Silicon wafer size measuring device with cleaning bin

Abstract

The utility model relates to a silicon wafer size measuring device with a cleaning bin. Comprising a conveying assembly, a camera detection assembly, a surface light assembly and a base plate, the conveying assembly comprises a conveying belt and a driving motor, the camera detection assembly comprises a profile support and a camera, the surface light assembly is arranged on the base plate, the conveying belt is transversely arranged above the surface light assembly, the camera is connected to the base plate through the profile support, and the camera points to the conveying belt; the driving motor drives the conveying belt to drive the silicon wafers placed on the conveying belt to pass through an area between the camera and the conveying belt. Rotary fine adjustment can be carried out in the Y direction or the X direction through the camera, then position adjustment is carried out in the Y direction and the up-down direction, shot images are more comprehensive and more accurate, the omission ratio is reduced, meanwhile, fragments falling on the area light source are blown into the fragment box through the blowing component to be collected, the fragment collecting function is achieved, the phenomena of misjudgment and the like are avoided, and the production efficiency is improved. Meanwhile, the phenomenon that fragments fly around is effectively avoided, the frequency of manually cleaning the machine table is reduced, and the labor cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the field of silicon wafer sorting equipment, and particularly relates to a silicon wafer size measuring device with a cleaning bin. Background Art

[0002] As an important raw material for solar cells, silicon wafers are widely used in the production and manufacturing of products such as solar cells and circuit boards. During the production process of silicon wafers, quality inspection needs to be carried out on the silicon wafers after production, and they can only be used if they are qualified. Among them, the silicon wafer sorter, as the terminal equipment for silicon wafer quality control, detects and sorts the quality grades of silicon wafers in terms of size, chipping, silicon loss, hidden cracks, thickness, resistivity, dirt, etc., to ensure the quality of products such as solar panels made of silicon wafers.

[0003] The silicon wafer sorter generally consists of three parts: feeding, detection, and discharging and sorting. The finished silicon wafers complete the detection of various quality indicators in the detector, and the silicon wafer size is also an important quality indicator. At present, the sizes of solar silicon wafers have been standardized in a series. The main length and width sizes of silicon wafers are the following series of sizes: 156*156mm, 182*182mm, 210*210mm, 230*230mm, 210*105mm, 156*78mm, 182*91mm, etc. The width of the silicon wafers is in the range of 78 - 230mm. To ensure that the sizes of silicon wafers in each production batch are consistent and the quality is qualified, it is necessary to strictly control the size of each silicon wafer. Secondly, in actual production, the silicon wafers may be broken due to factors such as collision during the conveying process, and the fragments will be carried into the detector by the conveyor line during the silicon wafer conveying and fall on the detection station, which will affect the subsequent detection and sorting work. Therefore, fragment detection is carried out while detecting the size of the silicon wafers, and the fragments are removed in the subsequent process. In a high-speed silicon wafer sorter, due to the fast incoming material and uncontrollable fragment conditions, fragments often fall on the surface light source at the size station, affecting the normal size detection function of the silicon wafers. In the prior art, blowing nozzles are often added on the side of the surface light source to directly blow away the fallen fragments, but this method causes the fragments to fly everywhere, resulting in a chaotic internal environment of the machine tool, not meeting the requirements of the factory's 5S production, and requiring secondary cleaning by personnel later, consuming a large amount of labor costs. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model provides a silicon wafer size measuring device with a cleaning bin. The camera can be rotated and finely adjusted along the Y direction or the X direction, and then the position is adjusted in the Y direction and the up and down directions, so that the captured image is more comprehensive and accurate, reducing the missed detection rate. At the same time, the blowing component blows the fragments falling on the surface light source into the scrap box for collection, realizing the function of fragment collection, avoiding phenomena such as misjudgment, effectively solving the phenomenon of fragments flying everywhere, reducing the number of times of manually cleaning the machine tool, and reducing the labor cost.

