Component packaging tube, chip mounter and chip mounter

Abstract

According to the element packaging pipe, the upper end of the element packaging pipe is a storage area, and the lower end of the element packaging pipe is an insertion area; a detachable bolt is inserted between the storage area and the insertion area; an opening is arranged below the plugging area. The chip mounter comprises a platform, a supporting device and a chip mounter, the chip mounter is provided with a feed port and a discharge port; the supporting device is connected with the platform; the supporting device is connected with the chip mounter; the supporter is used for supporting the chip mounter, so that the chip mounter is suspended at a preset position above the platform; the discharge port is vertically aligned with the chip mounting position; and the chip mounter is used for releasing an electronic element when chip mounting operation is executed, so that the electronic element falls down from the discharge port and falls on the chip mounting position of the PCB, and chip mounting is completed. The chip mounter is low in cost, simple in structure, simple to operate, easy to operate, easy to repair and low in use cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of SMT surface mounting technology, and particularly relates to a component packaging tube, a chip placer, and a chip mounter. Background Art

[0002] SMT (Surface Mounting Technology) is an important means of electronic manufacturing, so automatic chip mounters have been developed; however, automatic chip mounters are costly, with expensive accessories and high maintenance costs; moreover, automatic chip mounters require professional technicians to operate, resulting in high usage costs; in addition, automatic chip mounters have a complex structure, many vulnerable parts, and poor durability.

[0003] In common high-speed chip mounters, the placement heads need to move at high speed, constantly accelerating and decelerating, consuming a large amount of electric energy, which is not conducive to energy conservation and emission reduction.

[0004] Simple-to-operate manual chip mounters or manual placement stations, although easy to use, have low production yields, slow speeds, and high labor costs.

[0005] Currently, most fully automatic chip mounters need to be used with electronically components packaged in tapes. And tape packaging requires each component to be individually packaged, which is very troublesome and costly; moreover, the packaging materials for tape packaging have low recycling value (especially tapes made of composite materials), and many are discarded as garbage, which is not conducive to environmental protection.

[0006] Those skilled in the art have a technical prejudice that chip mounters should: first pick up the material, then move to the placement position, and finally release the material.

[0007] The present invention aims to provide a brand-new chip mounter, which has a simple structure, is easy to operate, has a low cost, is easy to master, is easy to repair, is long-lasting and durable, and can meet the needs of mass production. Utility Model Content

[0008] To solve the above problems, a first aspect of the present invention provides a chip placer, characterized by comprising:

[0009] The chip placer (30) is provided with a feed inlet (31); a discharge outlet (32) is provided below the chip placer (30); the feed inlet (31) is used to obtain electronic components, and the discharge outlet (32) is used to release electronic components;

[0010] A storage chamber (34) and a release chamber (35) are arranged inside the chip placer (30);

[0011] The storage chamber (34) is communicated with the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31);

[0012] The discharge port (32) is provided below the release chamber (35), and the release chamber (35) is in communication with the discharge port (32), so that the electronic components in the release chamber (35) can fall from the discharge port (32);

[0013] The storage chamber (34) is in communication with the release chamber (35), so that the electronic components in the storage chamber (34) can be pushed into the release chamber (35);

[0014] The storage chamber (34) is provided with a plug slot (36), so that when the plug (37) is inserted into the plug slot (36), the plug (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

[0015] Furthermore, a kind of chip mounter is characterized in that it further includes:

[0016] The feed inlet (31) is provided above the chip mounter (30), and the storage chamber (34) is provided below the feed inlet (31), so that the electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

[0017] Furthermore, a kind of chip mounter is characterized in that it further includes:

[0018] A plug-in chamber (33) is provided in the feed inlet (31) of the chip mounter (30).

[0019] Furthermore, a kind of chip mounter is characterized in that it further includes:

[0020] The storage chamber (34) and the release chamber (35) are in communication through a channel (38), and the height H of the channel (38) is not greater than the height of two electronic components.

[0021] In a second aspect, a kind of component packaging tube is provided, which is characterized in that it includes:

[0022] The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52);

[0023] A detachable plug (51) is inserted between the storage area (54) and the plug-in area (52);

[0024] An opening (53) is provided below the plug-in area (52), so that when the opening (53) faces downwards and the plug (51) is pulled out, the electronic components stored in the storage area (54) will fall from the opening (53).

