Integrated circuit lead frame

Abstract

The utility model relates to an integrated circuit lead frame, which belongs to the technical field of integrated circuits and comprises an integrated circuit lead frame body, three base islands are arranged on the integrated circuit lead frame body, and twelve pins are fixedly connected onto the integrated circuit lead frame body. A fixing frame is placed on the bottom surface of the integrated circuit lead frame body, a heat dissipation plate is fixedly connected to the inner bottom wall of the fixing frame, and a plurality of heat dissipation fins are fixedly connected to the top surface of the heat dissipation plate. According to the integrated circuit lead frame, the integrated circuit lead frame body is subjected to heat dissipation under the action of the heat dissipation fins and the heat dissipation plate, the heat dissipation effect is improved, heat is discharged under the action of the heat dissipation holes, the heat dissipation efficiency is improved, meanwhile, the integrated circuit lead frame body is supported under the action of the multiple heat dissipation fins, and the heat dissipation efficiency is improved. And the stability of the integrated circuit lead frame body is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, and particularly relates to an integrated circuit lead frame. Background Technique

[0002] An integrated circuit is a microelectronic device or component. Using a certain process, components such as transistors, resistors, capacitors, and inductors required in a circuit, as well as the wiring, are interconnected and fabricated on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a micro-structure with the required circuit functions. The lead frame is a basic component for manufacturing such semiconductors as integrated circuits.

[0003] Chinese Patent CN202564277U discloses an integrated circuit lead frame, which discloses a technical solution of double base islands that do not interfere with each other, and solves the problem that the existing lead frame only has one base island, reducing the use effect.

[0004] When the device is in use, the use effect is improved under the action of the double base islands. However, when the double base islands are working, their heating efficiency is relatively fast, the heat dissipation performance of the device itself is poor, resulting in a thermal expansion effect, and then the surface welding structure falls off, reducing the use effect. Therefore, an integrated circuit lead frame is proposed to solve the above problems. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an integrated circuit lead frame, which has the advantage of high heat dissipation efficiency, and solves the problem that when the device is in use, the use effect is improved under the action of the double base islands. However, when the double base islands are working, their heating efficiency is relatively fast, the heat dissipation performance of the device itself is poor, resulting in a thermal expansion effect, and then the surface welding structure falls off, reducing the use effect.

[0006] To achieve the above object, the utility model provides the following technical solution: an integrated circuit lead frame, including an integrated circuit lead frame body, on which there are three base islands, and there are twelve pins fixedly connected to the integrated circuit lead frame body.

[0007] A fixing frame is placed on the bottom surface of the integrated circuit lead frame body. A heat dissipation plate is fixedly connected to the inner bottom wall of the fixing frame. The top surface of the heat dissipation plate is fixedly connected with a plurality of heat dissipation fins. The top surfaces of the plurality of heat dissipation fins are all in contact with the bottom surface of the integrated circuit lead frame body. A plurality of heat dissipation holes are opened on the bottom surface of the fixing frame.

[0008] A connection component is provided between the integrated circuit lead frame body and the fixing frame to limit the integrated circuit lead frame body.

[0009] The fixing frame is provided with a fixing component for fixing the connection component.

[0010] Further, the twelve pins are respectively distributed in groups of six on the top and bottom of the base island, and a plurality of the heat dissipation fins are located between the twelve pins.

[0011] Further, the fixing frame is a U-shaped frame, and a plurality of the heat dissipation holes are linearly and equidistantly distributed from left to right, and the distance between two adjacent pins is 0.5 mm.

[0012] Further, the connection component includes two fixing plates. The two fixing plates are respectively fixedly connected to the left side surface and the right side surface of the integrated circuit lead frame body. The left side surface and the right side surface of the fixing frame are both fixedly connected with support plates. Fixing grooves are formed on the top surfaces of the two support plates. The two fixing plates respectively extend into the two fixing grooves. Limiting rods are fixedly connected to the interiors of the two fixing grooves. Limiting holes are formed on the bottom surfaces of the two fixing plates. The two limiting rods respectively extend into the two limiting holes. Rubber rings are fixedly sleeved on the outer peripheral walls of the two fixing plates. Two mounting grooves are formed on the top surfaces of the two support plates.

[0013] Further, the two limiting rods are in clearance fit with the two limiting holes respectively. The rubber ring is a rectangular ring. The rubber ring fits with the fixing groove. The fixing plate is an L-shaped plate.

