Device for wafer double-sided detection

Abstract

The utility model discloses a device for wafer double-sided detection, which comprises a turntable, a first visual inspection lens, a second visual inspection lens, a first lifting mechanism and a second lifting mechanism, wafer positioning grooves are arranged at the top of the turntable at intervals, a first support extending to the upper part of the turntable is arranged on the first lifting mechanism, and a second support extending to the lower part of the turntable is arranged on the second lifting mechanism. The first visual inspection lens is arranged on the first support and points downwards to the path of the wafer positioning groove rotating along with the rotating disc, a vertical plate is arranged on the second lifting mechanism, and a first cantilever extending to the position above the rotating disc is arranged on the upper portion of the vertical plate. The first cantilever is provided with a vacuum suction cup located above the path of the wafer positioning groove rotating along with the rotating disc, the bottom of the vertical plate is provided with a second cantilever extending to the position below the rotating disc, and the second visual detection lens is arranged on the second cantilever and located below the vacuum suction cup. And the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a device for double-sided detection of wafers. Background Art

[0002] During the processing or use of wafers, detection is required. For example, image acquisition of wafers is performed through a vision detection lens. By comparing with a standard image, it can be determined whether there are defects to reject defective products.

[0003] When performing image acquisition on a wafer, it is necessary to first position the wafer through a carrier, and then perform image acquisition on its top surface. Due to the occlusion of the carrier, it is impossible to synchronously perform image acquisition on the bottom surface of the wafer, and the wafer needs to be flipped 180 degrees. The operation is complex, the efficiency is low, and it is difficult to achieve automated detection, so improvement is needed. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a device for double-sided detection of wafers to perform automatic double-sided detection of wafers and improve work efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A device for double-sided detection of wafers includes: a turntable, a first vision detection lens, a second vision detection lens, a first lifting mechanism, and a second lifting mechanism. Wafer positioning grooves are arranged at intervals on the top of the turntable, through holes communicating with the wafer positioning grooves are arranged at the bottom of the turntable, the first lifting mechanism and the second lifting mechanism are arranged at intervals outside the turntable, a first support extending above the turntable is arranged on the first lifting mechanism, the first vision detection lens is arranged on the first support and points downward to the path where the wafer positioning groove rotates with the turntable, a vertical plate is arranged on the second lifting mechanism, a first cantilever extending above the turntable is arranged at the upper part of the vertical plate, a vacuum chuck located above the path where the wafer positioning groove rotates with the turntable is arranged on the first cantilever, a second cantilever extending below the turntable is arranged at the bottom of the vertical plate, and the second vision detection lens is arranged on the second cantilever and is located below the vacuum chuck.

[0007] Wherein, the first lifting mechanism and the second lifting mechanism respectively adopt electric screw slides.

[0008] Wherein, a cam divider is arranged at the bottom of the turntable.

[0009] Wherein, a fixing plate is arranged at the bottom of the cam divider, and the first lifting mechanism and the second lifting mechanism are respectively arranged vertically on the fixing plate.

[0010] Wherein, the number of the wafer positioning grooves is at least 2.

[0011] Among them, the wafer positioning grooves are distributed in an annular array on the top of the turntable.

[0012] Among them, the wafer positioning groove is a circular groove, and the diameter of the wafer positioning groove is larger than the diameter of the through hole.

[0013] The beneficial effects of the present utility model: A device for double-sided inspection of wafers. The wafer is placed in the wafer positioning groove on the turntable manually or by a manipulator, so that the wafer rotates with the turntable. When passing under the first vision inspection lens, the rotation pauses, and the image of the top surface of the wafer is collected and inspected through the first vision inspection lens. The wafer continues to rotate with the turntable. When passing above the second vision inspection lens, the rotation pauses. The vacuum chuck first descends with the first cantilever to adsorb the wafer, and then drives the wafer to rise out of the wafer positioning groove. The second vision inspection lens then rises into the through hole to collect and inspect the image of the bottom surface of the wafer, realizing the automatic double-sided inspection of the wafer and improving the inspection work efficiency. Description of the Drawings

[0014] Figure 1 is a schematic structural diagram of the present utility model;

[0015] Figure 2 is Figure 1 the schematic structural diagram after the second vision inspection lens rises in Detailed Embodiment

[0016] The following combines Figures 1 - 2 and further illustrates the technical solution of the present utility model through specific embodiments.

[0017] As Figure 1 shown, the device for double-sided inspection of wafers includes: a turntable 6, a first vision inspection lens 5, a second vision inspection lens 12, a first lifting mechanism 3 and a second lifting mechanism 10. The top of the turntable 6 is provided with wafer positioning grooves 15 at intervals. A through hole 11 communicating with the wafer positioning grooves 15 is provided at the bottom of the turntable 6. In this embodiment, the wafer positioning groove 15 is a circular groove, and the diameter of the wafer positioning groove 15 is larger than the diameter of the through hole 11, forming a stepped hole, which can position the wafer 14.