[0025] The plug-in area (52) is used to be plugged into the feed port or the plug-in chamber of the chip mounter as described in the first aspect of the present application.

[0026] A third aspect of the present invention provides a chip mounter, which is characterized by comprising:

[0027] A platform (10), a support (20), and one or more chip mounters (30);

[0028] The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components;

[0029] The support (20) is connected to the platform (10); the support (20) is connected to the chip mounter (30);

[0030] The support (20) is used to support the chip mounter (30), so that the chip mounter (30) is suspended above the platform (10) at a predetermined position, and the discharge port (32) is vertically aligned with the chip placement position, where the chip placement position refers to the chip placement position of the PCB board placed on the platform (10) during chip placement;

[0031] The chip mounter (30) is used to release an electronic component when performing a chip placement operation, so that the electronic component falls from the discharge port (32) and lands on the chip placement position.

[0032] Further, the chip mounter is characterized by further comprising:

[0033] The chip mounter (30) is the chip mounter as described in the first aspect of the present invention.

[0034] Further, the chip mounter is characterized by further comprising:

[0035] A circuit board (37); when the chip mounter is provided with a plurality of chip mounters, a plurality of chip mounters share one circuit board (37).

[0036] Further, the chip mounter is characterized by further comprising:

[0037] A positioning device (11) is provided on the platform (10) to facilitate positioning the PCB board at a predetermined position.

[0038] A fourth aspect of the present invention provides a chip mounter, which is characterized by comprising:

[0039] The component packaging tube as described in the second aspect of the present invention, and the chip mounter as described in the third aspect of the present invention; the chip mounter is equipped with a chip placer as described in the first aspect of the present invention; the component packaging tube is inserted into the feeding port or the insertion chamber of the chip placer.

[0040] It can be seen from the above technical solutions that this application has at least one of the following beneficial effects:

[0041] 1. The chip mounter provided by this application has a simple structure, no expensive components, low cost, and low maintenance cost; it is easy to operate, easy to get started, and has low usage cost; there are almost no vulnerable parts, and it is long-lasting and durable.

[0042] 2. When the chip mounter provided by this application is equipped with multiple chip placers, multiple chip placers can perform chip placement simultaneously. Therefore, the chip placement speed is fast, the efficiency is high, and the production speed can even exceed that of traditional high-speed chip mounters. Therefore, it can meet the requirements of large-scale production.

[0043] 3. The chip mounter provided by this application supplies materials vertically, the chip placement head is fixed, and multiple components can be placed simultaneously; its structure is completely different from that of traditional chip mounters, and its design concept overcomes the technical prejudice of those skilled in the art and creates a brand-new chip mounter technical solution.

[0044] 4. Compared with traditional chip mounters, the chip mounter provided by this application does not require the chip placement head to move at high speed. Therefore, it is more power-saving and conducive to energy conservation and emission reduction.

[0045] 5. For the component packaging tube provided by this application, there is no need to place electronic components one by one on the carrier tape. As long as the electronic components are loaded into the tube in an orderly manner, the packaging is convenient and fast, and the packaging cost is low; and the component packaging tube can be reused, which is conducive to environmental protection and cost savings. Description of the Drawings

[0046] Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0047] Figure 1 It is a schematic structural diagram of a component packaging tube proposed in the second aspect of the present invention;

[0048] Figure 2 It is a schematic side view structure diagram of a chip mounter proposed in the third aspect of the present invention;

[0049] Figure 3 It is a schematic front view structure diagram of a chip mounter proposed in the third aspect of the present invention;

[0050] Figure 4A schematic top view structure diagram of a mounter proposed in the third aspect of the present invention;

[0051] Figure 5 A cross-sectional view of a chip placer proposed in the first aspect of the present invention;

[0052] Figure 6 A cross-sectional view of a chip placer proposed in the first aspect of the present invention;

[0053] Figure 7 A schematic structure diagram of a mounter when an insertion board is installed, proposed in the third aspect of the present invention;

[0054] Figure 8 A cross-sectional view of the working process of a chip placer proposed in the first aspect of the present invention;

[0055] Figure 9 A cross-sectional view of the working process of a chip placer proposed in the first aspect of the present invention;