[0014] Further, the fixing component includes four driving rods. The four driving rods are respectively movably connected to the interiors of the four mounting grooves through bearings. One side surface of each of the four driving rods close to the fixing plate is movably connected with a screw rod with one end extending into the driving rod. One side surface of two adjacent screw rods is fixedly connected with a limiting plate. One side surface of two adjacent limiting plates opposite to each other is fixedly connected with a positioning rod. Positioning holes are formed on the front and back surfaces of the two fixing plates. The positioning rod extends into the positioning hole. Support holes are formed in the interiors of the two support plates. One side surface of each of the four limiting plates away from the positioning rod is fixedly connected with a support rod with one end extending into the support hole.

[0015] Further, the four mounting grooves are respectively located at the front and back of the two fixing grooves. Threaded holes are formed on one side surface of two adjacent driving rods opposite to each other. The two screw rods respectively extend into the two threaded holes and are threadedly connected thereto.

[0016] Further, the positioning rod is in clearance fit with the positioning hole, the limiting rod is in clearance fit with the limiting hole, and the limiting plate fits with the fixing plate.

[0017] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0018] 1. The integrated circuit lead frame dissipates heat from the integrated circuit lead frame body through the action of heat dissipation fins and a heat dissipation plate, improving the heat dissipation effect. Moreover, through the action of heat dissipation holes, heat is further discharged, improving the heat dissipation efficiency. At the same time, through the action of multiple heat dissipation fins, the integrated circuit lead frame body is supported, improving the stability of the integrated circuit lead frame body;

[0019] 2. The integrated circuit lead frame is conveniently connected between the integrated circuit lead frame body and the fixing frame through the cooperation between the fixing plate and the fixing groove. And through the clearance fit between the limiting rod and the limiting hole, the integrated circuit lead frame body is restricted, facilitating the operation of the staff. At the same time, through the clearance fit between the positioning rod and the positioning hole, the fixing plate is supported, improving the stability of the integrated circuit lead frame body, which is more convenient and practical. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of the present invention;

[0021] Figure 2 It is a schematic bottom view of the internal structure of the fixing frame in the structure of the present invention;

[0022] Figure 3 It is a schematic right side view of the internal structure of the right side support plate in the structure of the present invention;

[0023] Figure 4 It is a schematic top view of the right side fixing plate in the structure of the present invention.

[0024] In the figure: 1 integrated circuit lead frame body, 2 pins, 3 base islands, 4 fixing plates, 5 support plates, 6 fixing frames, 7 heat dissipation fins, 8 heat dissipation holes, 9 heat dissipation plates, 10 rubber rings, 11 positioning holes, 12 positioning rods, 13 limiting plates, 14 screws, 15 installation grooves, 16 driving rods, 17 support holes, 18 support rods, 19 limiting holes, 20 limiting rods, 21 fixing grooves. Detailed Embodiment

[0025] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] Embodiment 1: Please refer to Figures 1 to 4, An integrated circuit lead frame in this embodiment includes an integrated circuit lead frame body 1. There are three base islands 3 opened on the integrated circuit lead frame body 1, and twelve pins 2 are fixedly connected to the integrated circuit lead frame body 1.

[0027] A fixing frame 6 is placed on the bottom surface of the integrated circuit lead frame body 1. A heat dissipation plate 9 is fixedly connected to the inner bottom wall of the fixing frame 6. The top surface of the heat dissipation plate 9 is fixedly connected with a plurality of heat dissipation fins 7. The top surfaces of the plurality of heat dissipation fins 7 are all attached to the bottom surface of the integrated circuit lead frame body 1. A plurality of heat dissipation holes 8 are opened on the bottom surface of the fixing frame 6.

[0028] Among them, the twelve pins 2 are distributed in groups of six-six respectively at the top and bottom of the base island 3. The plurality of heat dissipation fins 7 are located between the twelve pins 2. The fixing frame 6 is a U-shaped frame. The plurality of heat dissipation holes 8 are linearly and equally spaced from left to right. The distance between two adjacent pins 2 is 0.5 millimeter., The fixing frame 6 is a U-shaped frame. The plurality of heat dissipation holes 8 are linearly and equally spaced from left to right. The distance between two adjacent pins 2 is 0.5 millimeter.

[0029] Specifically, push the integrated circuit lead frame body 1 to make the integrated circuit lead frame body 1 and the fixing frame 6 fit, and make the heat dissipation fins 7 and the integrated circuit lead frame body 1 fit. Under the action of the heat dissipation fins 7 and the heat dissipation plate 9, the integrated circuit lead frame body 1 is dissipated heat. Furthermore, under the action of the heat dissipation holes 8, the heat is discharged from the fixing frame 6.