[0005] To achieve the above object, the technical solution adopted by the present utility model is as follows:

[0006] A silicon wafer size measuring device with a cleaning chamber, comprising a conveying component, a camera detection component, a surface light component and a substrate. The conveying component includes a conveyor belt and a driving motor. The camera detection component includes a profile bracket and a camera. The surface light component is arranged on the substrate. The conveyor belt is horizontally placed above the surface light component. The camera is connected to the substrate through the profile bracket. The camera points to the conveyor belt. The driving motor drives the conveyor belt to drive the silicon wafer placed thereon to pass through the area between the camera and the conveyor belt.

[0007] The camera detection component further includes a sliding member and an extension member. The sliding member includes a Y-direction slide table, an X-direction slide table and a slide table mounting plate. The X direction is the traveling direction of the silicon wafer on the conveyor belt, and the Y direction is perpendicular to the traveling direction of the silicon wafer on the conveyor belt. The camera, the Y-direction slide table, the X-direction slide table and the slide table mounting plate are sequentially connected along the Y direction. The Y-direction slide table can rotate around the Y direction as the rotation center. The X-direction slide table can rotate around the X direction as the rotation center. The slide table mounting plate is connected to the profile bracket through the extension member. The extension member includes a guide rail, a Y-direction extension plate, an extension seat and a mounting table. The slide table mounting plate is movably connected up and down to the guide rail. The guide rail, the Y-direction extension plate, the extension seat and the mounting table are sequentially connected along the Y direction. The Y-direction extension plate and the extension seat are movably connected along the Y direction. The mounting table is detachably connected to the profile bracket. The camera detection component further includes a base. The profile bracket is detachably connected to the substrate through the base. The camera detection component further includes a reinforcing plate. The reinforcing plate is detachably connected to the profile bracket and the base respectively.

[0008] The surface light component includes a surface light member, and the surface light member includes a surface light source, a surface light support plate, surface light pedestals, and side baffles. The surface light source is arranged on the surface light support plate. The lower end of the surface light support plate is detachably connected to the substrate through the surface light pedestals. There are two groups of side baffles, and the two groups of side baffles are respectively connected to the opposite side surfaces of the surface light support plate. A blowing groove is formed by enclosing the two groups of side baffles and the surface light source. An avoidance groove is provided on the side baffle, and the conveyor belt is located in the avoidance groove. The surface light component further includes a blowing member, and the blowing member includes a blowing nozzle, a nozzle mounting bracket, and a movable block. The nozzle mounting bracket is connected to the side surface of the surface light support plate through the movable block, and the blowing nozzle is connected to the nozzle mounting bracket, and the blowing nozzle points to the blowing groove. The surface light component further includes a cleaning member, and the cleaning member includes a scrap baffle and a scrap box. Two opposite edges on the scrap baffle respectively extend downward to form extension plates, and the scrap baffle is connected to the side surface of the surface light support plate through the extension plates. The scrap box is arranged at the lower end of the scrap baffle. A blowing cavity is formed by enclosing the scrap baffle and the two extension plates, and the blowing cavity is respectively communicated with the blowing groove and the scrap box.

[0009] For the silicon wafer size measuring device with a cleaning chamber adopting this structure, the substrate provides the most basic supporting function. The conveyor belt of the conveying component is horizontally placed above the surface light component, and the camera on the camera detection component points to the conveyor belt. Driven by the driving motor, the silicon wafer passes through the area between the camera and the conveyor belt. The detection of the silicon wafer size adopts a single-camera structure. By using a high-resolution camera to take a complete image of the silicon wafer, and then counting the number of pixel points and pixel equivalent of the image to obtain the size of the silicon wafer. Since it is impossible to ensure that the direction of the camera is exactly perpendicular to the silicon wafer when the camera is installed on the profile bracket, and the two are relatively independent structures, there will be a slight angle between the silicon wafer conveyed on the conveyor belt and the camera in the vertical direction, which will affect the accurate detection of the image. In order to ensure that the detected data is accurate enough, a sliding member is set. The camera realizes rotation around the Y direction through the Y-direction slide table, and the camera realizes rotation around the X direction through the X-direction slide table. Therefore, the camera can adjust its position through the Y-direction slide table and the X-direction slide table. By adjusting the two angles, this problem can be compensated, so that the camera can ensure perpendicular to the upper end surface of the silicon wafer and improve the accuracy of detection.

