Lamp heat dissipation structure
By designing the heat dissipation structure of the liquid reservoir, main heat dissipation blade and air conduction components in LED lamps, the problem of difficulty in heat dissipation of sealed LED lamps is solved, and the heat dissipation effect and service life of LED lamps are significantly improved.
Patent Information
- Application Number
- CN202422230490.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-09-12
AI Technical Summary
The heat generated by sealed LED lamps during operation is difficult to effectively dissipate heat, which affects the service life of LED lamp beads.
A lighting fixture heat dissipation structure is designed, including a shell, partition, liquid reservoir, main heat dissipation blade and air conduction assembly. The liquid reservoir is filled with condensate, and the main heat dissipation blade penetrates the partition. The air conduction assembly is directed and discharged through the air conduction frame and exhaust holes to enhance the heat dissipation effect.
The heat generated by the LED lamp is absorbed through the flow of condensate, and through the synergistic effect of the main heat dissipation blade and the air conduction assembly, the heat dissipation effect of the lamp is significantly improved and the service life of the LED lamp is extended.
Smart Images

Figure CN222977966U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of lamps, in particular to a heat dissipation structure of a lamp. Background Art
[0002] Semiconductor lighting, namely light-emitting diodes, abbreviated as LED, is a semiconductor solid-state light-emitting device. It uses a solid semiconductor chip as the light-emitting material. In the semiconductor, carriers recombine to release excess energy, causing photon emission and directly emitting light. The technology of LED lamps is relatively mature in our lives. For example, more and more common car headlights in the automotive field use LED headlights.
[0003] In order to make vehicles more conspicuous and safe during night driving, more and more automobile manufacturers have designed LED through-tail lights on their vehicles. Since LED lamps generate heat during operation, and most of the LED lamps in car tail lights are of a sealed design, the sealed structure reduces the heat dissipation effect of the tail lights, which will in turn affect the service life of the entire LED lamp beads.
[0004] Therefore, it is necessary to provide a new heat dissipation structure for lamps to solve the above technical problems. Summary of the Utility Model
[0005] To solve the above technical problems, the utility model provides a heat dissipation structure of a lamp.
[0006] The heat dissipation structure of the lamp provided by the utility model includes: a housing, a partition is installed inside the housing, the partition divides the inside of the housing into two independent spaces, and an LED lamp is provided in one independent space on one side inside the housing;
[0007] A liquid storage pipe is provided in the space on the side where the LED lamp is provided inside the housing. The inside of the liquid storage pipe is filled with a condensate. The outer wall of the liquid storage pipe abuts against the outer wall of the LED lamp. A main heat dissipation fin is inserted into the inside of the liquid storage pipe, and the main heat dissipation fin penetrates through the partition and extends into the other space inside the housing;
[0008] Air guiding components for guiding are provided on both sides inside the housing.
[0009] Preferably, the air guiding component includes an air guiding frame, the air guiding frame is embedded in the space on the side far from the LED lamp inside the housing, exhaust holes are provided on the air guiding frame, an air inlet pipe is provided on the air guiding frame and is communicated with the air guiding frame, and the end of the air inlet pipe penetrates through the housing.
[0010] Preferably, the air guiding component further includes an air guiding pipe, the air guiding pipe is installed on the tailgate of the vehicle, and a connecting pipe for communication is provided between the air guiding pipe and the air inlet pipe.
[0011] Preferably, an exhaust pipe is provided in an independent space on the side of the housing away from the LED lamp, and the end of the exhaust pipe extends outside the housing.
[0012] Preferably, a convex rod and a through hole are provided on the side wall of the housing away from the LED lamp, and the inner wall of the through hole abuts against the outer wall of the intake pipe.
[0013] Preferably, a strip-shaped through groove is formed inside the partition board, and the inner wall of the strip-shaped through groove abuts against the outer wall of the main heat dissipation fin.
[0014] Preferably, a plurality of semiconductor refrigeration chips are embedded inside the partition board. The refrigerating surface of the semiconductor refrigeration chip abuts against the outer wall of the liquid storage pipe. An installation cover is provided outside the semiconductor refrigeration chip on the outer wall of the partition board. The inner wall of the installation cover abuts against the heating surface of the semiconductor refrigeration chip, and auxiliary heat dissipation fins are provided on the outer wall of the installation cover.