[0030] Embodiment Two: Please refer to Figures 1 to 4 , In this embodiment, on the basis of Embodiment One, there is a connection component between the integrated circuit lead frame body 1 and the fixing frame 6. The connection component includes two fixing plates 4. The two fixing plates 4 are respectively fixedly connected to the left side surface and the right side surface of the integrated circuit lead frame body 1. Support plates 5 are fixedly connected to the left side surface and the right side surface of the fixing frame 6. Fixing grooves 21 are opened on the top surfaces of the two support plates 5. The two fixing plates 4 respectively extend into the interiors of the two fixing grooves 21. Limiting rods 20 are fixedly connected to the interiors of the two fixing grooves 21. Limiting holes 19 are opened on the bottom surfaces of the two fixing plates 4. The two limiting rods 20 respectively extend into the interiors of the two limiting holes 19. Rubber rings 10 are fixedly sleeved on the outer peripheral walls of the two fixing plates 4. Installation grooves 15 are opened on the top surfaces of the two support plates 5, each having a quantity of two.

[0031] Among them, the two limiting rods 20 are in clearance fit with the two limiting holes 19 respectively. The rubber ring 10 is a rectangular ring. The rubber ring 10 is in contact with the fixing groove 21. The fixing plate 4 is an L-shaped plate.

[0032] Specifically, push the integrated circuit lead frame body 1 to make the integrated circuit lead frame body 1 fit with the fixing frame 6. Insert the fixing plate 4 into the inside of the fixing groove 21, and insert the limiting rod 20 into the inside of the limiting hole 19. The fixing plate 4 is restricted by the clearance fit between the limiting rod 20 and the limiting hole 19. The fixing plate 4 is supported by the fit between the rubber ring 10 and the fixing groove 21, improving the stability of the fixing plate 4.

[0033] Embodiment 3: Please refer to Figures 1 to 4 , in this embodiment, on the basis of Embodiment 1 and Embodiment 2, it includes a fixing component provided on the fixing frame 6. The fixing component includes four driving rods 16. The four driving rods 16 are respectively movably connected to the inside of the four mounting grooves 15 through bearings. One side of the four driving rods 16 close to the fixing plate 4 is movably connected to a screw rod 14 with one end extending into the driving rod 16. One side of two adjacent screw rods 14 is fixedly connected with a limiting plate 13. One side of two adjacent limiting plates 13 opposite to each other is fixedly connected with a positioning rod 12. Positioning holes 11 are opened on the front and back of the two fixing plates 4. The positioning rod 12 extends into the inside of the positioning hole 11. Support holes 17 are opened in the inside of the two support plates 5. One side of the four limiting plates 13 away from the positioning rod 12 is fixedly connected with a support rod 18 with one end extending into the inside of the support hole 17.

[0034] Among them, the four mounting grooves 15 are respectively located at the front and back of the two fixing grooves 21. Threaded holes are opened on one side of two adjacent driving rods 16 opposite to each other. The two screw rods 14 respectively extend into the inside of the two threaded holes and are threadedly connected thereto. The positioning rod 12 and the positioning hole 11 are in clearance fit. The limiting rod 20 and the limiting hole 19 are in clearance fit. The limiting plate 13 and the fixing plate 4 are in contact.

[0035] Specifically, rotate the driving rod 16 to make the driving rod 16 rotate. Through the threaded connection between the driving rod 16 and the screw rod 14 and the clearance fit between the support rod 18 and the support hole 17, the screw rod 14 drives the limiting plate 13 to move, making the positioning rod 12 insert into the inside of the positioning hole 11, and the limiting plate 13 and the fixing plate 4 are in contact. The fixing plate 4 is fixed by the clearance fit between the positioning rod 12 and the positioning hole 11.

[0036] The working principle of the above embodiments is:

[0037] Push the integrated circuit lead frame body 1 to make the integrated circuit lead frame body 1 fit with the fixing frame 6, make the heat dissipation fins 7 fit with the integrated circuit lead frame body 1, insert the fixing plate 4 into the inside of the fixing groove 21, and insert the limiting rod 20 into the inside of the limiting hole 19. Through the clearance fit between the limiting rod 20 and the limiting hole 19, the fixing plate 4 is restricted. Through the fit between the rubber ring 10 and the fixing groove 21, the fixing plate 4 is supported to improve the stability of the fixing plate 4. Rotate the driving rod 16 to make the driving rod 16 rotate. Through the threaded connection between the driving rod 16 and the screw rod 14 and the clearance fit between the support rod 18 and the support hole 17, the screw rod 14 drives the limiting plate 13 to move, so that the positioning rod 12 is inserted into the inside of the positioning hole 11. The limiting plate 13 fits with the fixing plate 4. Through the clearance fit between the positioning rod 12 and the positioning hole 11, the fixing plate 4 is fixed, and then the integrated circuit lead frame body 1 is fixed on the fixing frame 6. Under the action of the heat dissipation fins 7 and the heat dissipation plate 9, the integrated circuit lead frame body 1 is dissipated, and then under the action of the heat dissipation holes 8, the heat is discharged from the fixing frame 6.

