Controller and vehicle

Abstract

The utility model relates to a controller and a vehicle, and the controller comprises a power device which is at least used for the on-off control of a circuit; the circuit board is provided with a circuit which is electrically connected with the power device; the heat dissipation plate is attached to the power device so that heat transfer can be formed between the power device and the heat dissipation plate; wherein the power device is arranged between the circuit board and the heat dissipation plate, and a preset distance is formed between the power device and the circuit board; the heat dissipation plate forms or is connected with a plurality of heat dissipation columns which at least extend in the direction perpendicular to the heat dissipation plate. Wherein the heat dissipation column is arranged on one side, far away from the power device, of the heat dissipation plate; the heat dissipation columns are arranged in groups so as to divide the space of the side, away from the power device, of the heat dissipation plate into a column distribution area and a flow channel area. The controller and the vehicle have the beneficial effects that the heat dissipation effect is improved through grouping arrangement of the heat dissipation columns.

Description

Technical Field

[0001] The present application relates to the technical field of controllers, and particularly to a controller and a vehicle. Background Art

[0002] With the popularization and rapid development of new energy vehicles, the requirements for high integration, high power density, and high efficiency of their electronic control systems are getting higher and higher. The integrated controller is the core component of new energy vehicles, integrating the independent power distribution control of devices such as motor controllers, electric defrosting, electric heating, and electric air conditioners.

[0003] In the prior art, the integrated controller integrates multiple power devices. With the development of power devices towards high power efficiency, their operating temperatures also increase, and the current heat dissipation structure of the integrated controller can no longer meet the heat dissipation requirements. Utility Model Content

[0004] The embodiments of the present application provide a controller, which improves the heat dissipation effect of the controller to at least partially solve the above technical problems.

[0005] To achieve the above object, according to the first aspect of the present application, there is provided a controller, including: a power device, at least used for controlling the on-off of a circuit;

[0006] A circuit board, which has a circuit electrically connected to the power device;

[0007] A heat dissipation plate, which is attached to the power device so as to form heat transfer between the power device and the heat dissipation plate;

[0008] Wherein, the power device is arranged between the circuit board and the heat dissipation plate and keeps a preset distance between the power device and the circuit board;

[0009] The heat dissipation plate forms or is connected with:

[0010] A plurality of heat dissipation columns, at least extending in a direction perpendicular to the heat dissipation plate;

[0011] Wherein, the heat dissipation columns are arranged on the side of the heat dissipation plate away from the power device; the heat dissipation columns are grouped and arranged to divide the space on the side of the heat dissipation plate away from the power device into a column arrangement area and a flow channel area.

[0012] Optionally, the flow channel area is configured to have a curved flow channel.

[0013] Optionally, the flow channel area is configured to have a first flow channel, a second flow channel, and a confluence sub-region. The first flow channel and the second flow channel at least extend in a preset direction; the confluence sub-region is arranged on the extension paths of the first flow channel and the second flow channel, and the first flow channel and the second flow channel are respectively communicated with the confluence sub-region.

[0014] Optionally, the flow channel region includes a flow channel in the shape of ∞.

[0015] Optionally, the heat dissipation plate is connected to a heat dissipation housing for accommodating the cooling working medium flowing through it; the heat dissipation columns are arranged inside the heat dissipation housing.

[0016] Optionally, the controller further includes support columns supported between the circuit board and the heat dissipation plate; wherein, both ends of the support columns are respectively abutted against the circuit board and the heat dissipation plate.

[0017] Optionally, the power device includes a device body having a heat dissipation surface; device pins directly forming an electrical connection with the circuit of the circuit board; wherein, the heat dissipation surface is disposed opposite to the heat dissipation plate.

[0018] Optionally, the heat dissipation surface is the largest plane on the device body; the heat dissipation surface is attached to the plate surface of the heat dissipation plate.

[0019] Optionally, the circuit board is parallel to the heat dissipation plate.

[0020] Optionally, the device pins are bent.

[0021] Optionally, the controller further includes functional devices, circuit elements and wiring devices; the functional devices, circuit elements and wiring devices are disposed on a side of the circuit board away from the power device.

[0022] Optionally, the power device is a silicon carbide metal-oxide-semiconductor field effect transistor.

[0023] According to a second aspect of the present application, there is provided a vehicle including the controller as described above.

[0024] The beneficial effect of the present application is that: there is provided a controller and a vehicle that improve the heat dissipation effect by the grouped arrangement of heat dissipation columns.

