Radiator for power module and power module

Abstract

The utility model discloses a radiator used for a power module and the power module, the radiator comprises a heat radiation substrate, two sides of the heat radiation substrate in a thickness direction are respectively provided with a first heat radiation surface and a second heat radiation surface, and the first heat radiation surface is suitable for contacting with the power module; the water channel plate is arranged on the heat dissipation substrate, a flow channel surface at least partially spaced from the second heat dissipation surface is formed on the side, facing the heat dissipation substrate, of the water channel plate, and a water channel is defined between the flow channel surface and the second heat dissipation surface; and the distance between the runner surface and the second heat dissipation surface is gradually increased in the direction from the inlet to the outlet. According to the radiator provided by the utility model, the runner surface at least partially spaced from the second radiating surface is formed on the water channel plate, and the distance between the runner surface and the second radiating surface is gradually increased in the direction from the inlet to the outlet, so that the flow resistance of a cooling medium flowing in the water channel is reduced, and the heat dissipation efficiency of the radiator is improved under the condition that the flow resistance of the original radiator is not changed. The number of pin fins is increased, and the radiating effect of the radiator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power modules, in particular to a radiator for a power module and a power module. Background Art

[0002] In the related art, the heat dissipation substrate and the water channel plate of the traditional power module radiator are generally connected by bolts, and heat cannot be transferred between the heat dissipation substrate and the water channel plate, resulting in poor heat dissipation capacity of the radiator. The power module chip works near the boundary temperature for a long time, and the stability is reduced. In addition, in the traditional power module radiator, increasing the number of pins on the heat dissipation substrate or optimizing the shape of the pins on the heat dissipation substrate to increase the heat dissipation area will increase the flow resistance of the radiator, and there is a risk of exceeding the output capacity of the water pump. Content of the Utility Model

[0003] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, an object of the utility model is to provide a radiator for a power module. The radiator according to the utility model has a flow channel surface formed on the water channel plate and at least partially spaced from the second heat dissipation surface, and the distance between the flow channel surface and the second heat dissipation surface gradually increases in the direction from the inlet to the outlet, so as to reduce the flow resistance of the cooling medium flowing in the water channel. Thus, under the condition that the flow resistance of the original radiator remains unchanged, the number of pins can be increased, and the heat dissipation effect of the radiator is improved.

[0004] The utility model also provides a power module having the above radiator.

[0005] The radiator for a power module according to the utility model includes: a heat dissipation substrate, on both sides of which in the thickness direction are respectively formed a first heat dissipation surface and a second heat dissipation surface, and the first heat dissipation surface is adapted to contact with the power module; a water channel plate, which is arranged on the heat dissipation substrate, and on the side of the water channel plate facing the heat dissipation substrate is formed a flow channel surface at least partially spaced from the second heat dissipation surface, and a water channel is defined between the flow channel surface and the second heat dissipation surface; wherein the distance between the flow channel surface and the second heat dissipation surface gradually increases in the direction from the inlet to the outlet.

[0006] According to the radiator of the present utility model, a power module and a water channel plate are respectively arranged on both sides of the heat dissipation substrate in the thickness direction. The heat dissipation substrate and the water channel plate are welded into a whole. The power module can exchange heat with the heat dissipation substrate, and the heat dissipation substrate can transfer heat to the water channel plate, thereby increasing the heat dissipation area between the radiator and the power module and improving the heat dissipation effect of the radiator on the power module. A flow channel surface spaced from the second heat dissipation surface is formed on one side of the water channel plate facing the heat dissipation substrate. The flow channel surface and the second heat dissipation surface jointly define a water channel. The width of the water channel gradually increases in the direction from the inlet to the outlet, and the flow resistance of the cooling medium gradually decreases in the direction from the inlet to the outlet. Therefore, under the condition that the flow resistance of the original radiator remains unchanged, the number of pin fins can be increased, and the heat dissipation effect of the radiator is improved.

[0007] According to some embodiments of the present utility model, heat dissipation protrusions extending towards the water channel are formed on the second heat dissipation surface.

[0008] According to some embodiments of the present utility model, the heat dissipation protrusions are configured as heat dissipation pin fins arranged in an array on the second heat dissipation surface.

[0009] According to some embodiments of the present utility model, the density of the heat dissipation pin fins on the second heat dissipation surface gradually increases in the direction close to the outlet.

