Heat dissipation structure of laser power transformer

Abstract

The utility model relates to a heat dissipation structure of a laser power supply transformer, which is used for heat dissipation of the transformer in a laser power supply body and comprises a transformer groove body used for containing the transformer, the transformer groove body is not contacted with other electronic components adjacent to the transformer, the transformer groove body is provided with a peripheral groove wall, and the peripheral groove wall is provided with a plurality of through holes. A gap is formed between the peripheral groove wall and the periphery of the transformer, heat-conducting glue is poured into the transformer groove body, the gap is filled with the poured heat-conducting glue so as to surround the periphery of the transformer, and the transformer groove body and the transformer are combined into a whole through the heat-conducting glue. The bottom of the transformer groove body is connected with a shell of the laser power supply body through a fastener. The heat dissipation structure of the laser power supply transformer is good in heat dissipation effect, high in pertinence, beneficial to cost reduction and high in adaptability.

Description

Technical Field

[0001] The utility model relates to the technical field of laser power supply heat dissipation, and particularly relates to a heat dissipation structure for a laser power supply transformer. Background Art

[0002] Air cooling and water cooling of laser power supplies are two common heat dissipation methods in the laser power supply industry. In air cooling, a fan blows the surrounding air over the radiator of the power supply to carry away the heat of the power supply through the flow of air. In water cooling, a water circulation system is used to cool the heat of the power supply. The heat of the power supply is conducted to the bottom case by filling heat dissipation glue, and then the bottom case of the power supply conducts the heat to the water cooling plate by contacting the water cooling plate, and then the heat is dissipated through the water circulation. Compared with air cooling, water cooling usually has a higher heat dissipation effect. The thermal conductivity of water is better than that of air, so the water cooling system can better reduce the temperature of the power supply and keep it running stably. Especially when the power of the power supply is high and the working time is long, water cooling can better meet the requirements for heat dissipation performance. Since air cooling uses a fan, it will generate a certain amount of noise during operation, while the water-cooled laser generator has less noise under normal circumstances and less interference to the working environment. Lasers on the market need to operate stably with high power for a long time and have high requirements for noise and environment, so most laser power supplies for lasers choose water cooling for heat dissipation.

[0003] For the water cooling solution of laser power supplies, heat dissipation glue is usually poured over a large area where the heat of the power supply is high, and holes are opened in the PCB. The heat dissipation glue flows through the holes in the PCB to the bottom case. Heat sources such as magnetic devices conduct the generated heat to the bottom case through the heat dissipation glue. The heat dissipation capacity of this heat dissipation solution is limited by the size of the holes opened in the PCB and the number of nearby heat sources. Moreover, pouring heat dissipation glue over a large area of the heat source of the power supply will cause the heat source to conduct heat to nearby devices with low heat generation, resulting in the temperature of devices that were originally not hot being too high due to the influence of the heat source, affecting the performance of the devices. Summary of the Utility Model

[0004] In view of this, a heat dissipation structure for a laser power supply transformer with good heat dissipation effect, strong pertinence, beneficial to cost reduction and strong adaptability is provided.

[0005] A heat dissipation structure for a laser power supply transformer, which is used to dissipate heat from the transformer in the laser power supply body, includes a transformer slot for accommodating the transformer. The transformer slot does not contact other electronic components adjacent to the transformer. The transformer slot has surrounding slot walls, and there is a gap between the surrounding slot walls and the periphery of the transformer. Heat dissipation glue is poured into the transformer slot, and the poured heat dissipation glue fills the gap to surround the transformer. The transformer slot and the transformer are integrated through the heat dissipation glue. The bottom of the transformer slot is connected to the shell of the laser power supply body through fasteners.

[0006] Furthermore, the opening of the transformer tank is provided at the top, and the leads of the transformer extend out from the opening of the transformer tank.

[0007] Furthermore, the transformer partially protrudes from the opening of the transformer tank, and the top end of the thermal conductive adhesive is lower than the edge of the opening of the transformer tank so that the thermal conductive adhesive does not overflow from the opening of the transformer tank.

[0008] Furthermore, the transformer tank is a metal tank or a non-metallic tank with good thermal conductivity.

[0009] Furthermore, screw holes are provided at the bottom of the transformer tank, and the transformer tank is connected to the outer shell of the laser power supply body through screws, and the bottom surface of the bottom of the transformer tank is directly attached to the inner surface of the outer shell of the laser power supply body.

[0010] Furthermore, the thermal conductive adhesive wraps around the periphery and bottom of the transformer, and the thermal conductive adhesive fills the gap.