[0025] More specifically, some embodiments of the present application may produce the following specific beneficial effects:

[0026] By the grouped arrangement of the heat dissipation columns, the space on the side of the heat dissipation plate away from the power device is divided into a column arrangement region and a flow channel region, so that the cooling working medium has different flow states in the column arrangement region and the flow channel region, combining the advantages of a large heat dissipation area of the pin column structure and small flow resistance and pressure drop of the flow channel structure, thereby improving the heat dissipation effect.

[0027] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. Description of the Drawings

[0028] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] To more fully understand the present application and its beneficial effects, the following description will be made in conjunction with the drawings, where the same reference numerals in the following description represent the same parts.

[0030] Figure 1 is a schematic diagram of the overall structure of the controller provided in the exemplary embodiment of the present application;

[0031] Figure 2 is a left view of the controller provided in the exemplary embodiment of the present application;

[0032] Figure 3 is a schematic diagram of the structure of a part of the controller provided in the exemplary embodiment of the present application;

[0033] Figure 4 is a left view of a part of the controller provided in the exemplary embodiment of the present application;

[0034] Figure 5 is a schematic block diagram of the connection between the controller provided in the exemplary embodiment of the present application and the drive circuit and the pre-charge circuit.

[0035] Figure 6 is an exploded view of a part of the controller provided in the exemplary embodiment of the present application;

[0036] Figure 7 is a sectional view of the controller provided in the exemplary embodiment of the present application.

[0037] Figure 8 is a bottom view of a part of the controller provided in the exemplary embodiment of the present application;

[0038] Figure 9 is a top view of a part of the controller provided in the exemplary embodiment of the present application;

[0039] Figure 10 is a schematic diagram of the overall structure of the vehicle provided in the exemplary embodiment of the present application.

[0040] Description of reference numerals:

[0041] 100, controller;

[0042] 110, power device; 111, device body; 111a, heat dissipation surface; 112, device pin;

[0043] 120, Circuit board; 130, Heat dissipation plate; 140, Heat dissipation column;

[0044] 141, Column distribution area;

[0045] 142, Flow channel area; 142a, First flow channel; 142b, Second flow channel; 142c, Confluence sub - area;

[0046] 150, Heat dissipation housing; 150a, Working fluid inlet; 150b, Working fluid outlet;

[0047] 160, Support column;

[0048] 170, Functional device; 171, Opto - coupler;

[0049] 180, Circuit component; 181, Color - coded resistor;

[0050] 190, Wiring device; 191, High - voltage terminal; 192, Low - voltage connector; 193, Voltage sampling point;

[0051] 201, Electric defrosting; 202, Electric heating; 203, Electric air conditioner; 204, Air compressor controller; 205, Steering motor controller; 206, Pre - charge contactor;

[0052] 10, Vehicle. Detailed implementation manners

[0053] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present application.

[0054] According to the first aspect of the present application, with reference to Figures 1 to 7 , the present application provides a controller 100, including: a power device 110, a circuit board 120 and a heat dissipation plate 130.

[0055] The power device 110 is at least used for controlling the on - off of the circuit. The circuit board 120 (PCB board) has circuits electrically connected to the power device 110, such as a drive circuit, a pre - charge circuit, and a voltage sampling circuit, etc. The circuit board 120 controls the on - off of each power device 110 by receiving a pulse - width modulation PWM (PWM (Pulse Width Modulation)) signal input from the control board, thereby realizing independent control of multiple circuits.

[0056] With reference to Figure 5, Multiple power devices 110 are respectively connected in parallel to the drive circuits of the electric defroster 201, the electric heater 202, the electric air conditioner 203, the air compressor controller 204100, the steering motor controller 205100, etc. and the pre-charge circuit including the pre-charge contactor 206, and are used to control the on-off of the circuits such as the electric defroster 201, the electric heater 202, the electric air conditioner 203, the air compressor controller 204100, the steering motor controller 205100 and the pre-charge contactor 206. The independent power distribution of multiple circuits is realized through a single controller 100, greatly improving the space utilization rate. Among them, the pre-charge circuit reduces the impact current when the vehicle 10 is powered on at high voltage through the pre-charge resistor, improving the safety of the whole vehicle.

[0057] The heat dissipation plate 130 is attached to the power device 110 so that heat transfer is formed between the power device 110 and the heat dissipation plate 130. The heat dissipation plate 130 is made of a metal material and has good heat transfer ability. Preferably, the heat dissipation plate 130 is made of aluminum.

[0058] The power device 110 is arranged between the circuit board 120 and the heat dissipation plate 130 and the power device 110 is separated from the circuit board 120 by a preset distance. Through the setting of this preset distance, a heat buffer space is formed between the power device 110 and the circuit board 120, reducing the heat transfer to the circuit board 120.

