Chip welding fixing device
By using a combination technology of transfer components and self-adhesive adhesives in the chip welding fixture, the problems of complex and low efficiency of the chip packaging process are solved, and efficient chip and antenna packaging is achieved, and production efficiency is improved.
Patent Information
- Application Number
- CN202422452468.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-10-10
AI Technical Summary
The existing chip and antenna packaging technology process is complex, resulting in low packaging efficiency and may introduce thermal or mechanical stress in multiple steps, affecting the packaging effect.
A chip welding fixing device is provided, including a transfer assembly, which includes a transfer roller, a transfer roller bracket and a transfer roller driving assembly. The chip is carried and fixed by self-adhesive adhesive, and the chip and aluminum foil are soldered and encapsulated during the rotation of the transfer roller.
It realizes efficient soldering and packaging of chips, improves the packaging efficiency of chips and antennas, reduces waiting and adjustment time in production steps, and optimizes the utilization of production resources.
Smart Images
Figure CN222980488U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of chip packaging equipment, and more specifically, to a chip welding and fixing device. Background Art
[0002] With the rapid development of wireless communication technology, the application fields of radio frequency (RF) chips and antennas have been continuously expanding, covering multiple industries such as mobile communication, Internet of Things, automotive electronics, and medical devices. RF chips are also widely used in logistics, warehousing, inventory management, and access control. For example, RF chips can be combined with RFID tags for item tracking and identification, enabling data reading without contact. Due to the extremely wide application range and large application volume of RF chips, higher requirements are also put forward for the packaging efficiency of RF chips.
[0003] In the prior art, during the packaging process of chips and antennas, generally three steps of antenna preparation, chip bonding, and lamination need to be carried out separately. Among them, antenna preparation refers to the process of fabricating an antenna on a substrate through an etching process or a die-cutting process. Chip bonding is the process of physically connecting an RF chip and an antenna. Lamination is the process of re-layout and recombination of the bonded chip and antenna in a specific layout manner. Dividing the chip packaging process into multiple steps will result in a complex process flow of the chip packaging process. Each production step requires strict dimensional and process control, increasing the difficulty of production management. At the same time, there may be waiting and adjustment times between different production steps, and production equipment and production resources cannot be fully utilized. In addition, when the chip packaging process is operated in multiple steps, thermal stress or mechanical stress may be introduced, which may in turn affect the packaging effect of the antenna and the chip. Therefore, dividing the chip and antenna packaging into three steps of antenna preparation, chip bonding, and lamination limits the chip packaging efficiency. Summary of the Utility Model
[0004] The purpose of this application is to provide a chip welding and fixing device, which solves the technical problem of low chip packaging efficiency and achieves the technical effect of improving the packaging efficiency of chips and antennas.
[0005] A chip welding and fixing device provided by an embodiment of this application includes a transfer assembly. The transfer assembly includes a transfer roller, a transfer roller bracket, and a transfer roller drive assembly. The transfer roller is rotatably connected to the transfer roller bracket. The transfer roller drive assembly is disposed on the transfer roller bracket and is used to drive the transfer roller to rotate. The transfer roller is used to carry an adhesive label. When the adhesive label rotates with the transfer roller, it is used to carry chips and aluminum foils.
[0006] In a possible implementation manner, a plurality of positioning grooves are arranged in an array on the transfer roller, and the positioning grooves are used to position the chips.
[0007] In another possible implementation, the contour of the positioning groove is larger than the contour of the end of the chip suction head, so that the adhesive at the positioning groove can give way to the chip suction head for sucking the chip.
[0008] In another possible implementation, the center distance between the hole centers of adjacent positioning grooves along the length direction of the transfer roller is 2.5 mm to 3.5 mm.
[0009] In another possible implementation, the center distance between the hole centers of adjacent positioning grooves along the rotation direction of the transfer roller is 2 mm to 3 mm.
[0010] In another possible implementation, it further includes a control component, and the control component is used to control the rotation angle of the transfer roller drive component.
[0011] In another possible implementation, the transfer roller drive component is a direct drive motor.
[0012] In another possible implementation, the transfer roller bracket is made of ceramic.
[0013] In another possible implementation, the transfer roller is fixedly connected to the transfer roller shaft, and positioning rings are provided at both ends of the transfer roller on the transfer roller shaft.
[0014] In another possible implementation, the transfer roller shaft is made of ceramic.