[0010] The provided extension member can keep the silicon wafer on the conveyor belt centered within the imaging field of view of the camera by adjusting the distance of the Y-direction extension plate in the Y direction, ensuring that the silicon wafer does not exceed the field of view during high-speed conveying. Among them, the guide rail can adjust the height of the camera to obtain different working distances, so that the camera can obtain different fields of view and be able to detect silicon wafers with different specification sizes.

[0011] In the surface light component, the surface light source is located directly below the camera. When the silicon wafer to be measured is conveyed to the detection position, the surface light source shines light from the bottom upwards, and a complete image of the silicon wafer is obtained by the camera. The size of the silicon wafer is calculated according to the pixel equivalent. However, when there are fragments on the conveyor belt and they fall on the surface light source, the fragments will be captured together in the image taken by the camera. Therefore, the calculated pixel equivalent is inaccurate. In order to remove the fragments, a blowing component is provided. The blowing component consists of a blowing nozzle, a nozzle mounting bracket, and a movable block. The high-pressure gas blown out by the blowing nozzle blows into the blowing groove, blowing away the fragments that have fallen on the surface light source, making the detection image more accurate.

[0012] Furthermore, ventilation holes are provided on the waste material baffle, and a detachable filter screen is installed on the ventilation holes.

[0013] Compared with the prior art, the advantages of the present utility model are as follows: The camera rotates around the Y-axis through the Y-axis slide, and the camera rotates around the X-axis through the X-axis slide. Therefore, the position of the camera can be adjusted by the Y-axis slide and the X-axis slide. By adjusting the two angles, this problem can be compensated for, enabling the camera to ensure perpendicularity to the upper end surface of the silicon wafer and improving the accuracy of detection. By adjusting the distance of the Y-axis extension plate in the Y-axis direction, the silicon wafer on the conveyor belt can be kept centered within the imaging field of view of the camera, ensuring that the silicon wafer does not exceed the field of view during high-speed conveyance. The high-pressure gas blown out by the blowing nozzle blows into the blowing groove, blowing away the fragments that have fallen on the surface light source, making the detection image more accurate. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 Is a three-dimensional view of the present utility model;

[0016] Figure 2 Is a three-dimensional view of the camera detection component of the present utility model;

[0017] Figure 3 Is a three-dimensional view of the surface light component of the present utility model.

[0018] Wherein: 1. Conveyor assembly; 11. Conveyor belt; 12. Driving motor; 2. Camera detection assembly; 21. Camera; 22. Profile bracket; 23. Sliding member; 231. Y-direction slide; 232. X-direction slide; 233. Slide mounting plate; 24. Extension member; 241. Guide rail; 242. Y-direction extension plate; 243. Extension seat; 244. Mounting table; 25. Base; 26. Reinforcing plate; 3. Surface light assembly; 31. Surface light member; 311. Surface light source; 312. Surface light support plate; 313. Surface light foot seat; 314. Side baffle; 315. Blowing groove; 316. Avoidance groove; 32. Blowing member; 321. Blowing nozzle; 322. Nozzle mounting bracket; 323. Movable block; 33. Cleaning member; 331. Scrap baffle; 332. Scrap box; 333. Extension plate; 334. Blowing cavity; 335. Vent hole; 4. Substrate; 5. Silicon wafer. Detailed implementation manners

[0019] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the scope protected by the present utility model.

[0020] The following will describe the detailed implementation manners of the present utility model with reference to the accompanying drawings:

[0021] As Figures 1-3 shown, a silicon wafer size measuring device with a cleaning chamber includes a conveyor assembly 1, a camera 21 detection assembly 2, a surface light assembly 3 and a substrate 4. The conveyor assembly 1 includes a conveyor belt 11 and a driving motor 12. The camera 21 detection assembly 2 includes a profile bracket 22 and a camera 21. The surface light assembly 3 is disposed on the substrate 4. The conveyor belt 11 is horizontally disposed above the surface light assembly 3. The camera 21 is connected to the substrate 4 through the profile bracket 22. The camera 21 points to the conveyor belt 11. The driving motor 12 drives the conveyor belt 11 to drive the silicon wafer 5 placed thereon through the area between the camera 21 and the conveyor belt 11.