[0010] According to some embodiments of the present utility model, the cross-section of the heat dissipation pin fin is configured as an ellipse, and the major axis of the cross-section of the heat dissipation pin fin extends in the direction from the inlet to the outlet.

[0011] According to some embodiments of the present utility model, the major axis of the cross-section of the heat dissipation pin fin is a, the minor axis is b, and it satisfies: 1.2 ≤ a / b ≤ 1.8.

[0012] According to some embodiments of the present utility model, the heat dissipation pin fins are configured to extend in multiple rows in the direction from the inlet to the outlet. Among two adjacent rows of the heat dissipation pin fins, one row of the heat dissipation pin fins is provided with a plurality of first pin fins spaced from each other, and a gap is formed between two of the first pin fins. The other row of the heat dissipation pin fins is provided with second pin fins, and the second pin fins are aligned with the gap.

[0013] According to some embodiments of the present utility model, the distance between two adjacent rows of the heat dissipation pin fins is L1, the distance between the first pin fin and the second pin fin in the spacing direction is L2, and it satisfies: 1.2 ≤ L1 / L2 ≤ 1.8.

[0014] According to some embodiments of the present utility model, an inlet and an outlet communicating with the water channel are formed on the surface of the water channel plate facing away from the heat dissipation substrate, and a seal is provided on the water channel plate around the inlet and / or the outlet.

[0015] The power module according to the present utility model will be briefly described below.

[0016] The power module according to the present utility model is provided with the radiator described in any one of the above embodiments. Since the power module according to the present utility model is provided with the radiator described in any one of the above embodiments, the stability of the power module during operation according to the present application is higher and the service life is longer.

[0017] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0018] The above and / or additional aspects and advantages of the present utility model will become apparent and be easily understood from the description of the embodiments in conjunction with the following drawings, where:

[0019] Figure 1 is a schematic structural diagram of a radiator according to an embodiment of the present utility model;

[0020] Figure 2 is a schematic structural diagram of a heat dissipation substrate according to an embodiment of the present utility model;

[0021] Figure 3 is an enlarged view of the heat dissipation needle fins on the heat dissipation substrate according to an embodiment of the present utility model;

[0022] Figure 4 is a schematic diagram of the cooperation between the heat dissipation substrate and the water channel plate according to an embodiment of the present utility model;

[0023] Figure 5 is a cross-sectional view of the water channel plate according to an embodiment of the present utility model;

[0024] Figure 6 is a schematic diagram of the cooperation between the heat dissipation substrate and the power module according to an embodiment of the present utility model.

[0025] Reference Signs:

[0026] 100, radiator;

[0027] 11, heat dissipation substrate; 111, protrusion; 112, first heat dissipation surface; 113, second heat dissipation surface;

[0028] 12, first needle fin; 13, second needle fin;

[0029] 21, water channel plate; 22, flow channel surface; 23, water channel; 101, water inlet; 102, water outlet;

[0030] 31, power module. Detailed Embodiments

[0031] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0032] In the related art, the heat dissipation substrate and the water channel plate of a traditional power module radiator are generally connected by bolts. Heat cannot be transferred between the heat dissipation substrate and the water channel plate, resulting in poor heat dissipation capacity of the radiator. The power module chip works near the boundary temperature for a long time, and the stability is reduced. In addition, in a traditional power module radiator, increasing the number of needle fins on the heat dissipation substrate or optimizing the shape of the needle fins on the heat dissipation substrate to increase the heat dissipation area will increase the flow resistance of the radiator, and there is a risk of exceeding the output capacity of the water pump.

[0033] The following refers to Figures 1-6 Describe a radiator for a power module according to an embodiment of the present utility model.

[0034] A radiator 100 for a power module 31 according to the present utility model includes: a heat dissipation substrate 11 and a water channel plate 21. First heat dissipation surfaces 112 and second heat dissipation surfaces 113 are respectively formed on both sides of the heat dissipation substrate 11 in the thickness direction. The first heat dissipation surface 112 is adapted to contact the power module 31. The water channel plate 21 is disposed on the heat dissipation substrate 11. A flow channel surface 22 that is at least partially spaced from the second heat dissipation surface 113 is formed on the side of the water channel plate 21 facing the heat dissipation substrate 11. A water channel is defined between the flow channel surface 22 and the second heat dissipation surface 113. The distance between the flow channel surface 22 and the second heat dissipation surface 113 gradually increases in the direction from the inlet to the outlet.

