Magnetron sputtering coating machine
By controlling the air outlet of the gas supply pipeline structure in the magnetron sputtering coating machine, increasing the Ar positive ion impact at both ends of the target material, the problem of uneven coating thickness is solved and a more uniform coating effect is achieved.
Patent Information
- Application Number
- CN202421846504.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-31
AI Technical Summary
During magnetron sputtering coating, the thickness of the product coating at the corresponding positions at both ends of the target material is uneven.
A magnetron sputtering coating machine is designed. By controlling each gas supply pipeline structure separately, the air outlet volume of the gas supply pipeline structure arranged corresponding to both ends of the target material is greater than the air outlet volume of other gas supply pipeline structures. A large number of Ar positive ions impact both ends of the target material, increasing the sputtering ions at both ends of the target material.
It effectively avoids thinner films at the corresponding positions of the product, solves the problem of uneven coating thickness at both ends of the target material, and improves the uniformity of the coating.
Smart Images

Figure CN222975274U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of glass coating, and particularly to a magnetron sputtering coating machine. Background Art
[0002] Generally, during the processing of cover glass, it is necessary to coat the cover glass to improve its oxidation resistance, corrosion resistance, and change the color of the glass, etc.
[0003] During the processing, magnetron sputtering coating has been widely used due to its advantages of high deposition rate and strong adhesion.
[0004] In the prior art, the sputtering amount at the critical positions at both ends of the target used for magnetron sputtering coating is small, which affects the consistency of the coating thickness of the product, such as CN219260176U. Utility Model Content
[0005] One technical problem to be solved by this application is: during the magnetron sputtering coating process, there is a problem that the coating thickness of the product at the corresponding positions at both ends of the target is uneven.
[0006] To solve the above technical problem, this application provides a magnetron sputtering coating machine.
[0007] A magnetron sputtering coating machine provided according to this application includes: a housing assembly, the housing assembly includes a housing structure and a target mounting seat structure, the target mounting seat structure is connected to the housing structure, and the target is connected to the target mounting seat structure; a gas supply assembly, the gas supply assembly includes at least three gas supply pipeline structures, the gas supply pipeline structures are connected to the housing assembly, the axes of the gas supply pipeline structures are on the same straight line, the gas supply pipeline structures are arranged parallel to the target, and the gas supply pipeline structures arranged at both ends are respectively arranged corresponding to both ends of the target one by one.
[0008] In some embodiments, the gas supply pipeline structure includes an inlet pipeline, a gas pipe, and a flow meter. The flow meter is arranged on the inlet pipeline, the first end of the gas pipe is communicated with the inlet pipeline, and a plurality of first air outlet holes are arranged on the gas pipe.
[0009] In some embodiments, the length of the gas pipe corresponding to the end of the target is 20 cm to 30 cm.
[0010] In some embodiments, the diameter of the first air outlet hole is 0.8 mm to 1.2 mm.
[0011] In some embodiments, the distance between adjacent first air outlet holes is 3 cm to 6 cm.
[0012] In some embodiments, the distance between adjacent gas supply pipeline structures is less than 10 cm.
[0013] In some embodiments, the gas supply pipeline structure further includes an outer pipe, which is sleeved outside the gas pipe. A plurality of second air outlet holes are provided on the outer pipe, and the plurality of second air outlet holes are arranged in one-to-one correspondence with the plurality of first air outlet holes. The diameter of the second air outlet hole is larger than that of the first air outlet hole.
[0014] In some embodiments, the target mounting seat structure includes a mounting seat and a rotating shaft. The mounting seat is connected to the housing structure, the target is sleeved on the rotating shaft, and the rotating shaft is rotatably connected to the mounting seat.
[0015] In some embodiments, there are multiple groups of target mounting seat structures, and the gas supply components are arranged in one-to-one correspondence with the multiple groups of target mounting seat structures. The multiple groups of target mounting seat structures are evenly distributed along the inner wall of the housing structure.
[0016] In some embodiments, the magnetron sputtering coating machine further includes a fixing component, which is arranged inside the housing structure. The fixing component is rotatably connected to the housing structure, and the axis of the fixing component is parallel to the target.