[0022] The camera 21 detection component 2 further includes a sliding member 23 and an extension member 24. The sliding member 23 includes a Y-direction slide 231, an X-direction slide 232, and a slide mounting plate 233. The X direction is the traveling direction of the silicon wafer 5 on the conveyor belt 11, and the Y direction is perpendicular to the traveling direction of the silicon wafer 5 on the conveyor belt. The camera 21, the Y-direction slide 231, the X-direction slide 232, and the slide mounting plate 233 are sequentially connected along the Y direction. The Y-direction slide 231 can rotate around the Y direction as the rotation center, and the X-direction slide 232 can rotate around the X direction as the rotation center. The slide mounting plate 233 is connected to the profile bracket 22 through the extension member 24. The extension member 24 includes a guide rail 241, a Y-direction extension plate 242, an extension base 243, and a mounting table 244. The slide mounting plate 233 is movably connected to the guide rail 241 up and down. The guide rail 241, the Y-direction extension plate 242, the extension base 243, and the mounting table 244 are sequentially connected along the Y direction. The Y-direction extension plate 242 is movably connected to the extension base 243 along the Y direction. The mounting table 244 is detachably connected to the profile bracket 22. The camera 21 detection component 2 further includes a base 25. The profile bracket 22 is detachably connected to the substrate 4 through the base 25. The camera 21 detection component 2 further includes a reinforcing plate 26. The reinforcing plate 26 is detachably connected to the profile bracket 22 and the base 25 respectively.

[0023] The surface light assembly 3 includes a surface light member 31. The surface light member 31 includes a surface light source 311, a surface light support plate 312, a surface light footrest 313, and side baffles 314. The surface light source 311 is disposed on the surface light support plate 312. The lower end of the surface light support plate 312 is detachably connected to the substrate 4 through the surface light footrest 313. The side baffles 314 include two groups, and the two groups of side baffles 314 are respectively connected to the opposite sides of the surface light support plate 312. The two groups of side baffles 314 and the surface light source 311 enclose a blowing groove 315. The side baffle 314 is provided with an avoidance groove 316, and the conveyor belt 11 is located in the avoidance groove 316. The surface light assembly 3 further includes a blowing member 32. The blowing member 32 includes a blowing nozzle 321, a nozzle mounting bracket 322, and a movable block 323. The nozzle mounting bracket 322 is connected to the side of the surface light support plate 312 through the movable block 323. The blowing nozzle 321 is connected to the nozzle mounting bracket 322, and the blowing nozzle 321 points to the blowing groove 315. The surface light assembly 3 further includes a cleaning member 33. The cleaning member 33 includes a debris baffle 331 and a debris box 332. Two opposite edges on the debris baffle 331 respectively extend downward to form extension plates 333. The debris baffle 331 is connected to the side of the surface light support plate 312 through the extension plates 333. The debris box 332 is disposed at the lower end of the debris baffle 331. A blowing cavity 334 is enclosed between the debris baffle 331 and the two extension plates 333. The blowing cavity 334 is respectively communicated with the blowing groove 315 and the debris box 332.

[0024] Further, the debris baffle 331 is provided with ventilation holes 335, and a detachable filter screen is installed on the ventilation holes 335.

[0025] The working mode of the present utility model is described as follows:

[0026] For the silicon wafer size measuring device with a cleaning chamber adopting this structure, the substrate 4 provides the most basic supporting function. The conveyor belt 11 of the conveying component 1 is horizontally placed above the surface light component 3, and the camera 21 on the detection component 2 points to the conveyor belt 11. Driven by the driving motor 12, the silicon wafer 5 passes through the area between the camera 21 and the conveyor belt 11. The detection of the silicon wafer 5 size adopts a single-camera 21 structure. By using a high-resolution camera 21 to take an overall picture of the silicon wafer 5 to obtain a complete image of the silicon wafer 5, and then counting the number of image pixels and pixel equivalent to obtain the size of the silicon wafer 5. Since it is impossible to ensure that the camera 21 points perpendicularly to the silicon wafer 5 when the camera 21 is installed on the profile bracket 22, and the two are relatively independent structures, there will be a slight angle between the silicon wafer 5 conveyed on the conveyor belt 11 and the camera 21 in the vertical direction, which will affect the accurate detection of the image. In order to ensure that the detected data is accurate enough, a sliding member 23 is set. The camera 21 rotates around the Y-axis through the Y-axis slide 231, and the camera 21 rotates around the X-axis through the X-axis slide 232. Therefore, the camera 21 can adjust its position through the Y-axis slide 231 and the X-axis slide 232. By adjusting the two angles, this problem can be compensated, so that the camera 21 can ensure perpendicular to the upper end surface of the silicon wafer 5 and improve the detection accuracy.