[0035] In some specific embodiments, the heat sink 100 is composed of a heat dissipation substrate 11 and a water channel plate 21. On one side of the heat dissipation substrate 11 in the thickness direction, a first heat dissipation surface 112 is formed. On the other side of the heat dissipation substrate 11 in the thickness direction, a second heat dissipation surface 113 is formed. The second heat dissipation surface 113 is welded to the water channel plate 21 and connected to form an integral body. The heat dissipation substrate 11 and the water channel plate 21 are made of the same material. The first heat dissipation surface 112 is in contact with the power module 31. The power module 31 can exchange heat with the first heat dissipation surface 112, and the first heat dissipation surface 112 can transfer heat to the water channel plate 21 through the second heat dissipation surface 113, thereby increasing the heat dissipation area between the heat sink 100 and the power module 31 and improving the heat dissipation effect of the heat sink 100 on the power module 31. On one side of the water channel plate 21 facing the second heat dissipation surface 113, a flow channel surface 22 is formed at an interval from the second heat dissipation surface 113. The flow channel surface 22 and the second heat dissipation surface 113 jointly define a water channel 23. The distance between the flow channel surface 22 and the second heat dissipation surface 113 gradually increases in the direction from the inlet to the outlet, that is, the width of the water channel 23 gradually increases in the direction from the inlet to the outlet. The flow resistance of the cooling medium gradually decreases in the direction from the inlet to the outlet. Thus, under the condition that the flow resistance of the original heat sink 100 remains unchanged, the number of pin fins can be increased, and the heat dissipation effect of the heat sink 100 is improved.

[0036] According to the heat sink 100 of the present invention, the power module 31 and the water channel plate 21 are respectively arranged on both sides of the heat dissipation substrate 11 in the thickness direction. The heat dissipation substrate 11 and the water channel plate 21 are welded into an integral body. The power module 31 can exchange heat with the heat dissipation substrate 11, and the heat dissipation substrate 11 can transfer heat to the water channel plate 21, thereby increasing the heat dissipation area between the heat sink 100 and the power module 31 and improving the heat dissipation effect of the heat sink 100 on the power module 31. On one side of the water channel plate 21 facing the heat dissipation substrate 11, a flow channel surface 22 is formed at an interval from the second heat dissipation surface 113. The flow channel surface 22 and the second heat dissipation surface 113 jointly define a water channel 23. The width of the water channel 23 gradually increases in the direction from the inlet to the outlet. The flow resistance of the cooling medium gradually decreases in the direction from the inlet to the outlet. Thus, under the condition that the flow resistance of the original heat sink 100 remains unchanged, the number of pin fins can be increased, and the heat dissipation effect of the heat sink 100 is improved.

[0037] According to some embodiments of the present invention, heat dissipation protrusions 111 are formed on the second heat dissipation surface 113 extending towards the water channel. The heat dissipation protrusions 111 can be in contact with the cooling medium in the flow channel in the water channel to exchange heat, and the protrusions 111 exchange heat with the power module 31 on the heat dissipation substrate 11, thereby realizing the cooling of the power module 31.

[0038] According to some embodiments of the present invention, the heat dissipation protrusions 111 are configured as heat dissipation pin fins arranged in an array on the second heat dissipation surface 113.

[0039] In some specific embodiments, the heat dissipation protrusion 111 is constructed as heat dissipation pin fins, and a plurality of heat dissipation pin fins perpendicular to the second heat dissipation surface 113 and extending toward the water channel are arranged on the second heat dissipation surface 113. The shape and size of the pin fins can be changed according to the design of the heat dissipation substrate 11 and the water channel and are not limited here. The heat dissipation pin fins can contact the cooling medium in the flow channel of the water channel for heat exchange, and the pin fins exchange heat with the power module 31 on the heat dissipation substrate 11, thereby achieving cooling of the power module 31. The array-arranged heat dissipation pin fins can disturb the cooling medium flowing through the second heat dissipation surface 113 to generate turbulence. The turbulence can break the boundary layer of the fluid, accelerate the heat exchange between the cooling medium and the pin fins, and improve the heat dissipation efficiency of the radiator 100. The array-arranged heat dissipation pin fins help to evenly distribute heat, prevent local overheating or overcooling of the heat dissipation substrate 11, and further improve the heat dissipation effect of the power module 31.