[0011] Compared with the prior art, the utility model has at least the following beneficial effects:

[0012] First, this heat dissipation structure of the laser power supply transformer is provided with a transformer tank. The transformer tank is a metal tank with good thermal conductivity. A thermal conductive adhesive is poured into the transformer tank. The transformer is placed inside the transformer tank. The transformer tank and the transformer are integrated through the thermal conductive adhesive, and the transformer tank is tightly locked on the outer shell of the laser power supply body through screws. This structure can regard the transformer tank and the outer shell of the laser power supply body as a whole, and can quickly conduct the heat of the transformer to the transformer tank through the thermal conductive adhesive first, and then quickly transfer it to the outer shell of the laser power supply body. The heat dissipation effect is better than the large-area potting of the prior art.

[0013] Second, this heat dissipation structure of the laser power supply transformer only pours the thermal conductive adhesive inside the transformer tank or inside the tanks of other components that need heat dissipation. Compared with large-area potting, it can reduce the amount of thermal conductive adhesive used, which is beneficial to cost reduction. Moreover, the heat dissipation effect of this heat dissipation structure has nothing to do with the size of the PCB opening and is not limited by the number of heat sources either.

[0014] Third, the transformer set in this heat dissipation structure of the laser power supply transformer and the transformer tank are integrated after potting. The transformer tank does not contact other electronic components adjacent to the transformer. The thermal conductive adhesive does not overflow from the opening of the transformer tank. The heat of the transformer will not be transferred to the devices with low heat generation nearby, and will not cause the devices with originally low temperature to be heated and affect their performance. It has strong pertinence.

[0015] Fourthly, this heat dissipation structure can also be set for other magnetic devices inside the laser power supply that require heat dissipation. For example, for the PFC inductor, resonant inductor, etc., the PFC inductor slot and resonant inductor slot can be separately set. The heat dissipation method is the same as that of the above-mentioned transformer slot, with strong adaptability. Brief Description of the Drawings

[0016] Figure 1 is a three-dimensional schematic diagram of a heat dissipation structure of a laser power supply transformer according to an embodiment of the present invention.

[0017] Figure 2 is a three-dimensional schematic diagram of the heat dissipation structure of a laser power supply transformer according to an embodiment of the present invention in another direction.

[0018] Among them,

[0019] 1. Transformer; 2. Transformer slot; 3. Thermal conductive adhesive; 4. Screw hole. Detailed Embodiment

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0021] Please refer to Figures 1 to 2 , which shows a heat dissipation structure of a laser power supply transformer provided by an embodiment of the present invention, used to dissipate heat from the transformer 1 in the laser power supply body. It includes a transformer slot 2 for accommodating the transformer 1. The transformer slot 2 does not contact other electronic components adjacent to the transformer 1. The transformer slot 2 has surrounding slot walls, and there is a gap between the surrounding slot walls and the periphery of the transformer 1. The transformer slot 2 is filled with a thermal conductive adhesive 3, and the filled thermal conductive adhesive 3 fills the gap to surround the transformer 1. The transformer slot 2 and the transformer 1 are integrated through the thermal conductive adhesive 3. The bottom of the transformer slot 2 is connected to the outer shell of the laser power supply body through fasteners. In some specific embodiments, the transformer slot 2 conducts the heat generated by the transformer 1 to the outer shell of the laser power supply body through the thermal conductive adhesive 3. Subsequently, the power supply outer shell conducts the heat to the water-cooling plate by contacting the water-cooling plate, and then the heat is dissipated through the water cycle.

[0022] Specifically, the opening of the transformer slot 2 is provided at the top, and the leads of the transformer 1 extend out from the opening of the transformer slot 2.

[0023] More specifically, the transformer 1 partially protrudes from the opening of the transformer housing 2, and the top end of the thermal conductive adhesive 3 is lower than the opening edge of the transformer housing 2 so that the thermal conductive adhesive 3 does not overflow from the opening of the transformer housing 2. In some specific embodiments, the thermal conductive adhesive 3 is arranged not to contact the leads of the transformer and other electronic components adjacent to the transformer, so as to avoid conducting heat to devices with low heat generation nearby.

[0024] In some specific embodiments, this heat dissipation structure can also be applied to other magnetic devices with heat dissipation requirements, such as PFC inductors and resonant inductors, etc. The amount of the thermal conductive adhesive 3 can be adjusted according to the heat generation degree of each heating element in the normal working state.

[0025] Specifically, the transformer housing 2 is a metal housing or a non-metallic housing with good thermal conductivity. Considering the comprehensive material cost and processing cost, common metals with good thermal conductivity such as aluminum or copper can be preferably used to make the transformer housing 2.