[0038] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "including a..." does not exclude the presence of additional identical elements in the process, method, article or device including the element.

[0039] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit lead frame, comprising an integrated circuit lead frame body (1), characterized in that: The integrated circuit lead frame body (1) is provided with three base islands (3), and the integrated circuit lead frame body (1) is fixedly connected with twelve pins (2); A fixing frame (6) is placed on the bottom surface of the integrated circuit lead frame body (1), a heat sink (9) is fixedly connected to the inner bottom wall of the fixing frame (6), a plurality of heat sink fins (7) are fixedly connected to the top surface of the heat sink (9), the top surfaces of the plurality of heat sink fins (7) are all in contact with the bottom surface of the integrated circuit lead frame body (1), and a plurality of heat sink holes (8) are provided on the bottom surface of the fixing frame (6); A connecting component is provided between the integrated circuit lead frame body (1) and the fixing frame (6), and a fixing component is provided on the fixing frame (6).

2. An integrated circuit lead frame according to claim 1, characterized in that: The twelve pins (2) are distributed in groups of six on the top and bottom of the base island (3), and the plurality of heat sink fins (7) are located between the twelve pins (2).

3. An integrated circuit lead frame according to claim 2, characterized in that: The fixing frame (6) is a U-shaped frame, and the plurality of heat dissipation holes (8) are linearly and equidistantly distributed from left to right, and the distance between two adjacent pins (2) is 0.5 mm.

4. The integrated circuit lead frame according to claim 1, characterized in that: The connection assembly comprises two fixing plates (4), the two fixing plates (4) are respectively fixedly connected to the left side and the right side of the integrated circuit lead frame body (1), the left side and the right side of the fixing frame (6) are both fixedly connected to a support plate (5), the top surfaces of the two support plates (5) are both provided with fixing grooves (21), the two fixing plates (4) extend to the inside of the two fixing grooves (21), the inside of the two fixing grooves (21) are both fixedly connected with a limiting rod (20), the bottom surfaces of the two fixing plates (4) are both provided with limiting holes (19), the two limiting rods (20) extend to the inside of the two limiting holes (19), the outer peripheral walls of the two fixing plates (4) are both fixedly sleeved with a rubber ring (10), and the top surfaces of the two support plates (5) are both provided with two mounting grooves (15).

5. An integrated circuit lead frame according to claim 4, characterized in that: The two limiting rods (20) are respectively clearance-matched with the two limiting holes (19); the rubber ring (10) is a rectangular ring; the rubber ring (10) and the fixing groove (21) are fitted together; and the fixing plate (4) is an L-shaped plate.

6. An integrated circuit lead frame according to claim 4, characterized in that: The fixing assembly comprises four driving rods (16), the four driving rods (16) are movably connected to the inside of four mounting grooves (15) through bearings, the side surfaces of the four driving rods (16) close to the fixing plate (4) are movably connected to a screw rod (14) having one end extending to the inside of the driving rod (16), the side surfaces of two adjacent screw rods (14) are fixedly connected to a limiting plate (13), the opposite side surfaces of two adjacent limiting plates (13) are fixedly connected to a positioning rod (12), the front and back surfaces of the two fixing plates (4) are provided with positioning holes (11), the positioning rod (12) extends to the inside of the positioning hole (11), the insides of the two supporting plates (5) are provided with supporting holes (17), and the side surfaces of the four limiting plates (13) away from the positioning rod (12) are fixedly connected to a support rod (18) having one end extending to the inside of the supporting hole (17).

7. An integrated circuit lead frame according to claim 6, characterized in that: The four installation grooves (15) are respectively located at the front and back sides of the two fixing grooves (21), and threaded holes are provided on the opposite sides of the two adjacent driving rods (16), and the two screw rods (14) respectively extend into the inside of the two threaded holes and are threadedly connected thereto.

8. An integrated circuit lead frame according to claim 7, characterized in that: The positioning rod (12) and the positioning hole (11) are clearance-matched, the limiting rod (20) and the limiting hole (19) are clearance-matched, and the limiting plate (13) and the fixing plate (4) are in close contact.

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