[0059] The heat dissipation plate 130 forms or is connected with a plurality of heat dissipation columns 140. The heat dissipation columns 140 are arranged on the side of the heat dissipation plate 130 away from the power device 110 and at least extend in a direction perpendicular to the heat dissipation plate 130; the heat dissipation columns 140 are in a needle column structure and have a large heat dissipation surface area. Specifically, the heat dissipation columns 140 can be welded to the heat dissipation plate 130 to form an integral body.

[0060] The heat dissipation columns 140 are arranged in groups to divide the space on the side of the heat dissipation plate 130 away from the power device 110 into a column arrangement area 141 and a flow channel area 142. Among them, the column arrangement area 141 is arranged with heat dissipation columns 140 in an array. The heat generated by the power device 110 is transferred to the heat dissipation columns 140 through the heat dissipation plate 130. There are column gaps between the heat dissipation columns 140 through which the cooling medium can pass, enabling the cooling medium to take away the heat of the heat dissipation columns 140. The flow channel area 142 is mainly a flow channel structure and no heat dissipation columns 140 are arranged in this area, and the flow resistance and pressure drop of the cooling medium passing through are small.

[0061] Through the above technical solution, by arranging the heat dissipation columns 140 in groups, the space on the side of the heat dissipation plate 130 away from the power device 110 is divided into a column arrangement area 141 and a flow channel area 142, enabling the cooling medium to have different flow states in the column arrangement area 141 and the flow channel area 142, combining the advantages of a large heat dissipation surface area of the needle column structure and a small flow resistance and pressure drop of the flow channel structure, thereby effectively dissipating the heat generated when the power device 110 works.

[0062] Meanwhile, based on the above improvement in heat dissipation effect, the overall thickness formed by the heat dissipation posts 140 and the heat dissipation plate 130 can be reduced, so that the controller 100 of the present application has a thin and light structure, is easy to install, and has a higher integration level.

[0063] In some embodiments, referring to Figure 7 and Figure 8 , the flow channel region 142 is configured to have a curved flow channel, which is longer than a straight water channel and can be more fully interleaved among the pin posts, so as to effectively dissipate the heat generated when the power device 110 is conducting.

[0064] In some embodiments, referring to Figure 7 and Figure 8 , the flow channel region 142 is configured to have a first flow channel 142a, a second flow channel 142b and a confluence sub-region 142c. The first flow channel 142a and the second flow channel 142b are symmetrically arranged, and the first flow channel 142a and the second flow channel 142b are connected to the same working fluid inlet 150a and working fluid outlet 150b. The first flow channel 142a and the second flow channel 142b extend at least along a preset direction (i.e., the direction from the working fluid inlet 150a to the working fluid outlet 150b). Through the arrangement of the first flow channel 142a and the second flow channel 142b, the flow channel region 142 and the pin arrangement region 141 are fully interleaved. The confluence sub-region 142c is arranged on the extension paths of the first flow channel 142a and the second flow channel 142b, and the first flow channel 142a and the second flow channel 142b are respectively connected to the confluence sub-region 142c. Through the arrangement of the confluence sub-region 142c, the cooling working fluids in the first flow channel 142a and the second flow channel 142b are mixed in the confluence sub-region 142c, which can increase the turbulence degree of the cooling working fluid and further improve the heat dissipation effect.

[0065] In some embodiments, referring to Figure 7 and Figure 8 , the flow channel region 142 includes an ∞-shaped flow channel, which can increase the turbulence degree while having a long flow channel length and good interleaving property, and has a small flow resistance, thereby improving the heat dissipation effect.

[0066] In some embodiments, referring to Figure 1 and Figure 7 , the heat dissipation plate 130 is connected with: a heat dissipation housing 150.

[0067] The heat dissipation housing 150 is used to accommodate the cooling working fluid flowing through it, and the heat dissipation posts 140 are arranged inside the heat dissipation housing 150. The heat dissipation housing 150 is formed with a working fluid inlet 150a and a working fluid outlet 150b that are communicated with the inside.

[0068] In some embodiments, referring to Figure 3, the controller 100 further includes: a support column 160.

[0069] Both ends of the support column 160 are respectively abutted against the circuit board 120 and the heat dissipation plate 130, supported between the circuit board 120 and the heat dissipation plate 130, so that the circuit board 120 and the heat dissipation plate 130 maintain an appropriate distance, and provide an installation space for the power device 110.

