Overflow circulating device for recycling water in fishing tank and silicon wafer cleaning system
By designing a overflow circulation device for water reuse of the feed tank during the cleaning process of silicon wafers, the problem of low water exchange efficiency during the cleaning process of silicon wafers is solved, and efficient recycling of water resources and improving the cleaning effect of silicon wafers is achieved.
Patent Information
- Application Number
- CN202421836697.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-30
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-07-30
AI Technical Summary
The water exchange efficiency is low during the cleaning process of silicon wafers, resulting in waste of water resources and low operating efficiency.
A water recycle overflow circulation device for feed trough is designed. Through the connection between the sink of the insertion machine and the overflow trough, multiple pipes and valves, the circulating overflow of water is realized and the flowability of water in the trough is improved.
The device effectively improves the recycling rate of water, reduces the frequency of water replacement and the cost of water, and improves the cleaning effect of silicon wafers.
Smart Images
Figure CN222980463U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic technology, and in particular, to a water reuse overflow circulation device for a material fishing tank and a cleaning system for silicon wafers. Background Art
[0002] During the cutting process of monocrystalline silicon wafers, the diamond wire completes the cutting by continuously scratching and squeezing the silicon wafers. Along with the infiltration of cutting fluid and water, a large amount of silicon mud will remain on the silicon wafers. After the degumming process is completed, the surface of the silicon wafers will be cleaned to remove impurities such as silicon mud on the surface.
[0003] Before cleaning the silicon wafers, the silicon wafers need to be manually fished out and placed in a material carrier to facilitate subsequent slicing and inserting. The prepared material carrier is placed in the material fishing tank waiting to be inserted. Since the incoming silicon wafers are relatively dirty, it is necessary to continuously change the water manually to ensure that the water in the material fishing tank is relatively clean, resulting in low operation efficiency.
[0004] In view of the above problems, no effective solution has been proposed yet. Summary of the Utility Model
[0005] Embodiments of this application provide a water reuse overflow circulation device for a material fishing tank and a cleaning system for silicon wafers to at least solve the technical problem of low water change efficiency during the cleaning process of silicon wafers.
[0006] According to one aspect of the embodiments of this application, a water reuse overflow circulation device for a material fishing tank is provided, including: an inserter water tank and an overflow tank. The overflow tank is installed on the side of the inserter water tank and is communicated with the inserter water tank. After the water level height in the inserter water tank reaches a preset height, it overflows to the overflow tank; a material fishing water tank, with a water inlet, a first water outlet, and a second water outlet opened on the side of the material fishing water tank. The height of the water inlet is between the lowest water level and the highest water level of the overflow tank. The height of the first water outlet is lower than the height of the water inlet and higher than the height of the second water outlet. The second water outlet is located on the bottom side of the material fishing water tank; a three-way valve, a first pipeline, a second pipeline, a third pipeline, and a fourth pipeline. One end of the first pipeline is communicated with the water inlet, and the other end is communicated with the first end of the three-way valve. The second pipeline is communicated with the first water outlet. One end of the third pipeline is communicated with the second water outlet, and the other end is communicated with the second end of the three-way valve. The valve at the second end of the three-way valve is in a normally closed state. One end of the fourth pipeline is communicated with the third end of the three-way valve, and the other end is communicated with the overflow tank.
[0007] Optionally, the overflow recycling device for the water reuse of the material scooping tank further includes: a fifth pipeline, one end of the fifth pipeline is communicated with the overflow tank, a drain valve is installed at the other end of the fifth pipeline, the drain valve is in a normally closed state, an opening communicated with one end of the fourth pipeline is formed on the fifth pipeline, and the height of the opening is lower than the height of the second water outlet.
[0008] Optionally, in the overflow recycling stage, water overflows from the inserting machine water tank to the overflow tank, and successively flows through the fifth pipeline, the fourth pipeline, the third end of the three-way valve, the first end of the three-way valve, the first pipeline and the water inlet, so as to flow into the material scooping water tank, and the water in the material scooping water tank successively flows through the first water outlet and the second pipeline, and thus flows out of the material scooping water tank.
