Photovoltaic welding strip cooling and annealing device

Abstract

The utility model relates to the technical field of photovoltaic welding strip processing, in particular to a photovoltaic welding strip cooling and annealing device which comprises an annealing heat preservation box, connecting plates are fixedly connected to the two sides of the annealing heat preservation box, and a scrap removing mechanism facilitating scrap removing and collecting on the surface of a welding strip is arranged in the annealing heat preservation box. The scrap removing bin is arranged in the annealing heat preservation box, the pull groove is formed in the inner wall of the scrap removing bin in a penetrating mode, the through groove is formed between the scrap removing bin and the annealing heat preservation box in a penetrating mode, the rotating ring is fixedly connected to the inner wall of the scrap removing bin, and the two rotating shafts are rotationally connected to the interior of the rotating ring. According to the photovoltaic welding strip cooling and annealing device, the first chip sweeping roller and the second chip sweeping roller are rotationally connected into the chip removing bin arranged at the rear end of the annealing and heat preservation box, the first chip sweeping roller and the second chip sweeping roller are connected with the transmission unit, and meanwhile the chip collecting drawer is arranged at the bottom, so that surface rotary sweeping treatment is conveniently conducted on a photovoltaic welding strip after heating and heat preservation are completed.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic solder ribbon processing, in particular to a photovoltaic solder ribbon cooling and annealing device. Background Technique

[0002] Photovoltaic solder ribbon, also known as tinned copper strip or tin-coated copper strip, is divided into bus bars and interconnection bars, and is widely used in the connection between battery cells of photovoltaic modules, playing an important role in conducting and collecting electricity. During the production and processing of photovoltaic solder ribbon, in order to meet the usage requirements in photovoltaic battery modules, it is necessary to anneal the photovoltaic solder ribbon to improve its physical and chemical properties.

[0003] The existing technology does not have a structure for removing chips after annealing and heat preservation of photovoltaic solder ribbon. When the existing photovoltaic solder ribbon is heated, it is necessary to temporarily place the solder ribbon in a heat preservation box for a period of time to make the internal temperature of the solder ribbon uniform. During the heating and heat preservation process of the solder ribbon, some chips will be generated on the surface of the solder ribbon. If they are not cleaned, it will affect subsequent processing. Based on the deficiencies of the existing technology, the utility model designs a photovoltaic solder ribbon cooling and annealing device. Content of the Utility Model

[0004] Aiming at the deficiencies of the existing technology, the utility model provides a photovoltaic solder ribbon cooling and annealing device, which has the advantage of removing chips after annealing and heat preservation of photovoltaic solder ribbon.

[0005] The utility model provides the following technical solution: a photovoltaic solder ribbon cooling and annealing device, including an annealing and heat preservation box, two sides of the annealing and heat preservation box are fixedly connected with connecting plates, and a chip removing mechanism for facilitating chip removal and collection on the surface of the solder ribbon is arranged inside the annealing and heat preservation box;

[0006] The chip removing mechanism includes a chip removing chamber, a pulling groove, a through groove, a rotating ring, a rotating shaft, a first chip sweeping roller, a second chip sweeping roller, a transmission unit, a chip collecting drawer and a handle. The chip removing chamber is arranged inside the annealing and heat preservation box. The pulling groove is penetrated and opened on the inner wall of the chip removing chamber. The through groove is penetrated and opened between the chip removing chamber and the annealing and heat preservation box. The rotating ring is fixedly connected to the inner wall of the chip removing chamber. Two rotating shafts are rotatably connected inside the rotating ring, and one end of the rotating shaft extends outwards through the annealing and heat preservation box. The first chip sweeping roller is fixedly connected to the upper rotating shaft, the second chip sweeping roller is fixedly connected to the lower rotating shaft, the transmission unit is fixedly connected to one side of the annealing and heat preservation box, the chip collecting drawer is slidably inserted inside the pulling groove, and the handle is fixedly connected to the outer side of the chip collecting drawer.

[0007] As a preferred technical solution of the utility model, the bottom of the annealing and heat preservation box is fixedly connected with a first support leg. Feed ports are penetrated and opened on both sides of the annealing and heat preservation box. A temperature controller is arranged on the top of the annealing and heat preservation box.

[0008] As a preferred technical solution of the present utility model, a first feeding belt is rotatably connected to the inner side of the connecting plate, a second feeding belt is rotatably connected to the inner side of the connecting plate, the other ends of the first feeding belt and the second feeding belt are connected to a second support leg, a gear set is installed on one side of the second support leg, and a motor is installed on the gear set.