[0018] The first lifting mechanism 3 and the second lifting mechanism 10 are arranged at intervals outside the turntable 6. In this embodiment, a cam divider 2 is provided at the bottom of the turntable 6 to drive the rotation of the turntable 6. The cam divider 2 can be controlled by a PLC to realize the intermittent rotation of the turntable 6.

[0019] A fixed plate 1 is provided at the bottom of the cam divider 2. The first lifting mechanism 3 and the second lifting mechanism 10 are respectively vertically arranged on the fixed plate 1 and can be fixed by screws, with a stable structure. In this embodiment, the first lifting mechanism 3 and the second lifting mechanism 10 respectively adopt electric screw slides and can be controlled for lifting by a PLC, with high lifting precision.

[0020] A first bracket 4 extending above the turntable 6 is provided on the first lifting mechanism 3. The first vision detection lens 5 is arranged on the first bracket 4 and points downward to the path where the wafer positioning groove 15 rotates with the turntable 6. The wafer 14 is placed in the wafer positioning groove 15 on the turntable 6 manually or by a manipulator, so that the wafer 14 rotates with the turntable 6. When passing below the first vision detection lens 5, the rotation pauses, and the image of the top surface of the wafer 14 is collected and detected through the first vision detection lens 5.

[0021] In order to collect and detect the image of the bottom surface of the wafer 14, a vertical plate 9 is provided on the second lifting mechanism 10. A first cantilever 8 extending above the turntable 6 is provided at the upper part of the vertical plate 9. A vacuum chuck 7 located above the path where the wafer positioning groove 15 rotates with the turntable 6 is arranged on the first cantilever 8. The vacuum chuck 7 can descend with the first cantilever 8 to adsorb and fix the top surface of the wafer 14.

[0022] A second cantilever 13 extending below the turntable 6 is provided at the bottom of the vertical plate 9. The second vision detection lens 12 is arranged on the second cantilever 13 and is located below the vacuum chuck 7. As Figure 2 shown, the wafer 14 continues to rotate with the turntable 6. When passing above the second vision detection lens 12, the rotation pauses. The vacuum chuck 7 first descends with the first cantilever 8 to adsorb the wafer 14, and then drives the wafer 14 to rise out of the wafer positioning groove 15. The second vision detection lens 12 then rises into the through hole 11 to collect and detect the image of the bottom surface of the wafer 14, realizing the automatic double-sided detection of the wafer.

[0023] In this embodiment, the number of the wafer positioning grooves 15 is at least 2, and the wafer positioning grooves 15 are annularly and arrayedly distributed on the top of the turntable 6, so that multiple wafers can be placed, and the vision detection of the top surface and the bottom surface is sequentially carried out with the rotation of the turntable 6, improving the working efficiency.

[0024] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A device for double-sided inspection of a wafer, characterized in that: include: A turntable, a first visual inspection lens, a second visual inspection lens, a first lifting mechanism and a second lifting mechanism, wherein wafer positioning grooves are arranged at intervals on the top of the turntable, and through holes connected to the wafer positioning grooves are arranged at the bottom of the turntable. The first lifting mechanism and the second lifting mechanism are arranged at intervals on the outside of the turntable, and the first lifting mechanism is provided with a first bracket extending to the top of the turntable, the first visual inspection lens is arranged on the first bracket and points downward to the path of the wafer positioning groove rotating with the turntable, the second lifting mechanism is provided with a vertical plate, and a first cantilever extending to the top of the turntable is arranged on the upper part of the vertical plate, a vacuum suction cup is arranged on the first cantilever and is located above the path of the wafer positioning groove rotating with the turntable, and a second cantilever extending to the bottom of the turntable is arranged at the bottom of the vertical plate, and the second visual inspection lens is arranged on the second cantilever and is located below the vacuum suction cup.

2. The device for double-sided wafer inspection according to claim 1, characterized in that: The first lifting mechanism and the second lifting mechanism respectively adopt electric screw slides.

3. The device for double-sided wafer inspection according to claim 1, characterized in that: A cam divider is arranged at the bottom of the rotating disk.

4. The device for double-sided wafer inspection according to claim 3, characterized in that: A fixing plate is arranged at the bottom of the cam divider, and the first lifting mechanism and the second lifting mechanism are respectively arranged vertically on the fixing plate.

5. The device for wafer double-side detection according to claim 1, characterized in that: The number of the wafer positioning grooves is at least 2.

6. The device for wafer double-side detection according to claim 5, characterized in that: The wafer positioning grooves are arranged in an annular array on the top of the turntable.

7. The device for wafer double-side detection according to claim 1, characterized in that: The wafer positioning groove is a circular groove, and the diameter of the wafer positioning groove is greater than the diameter of the through hole.

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