[0009] Optionally, when it is necessary to empty the water in the material scooping tank, open the valve at the second end of the three-way valve and the drain valve of the fifth pipeline, and the water in the material scooping tank successively flows through the second water outlet, the third pipeline, the second end of the three-way valve, the third end of the three-way valve, the first pipeline and the fifth pipeline, so as to empty the water in the material scooping tank.
[0010] According to another aspect of the embodiments of the present application, a cleaning system for silicon wafers is further provided, including the above-mentioned overflow recycling device for the water reuse of the material scooping tank.
[0011] In the embodiments of the present application, the overflow recycling device for the water reuse of the material scooping tank includes: an inserting machine water tank and an overflow tank, the overflow tank is installed on the side of the inserting machine water tank and communicated with the inserting machine water tank, and overflows to the overflow tank after the water level height in the inserting machine water tank reaches a preset height; a material scooping water tank, a water inlet, a first water outlet and a second water outlet are formed on the side of the material scooping water tank, the height of the water inlet is between the lowest water level and the highest water level of the overflow tank, the height of the first water outlet is lower than the height of the water inlet and higher than the height of the second water outlet, and the second water outlet is located on the bottom side of the material scooping water tank; a three-way valve, a first pipeline, a second pipeline, a third pipeline and a fourth pipeline, one end of the first pipeline is communicated with the water inlet and the other end is communicated with the first end of the three-way valve, the second pipeline is communicated with the first water outlet, one end of the third pipeline is communicated with the second water outlet and the other end is communicated with the second end of the three-way valve, the valve at the second end of the three-way valve is in a normally closed state, and one end of the fourth pipeline is communicated with the third end of the three-way valve and the other end is communicated with the overflow tank. This solution adopts the water circulation and overflow methods to increase the fluidity of the water in the tank, save the water change cost and reduce the operation cost of the factory. It can solve the technical problem of low water change efficiency in the process of silicon wafer cleaning. Description of the Drawings
[0012] The accompanying drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:
[0013] Figure 1 is a schematic diagram of a material scooping tank water reuse overflow circulation device according to an embodiment of the present application;
[0014] Figure 2 is a schematic diagram of an optional material scooping tank pipeline according to an embodiment of the present application.
[0015] In the figure:
[0016] 1 - Inserting machine water tank, 11 - Water inlet, 2 - Overflow tank, 3 - Material scooping water tank, 31 - Water inlet, 32 - First water outlet, 33 - Second water outlet, 4 - Three-way valve, 51 - First pipeline, 52 - Second pipeline, 53 - Third pipeline, 54 - Fourth pipeline, 55 - Fifth pipeline, 6 - Drain valve. Detailed implementation manners
[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.
[0018] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.
[0019] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0020] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.
[0021] In addition, terms such as "horizontal", "vertical", "hanging" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0022] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0023] The following will describe in detail some embodiments of the present application with reference to the drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.
[0024] The water in the cleaning and material fishing tank has a high frequency of water replacement due to the dirty surface of the incoming silicon wafers, resulting in waste of water cost, long water replacement time, and difficult operation. The present application reforms the water pipe structure of the material fishing tank, changes the water source and the water replacement method, so as to maintain the balance state of the water cleanliness in the tank. According to one aspect of the present application, an embodiment of a water reuse overflow circulation device for a material fishing tank is provided, as Figure 1 shown, including:
[0025] A wafer inserter water tank 1 and an overflow tank 2. The wafer inserter water tank 1 has a water inlet 11. The overflow tank is installed on the side of the wafer inserter water tank and is communicated with the wafer inserter water tank. After the water level in the wafer inserter water tank reaches a preset height (i.e., the overflow height), it overflows into the overflow tank;
[0026] The material fishing water tank 3, the side of the material fishing water tank is provided with a water inlet 31, a first water outlet 32 and a second water outlet 33. The height of the water inlet is between the lowest water level and the highest water level of the overflow tank. The height of the first water outlet is lower than the height of the water inlet and higher than the height of the second water outlet. The second water outlet is located on the bottom side of the material fishing water tank;
[0027] A three-way valve 4 and multiple pipelines, specifically including a first pipeline 51, a second pipeline 52, a third pipeline 53 and a fourth pipeline 54. One end of the first pipeline 51 is communicated with the water inlet 31, and the other end is communicated with the first end of the three-way valve 4. The second pipeline 52 is communicated with the first water outlet 32. One end of the third pipeline 53 is communicated with the second water outlet 33, and the other end is communicated with the second end of the three-way valve 4. The valve at the second end of the three-way valve 4 is in a normally closed state. One end of the fourth pipeline 54 is communicated with the third end of the three-way valve 4, and the other end is communicated with the overflow tank 2.