[0017] Through the above technical solutions, the magnetron sputtering coating machine provided by the present application controls each gas supply pipeline structure respectively, so that the gas output of the gas supply pipeline structures corresponding to both ends of the target is greater than that of other gas supply pipeline structures. A large number of Ar positive ions impact both ends of the target, increasing the sputtering ion amount at both ends of the target and avoiding the film body at the corresponding position of the product from being too thin. The technical solution of the present application effectively solves the problem in the prior art that during the magnetron sputtering coating process, the coating thickness of the product at the corresponding positions at both ends of the target is uneven. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 Shows the structural schematic diagram of the magnetron sputtering coating machine disclosed in Embodiment 1 of the present application;
[0020] Figure 2 Shows Figure 1 the structural schematic diagram of the gas supply component of the magnetron sputtering coating machine;
[0021] Figure 3 Shows Figure 1 the partial enlarged structural schematic diagram of the gas supply component of the magnetron sputtering coating machine;
[0022] Figure 4 Shows Figure 1Schematic front view structure of the gas supply assembly of a magnetron sputtering coating machine;
[0023] Figure 5 Shows Figure 1 Schematic cross-sectional structure of the gas supply pipeline structure of a magnetron sputtering coating machine.
[0024] Description of reference numerals:
[0025] 10. Housing assembly; 11. Housing structure; 12. Target mounting seat structure; 121. Mounting seat; 122. Rotating shaft; 20. Gas supply assembly; 21. Gas supply pipeline structure; 211. Inlet pipeline; 212. Gas pipe; 213. Outer pipe; 30. Fixing assembly. Detailed implementation manners
[0026] The following further describes in detail the implementation manners of the present application in conjunction with the drawings and embodiments. The detailed descriptions and drawings of the following embodiments are used to exemplarily illustrate the principle of the present application, but cannot be used to limit the scope of the present application. The present application can be implemented in many different forms, not limited to the specific embodiments described in the text, but including all technical solutions falling within the scope of the claims.
[0027] These embodiments of the present application are provided to make the present application thorough and complete, and to fully express the scope of the present application to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangements of the components and steps described in these embodiments, the components of the materials, the numerical expressions and values should be interpreted as merely exemplary, rather than as limitations.
[0028] It should be noted that in the description of the present application, unless otherwise specified, the meaning of "a plurality" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicate the orientation or position relationship only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. When the absolute position of the described object changes, the relative position relationship may also change accordingly.
[0029] In addition, the "first", "second" and similar terms used in the present application do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range. The terms "including" or "comprising" and the like mean that the elements before the term cover the elements listed after the term, and do not exclude the possibility of also covering other elements.
[0030] It should also be noted that in the description of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. When it is described that a specific device is located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.
[0031] All terms used in this application have the same meanings as those understood by those of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as those, should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense, unless specifically defined as such here.
[0032] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the specification.
[0033] As Figures 1 to 5 shown, the magnetron sputtering coating machine disclosed in Embodiment 1 of the present application includes: a housing assembly 10 and a gas supply assembly 20. The housing assembly 10 includes a housing structure 11 and a target mounting seat structure 12. The target mounting seat structure 12 is connected to the housing structure 11, and the target is connected to the target mounting seat structure 12. The gas supply assembly 20 includes at least three gas supply pipeline structures 21. The gas supply pipeline structures 21 are connected to the housing assembly 10. The axes of the respective gas supply pipeline structures 21 are located on the same straight line, and the respective gas supply pipeline structures 21 are arranged parallel to the target. The gas supply pipeline structures 21 provided at both ends are respectively arranged in one-to-one correspondence with both ends of the target.
[0034] Applying the technical solution of Embodiment 1, by respectively controlling each gas supply pipeline structure 21, the gas outlet volume of the gas supply pipeline structures 21 corresponding to both ends of the target is made larger than that of other gas supply pipeline structures 21. A large number of Ar positive ions impact both ends of the target, increasing the sputtering ion amount at both ends of the target and avoiding the film body at the corresponding position of the product from being too thin. The technical solution of Embodiment 1 effectively solves the problem in the prior art that during the magnetron sputtering coating process, the coating thickness of the product at the corresponding positions at both ends of the target is uneven.
