positioning block 71. The positioning block 71 has a workpiece positioning surface 712, which can be used to abut against the side of the workpiece 8, so as to realize the positioning of the workpiece 8.

[0081] The base body 5 has a plurality of mounting portions 54 respectively extending along its transverse and longitudinal directions. A positioning block 71 is correspondingly provided on each mounting portion 54. The workpiece positioning surfaces 712 on at least two positioning blocks 71 are perpendicular to each other. The transverse and longitudinal positioning of the workpiece 8 can be realized through the mutually perpendicular workpiece positioning surfaces 712.

[0082] In some embodiments of the present application, the positioning component 7 further includes a fastener 72. The mounting portion 54 has a plurality of threaded holes arranged along the transverse or longitudinal direction of the base body 5, which can be used to fixedly connect with the fastener 72. The positioning block 71 has a strip hole 711 that matches the fastener 72, which is convenient for adjusting the setting position of the positioning block 71 in the mounting portion 54, so as to make the workpiece positioning surface 712 abut against the outer side of the workpiece 8.

[0083] It should be noted that by providing a plurality of positioning components 7 on the base body 5, the plurality of positioning blocks 71 are arranged in an L shape on the base body 5, which can be respectively used to position two sides of the workpiece 8 (one transverse side and one longitudinal side), so as to realize the transverse and longitudinal positioning of the workpiece 8, and further realize the positioning setting of the workpiece 8 in the base module, such as Figure 8 shown.

[0084] In some embodiments of the present application, the mounting portion 54 has a plurality of positioning block mounting positions, and the plurality of positioning block mounting positions are correspondingly arranged with the plurality of support portions 52. When the positioning block 71 is arranged on the positioning block mounting position, it can cooperate with the support portion 52 corresponding to the positioning block mounting position to realize the positioning of the workpiece 8 with the corresponding size of the support portion 52.

[0085] Specifically, each positioning block mounting position has a threaded hole for connecting with the fastener 72, which can be used to realize the installation of the positioning block 71 and the fastener 72, as Figure 8 shown. In order to realize the position movement of the positioning block 71 on the mounting portion 54, the support portion 52 is provided with an avoidance notch for avoiding the positioning block 71, as Figure 6 and Figure 8 shown.

[0086] In some embodiments of the present application, please refer to Figure 3 、 Figure 6 and Figure 8 . After the workpiece 8 is positioned, it is necessary to ensure that the workpiece 8 will not be displaced as a whole due to the abutment of the pressing strip 1. Therefore, in some embodiments of the present application, the base module includes an adsorption component 6, and the adsorption component 6 faces the pressing plate module and can be used to adsorb the bottom of the workpiece 8 to prevent the workpiece 8 from being horizontally displaced during the pressing process of the pressing strip 1, affecting the chip separation operation.

[0087] In some embodiments of the present application, the adsorption component 6 is arranged in the middle of the support portion 52, which can be suitable for adsorbing the central area of workpieces 8 of different specifications, so as to fix workpieces 8 of various specifications.

[0088] In some embodiments of the present application, the adsorption component 6 includes a negative pressure groove 61 arranged in the horizontal plane, which can adsorb the bottom plane of the workpiece 8. The adsorption component 6 further includes a communication hole 62 and a negative pressure channel 63 communicated with the negative pressure groove 61. The negative pressure channel 63 is arranged inside the base body 5 and can be used to connect with an external negative pressure device.

[0089] The third aspect of the embodiments of the present application provides a chip separation device, which includes the chip separation component in the above embodiments, and further includes a driving mechanism drivingly connected to the pressing plate module, which can drive the pressing plate module to move relative to the base module in the vertical direction, so as to realize automatic chip separation.

[0090] Please refer to Figures 1 to 11 . In some embodiments of the present application, the usage method of the above chip separation device is as follows:

[0091] Step 1: Determine the corresponding fixing groove 21 and support portion 52 according to the size of the workpiece 8. Set a plurality of pressing strips 1 in the selected fixing groove 21, and set a positioning component 7 outside the selected support portion 52;

[0092] Step 2: Place the workpiece 8 on the selected support portion 52, and abut the two sides of the workpiece 8 against the workpiece positioning surface 712 of the positioning block 71; after the workpiece 8 is positioned, fix the workpiece 8 on the support portion 52 through the adsorption component 6;

[0093] Step 3: Drive the pressing plate module and the pressing strip 1 to descend through the driving mechanism. During the descent, the first guiding portion 3 is inserted into the second guiding portion 4 to achieve the alignment of the pressing strip 1 and the workpiece 8. Then, the first abutting portion 11 abuts against the edge of the product 81 of the workpiece 8 and is disposed opposite to the supporting portion 52. The second abutting portion 12 abuts against the frame 82 of the workpiece 8, and the bottom of the frame 82 is suspended. Drive the pressing strip 1 to continuously press the workpiece 8 through the driving mechanism. The second abutting portion 12 undergoes elastic deformation and applies an inclined downward force to the frame 82, causing the frame 82 to move towards Figure 11 the lower right in

[0094] to achieve the separation of the product 81.