[0028] Optionally, the material fishing tank water reuse overflow circulation device further includes: a fifth pipeline 55. One end of the fifth pipeline 55 is communicated with the overflow tank 2. A drain valve 6 is installed at the other end of the fifth pipeline. The drain valve is in a normally closed state. An opening communicated with one end of the fourth pipeline 54 is opened on the fifth pipeline 55. The height of the opening is lower than the height of the second water outlet 33 to facilitate draining the water therein.
[0029] 1) In the overflow circulation stage, the drain valve 6 and the valve at the second end of the three-way valve 4 are in a normally closed state. Water overflows from the inserter water tank 1 to the overflow tank 2, and successively flows through the fifth pipeline 55, the fourth pipeline 54, the third end of the three-way valve 4, the first end of the three-way valve 4, the first pipeline 51 and the water inlet 31, and thus flows into the material fishing water tank. The water in the material fishing water tank successively flows through the first water outlet 32 and the second pipeline 52, and thus flows out of the material fishing water tank.
[0030] 2) When it is necessary to drain the water in the material fishing water tank, open the valve at the second end of the three-way valve and the drain valve 6 of the fifth pipeline. The water in the material fishing water tank successively flows through the second water outlet 33, the third pipeline 53, the second end of the three-way valve 4, the third end of the three-way valve 4, the fourth pipeline 54 and the lower half of the fifth pipeline, and thus drains the water in the material fishing water tank.
[0031] In the technical solution of the present application, the overflow circulation device for water reuse in the material scooping tank includes: an inserting machine water tank and an overflow tank. The overflow tank is installed on the side of the inserting machine water tank and is communicated with the inserting machine water tank. After the water level in the inserting machine water tank reaches a preset height, it overflows into the overflow tank; a material scooping water tank, on the side of the material scooping water tank, there are a water inlet, a first water outlet and a second water outlet. The height of the water inlet is between the lowest water level and the highest water level of the overflow tank. The height of the first water outlet is lower than the height of the water inlet and higher than the height of the second water outlet. The second water outlet is located on the bottom side of the material scooping water tank; a three-way valve, a first pipeline, a second pipeline, a third pipeline and a fourth pipeline. One end of the first pipeline is communicated with the water inlet, and the other end is communicated with the first end of the three-way valve. The second pipeline is communicated with the first water outlet. One end of the third pipeline is communicated with the second water outlet, and the other end is communicated with the second end of the three-way valve. The valve at the second end of the three-way valve is normally closed. One end of the fourth pipeline is communicated with the third end of the three-way valve, and the other end is communicated with the overflow tank. This solution uses the water circulation and overflow methods to increase the fluidity of the water in the tank, save the cost of changing water, and reduce the operating cost of the factory. It can solve the technical problem of low water change efficiency during the wafer cleaning process.
[0032] The present application adopts a pipeline transformation method, combined with the water supply and circulation method of the inserting machine, to achieve the water circulation and overflow of the material scooping tank, ensuring that the water quality is relatively clear and clean. This solution can greatly reduce the frequency of changing water and the water cost, and at the same time has a positive improvement on the wafer edge chipping. As an optional embodiment, the technical solution of the present application is further described in detail below in combination with the specific implementation manners:
[0033] In order to solve the water circulation problem of the material scooping tank, this solution designs and transforms the material scooping tank and the inserting machine pipeline, so that the clean water of the inserting machine forms a cycle with the material scooping tank, ensuring the stable liquid level of the material scooping tank and the clear water source to maintain stable inserting and reduce the cleaning pressure.