[0027] The provided extension member 24 can keep the silicon wafer 5 on the conveyor belt 11 centered within the imaging field of view of the camera 21 by adjusting the distance of the Y-axis extension plate 242 in the Y-axis direction, ensuring that the silicon wafer 5 does not exceed the field of view during high-speed conveying. The guide rail 241 can adjust the height of the camera 21 to obtain different working distances, so that the camera 21 can obtain different fields of view and be compatible with the detection of silicon wafers 5 of different specifications and sizes.

[0028] In the surface light component 3, the surface light source 311 is located directly below the camera 21. When the silicon wafer 5 to be measured is conveyed to the detection position, the surface light source 311 shines light from bottom to top, and a complete image of the silicon wafer 5 is obtained in the camera 21. The size of the silicon wafer 5 is calculated according to the pixel equivalent. However, when there are fragments in the incoming material of the conveyor belt 11 and they fall on the surface light source 311, the fragments will be taken in the image captured by the camera 21, so the calculated pixel equivalent is inaccurate. In order to remove the fragments, a blowing member 32 is set. The blowing member 32 composed of a blowing nozzle 321, a nozzle mounting bracket 322, and a movable block 323 can change the blowing angle of the blowing nozzle 321 through the connection between the nozzle mounting bracket 322 and the movable block 323, and keep the high-pressure gas blown out by the blowing nozzle 321 blown into the blowing groove 315 to blow away the fragments falling on the surface light source 311 and make the detection image more accurate.

[0029] When the blowing nozzle 321 blows out high-pressure gas, the blowing trough 315 formed by enclosing the two groups of side baffles 314 can serve as a diversion channel to make the fragments concentrate and move towards the scrap baffle 331. The scrap baffle 331 and the two groups of extension plates 333 enclose a blowing cavity 334. The blowing cavity 334 connects the blowing trough 315 and the scrap box 332. Therefore, under the high-pressure gas, the scraps will be blown into the scrap box 332. However, due to the high-pressure gas, without the function of filtering the gas, the scraps blown into the scrap box 332 will be blown out in the reverse direction. Therefore, ventilation holes 335 are provided on the scrap baffle 331, and filter nets are installed on the ventilation holes 335. The filter nets can be wire meshes. The wire mesh structure allows the high-pressure gas to blow out along the wire mesh holes. The wire mesh holes allow the air flow to flow straight and block the scraps. The air flow can blow the scraps into the blowing cavity 334 without forming a backflow, and will not form a backflow resulting in the fragments flying randomly. After the fragments are blown onto the scrap baffle 331, they will concentrate and fall into the scrap box 332, completing the function of scrap collection and cleaning.

[0030] The beneficial effects of the present utility model are as follows: The rotation of the camera 21 around the Y-axis is realized through the Y-axis slide 231, and the rotation of the camera 21 around the X-axis is realized through the X-axis slide 232. Therefore, the position of the camera 21 can be adjusted through the Y-axis slide 231 and the X-axis slide 232. By adjusting the two angles, this problem can be compensated, so that the camera 21 can ensure perpendicular to the upper end surface of the silicon wafer 5, improving the accuracy of detection. By adjusting the distance of the Y-axis extension plate 242 in the Y-axis direction, the silicon wafer 5 on the conveyor belt 11 can be kept centered within the imaging field of view of the camera 21, ensuring that the silicon wafer 5 does not exceed the field of view during high-speed transportation. The high-pressure gas blown out by the blowing nozzle 321 blows into the blowing trough 315, blowing away the fragments falling on the surface light source 311, making the detection image more accurate. The wire mesh structure allows the high-pressure gas to blow out along the wire mesh holes, and will not form a backflow resulting in the fragments flying randomly. After the fragments are blown onto the scrap baffle 331, they will concentrate and fall into the scrap box 332, completing the function of scrap collection and cleaning.