[0095] It should be understood that the terms used in this specification are for the purpose of describing particular example embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing", and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless explicitly indicated as the order of performance. It should also be understood that additional or alternative steps may be used.

[0096] Although the terms first, second, third, etc. may be used herein to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms do not imply an order or sequence when used herein. Thus, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of the example embodiments.

[0097] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A layering strip, characterized in that: include: A first abutment portion (11), the first abutment portion (11) extending along the length direction of the pressure strip (1); A second abutting portion (12), the second abutting portion (12) extending along the length direction of the pressure strip (1), and the second abutting portion (12) is arranged on one side of the first abutting portion (11), there is a preset distance between the first abutting portion (11) and the second abutting portion (12) in the width direction of the pressure strip (1), and the first abutting portion (11) and the second abutting portion (12) are both made of elastic material.

2. The layering strip according to claim 1, characterized in that: The second abutting portion (12) comprises an abutting surface (121) and an inclined surface (122) arranged toward the first abutting portion (11); the inclined surface (122) is connected to the abutting surface (121) at a side away from the first abutting portion (11).

3. A splitter assembly, comprising the layering strip (1) according to claim 1 or 2, characterized in that: It also includes a pressure plate module and a base module that are arranged opposite to each other, the pressure strip (1) is arranged on the pressure plate module, the first abutment portion (11) and the second abutment portion (12) are arranged toward the base module, and the pressure plate module can move relative to the base module.

4. The splitter assembly according to claim 3, characterized in that: The pressure plate module comprises a pressure plate body (2), a fixing groove (21) is provided on the pressure plate body (2), and a plurality of pressure strips (1) are detachably connected to the fixing groove (21).

5. The splitter assembly according to claim 4, characterized in that: The number of the fixing grooves (21) is plural, and the fixing grooves (21) are annular grooves, and two adjacent annular grooves are arranged in a U-shaped manner on the pressure plate body (2); Alternatively, the fixed groove (21) is a linear groove, and a plurality of the linear grooves are divided into a plurality of groups of fixed structures, and a plurality of the linear grooves in any group of the fixed structures are arranged in a ring shape on the pressure plate body (2), and two adjacent groups of the fixed structures are arranged in a U-shape on the pressure plate body (2).

6. The splitter assembly according to any one of claims 3 to 5, characterized in that: The pressure plate module is provided with a first guide portion (3), and the base module is provided with a second guide portion (4), and the first guide portion (3) and the second guide portion (4) are arranged to match each other.

7. The splitter assembly according to claim 6, characterized in that: The base module comprises a base body (5) and a semi-enclosed frame (51) protruding from the upper surface of the base body (5), and the second guide portion (4) is arranged on the semi-enclosed frame (51); The base body (5) also has a support portion (52) protruding from the upper surface of the base body (5), and the support portion (52) is arranged opposite to the first abutting portion (11).

8. The splitter assembly according to claim 7, characterized in that: The base module comprises a plurality of positioning components (7), the positioning components (7) comprise positioning blocks (71), and the positioning blocks (71) are provided with workpiece positioning surfaces (712); The base body (5) has a plurality of mounting portions (54) extending in the transverse and longitudinal directions thereof, each mounting portion (54) is correspondingly provided with a positioning block (71), and the workpiece positioning surfaces (712) on at least two positioning blocks (71) are perpendicular to each other.

9. The splitter assembly according to claim 8, characterized in that: The number of the supporting parts (52) is plural, any one of the supporting parts (52) is arranged in a ring shape on the base body (5), and two adjacent supporting parts (52) are arranged in a circle shape on the base body (5); the mounting part (54) has a plurality of positioning block mounting positions, and the plurality of positioning block mounting positions are arranged in a one-to-one correspondence with the plurality of supporting parts (52).

10. A splitting device, comprising the splitting assembly according to any one of claims 3 to 9, characterized in that: It also includes a driving mechanism that is drivingly connected to the pressing plate module.

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