[0015] The beneficial effects of the embodiments of the present application compared with the prior art are as follows:
[0016] The embodiments of the present application provide a chip welding and fixing device, which includes a transfer assembly. The transfer assembly includes a transfer roller, a transfer roller bracket, and a transfer roller drive component. The transfer roller is rotatably connected to the transfer roller bracket. The transfer roller drive component is arranged on the transfer roller bracket and is used to drive the transfer roller to rotate. The transfer roller is used to carry the adhesive, and when the adhesive rotates with the transfer roller, it is used to carry the chip and the aluminum foil. In the chip welding and fixing device in the embodiments of the present application, the chip is carried and fixed by the adhesive, and then the chip and the aluminum foil can be welded and encapsulated during the rotation of the adhesive with the transfer roller, realizing efficient welding of the chip and improving the packaging efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0018] Figure 1The front view structural schematic diagram of a chip welding and fixing device provided by an embodiment of the present application;
[0019] Figure 2 The side view structural schematic diagram of a chip welding and fixing device provided by an embodiment of the present application;
[0020] Figure 3 For Figure 1 The partial structural schematic diagram at position A of a chip welding and fixing device in
[0021] Figure 4 For Figure 2 The partial structural schematic diagram at position B of a chip welding and fixing device in
[0022] Figure 5 The chip welding schematic diagram of a chip welding and fixing device provided by an embodiment of the present application;
[0023] Figure 6 The partial structural schematic diagram when a chip welding and fixing device provided by an embodiment of the present application is working;
[0024] In the figure, 101, self - adhesive; 2, transfer component; 21, transfer roller; 211, positioning groove; 212, transfer roller shaft; 213, positioning ring; 22, transfer roller bracket; 23, transfer roller drive component; 301, chip; 311, chip suction head; 401, aluminum foil; 5, welding component. Detailed implementation manners
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0026] It should be noted that when a component or structure is referred to as "fixed to" or "arranged on" another component or structure, it can be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as "connected to" another component or structure, it can be directly connected to the other component or structure or indirectly connected to the other component or structure.
[0027] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or a component or structure referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.
[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.
[0029] In the prior art, during the process of chip and antenna packaging, generally three steps of antenna preparation, chip bonding, and lamination need to be carried out separately, which limits the chip packaging efficiency.
[0030] For the above reasons, the embodiments of the present application provide a chip welding and fixing device, including a transfer component. The transfer component includes a transfer roller, a transfer roller bracket, and a transfer roller driving component. The transfer roller is rotatably connected to the transfer roller bracket. The transfer roller driving component is arranged on the transfer roller bracket and is used to drive the transfer roller to rotate. The transfer roller is used to carry the self-adhesive. When the self-adhesive rotates with the transfer roller, it is used to carry the chip and the aluminum foil. The chip welding and fixing device in the embodiments of the present application carries and fixes the chip through the self-adhesive, and then the chip and the aluminum foil can be welded and packaged during the rotation of the self-adhesive with the transfer roller, realizing the efficient welding of the chip and improving the chip packaging efficiency.
[0031] In some scenarios, a chip welding and fixing device in the embodiments of the present application can be applied to the welding and packaging of the chip and the antenna of an RFID tag, and can improve the welding and packaging efficiency of the chip and the antenna.
[0032] The following specifically describes a chip welding and fixing device provided by the embodiments of the present application with specific examples.
[0033] Figure 1 is a front view structural schematic diagram of a chip welding and fixing device provided by the embodiments of the present application, Figure 2 is a side view structural schematic diagram of a chip welding and fixing device provided by the embodiments of the present application, as Figure 1 and Figure 2As shown, the chip welding and fixing device includes a transfer assembly 2. The transfer assembly 2 includes a transfer roller 21, a transfer roller bracket 22, and a transfer roller drive assembly 23. The transfer roller 21 is rotatably connected to the transfer roller bracket 22. The transfer roller drive assembly 23 is disposed on the transfer roller bracket 22 and is used to drive the transfer roller 21 to rotate. The transfer roller 21 is used to carry the self-adhesive 101. When the self-adhesive 101 rotates with the transfer roller 21, it is used to carry the chip 301 and the aluminum foil 401.