[0015] Compared with the related art, the lamp heat dissipation structure provided by the present utility model has the following beneficial effects:
[0016] In the present utility model, the LED lamp is embedded in the liquid storage pipe filled with the condensate. When the vehicle is running, the vibration generated by the vehicle can make the condensate flow evenly, so that the heat generated by the LED lamp can be absorbed and dissipated through the main heat dissipation fins. At the same time, the air guiding component can introduce the airflow during driving into the housing for circulation. Therefore, the heat dissipation effect of the lamp can be assisted to improve, and the service life of the LED lamp can be increased.
[0017] In the present utility model, by embedding the semiconductor refrigeration chip, during use, the semiconductor refrigeration chip can also cool the condensate in the liquid storage pipe, so as to further improve the heat dissipation effect on the LED lamp.
[0018] In the present utility model, by providing auxiliary heat dissipation fins outside the semiconductor refrigeration chip, when the air guiding component introduces the airflow into the housing, the flowing airflow can also dissipate the heat generated when the semiconductor refrigeration chip works by blowing the auxiliary heat dissipation fins. Description of the Drawings
[0019] Figure 1 It is a schematic structural diagram of a preferred embodiment of the lamp heat dissipation structure provided by the present utility model;
[0020] Figure 2 is Figure 1 a partial cross-sectional structural diagram of the shown LED lamp and liquid storage pipe;
[0021] Figure 3 is Figure 1 a schematic structural diagram of the shown air guiding component;
[0022] Figure 4 is Figure 1 a schematic structural diagram of a partial cross-section of the housing and its components shown;
[0023] Figure 5 is Figure 1 a schematic partial structural diagram of the semiconductor refrigeration chip and its components shown.
[0024] Reference numerals in the figure: 1, housing; 11, partition; 111, strip-shaped through groove; 12, exhaust pipe; 13, convex rod; 14, through hole; 2, LED lamp; 3, liquid storage pipe; 31, main heat dissipation fin; 4, air guide assembly; 41, air guide frame; 411, intake pipe; 412, exhaust hole; 42, air guide pipe; 43, adapter pipe; 5, auxiliary heat dissipation fin; 51, mounting cover; 6, semiconductor refrigeration chip. Specific embodiments
[0025] In order to make the purpose, technical solutions and advantages of the present utility model clearer, the following further details the present utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.
[0026] The following details the specific implementation of the present utility model in conjunction with specific embodiments.
[0027] Please refer to Figures 1 to 5 , a lamp heat dissipation structure provided by an embodiment of the present utility model, the lamp heat dissipation structure includes: a housing 1.
[0028] In the embodiment of the present utility model, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4, a partition 11 is installed inside the housing 1. The partition 11 divides the inside of the housing 1 into two independent spaces. An LED lamp 2 is provided in one of the independent spaces on one side inside the housing 1. A liquid storage tube 3 is provided in the space on the side where the LED lamp 2 is provided inside the housing 1. The inside of the liquid storage tube 3 is filled with a condensate. The outer wall of the liquid storage tube 3 abuts against the outer wall of the LED lamp 2. A main heat dissipation fin 31 is inserted into the inside of the liquid storage tube 3, and the main heat dissipation fin 31 extends through the partition 11 to the other space inside the housing 1. Air guiding assemblies 4 for guiding are provided on both sides inside the housing 1. The air guiding assembly 4 includes an air guiding frame 41. The air guiding frame 41 is embedded in the space on the side away from the LED lamp 2 inside the housing 1. Exhaust holes 412 are formed in the air guiding frame 41. An air inlet pipe 411 communicating with the air guiding frame 41 is provided on the air guiding frame 41, and the end of the air inlet pipe 411 penetrates through the housing 1. The air guiding assembly 4 further includes an air guiding pipe 42. The air guiding pipe 42 is installed on the tailgate of the vehicle, and a connecting pipe 43 is provided between the air guiding pipe 42 and the air inlet pipe 411. An exhaust pipe 12 communicating with the air guiding frame 41 is provided in the independent space on the side away from the LED lamp 2 inside the housing 1, and the end of the exhaust pipe 12 extends to the outside of the housing 1.
[0029] It should be noted that: by embedding the LED lamp 2 in the liquid storage tube 3 filled with the condensate, when the vehicle is running, the vibration generated by the vehicle can make the condensate flow evenly, and then it can absorb the heat generated by the LED lamp 2 and dissipate the heat through the main heat dissipation fin 31.