[0040] According to some embodiments of the utility model, since the distance between the flow channel surface 22 and the second heat dissipation surface 113 gradually increases in the direction from the inlet to the outlet, as the water channel width increases, the flow resistance to which the cooling medium is subjected gradually decreases in the direction from the inlet to the outlet. Therefore, the density of the heat dissipation pin fins on the second heat dissipation surface 113 gradually increases in the direction approaching the outlet. Under the condition that the flow resistance of the original radiator 100 remains unchanged, the number of pin fins can be increased, thereby improving the heat dissipation effect of the radiator 100.

[0041] According to some embodiments of the utility model, the cross-section of the pin fin is elliptical. Compared with the pin fin with a circular or square cross-section, the pin fin with an elliptical cross-section can provide lower fluid resistance. When the cooling medium flows through the elliptical pin fin, the fluid dynamic characteristics enable the fluid to bypass the pin fin more smoothly, reducing the eddy current and friction loss of the cooling medium flowing through the pin fin, thereby reducing the energy consumption of the pump. When the cooling medium encounters the elliptical pin fin, the cooling medium will produce a more uniform flow distribution around the pin fin, so that the heat exchange between the pin fin as a whole and the cooling medium is more uniform, thereby improving the heat dissipation effect of the radiator 100. The long axis of the pin fin cross-section extends in the direction from the inlet to the outlet, that is, the long axis of the pin fin extends along the flow direction of the cooling medium, which can increase the contact time and contact area between the cooling medium and the pin fin, which means that the pin fin and the cooling medium have more time for heat exchange and the heat exchange area is larger. Therefore, the cooling medium can more effectively take away heat when flowing through the pin fin, thereby improving the heat dissipation efficiency and heat dissipation effect of the radiator 100.

[0042] According to some embodiments of the present utility model, the major axis of the cross-section of the heat dissipation pin fins is a and the minor axis is b, and they satisfy: 1.2 ≤ a / b ≤ 1.8. When a / b is within the above range, during the process of the cooling medium flowing from the inlet towards the outlet, the contact area between the cooling medium and the heat dissipation pin fins is larger, improving the heat exchange effect between the heat dissipation pin fins and the cooling medium, enhancing the heat dissipation effect and heat dissipation efficiency of the radiator 100, and when a / b = 1.5, it is the most preferred.

[0043] According to some embodiments of the present utility model, the heat dissipation pin fins are configured as multiple rows extending in the direction from the inlet to the outlet. Among two adjacent rows of heat dissipation pin fins, one row of heat dissipation pin fins is provided with a plurality of first pin fins 12 spaced apart from each other, and a gap is formed between two first pin fins 12. The gaps between the plurality of first pin fins 12 can guide the cooling medium to be more evenly distributed on the entire surface of the heat dissipation substrate 11, avoiding local overheating of the heat dissipation substrate 11 and ensuring the temperature uniformity on the heat dissipation substrate 11. The other row of heat dissipation pin fins is provided with second pin fins 13, and the second pin fins 13 are aligned with the gaps. The staggered first pin fins 12 and second pin fins 13 can reduce the resistance during the cooling flow, thereby reducing the energy consumption of the pump and improving the durability and stability of the operation of the radiator 100.

[0044] According to some embodiments of the present utility model, the distance between two adjacent rows of heat dissipation pin fins is L1, that is, the distance between the centers of the first pin fins 12 and the centers of the second pin fins 13 in the direction from the inlet to the outlet is L1, and the distance between the first pin fins 12 and the second pin fins 13 in the spacing direction is L2, that is, the distance between the centers of the first pin fins 12 and the centers of the second pin fins 13 in the spacing direction is L2, and they satisfy: 1.2 ≤ L1 / L2 ≤ 1.8. When L1 / L2 is within the above range, the resistance of the cooling medium flowing between the heat dissipation pin fins can be reduced, the operating power consumption of the pump can be reduced, and at the same time, a good cooling effect can be maintained. At the same time, when the cooling medium passes through the heat dissipation pin fins, a more effective turbulent flow will be formed. The turbulent flow can increase the contact between the cooling medium and the surface of the pin fins, thereby improving the heat exchange efficiency between the heat dissipation substrate 11 and the cooling medium.