[0070] In some embodiments, referring to Figure 4 and Figure 6 , the power device 110 includes: a device body 111 and device pins 112.

[0071] The device pins 112 are directly electrically connected to the circuit of the circuit board 120. The device body 111 has a heat dissipation surface 111a, and the heat dissipation surface 111a is disposed opposite to the heat dissipation plate 130, and the two may be parallel to each other, so that the heat dissipation surface 111a can contact the heat dissipation plate 130 more. Among them, the heat dissipation surface 111a is the largest plane on the device body 111, and the heat dissipation surface 111a is attached to the plate surface of the heat dissipation plate 130. By using the largest plane on the device body 111 as the heat dissipation surface 111a to be attached to the heat dissipation plate 130, the heat transfer efficiency of the power device 110 to the heat dissipation plate 130 is improved.

[0072] In some embodiments, the power device 110 and the heat dissipation plate 130 are bonded by thermal conductive silicone grease, which not only fixes the power device 110, but also improves the heat conduction efficiency between the power device 110 and the heat dissipation plate 130.

[0073] In some embodiments, referring to Figures 1 to 4 , the circuit board 120 is parallel to the heat dissipation plate 130, so that a uniform heat dissipation space is maintained between the circuit board 120 and the heat dissipation plate 130.

[0074] In some embodiments, referring to Figure 4 and Figure 6 , the device pins 112 are bent. By connecting the device pins 112 after bending to the circuit board 120, the distance from the power device 110 to the circuit board 120 is only the length of the device pins 112 after bending, without other leads, so that the installation loop is extremely short and the structure is simple, which can effectively enhance the anti-interference ability. At the same time, the thinness and lightness of the controller 100 are further improved.

[0075] In some embodiments, referring to Figures 1 to 6 , Figure 9 , the controller 100 further includes: a functional device 170, a circuit component 180 and a wiring device 190. The functional device 170, the circuit component 180 and the wiring device 190 are disposed on the side of the circuit board 120 away from the power device 110.

[0076] Specifically, the wiring device 190 includes: a high-voltage terminal 191 and a low-voltage connector 192.

[0077] The high-voltage terminal 191 is used for inputting and outputting high-voltage electricity. Multiple high-voltage terminals 191 are evenly arranged on the circuit board 120. For example, referring to Figure 9 , the two high-voltage terminals 191 located on the left are responsible for inputting high-voltage electricity; the remaining six high-voltage terminals 191 symmetrically arranged in the front-back direction and connected to the power device 110 are responsible for outputting high-voltage electricity.

[0078] Here, the left-right direction is only for facilitating the introduction of the specific embodiments of the present application. Similarly, the up-down direction and the front-back direction are only for expressing relative positional relationships. They only indicate the general orientation, rather than absolute geometric relationships.

[0079] The low-voltage connector 192 is connected to the voltage sampling module. For example, the voltage is scaled down in proportion through a differential amplifier circuit and then transmitted to the control board chip through the low-voltage connector 192 for voltage sampling. Figure 5 Exemplarily, the voltage sampling points 193 of the drive circuit and the pre-charge circuit are shown. Through voltage sampling, the real-time monitoring of the voltage at the output end of the power device 110 can be realized, and an alarm can be given for faults in a timely manner to prevent the occurrence of short-circuit phenomena.

[0080] The external interaction signals of the low-voltage connector 192 mainly include voltage acquisition signals and PWM control signals. At the same time, it is also connected to the power supply that supplies power to the circuit of the circuit board 120.

[0081] The circuit element 180 includes: a color ring resistor 181. By replacing the independent metal resistor with a surface-mounted color ring resistor 181 and integrating it on the circuit board 120, a pre-charge circuit is formed with the pre-charge contactor 206 to realize the pre-charge of the drive circuit, improving the space utilization rate and reducing the usage cost. In addition, the pre-charge circuit reduces the inrush current when the vehicle 10 is powered on at high voltage, improving the safety of the whole vehicle.

[0082] The functional device 170 includes: an opto-coupler 171 and a diode (not shown). The drive circuit controls the on-off of each power device 110 by receiving the input PWM signal through the opto-coupler 171, thereby realizing the independent control of multiple circuits. The opto-coupler 171 and the diode form a protection circuit to protect the drive circuit through active clamping and monitoring of the tube voltage drop.

[0083] The controller 100 of the present application integrates the power device 110, the voltage sampling circuit, the pre-charge circuit, heat dissipation, etc., making the controller 100 of the present application have a high degree of integration.

[0084] In some embodiments, the power device 110 is a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET).