[0035] As Figures 1 to 4As shown in the figure, in the technical solution of Embodiment 1, the gas supply pipeline structure 21 includes an intake pipeline 211, a gas pipe 212, and a flow meter. The flow meter is arranged on the intake pipeline 211. The first end of the gas pipe 212 is connected to the intake pipeline 211, and a plurality of first air outlet holes are arranged on the gas pipe 212. The intake pipeline 211 is arranged inside the housing structure 11. The first end of the intake pipeline 211 is located inside the housing structure 11 and is connected to the intake pipeline 211. The second end of the intake pipeline 211 is located outside the housing structure 11 and is connected to a gas source. The gas source passes gas into the intake pipeline 211, enters the gas pipe through the intake pipeline 211, and then discharges from the plurality of first air outlet holes and impacts the target. A flow meter is arranged on each intake pipeline 211 to monitor the gas flow of the corresponding intake pipeline 211. By controlling the gas flow of each intake pipeline 211 separately, the problem of uneven coating on both ends of the target is avoided.
[0036] As Figures 1 to 4 shown in the figure, in the technical solution of Embodiment 1, the length of the gas pipe 212 corresponding to the end of the target is 20 cm to 30 cm. When the length of the gas pipe 212 corresponding to the end of the target is less than 20 cm, the gas pipe cannot cover the entire target and there will be an area with a thin coating, and there is still a problem of thin coating of the product corresponding to the end in the actual coating effect; when the length of the gas pipe 212 corresponding to the end of the target is greater than 30 cm, the gas pipe 212 also covers the area with a normal coating thickness. When the gas output of the gas pipe 212 is large, the coating in the original normal coating area is too thick and the coating effect is not good.
[0037] As Figures 1 to 4 shown in the figure, in the technical solution of Embodiment 1, the diameter of the first air outlet hole is 0.8 mm to 1.2 mm. When the diameter of the first air outlet hole is less than 0.8 mm, the gas output is small, which is not conducive to target sputtering, and the coating is easily deposited at the first air outlet hole, resulting in blockage of the first air outlet hole; when the diameter of the first air outlet hole is greater than 1.2 mm, the gas outlet speed of the first air outlet hole is slow, and the gas is relatively dispersed, and the impact effect on the surface of the target is poor, which is not conducive to the occurrence of sputtering.
[0038] As Figures 1 to 4 shown in the figure, in the technical solution of Embodiment 1, the distance between adjacent first air outlet holes is 3 cm to 6 cm. When the distance between adjacent first air outlet holes is less than 3 cm, the gas ejected from adjacent first air outlet holes will interfere with each other, affecting the sputtering rate; when the distance between adjacent first air outlet holes is greater than 6 cm, the gas volume in the area between two adjacent air outlet holes is small, and the sputtering rate of the target at this place is low, and the coating effect is poor.
[0039] As Figures 1 to 4As shown, in the technical solution of the first embodiment, the distance between adjacent gas supply pipeline structures 21 is less than 10 cm. If the distance between adjacent gas supply pipeline structures 21 is too large, the distance between the first air outlets at the ends of the two adjacent gas supply pipeline structures 21 is relatively large, the sputtering rate of the target corresponding to the gap between the two adjacent gas supply pipeline structures 21 is low, and the coating at the corresponding part of the product is relatively thin, resulting in poor coating effect.
[0040] As Figures 1 to 5 shown, in the technical solution of the first embodiment, the gas supply pipeline structure 21 further includes an outer pipe 213. The outer pipe 213 is sleeved outside the gas pipe 212. A plurality of second air outlets are provided on the outer pipe 213. The plurality of second air outlets are arranged in one-to-one correspondence with the plurality of first air outlets. The diameter of the second air outlet is larger than that of the first air outlet. The outer pipe 213 is semi-circular. A stainless steel clamp is provided outside the outer pipe 213. The stainless steel clamp fixes the outer pipe 213 on the housing structure 11. The gas pipe 212 is arranged between the outer pipe 213 and the housing structure 11, and the gas pipe 212 is clamped by the outer pipe 213 and the housing structure 11. The setting of the outer pipe 213 effectively reduces the contact between the ions sputtered from the target and the first air outlet, delays the time when the first air outlet is blocked, and improves the service life of the gas supply pipeline structure 21.
[0041] As Figures 1 to 4 shown, in the technical solution of the first embodiment, the target mounting seat structure 12 includes a mounting seat 121 and a rotating shaft 122. The mounting seat 121 is connected to the housing structure 11. The target is sleeved on the rotating shaft 122, and the rotating shaft 122 is rotatably connected to the mounting seat 121. A bearing is provided at the connection between the rotating shaft 122 and the mounting seat 121. The rotation of the rotating shaft 122 drives the target to rotate, controlling the target to rotate at a constant speed to ensure that all parts of the target participate in the sputtering reaction, the target reaction is relatively complete, and the waste of raw materials is avoided.