[0045] According to some embodiments of the present utility model, on the surface of the water channel plate 21 facing away from the heat dissipation substrate 11, a water inlet 101 and a water outlet 102 communicating with the water channel are formed. The cooling medium flows into the water channel from the water inlet 101 and then flows out of the water channel from the water outlet 102. A sealing groove is provided on the water channel plate 21 around the water inlet 101 and the water outlet 102, and a sealing member is arranged in the sealing groove. The sealing member can cooperate with the motor controller housing to prevent the leakage of the cooling medium, realizing the sealing between the radiator 100 and the motor controller housing. The sealing member is usually made of a material with elasticity and corrosion resistance, such as rubber or silica gel, and can withstand long-term high pressure and temperature changes, maintaining good sealing performance.

[0046] The power module 31 according to the present utility model will be briefly described below.

[0047] The power module 31 according to the present utility model is provided with the radiator 100 described in any one of the above embodiments. Since the power module 31 according to the present utility model is provided with the radiator 100 described in any one of the above embodiments, the stability of the power module 31 during operation according to the present application is higher and the service life is longer.

[0048] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0049] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.

[0050] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0051] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.

[0052] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0053] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model, and the scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A heat sink for a power module, characterized in that: include: A heat dissipation substrate (11), wherein a first heat dissipation surface (112) and a second heat dissipation surface (113) are respectively formed on both sides of the heat dissipation substrate (111) in a thickness direction, and the first heat dissipation surface (112) is suitable for contacting with a power module; A waterway plate (21), the waterway plate (21) being arranged on the heat dissipation substrate (11), the waterway plate (21) having a flow channel surface (22) at least partially spaced from the second heat dissipation surface (113) formed on a side of the waterway plate (21) facing the heat dissipation substrate (11), the flow channel surface (22) and the second heat dissipation surface (113) defining a waterway (23); wherein The distance between the flow channel surface (22) and the second heat dissipation surface (113) gradually increases in a direction from the inlet to the outlet.

2. The heat sink for a power module according to claim 1, characterized in that: A heat dissipation protrusion (111) extending toward the water channel is formed on the second heat dissipation surface (113).

3. The heat sink for a power module according to claim 2, characterized in that: The heat dissipation protrusions (111) are configured as heat dissipation pin fins arranged in an array on the second heat dissipation surface (113).

4. The heat sink for a power module according to claim 3, characterized in that: The density of the heat dissipation pin fins on the second heat dissipation surface (113) gradually increases in a direction approaching the outlet.

5. The heat sink for a power module according to claim 4, characterized in that: The cross section of the heat dissipation pin fin is elliptical and the major axis of the cross section of the heat dissipation pin fin extends in a direction from the inlet to the outlet.

6. The heat sink for a power module according to claim 5, characterized in that: The cross section of the heat dissipation pin fin has a major axis a and a minor axis b and satisfies: 1.2≤a / b≤1.

8.

7. The heat sink for a power module according to claim 6, characterized in that: The heat dissipation pin fins are constructed into multiple rows extending in a direction from an inlet to an outlet. In two adjacent rows of the heat dissipation pin fins, one row of the heat dissipation pin fins is provided with a plurality of first pin fins (12) spaced apart from each other, a gap is formed between two of the first pin fins (12), and the other row of the heat dissipation pin fins is provided with second pin fins (13), and the second pin fins (13) are directly opposite to the gap.

8. The heat sink for a power module according to claim 7, characterized in that: The distance between two adjacent rows of the heat dissipation pin fins is L1, the distance between the first pin fin (12) and the second pin fin (13) in the spacing direction is L2, and the following condition is satisfied: 1.2≤L1 / L2≤1.

8.

9. The heat sink for a power module according to claim 1, characterized in that: A water inlet (101) and a water outlet (102) in communication with the water channel are formed on a surface of the waterway plate (21) facing away from the heat dissipation substrate (11), and a sealing member arranged around the water inlet (101) and / or the water outlet (102) is provided on the waterway plate (21).

10. A power module, characterized in that: A radiator comprising any one of claims 1 to 9.

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