[0034] As Figure 1 shown, the water source of the inserting machine water tank is supplied by the factory service end. When the water level reaches a certain height, it flows into the right-side auxiliary tank (overflow tank). The pipeline of the material scooping tank is transformed into the Figure 2 scheme shown (only for schematically showing the structure, the unclear parts in the figure do not affect this schematic). Using the principle of communicating vessels, the drain pipe of the auxiliary tank is connected to a three-way valve and then communicated with the material scooping tank. The circulating water can continuously enter the material scooping tank, and the water is drained from the bottom opening. The hand valve controls the opening degree to ensure the balance between the overflow water inflow and the drainage volume, and the water level is stable.
[0035] Adopt the above technical solution to transform the overflow drainage pipeline of the chip inserter, connect a tee to ensure the water circulation in the tank; adopt the above technical solution to add an overflow inlet pipeline to the material scooping tank, and utilize the principle of communicating vessels to ensure the stable water level in the tank without the need for a water pump to provide power; at the same time, adding two pipelines can ensure the realization of overflow circulation, with stable water circulation, reducing the frequency of manual water replacement and the wafer contamination rate.
[0036] According to another aspect of the present application, there is also provided a wafer cleaning system, including the above-mentioned material scooping tank water reuse overflow circulation device. Adopting this technical solution to transform the overflow drainage pipeline of the chip inserter, add an overflow inlet pipeline to the material scooping tank, and add a manual valve drainage pipeline at the bottom of the material scooping tank can greatly improve the man-machine efficiency and avoid waste of production capacity caused by high-frequency water replacement or cleaning. On the other hand, it also reduces the frequency of water replacement and the contamination rate of the cleaning machine, which is beneficial to the operation of the factory.
[0037] The above are only the preferred embodiments of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present application.
Claims
1. A scoop trough water recycling overflow circulation device, characterized in that: include: A wafer inserter water tank and an overflow tank, wherein the overflow tank is installed on the side of the wafer inserter water tank and is connected to the wafer inserter water tank, and overflows to the overflow tank after the water level in the wafer inserter water tank reaches a preset height; A scooping trough, wherein a water inlet, a first water outlet and a second water outlet are provided on the side of the scooping trough, wherein the height of the water inlet is between the lowest water level and the highest water level of the overflow trough, the height of the first water outlet is lower than the height of the water inlet and higher than the height of the second water outlet, and the second water outlet is located on the bottom side of the scooping trough; A three-way valve, a first pipe, a second pipe, a third pipe and a fourth pipe, wherein one end of the first pipe is connected to the water inlet, and the other end is connected to the first end of the three-way valve, the second pipe is connected to the first water outlet, one end of the third pipe is connected to the second water outlet, and the other end is connected to the second end of the three-way valve, the valve at the second end of the three-way valve is in a normally closed state, and one end of the fourth pipe is connected to the third end of the three-way valve, and the other end is connected to the overflow tank.
2. The overflow circulation device for recycling trough water according to claim 1, characterized in that: The scoop trough water reuse overflow circulation device also includes: A fifth pipe, one end of which is connected to the overflow tank, a drain valve is installed at the other end of the fifth pipe, the drain valve is in a normally closed state, and an opening is opened on the fifth pipe to be connected to one end of the fourth pipe, and the height of the opening is lower than the height of the second water outlet.
3. The overflow circulation device for recycling trough water according to claim 2, characterized in that: During the overflow circulation stage, water overflows from the inserting machine water tank to the overflow tank, and flows through the fifth pipe, the fourth pipe, the third end of the three-way valve, the first end of the three-way valve, the first pipe and the water inlet in sequence, and then flows into the scooping water tank. The water in the scooping water tank flows through the first water outlet and the second pipe in sequence, and then flows out of the scooping water tank.
4. The overflow circulation device for recycling trough water according to claim 2, characterized in that: When it is necessary to drain the water in the scooping trough, open the valve at the second end of the three-way valve and the drain valve of the fifth pipe, and the water in the scooping trough flows through the second water outlet, the third pipe, the second end of the three-way valve, the third end of the three-way valve, the first pipe and the fifth pipe in sequence, thereby draining the water in the scooping trough.
5. A silicon wafer cleaning system, characterized in that: It comprises the overflow circulation device for recycling trough water according to any one of claims 1 to 4.