[0030] During the running of the vehicle, the air guiding pipe 42 can introduce the external air flow into the connecting pipe 43, the air inlet pipe 411 and the air guiding frame 41, and flow through the exhaust frame in the air guiding frame 41 to the side away from the LED lamp 2 inside the housing 1. At this time, the flowing air flow can take away the heat on the main heat dissipation fin 31 on the side away from the LED lamp 2 inside the housing 1 and discharge it to the outside through the exhaust pipe 12. Furthermore, by improving the heat dissipation effect of the main heat dissipation fin 31, the heat dissipation effect of the whole device can be improved, so that the heat dissipation effect of the device in the later stage can be more excellent.
[0031] In the embodiment of the present utility model, please refer to Figure 1 , Figure 2 and Figure 4 , a convex rod 13 and a through hole 14 are provided on the side wall of the housing 1 away from the LED lamp 2, and the inner wall of the through hole 14 abuts against the outer wall of the air inlet pipe 411.
[0032] It should be noted that: by providing the through hole 14, the air inlet pipe 411 can extend to the outside of the housing 1. And by providing the convex rod 13, when installing the device later, after inserting the convex rod 13 into the tailgate of the vehicle, the device can be installed and fixed by screwing a nut.
[0033] In the embodiment of the present utility model, please refer to Figure 1, Figure 2 and Figure 4 , a strip-shaped through groove 111 is formed inside the partition plate 11, and the inner wall of the strip-shaped through groove 111 abuts against the outer wall of the main heat dissipation fin 31.
[0034] It should be noted that: by forming the strip-shaped through groove 111, the main heat dissipation fin 31 on one side inside the LED lamp 2 can be inserted into the strip-shaped through groove 111 and extend to the other side inside the housing 1, so that the main heat dissipation fin 31 is in the flow space of the gas introduced by the air guiding assembly 4, thereby facilitating the improvement of the heat dissipation of the condensate.
[0035] In the embodiment of the present invention, please refer to Figure 1 and Figure 5 , a plurality of semiconductor refrigeration chips 6 are embedded inside the partition plate 11. The refrigerating surface of the semiconductor refrigeration chip 6 abuts against the outer wall of the liquid storage pipe 3. An installation cover 51 is arranged outside the semiconductor refrigeration chip 6 on the outer wall of the partition plate 11. The inner wall of the installation cover 51 abuts against the heating surface of the semiconductor refrigeration chip 6, and auxiliary heat dissipation fins 5 are arranged on the outer wall of the installation cover 51.
[0036] It should be noted that: through the arrangement of the semiconductor refrigeration chip 6, during the later use process, the working semiconductor refrigeration chip 6 can refrigerate the condensate inside the liquid storage pipe 3, so that the condensate can be a continuous cold source, thereby improving the heat dissipation effect of the condensate on the LED lamp 2. And through the arrangement of the auxiliary heat dissipation fins 5, the contact area between the installation cover 51 and the outside can be increased. When the air guiding assembly 4 guides the outside air, the heat dissipation of the semiconductor refrigeration chip 6 itself can be improved.
[0037] The working principle of the lamp heat dissipation structure provided by the present invention is as follows:
[0038] During the later use of the device, first, the convex rod 13 and the air inlet pipe 411 on the housing 1 can be inserted into the installation groove reserved in the vehicle trunk, and then a nut is screwed onto the convex rod 13 to fixedly install the housing 1. Then, the air guide pipe 42 in the air guiding assembly 4 can be installed on the vehicle tailgate, and the bent end of the air guide pipe 42 extends into the vehicle trunk through the reserved hole. Then, the adapter pipe 43 can be taken out, and the adapter pipe 43 is connected to the air guide pipe 42 and the air inlet pipe 411. Then, the electrical connection of the device is carried out to complete the installation of the device;
[0039] During the later use, when the LED lamp 2 is lit and working, the condensate inside the liquid storage pipe 3 outside the LED can wrap the LED lamp 2, and the vibration force during the vehicle driving can also make the condensate flow evenly, so that the condensate can be heated more evenly. And the main heat dissipation fins 31 embedded at one end inside the liquid storage pipe 3 can increase the contact area outside the liquid storage pipe 3 and improve the heat dissipation effect of the main heat dissipation fins 31 on the condensate;
[0040] During this process, the working semiconductor refrigeration sheet 6 can refrigerate the condensate inside the liquid storage pipe 3, enabling the condensate to continuously receive a cold source in the later stage. Furthermore, it can reduce the phenomenon that the temperature of the condensate is too high, which may lead to a poor cooling and heat dissipation effect on the LED lamp 2. Therefore, the heat dissipation effect on the LED lamp 2 can be improved.