[0031] The above embodiments are only used to illustrate the technical solutions of the present utility model, rather than to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A silicon wafer size measuring device with a cleaning chamber, characterized in that: It includes a conveying component, a camera detection component, a surface light component and a substrate. The conveying component includes a conveyor belt and a driving motor. The camera detection component includes a profile bracket and a camera. The surface light component is arranged on the substrate. The conveyor belt is horizontally placed above the surface light component. The camera is connected to the substrate through the profile bracket. The camera points to the conveyor belt. The driving motor drives the conveyor belt to drive the silicon wafer placed thereon to pass through the area between the camera and the conveyor belt.

2. The silicon wafer size measuring device with a cleaning chamber according to claim 1, characterized in that: The camera detection assembly also includes a sliding component and an extension component, the sliding component includes a Y-axis slide, an X-axis slide and a slide mounting plate, the X-axis is the travel direction of the silicon wafer on the conveyor belt, the Y-axis is the travel direction of the silicon wafer perpendicular to the conveyor belt, the camera, the Y-axis slide, the X-axis slide and the slide mounting plate are connected in sequence along the Y-axis, the Y-axis slide can rotate with the Y-axis as the rotation center, the X-axis slide can rotate with the X-axis as the rotation center, and the slide mounting plate is connected to the profile bracket through an extension component.

3. The silicon wafer size measuring device with a cleaning chamber according to claim 2, characterized in that: The extension component includes a guide rail, a Y-direction extension plate, an extension seat and a mounting table. The slide mounting plate can be movably connected to the guide rail up and down. The guide rail, the Y-direction extension plate, the extension seat and the mounting table are connected in sequence along the Y direction. The Y-direction extension plate and the extension seat are movably connected along the Y direction, and the mounting table is detachably connected to the profile bracket.

4. The silicon wafer size measuring device with a cleaning chamber according to claim 3, characterized in that: The camera detection assembly also includes a base, and the profile bracket is detachably connected to the base plate via the base.

5. The silicon wafer size measuring device with a cleaning chamber according to claim 4, characterized in that: The camera detection assembly also includes a reinforcing plate, which is detachably connected to the profile bracket and the base respectively.

6. The silicon wafer size measuring device with a cleaning chamber according to claim 1, characterized in that: The surface light assembly includes a surface light component, which includes a surface light source, a surface light support plate, a surface light foot and a side baffle. The surface light source is arranged on the surface light support plate, and the lower end of the surface light support plate is detachably connected to the base plate through the surface light foot. The side baffles include two groups, and the two groups of side baffles are respectively connected to the opposite sides of the surface light support plate. The two groups of side baffles and the surface light source form a blowing groove. The side baffles are provided with a avoidance groove, and the conveyor belt is located in the avoidance groove.

7. The silicon wafer size measuring device with a cleaning chamber according to claim 6, characterized in that: The surface light assembly also includes a blowing component, which includes a blowing nozzle, a nozzle mounting frame and a movable block. The nozzle mounting frame is connected to the side of the surface light support plate through the movable block, and the blowing nozzle is connected to the nozzle mounting frame, and the blowing nozzle points to the blowing slot.

8. The silicon wafer size measuring device with a cleaning chamber according to claim 7, characterized in that: The surface light assembly also includes a cleaning component, which includes a debris baffle and a debris box, wherein two groups of opposite edges on the debris baffle respectively extend downward to form extension plates, and the debris baffle is connected to the side of the surface light support plate through the extension plates, and the debris box is arranged at the lower end of the debris baffle, and a blowing chamber is enclosed between the debris baffle and the two groups of extension plates, and the blowing chamber is respectively connected to the blowing slot and the debris box.

9. The silicon wafer size measuring device with a cleaning chamber according to claim 8, characterized in that: The crushed material baffle is provided with a vent hole, and a detachably connected filter screen is mounted on the vent hole.

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