[0085] As a relatively mature wide-bandgap switching device, the silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET) has the advantages of high breakdown voltage, high thermal conductivity, and high switching frequency.

[0086] Compared with traditional contactors, the SiC MOSFET has a smaller volume, a larger power density, better voltage withstand performance (up to over 1200V), and better temperature resistance performance.

[0087] Compared with Si MOSFETs of the same power level, the on-resistance and switching losses of SiC MOSFETs are significantly reduced, making them suitable for higher operating frequencies. However, the relatively wide bandgap of SiC MOSFETs also gives them a higher breakdown field strength and operating temperature. If the temperature of the controller 100 using SiC MOSFETs cannot be dissipated quickly, its junction temperature will rise sharply, greatly reducing its own performance; in addition, the transient maximum junction temperature of the controller 100 at high power also needs to be controlled within a reliable range.

[0088] In this application, the power device 110 is a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET), which is combined with the heat dissipation method of the grouped arrangement of the heat dissipation columns 140 to form the heat dissipation column area 141 and the flow channel area 142, effectively dissipating the heat generated when the SiC MOSFET is conducting. While making the entire module have a high degree of integration, it also has good heat dissipation.

[0089] According to the second aspect of this application, referring to Figure 10 , a vehicle 10 is provided, and the vehicle 10 includes the above-mentioned controller 100. The vehicle 10 has all the beneficial effects of the above-mentioned controller 100, and will not be elaborated herein.

[0090] The vehicle 10 can be a plug-in hybrid vehicle or a new energy vehicle, etc., and this application does not make specific limitations on this.

[0091] In the description of this application, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "a plurality" means two or more, unless otherwise specifically defined.

[0092] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0093] Among the embodiments, implementation manners and related technical features of the present application, they can be combined and replaced with each other without conflict.

[0094] The above are only the preferred embodiments of the present application and do not impose any formal restrictions on the present application. Although the present application has been described by way of examples and the descriptions of the respective embodiments have their own emphases, for parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A controller, characterized in that: include: Power devices, at least used for on-off control of the circuit; A circuit board having a circuit electrically connected to the power device; A heat sink, attached to the power device to enable heat transfer between the power device and the heat sink; Wherein, the power device is arranged between the circuit board and the heat sink and the power device is separated from the circuit board by a preset distance; The heat sink is formed or connected with: A plurality of heat dissipation columns extending at least in a direction perpendicular to the heat dissipation plate; The heat dissipation columns are arranged on a side of the heat dissipation plate away from the power device; the heat dissipation columns are arranged in groups to divide the space on a side of the heat dissipation plate away from the power device into a column arrangement area and a flow channel area.

2. The controller according to claim 1, characterized in that: The flow channel region is configured to have a curved flow channel.

3. The controller according to claim 2, characterized in that: The flow channel area is constructed to have a first flow channel, a second flow channel and a confluence sub-area, the first flow channel and the second flow channel extend at least along a preset direction; the confluence sub-area is arranged on the extension path of the first flow channel and the second flow channel, and the first flow channel and the second flow channel are respectively connected to the confluence sub-area.

4. The controller according to claim 3, characterized in that: The flow channel region includes an ∞-shaped flow channel.

5. The controller according to claim 1, characterized in that: The heat sink is connected with: A heat dissipation housing, used to contain a cooling medium flowing therethrough; The heat dissipation column is arranged inside the heat dissipation housing.

6. The controller according to any one of claims 1 to 5, characterized in that: The controller further comprises: A support column, supported between the circuit board and the heat sink; Wherein, two ends of the support column abut against the circuit board and the heat dissipation plate respectively.

7. The controller according to claim 6, characterized in that: The power device comprises: The device body has a heat dissipation surface; The device pins are directly electrically connected to the circuit of the circuit board; Wherein, the heat dissipation surface is arranged opposite to the heat dissipation plate.

8. The controller according to claim 7, characterized in that: The heat dissipation surface is the largest plane on the device body; the heat dissipation surface is in contact with the surface of the heat dissipation plate.

9. The controller according to claim 7, characterized in that: The circuit board is parallel to the heat dissipation plate.

10. The controller according to claim 7, characterized in that: The device pins are bent.

11. The controller according to claim 1, characterized in that: The controller also includes: functional devices, circuit elements and wiring devices; The functional device, circuit element and wiring device are arranged on a side of the circuit board away from the power device.

12. The controller according to any one of claims 1 to 5, characterized in that: The power device is a silicon carbide metal-oxide semiconductor field effect transistor.

13. A vehicle, characterized in that: Comprising a controller as claimed in any one of claims 1 to 12.

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