[0056] Figure 10 A cross-sectional view of the working process of a chip placer proposed in the first aspect of the present invention;

[0057] Figure 11 A schematic structure diagram of a mounter when multiple chip placers are installed, proposed in the third aspect of the present invention;

[0058] Figure 12 A schematic structure diagram of a mounter proposed in the fourth aspect of the present invention;

[0059] Among them, each reference numeral in the figure: 50 - component packaging tube; 51 - plug; 52 - insertion area; 53 - opening; 54 - storage area; 10 - platform; 11 - positioning device; 20 - support; 30 - chip placer; 31 - feed port; 32 - discharge port; 33 - insertion chamber; 34 - storage chamber; 35 - release chamber; 36 - insertion board slot; 37 - insertion board; 38 - channel; 80 - first electronic component; 81 - second electronic component. Detailed implementation manners

[0060] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0061] The first aspect of the present invention proposes a chip placer, which is characterized by including:

[0062] The applicator (30) is provided with a feed inlet (31); a discharge outlet (32) is arranged below the applicator (30); the feed inlet (31) is used to obtain electronic components, and the discharge outlet (32) is used to release electronic components;

[0063] A storage chamber (34) and a release chamber (35) are arranged inside the applicator (30);

[0064] The storage chamber (34) is communicated with the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31);

[0065] The discharge outlet (32) is arranged below the release chamber (35), and the release chamber (35) is communicated with the discharge outlet (32), so that the electronic components in the release chamber (35) can fall from the discharge outlet (32);

[0066] The storage chamber (34) and the release chamber (35) are communicated, so that the electronic components in the storage chamber (34) can be pushed into the release chamber (35);

[0067] The storage chamber (34) is provided with a plug slot (36), so that when a plug board (37) is inserted into the plug slot (36), the plug board (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

[0068] Further, the applicator is characterized in that it further includes:

[0069] The feed inlet (31) is arranged above the applicator (30), and the storage chamber (34) is arranged below the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

[0070] Further, the applicator is characterized in that it further includes:

[0071] A plug-in chamber (33) is arranged in the feed inlet (31) of the applicator (30).

[0072] The plug-in chamber (33) is used to plug the component packaging tube as described in the second aspect of the present invention. The connection is made by plugging, which is convenient for quick installation and disassembly, so as to facilitate the quick replacement of the component packaging tube.

[0073] Further, the applicator is characterized in that it further includes:

[0074] The storage chamber (34) and the release chamber (35) are connected via a channel (38), and a height H of the channel (38) is not greater than the height of two electronic components, so that when the plug board (37) is inserted into the plug board gap (36), the plug board (37) can only push one electronic component into the release chamber (35).

[0075] The following is a detailed example to introduce the working principle and working process of the patch device (30) according to the second aspect of the present invention. Please refer to Figures 8 - 10 :

[0076] First, a first electronic component (80) and a second electronic component (81) are placed from the feed port. Due to gravity, the first electronic component (80) falls into the storage chamber, and the second electronic component (81) is stacked on top of the first electronic component (80). Figure 8 As shown;

[0077] Then, the patch operation is performed: the plug board (37) is inserted into the plug board gap. At this time, the first electronic component (80) originally in the storage chamber is pushed into the release chamber by the plug board (37). Figure 9 As shown;

[0078] Then, due to the effect of gravity, the first electronic component (80) in the release chamber falls downward, falls out of the discharge port (32), and falls on the patch position of the PCB board placed on the platform, and the patch operation is now completed;

[0079] Next, the plug board (37) is removed, and then due to the effect of gravity, the second electronic component (81) falls into the storage chamber and waits to be pushed into the release chamber when the next patch operation is performed. Figure 10 As shown;

[0080] As an example, the first electronic component (80) and the second electronic component (81) are an integrally formed square chip inductor.

[0081] The chip mounter (30) can be applied to the chip mounter described in the third aspect of the present invention. Therefore, the structure, function, working principle, working process, etc. of the chip mounter (30) can be further understood by referring to the chip mounter described in the third aspect of the present invention.

[0082] A second aspect provides a component packaging tube, characterized in that it comprises:

[0083] The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52);

[0084] A detachable latch (51) is inserted between the storage area (54) and the insertion area (52);

[0085] An opening (53) is provided below the plug-in area (52) such that when the opening (53) faces downward, pulling out the plug (51) causes the electronic components stored in the storage area (54) to fall out from the opening (53).