[0034] During operation, the transfer assembly 2 is used to perform welding and encapsulation after the chip is carried and fixed, as Figure 1 and Figure 2 shown. The transfer assembly 2 includes a transfer roller 21, a transfer roller bracket 22, and a transfer roller drive assembly 23. The transfer roller bracket 22 is used to support the transfer roller 21. The transfer roller 21 is rotatably connected to the transfer roller bracket 22. The transfer roller drive assembly 23 is disposed on the transfer roller bracket 22 and is used to drive the transfer roller 21 to rotate, so that the transfer roller drive assembly 23 can drive the transfer roller 21 to rotate. The transfer roller 21 is used to convey the chip 301.
[0035] During operation, the transfer roller 21 is used to carry the self-adhesive 101. The self-adhesive 101 is used to fix the chip 301 and the aluminum foil 401. When the self-adhesive 101 rotates with the transfer roller 21, it is used to carry the chip 301 and the aluminum foil 401, realizing the fixation and encapsulation of the chip 301 and the aluminum foil 401.
[0036] Exemplarily, a welding assembly 5 for welding the chip 301 and the aluminum foil 401 can be provided on the side of the transfer roller 21 to realize the welding and encapsulation of the chip 301 and the aluminum foil 401.
[0037] The beneficial effect brought by the above implementation is that by using the transfer roller to carry the self-adhesive, the self-adhesive can fix the chip and the aluminum foil. When the self-adhesive rotates with the transfer roller, it carries the chip and the aluminum foil, realizing the efficient encapsulation of the chip and the aluminum foil and improving the encapsulation efficiency of the chip and the aluminum foil.
[0038] In some implementations, a plurality of positioning grooves 211 are arranged in an array on the transfer roller 21. The positioning grooves 211 are used to position the chip 301.
[0039] Figure 3 For Figure 1 a partial structural schematic diagram of part A of a chip welding and fixing device in Figure 4 For Figure 2 a partial structural schematic diagram of part B of a chip welding and fixing device in Figure 5 This is a chip welding schematic diagram of a chip welding and fixing device provided by an embodiment of the present application. Figure 6The figure is a partial structural schematic diagram of a chip soldering and fixing device provided by an embodiment of the present application when it is working, as Figures 3 to 6 shown, a plurality of positioning grooves 211 are arranged in an array on the transfer roller 21. The positioning grooves 211 are used to position the chip 301, so that the chip 301 can improve the positioning stability under the positioning action of the positioning grooves 211.
[0040] Structurally, the concave structure of the positioning groove 211 can accommodate the chip 301, so that the chip 301 will not lift the aluminum foil 401 to cause the bulge of the aluminum foil 401, which is convenient for the welding assembly 5 to weld the chip 301 and the aluminum foil 401.
[0041] The beneficial effects brought by the above implementation method are that the positioning groove can improve the positioning stability of the chip, and the concave structure of the positioning groove can accommodate the chip, which is convenient for high-quality welding of the chip and the aluminum foil.
[0042] In some implementation methods, the contour of the positioning groove 211 is larger than the end contour of the chip suction head 311, so that the adhesive 101 at the positioning groove 211 is used to give way to the chip suction head 311 that adsorbs the chip 301.
[0043] Structurally, as Figure 6 shown, the contour of the positioning groove 211 is larger than the end contour of the chip suction head 311, so that the end of the chip suction head 311 can be pressed into the positioning groove 211, which is convenient for the chip on the chip suction head 311 to be smoothly transferred to the adhesive 101, and can avoid the chip 301 from being damaged due to excessive pressure.
[0044] The beneficial effects brought by the above implementation method are that the end of the chip suction head can be pressed into the positioning groove, which can avoid the chip from being damaged due to excessive pressure.
[0045] In some implementation methods, the hole center distance between adjacent positioning grooves 211 along the length direction of the transfer roller 21 is 2.5 mm to 3.5 mm.
[0046] As Figure 3 shown, the hole center distance D1 between adjacent positioning grooves 211 along the length direction of the transfer roller 21 is 2.5 mm to 3.5 mm, so that the hole center distance of the positioning grooves 211 is correspondingly set with the positions of a plurality of chip suction heads 311, which is convenient for transferring and fixing the chips.
[0047] The beneficial effects brought by the above implementation method are that the hole center distance between adjacent positioning grooves on the length direction of the transfer roller is correspondingly set with the positions of the chip suction heads, which is convenient for transferring and fixing the chips.
[0048] In some implementations, the center-to-center distance between the holes of adjacent positioning grooves 211 along the rotation direction of the transfer roller 21 is 2 mm to 3 mm.