[0042] As Figures 1 to 4 shown, in the technical solution of the first embodiment, there are multiple groups of target mounting seat structures 12. The gas supply assembly 20 is arranged in one-to-one correspondence with the multiple groups of target mounting seat structures 12, and the multiple groups of target mounting seat structures 12 are evenly distributed along the inner wall of the housing structure 11. Each group of target mounting seat structures 12 fixes two targets. The gas supply assembly 20 is arranged between the two targets. The setting of the multiple groups of target mounting seat structures 12 can realize simultaneous sputtering coating at multiple points, and the coating efficiency is higher.
[0043] As Figures 1 to 4As shown, in the technical solution of the first embodiment, the magnetron sputtering coating machine further includes a fixing component 30. The fixing component 30 is arranged in the housing structure 11 and is rotatably connected to the housing structure 11. The axis of the fixing component 30 is parallel to the target. A plurality of products to be coated are arranged on the fixing component 30 in the circumferential direction. The fixing component 30 is arranged in the housing structure 11. During the sputtering coating process, the fixing component 30 rotates to drive the products to be coated to rotate, so as to ensure uniform coating of each product. The fixing component 30 includes a central cylinder and a fixing fixture. The fixing fixture is fixed on the central cylinder. The fixing fixture is designed according to the shape of the product to be coated. A plurality of negative pressure adsorption holes are arranged on the profiling surface. The products to be coated are fixed by means of negative pressure adsorption, so as to prevent the products to be coated from falling off under the action of centrifugal force during the rotation of the fixing component 30. The fixing component 30 rotates at a constant speed to ensure uniform coating of each product to be coated.
[0044] The difference between the technical solution of the second embodiment and the technical solution of the first embodiment is that the gas supply pipeline structure 21 further includes valves. The valves are arranged in one-to-one correspondence with the first air outlet holes. By adjusting the opening degrees of the respective valves respectively, the air output of the corresponding first air outlet holes can be controlled, and thus the individual control of the sputtering rate of each target can be realized, and the coating effect is better.
[0045] As described above, the object of the present application is to solve the problems existing in the prior art and propose a longitudinal uniformity extension repair solution for a magnetron sputtering vacuum coating machine. To achieve the above object, the present application adopts the following technical solutions: The uniformity adjustment component of the magnetron sputtering vacuum coating machine includes a baffle main body, a correction strip main body, and a gas supply device. The original correction baffle and baffle strip remain unchanged, and only the gas supply pipe (gas supply pipeline structure 21) is transformed. The gas pipe 212 supplies gas in multiple paths, that is, the existing gas supply method is transformed from 1-path gas supply to 4-path gas supply. The first and fourth paths are mainly arranged at both ends of the target. The gas pipe 212 is a stainless steel pipe with an outer diameter of 8 mm, and there are 1-mm air holes (the first air holes) on the pipe wall, with a hole pitch of 6 cm. The first gas pipe 212 has 4 air holes, the second gas pipe 212 has 9 air holes, the third gas pipe 212 has 9 air holes, and the fourth gas pipe 212 has 4 air holes. Each gas pipe 212 is separately connected to a flow meter, and the flow meter is controlled by a solenoid valve. After setting the flow rate, the solenoid valve controls the gas path switch to achieve segmented control of the sputtering amount. The present application effectively solves the problem of poor uniformity at both ends of the target. By testing the correlation between the Ar gas volume and the sputtering amount, the sputtering amount at both ends of the target is made nearly equivalent to that at other positions, achieving the purpose of extending the uniformity. The longitudinal uniformity is increased by 25 cm, and the production capacity is increased by more than 1 / 4. The uniformity at both ends of the target cannot be repaired under the original single-path gas supply method, while under the new four-path gas supply method, segmented control can be achieved, and the uniformity at both ends of the target can be adjusted by controlling the sputtering amount by adjusting the Ar gas volume. The efficiency of uniformity repair and the production capacity of the machine are improved. The present application can cover vacuum coating machines (magnetron sputtering coating machines) of different sizes, and the target length also covers all sizes. The first gas pipe 212 and the fourth gas pipe 212 are arranged in the space of 20 - 30 cm at both ends of the target, and the air hole pitch of the gas pipe at this position is 3 - 6 cm. The gas pipe is wrapped with a 2-cm stainless steel pipe (outer pipe 213) to enhance the toughness of the gas pipe 212, and a 2-mm second air hole is reserved outside, at the same position as the internal gas pipe 212. The gas pipe combination pipe is fixed behind the target by a stainless steel clamp, and the extension pipe of the gas pipe 212 passes through the coating machine through a sealing ring and reaches the flow meter.