[0041] Moreover, during the vehicle's driving process, the air duct 42 can introduce external airflows into the adapter pipe 43, the intake pipe 411, and the air guide frame 41, and the airflows can flow through the exhaust frame inside the air guide frame 41 to the side of the housing 1 away from the LED lamp 2. At this time, the flowing airflows can carry away the heat on the main heat dissipation fins 31 and the auxiliary heat dissipation fins 5 on the side of the housing 1 away from the LED lamp 2. Then, the gas can drive the heat to be discharged outward through the exhaust pipe 12. Furthermore, by improving the heat dissipation effect of the main heat dissipation fins 31 and the auxiliary heat dissipation fins 5, the heat dissipation effect of the entire device can be improved. Therefore, the heat dissipation effect of the device in the later stage can be made more excellent.
[0042] The circuits and controls involved in the present utility model are all prior arts and will not be elaborated here.
[0043] The above are only embodiments of the present utility model and do not limit the patent scope of the present utility model. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present utility model.
Claims
1. A lamp heat dissipation structure, characterized in that: include: A shell (1), wherein a partition (11) is provided inside the shell (1), wherein the partition (11) divides the inside of the shell (1) into two independent spaces, and an LED lamp (2) is provided in the independent space on one side of the inside of the shell (1); A liquid storage tube (3) is provided in a space on one side of the LED lamp (2) inside the housing (1), condensate is provided inside the liquid storage tube (3), the outer wall of the liquid storage tube (3) abuts against the outer wall of the LED lamp (2), a main heat dissipation blade (31) is inserted into the liquid storage tube (3), and the main heat dissipation blade (31) passes through the partition (11) and extends to the other side of the space inside the housing (1); Air guide components (4) for guiding flow are provided on both sides of the interior of the housing (1).
2. The lamp heat dissipation structure according to claim 1, characterized in that: The air guide assembly (4) comprises an air guide frame (41), the air guide frame (41) being embedded in a space inside the housing (1) away from a side of the LED lamp (2), the air guide frame (41) being provided with an exhaust hole (412), the air guide frame (41) being provided with a communicating air intake pipe (411), and the end of the air intake pipe (411) passing through the housing (1).
3. The lamp heat dissipation structure according to claim 2, characterized in that: The air guide assembly (4) further comprises an air guide pipe (42), wherein the air guide pipe (42) is mounted on the tailgate of the vehicle, and a connecting pipe (43) is provided between the air guide pipe (42) and the air intake pipe (411).
4. The lamp heat dissipation structure according to claim 1, characterized in that: A connected exhaust pipe (12) is provided in an independent space on a side of the housing (1) away from the LED lamp (2), and an end of the exhaust pipe (12) extends to the outside of the housing (1).
5. The lamp heat dissipation structure according to claim 2, characterized in that: A convex rod (13) and a through hole (14) are provided on the side wall of the housing (1) away from the LED lamp (2), and the inner wall of the through hole (14) abuts against the outer wall of the air intake pipe (411).
6. The lamp heat dissipation structure according to claim 1, characterized in that: A strip-shaped through-groove (111) is provided inside the partition plate (11), and the inner wall of the strip-shaped through-groove (111) abuts against the outer wall of the main heat dissipation blade (31).
7. The lamp heat dissipation structure according to claim 1, characterized in that: A plurality of semiconductor refrigeration sheets (6) are embedded inside the partition (11), and the cooling surface of the semiconductor refrigeration sheet (6) abuts against the outer wall of the liquid storage tube (3). A mounting cover (51) is provided outside the semiconductor refrigeration sheet (6) on the outer wall of the partition (11), and the inner wall of the mounting cover (51) abuts against the heating surface of the semiconductor refrigeration sheet (6), and an auxiliary heat dissipation blade (5) is provided on the outer wall of the mounting cover (51).