[0026] Specifically, screw holes 4 are provided at the bottom of the transformer housing 2, and the transformer housing 2 is connected to the outer shell of the laser power supply body through screws, and the bottom surface of the transformer housing 2 is directly attached to the inner surface of the outer shell of the laser power supply body.

[0027] In some specific embodiments, before the thermal conductive adhesive 3 is poured, the screw holes 4 are blocked by dispensing glue. After the thermal conductive adhesive 3 is cured, the dispensed glue is removed so that the transformer housing 2 can be connected to the outer shell of the laser power supply body through screws.

[0028] Specifically, the thermal conductive adhesive 3 wraps around the four sides and the bottom of the transformer 1, and the thermal conductive adhesive 3 fills the gap. In some specific embodiments, a spacing of 2 - 3 millimeters is ensured on each side of the gap to accommodate the process errors of the transformer 1 and the transformer housing 2, and the glue fills the gap therein.

[0029] In summary, the heat dissipation structure of this laser power supply transformer is provided with a transformer tank 2, which is a metal tank with good thermal conductivity. A heat-conducting adhesive 3 is poured into the transformer tank 2, and the transformer 1 is placed inside the transformer tank 2. The transformer tank 2 is integrated with the transformer 1 through the heat-conducting adhesive 3, and the transformer tank 2 is tightly locked on the outer shell of the laser power supply body by screws. This structure can regard the transformer tank 2 and the outer shell of the laser power supply body as a whole, and can quickly conduct the heat of the transformer 1 to the transformer tank 2 through the heat-conducting adhesive 3 first, and then quickly transfer it to the outer shell of the laser power supply body. The heat dissipation effect is better than that of large-area potting in the prior art; only pouring the heat-conducting adhesive 3 into the transformer tank 2 or the tanks of other components that need heat dissipation can reduce the amount of the heat-conducting adhesive 3 compared with large-area potting, which is beneficial to cost reduction. Moreover, the heat dissipation effect of this heat dissipation structure has nothing to do with the size of the PCB opening and is not limited by the number of heat sources; after the transformer 1 and the transformer tank 2 are potted, they are integrated as a whole, and the transformer tank 2 does not contact other electronic components adjacent to the transformer 1. The heat-conducting adhesive 3 does not overflow from the opening of the transformer tank 2, and the heat of the transformer 1 will not be transferred to the devices with low heat generation nearby, so as not to cause the devices with originally low temperature to be heated and affect their performance, with strong pertinence; this heat dissipation structure can also be set for other magnetic devices with heat dissipation requirements inside the laser power supply. For example, the PFC inductor and the resonant inductor can also be separately provided with a PFC inductor tank and a resonant inductor tank respectively, and the heat dissipation method is the same as that of the above-mentioned transformer tank 2, with strong adaptability.

[0030] It should be noted that the present invention is not limited to the above embodiments. According to the creative spirit of the present invention, those skilled in the art can also make other changes, and these changes made based on the creative spirit of the present invention should be included in the scope protected by the present invention.

Claims

1. A heat dissipation structure of a laser power transformer, used to dissipate heat from the transformer in the laser power body, characterized in that: The invention comprises a transformer slot body for accommodating the transformer, wherein the transformer slot body does not contact other electronic components adjacent to the transformer, the transformer slot body has slot walls on all sides, the slot walls on all sides have gaps with the periphery of the transformer, the transformer slot body is filled with thermal conductive adhesive, the thermal conductive adhesive is filled in the gaps to surround the transformer, the transformer slot body is integrated with the transformer through the thermal conductive adhesive, and the bottom of the transformer slot body is connected to the outer shell of the laser power supply body through fasteners.

2. The heat dissipation structure of a laser power transformer according to claim 1, characterized in that: The opening of the transformer tank body is arranged at the top, and the lead wire of the transformer extends out from the opening of the transformer tank body.

3. The heat dissipation structure of a laser power transformer according to claim 2, characterized in that: The transformer partially protrudes from the opening of the transformer slot body, and the top of the thermal conductive adhesive is lower than the opening edge of the transformer slot body so that the thermal conductive adhesive does not overflow from the opening of the transformer slot body.

4. The heat dissipation structure of a laser power transformer according to claim 1, characterized in that: The transformer tank body is a metal tank or a thermally conductive non-metal tank.

5. The heat dissipation structure of a laser power transformer according to claim 1, characterized in that: The bottom of the transformer tank body is provided with screw holes, the transformer tank body is connected to the outer shell of the laser power supply body through screws, and the bottom surface of the transformer tank body is directly attached to the inner surface of the outer shell of the laser power supply body.

6. The heat dissipation structure of a laser power transformer according to claim 1, characterized in that: The thermal conductive adhesive wraps around the periphery and the bottom of the transformer, and the thermal conductive adhesive fills the gap.

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