[0049] As Figure 4 shown, the center-to-center distance D2 between the holes of adjacent positioning grooves 211 along the rotation direction of the transfer roller 21 is 2 mm to 3 mm, so that the center-to-center distance between the holes of adjacent positioning grooves 211 in the rotation direction of the transfer roller 21 can be correspondingly set with the positions of a plurality of chip suction heads 311, facilitating the transfer and fixation of the chips 301.
[0050] The beneficial effect brought by the above implementation is that the center-to-center distance between the holes of adjacent positioning grooves in the rotation direction of the transfer roller is correspondingly set with the positions of the chip suction heads, facilitating the transfer and fixation of the chips.
[0051] In some implementations, the chip welding and fixing device further includes a control component for controlling the rotation angle of the transfer roller driving component 23.
[0052] In terms of structure, the chip welding and fixing device further includes a control component for controlling the rotation angle of the transfer roller driving component 23, so that the control component can control the rotation azimuth angle of the printing roller driving component 23 as needed, achieving precise control of the chip packaging process and rapid high-precision packaging of a large number of chips.
[0053] In some implementations, the transfer roller driving component 23 is a direct drive motor.
[0054] In terms of structure, the transfer roller driving component 23 is a direct drive motor, reducing the rotation angle error caused by the intermediate transmission structure and improving the working efficiency of the transfer roller driving component 23.
[0055] In some implementations, the transfer roller bracket 22 is made of ceramic.
[0056] In terms of structure, the transfer roller bracket 22 is made of ceramic, so that the coefficient of thermal expansion and contraction of the transfer roller bracket 22 is small, improving the accuracy of the chip packaging process.
[0057] In some implementations, the transfer roller 21 is fixedly connected to the transfer roller shaft 212, and the transfer roller 21 is provided with positioning rings 213 at both ends of the transfer roller shaft 212.
[0058] As Figure 1 shown, the transfer roller 21 is fixedly connected to the transfer roller shaft 212, and the transfer roller 21 is provided with positioning rings 213 at both ends of the transfer roller shaft 212. The position of the transfer roller 21 on the transfer roller shaft 212 can be accurately positioned through the positioning rings 213, improving the packaging accuracy of the chips.
[0059] In some implementations, the transfer roller shaft 212 is made of ceramic.
[0060] Structurally, the transfer roller shaft 212 is made of ceramic, so that the thermal expansion and contraction ratio and the stress deformation degree of the transfer roller shaft 212 are small, ensuring the packaging accuracy of the chip 301.
[0061] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A chip welding and fixing device, characterized in that: The invention comprises a transfer assembly, which comprises a transfer roller, a transfer roller bracket and a transfer roller driving assembly. The transfer roller is rotatably connected to the transfer roller bracket. The transfer roller driving assembly is arranged on the transfer roller bracket and is used to drive the transfer roller to rotate. The transfer roller is used to carry the self-adhesive sticker. When the self-adhesive sticker rotates with the transfer roller, it is used to carry the chip and the aluminum foil.
2. The chip welding and fixing device according to claim 1, characterized in that: A plurality of positioning grooves are arranged in an array on the transfer roller, and the positioning grooves are used to position the chip.
3. The chip welding and fixing device according to claim 2, characterized in that: The contour of the positioning groove is larger than the contour of the end of the chip adsorption head, so that the self-adhesive at the positioning groove can make way for the chip adsorption head that adsorbs the chip.
4. The chip welding and fixing device according to claim 3, characterized in that: The hole center distance between adjacent positioning grooves along the length direction of the transfer roller is 2.5 mm to 3.5 mm.
5. The chip welding and fixing device according to claim 4, characterized in that: The hole center distance between adjacent positioning grooves along the rotation direction of the transfer roller is 2 mm to 3 mm.
6. The chip welding and fixing device according to claim 5, characterized in that: It also includes a control component, which is used to control the rotation angle of the transfer roller driving component.
7. The chip welding and fixing device according to claim 6, characterized in that: The transfer roller drive assembly is a direct drive motor.
8. The chip welding and fixing device according to claim 7, characterized in that: The transfer roller holder is made of ceramic.
9. The chip welding and fixing device according to claim 8, characterized in that: The transfer roller is fixedly connected to the transfer roller shaft, and the transfer roller is provided with positioning rings at both ends of the transfer roller shaft.
10. The chip welding and fixing device according to claim 9, characterized in that: The transfer roller is made of ceramic.