[0046] The above specific implementation manners further elaborate on the object, technical solutions, and beneficial effects of the present application. It should be understood that the above are only specific implementation manners of the present application and are not used to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the application.
[0047] So far, the embodiments of the present application have been described in detail. To avoid obscuring the concept of the present application, some details well known in the art have not been described. Those skilled in the art can clearly understand how to implement the technical solutions of the present application based on the above description.
[0048] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration purposes and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified or equivalent substitutions can be made for some technical features without departing from the scope and spirit of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way.
Claims
1. A magnetron sputtering coating machine, characterized in that: include: A shell assembly (10), the shell assembly (10) comprising a shell structure (11) and a target mounting seat structure (12), the target mounting seat structure (12) being connected to the shell structure (11), and the target being connected to the target mounting seat structure (12); An air supply assembly (20), the air supply assembly (20) comprising at least three air supply pipeline structures (21), the air supply pipeline structures (21) being connected to the shell assembly (10), the axes of each of the air supply pipeline structures (21) being located on the same straight line, each of the air supply pipeline structures (21) being arranged parallel to the target material, and the air supply pipeline structures (21) arranged at both ends being arranged in one-to-one correspondence with the two ends of the target material.
2. The magnetron sputtering coating machine according to claim 1, characterized in that: The air supply pipeline structure (21) comprises an air intake pipeline (211), an air pipe (212) and a flow meter, wherein the flow meter is arranged on the air intake pipeline (211), a first end of the air pipe (212) is connected to the air intake pipeline (211), and a plurality of first air outlet holes are arranged on the air pipe (212).
3. The magnetron sputtering coating machine according to claim 2, characterized in that: The length of the air pipe (212) arranged corresponding to the end of the target material is 20 cm to 30 cm.
4. The magnetron sputtering coating machine according to claim 3, characterized in that: The diameter of the first air outlet hole is 0.8 mm to 1.2 mm.
5. The magnetron sputtering coating machine according to claim 3, characterized in that: The distance between adjacent first air outlet holes is 3 cm to 6 cm.
6. The magnetron sputtering coating machine according to claim 1, characterized in that: The distance between adjacent air supply pipeline structures (21) is less than 10 cm.
7. The magnetron sputtering coating machine according to claim 2, characterized in that: The air supply pipeline structure (21) further comprises an outer tube (213), wherein the outer tube (213) is sleeved outside the air tube (212), and a plurality of second air outlet holes are arranged on the outer tube (213), wherein the plurality of second air outlet holes are arranged in one-to-one correspondence with the plurality of first air outlet holes, and the diameter of the second air outlet holes is greater than the diameter of the first air outlet holes.
8. The magnetron sputtering coating machine according to claim 7, characterized in that: The target material mounting seat structure (12) comprises a mounting seat (121) and a rotating shaft (122); the mounting seat (121) is connected to the shell structure (11); the target material is sleeved on the rotating shaft (122); and the rotating shaft (122) is rotatably connected to the mounting seat (121).
9. The magnetron sputtering coating machine according to claim 1, characterized in that: The target material mounting seat structure (12) comprises a plurality of groups, the gas supply assembly (20) is arranged in one-to-one correspondence with the plurality of groups of the target material mounting seat structures (12), and the plurality of groups of the target material mounting seat structures (12) are evenly distributed along the inner wall of the shell structure (11).
10. The magnetron sputtering coating machine according to any one of claims 1 to 9, characterized in that: The magnetron sputtering coating machine also includes a fixing component (30), which is arranged in the shell structure (11), the fixing component (30) is rotatably connected to the shell structure (11), and the axis of the fixing component (30) is parallel to the target material.
Citation Information
Patent Citations
Efficient semiconductor packaging coating system
CN219260176U