[0086] The component packaging tube is used to store electronic components and is the packaging material for the electronic components; the plug (51) is used to block the electronic components stored in the storage area (54) so that they do not fall out from the opening (53).

[0087] The plug-in area (52) is used to be plugged into the feed inlet or the plug-in chamber of the chip mounter as described in the first aspect of the present application.

[0088] Usage method: Plug the plug-in area (52) of the component packaging tube (50) into the feed inlet of the chip mounter, and then pull out the plug (51). At this time, due to the action of gravity, the electronic components flow out from the opening (53) and then flow into the chip mounter, so as to supply the electronic components for chip mounting to the chip mounter.

[0089] A third aspect of the present invention proposes a chip mounter, which is characterized by including:

[0090] A platform (10), a supporter (20), and one or more chip mounters (30);

[0091] The chip mounter (30) is provided with a feed inlet (31); a discharge outlet (32) is provided below the chip mounter (30); the feed inlet (31) is used to obtain electronic components, and the discharge outlet (32) is used to release electronic components;

[0092] The supporter (20) is connected to the platform (10); the supporter (20) is connected to the chip mounter (30);

[0093] The supporter (20) is used to support the chip mounter (30) so that the chip mounter (30) is suspended above the platform (10) at a predetermined position and the discharge outlet (32) is vertically aligned with the chip mounting position, where the chip mounting position refers to the chip mounting position of the PCB board placed on the platform (10) during chip mounting.

[0094] The chip mounter (30) is used to release an electronic component when performing a chip mounting operation, so that the electronic component falls from the discharge outlet (32) and lands on the chip mounting position.

[0095] The electronic components enter the mounter (30) through the feeding port (31). When the chip mounting operation is performed, the electronic components are released from the discharging port (32) of the mounter (30) and fall on the chip mounting positions of the PCB board. When there are multiple chip components to be mounted on the PCB board, multiple mounters (30) can be installed on the same chip mounter, so that multiple electronic components can be mounted at one time, improving the chip mounting speed.

[0096] Further, a chip mounter is characterized in that it further comprises:

[0097] The mounter (30) is the mounter as described in the first aspect of the present invention.

[0098] Further, a chip mounter is characterized in that it further comprises:

[0099] A plug board (37); when the chip mounter is provided with multiple mounters, the multiple mounters share one plug board (37) as Figure 11 shown.

[0100] Since each mounter has a plug board, when there are multiple mounters, the workload of inserting and removing the plug board is very large; therefore, when multiple mounters share one plug board, the plug boards of multiple mounters can be inserted and removed at one time, thereby improving the efficiency and facilitating large-scale production. The plug board (37) can be an ordinary plastic board, iron board or stainless steel board, and users can make the plug board (37) by themselves, so it can also not be provided to customers.

[0101] Further, a chip mounter is characterized in that it further comprises:

[0102] A positioning device (11) is arranged on the platform (10) to limit the PCB board to a predetermined position, so that when chip mounting, the discharging port (32) can be quickly aligned with the chip mounting positions of the PCB board placed on the platform (10).

[0103] A fourth aspect of the present invention provides a chip mounter, which is characterized by comprising:

[0104] The component packaging tube as described in the second aspect of the present invention, the chip mounter as described in the third aspect of the present invention; the chip mounter is installed with the mounter as described in the first aspect of the present invention; the component packaging tube is inserted into the feeding port or the insertion chamber of the mounter. At this time, the component packaging tube becomes a part of the device and can be replaced.

[0105] The following details the usage method of the chip mounter proposed by the present invention, and the steps are as follows:

[0106] 1. Package the electronic components with the component packaging tube described in the second aspect of the present invention. Then, insert the insertion area (52) of the component packaging tube storing the electronic components into the insertion chamber (33) of the placement head (30) of the mounter. Then, pull out the pin (51) of the component packaging tube, so that the electronic components in the component packaging tube flow into the placement head (30) under the action of gravity. Thus, the loading (loading of electronic component materials) operation is completed;

[0107] 2. Place the PCB board printed with solder paste on the platform and limit it at a predetermined position through the positioning device (11), so that the discharge port of the placement head is vertically aligned with the placement position on the PCB board;

[0108] 3. Insert the insertion board into the insertion slot of the placement head. At this time, an electronic component falls from the discharge port of the placement head and lands on the placement position on the PCB board, and then is adhered to the placement position by the solder paste. Thus, the placement is completed; for the detailed working process of the placement head, please refer to the above introduction;

[0109] 4. Take out the insertion board from the insertion slot, take away the PCB board that has completed placement, and then return to step 2; when the electronic components in the component packaging tube are used up, pull out the component packaging tube, replace it with a new component packaging tube (the new component packaging contains electronic components), and then continue the placement work;

[0110] The empty component packaging tube can be used to reload electronic components and reused.

[0111] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims

1. A patch mounter, characterized in that: include: The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The patch mounter (30) is provided with a storage chamber (34) and a release chamber (35) inside; The storage chamber (34) is in communication with the feed port (31), so that the electronic components can enter the storage chamber (34) from the feed port (31); The discharge port (32) is arranged below the release chamber (35), and the release chamber (35) is in communication with the discharge port (32), so that the electronic components in the release chamber (35) can fall out of the discharge port (32); The storage chamber (34) and the release chamber (35) are in communication, so that the electronic component in the storage chamber (34) can be pushed into the release chamber (35); The storage chamber (34) is provided with an insertion plate gap (36), so that when an insertion plate (37) is inserted into the insertion plate gap (36), the insertion plate (37) pushes an electronic component in the storage chamber (34) into the release chamber (35).

2. A patch mounter as claimed in claim 1, characterized in that: Also includes: The feed inlet (31) is arranged above the chip mounter (30), and the storage chamber (34) is arranged below the feed inlet (31), so that electronic components can enter the storage chamber (34) from the feed inlet (31) under the action of gravity.

3. A patch device as claimed in claim 1 or 2, characterized in that: Also includes: An insertion chamber (33) is provided in the feed port (31) of the patch mounter (30).

4. A patch device as claimed in claim 1 or 2, characterized in that: Also includes: The storage chamber (34) and the release chamber (35) are connected via a channel (38), and a height H of the channel (38) is no greater than the height of the two electronic components.

5. A component packaging tube, characterized in that: include: The upper end of the component packaging tube (50) is a storage area (54), and the lower end is a plug-in area (52); A detachable latch (51) is inserted between the storage area (54) and the insertion area (52); An opening (53) is provided below the plug-in area (52), such that when the opening (53) faces downward, the latch (51) is pulled out and the electronic components stored in the storage area (54) fall out of the opening (53); The insertion area (52) is used for being inserted into a feed port or an insertion chamber of the mounter according to any one of claims 1 to 4.

6. A chip mounter, characterized in that: include: A platform (10), a support (20), and one or more patch mounters (30); The chip mounter (30) is provided with a feed port (31); a discharge port (32) is provided below the chip mounter (30); the feed port (31) is used to obtain electronic components, and the discharge port (32) is used to release electronic components; The support (20) is connected to the platform (10); the support (20) is connected to the patch mounter (30); The support (20) is used to support the chip mounter (30) so that the chip mounter (30) is suspended at a predetermined position above the platform (10), and the discharge port (32) is vertically aligned with a chip mounting position, wherein the chip mounting position refers to a chip mounting position of a PCB board placed on the platform (10) during chip mounting; The chip mounter (30) is used to release an electronic component when performing a chip mounting operation, so that the electronic component falls from the discharge port (32) and lands on the chip mounting position.

7. A chip mounter as claimed in claim 6, characterized in that: Also includes: The patch mounter (30) is the patch mounter according to any one of claims 1 to 4.

8. A chip mounter as claimed in claim 6, characterized in that: Also includes: An insert board (37); when the chip mounter is provided with a plurality of chip mounters, the plurality of chip mounters share one insert board (37).

9. A chip mounter according to any one of claims 6 to 8, characterized in that: Also includes: The platform (10) is provided with a positioning device (11) so as to limit the PCB board to a predetermined position.

10. A chip mounter, characterized in that: include: The component packaging tube according to claim 5, and the placement machine according to any one of claims 6 to 9; The chip mounter is installed with the chip mounter as described in any one of claims 1 to 4; the component packaging tube is inserted into the feed port or the insertion chamber of the chip mounter.

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