[0009] As a preferred technical solution of the present utility model, the discharge port of the feed inlet communicates with the inner cavity of the chip removal chamber.

[0010] As a preferred technical solution of the present utility model, one ends of the first feeding belt and the second feeding belt penetrate through the second support leg and are connected to the output end of the gear set.

[0011] As a preferred technical solution of the present utility model, the output end of the motor is connected to the input end of the gear set.

[0012] As a preferred technical solution of the present utility model, the outer ends of the two rotating shafts are connected to the output end of the transmission unit.

[0013] As a preferred technical solution of the present utility model, the first chip sweeping roller and the second chip sweeping roller are rotatably connected inside the chip removal chamber, and the chip collecting drawer is arranged directly below the first chip sweeping roller and the second chip sweeping roller.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] In the photovoltaic ribbon cooling and annealing device, after the photovoltaic ribbon is insulated in the annealing insulation box and enters the chip removal chamber through the through groove, the working transmission unit drives the two rotating shafts to rotate under the support of the rotating ring, so that the first chip sweeping roller and the second chip sweeping roller start to work. When the photovoltaic ribbon passes between the first chip sweeping roller and the second chip sweeping roller, the rotating first chip sweeping roller and the second chip sweeping roller use the surface bristles to quickly clean the debris generated on the surface of the ribbon until a single ribbon is discharged from the feed inlet. At the same time, the brushed debris will fall on the bottom of the chip collecting drawer under the interception of the inner wall of the chip removal chamber. After the chip collecting drawer is full, hold the handle and pull out the chip collecting drawer from the pulling groove for cleaning. This device is convenient for cleaning the debris on the surface of the photovoltaic ribbon. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 It is a schematic diagram of the structure of the annealing insulation box of the present utility model;

[0018] Figure 3 It is a schematic diagram of the connection structure of the feeding belt of the present utility model;

[0019] Figure 4This is a schematic structural diagram of the chip removal mechanism of the utility model.

[0020] In the figure: 1. Annealing insulation box; 101. First support leg; 102. Feeding port; 103. Temperature controller; 2. Connecting plate; 201. First feeding belt; 202. Second feeding belt; 203. Second support leg; 204. Gear set; 205. Motor; 3. Chip removal mechanism; 301. Chip removal chamber; 302. Groove; 303. Through groove; 304. Rotating ring; 305. Rotating shaft; 306. First chip sweeping roller; 307. Second chip sweeping roller; 308. Transmission unit; 309. Chip collection drawer; 310. Handle. Specific implementation manners

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1-4 , a photovoltaic solder ribbon cooling and annealing device, including an annealing insulation box 1, two sides of the annealing insulation box 1 are fixedly connected with a connecting plate 2, an internal part of the annealing insulation box 1 is provided with a chip removal mechanism 3 for facilitating chip removal and collection on the surface of the solder ribbon, a bottom of the annealing insulation box 1 is fixedly connected with a first support leg 101, two sides of the annealing insulation box 1 are penetrated and provided with a feeding port 102, a top of the annealing insulation box 1 is provided with a temperature controller 103, and a discharging part of the feeding port 102 communicates with an inner cavity of the chip removal chamber 301.

[0023] Please refer to Figure 3 , an inner side of the connecting plate 2 is rotatably connected with a first feeding belt 201, the inner side of the connecting plate 2 is rotatably connected with a second feeding belt 202, the other ends of the first feeding belt 201 and the second feeding belt 202 are connected with a second support leg 203, a gear set 204 is installed on one side of the second support leg 203, a motor 205 is installed on the gear set 204, one ends of the first feeding belt 201 and the second feeding belt 202 penetrate through the second support leg 203 and are connected with an output end of the gear set 204, and an output end of the motor 205 is connected with an input end of the gear set 204.

[0024] Please refer to Figure 4, the chip removal mechanism 3, the chip removal mechanism 3 includes a chip removal chamber 301, a grooving 302, a through groove 303, a swivel ring 304, a rotating shaft 305, a first chip sweeping roller 306, a second chip sweeping roller 307, a transmission unit 308, a chip collection drawer 309 and a handle 310. The chip removal chamber 301 is arranged inside the annealing insulation box 1. The grooving 302 is penetrated and opened on the inner wall of the chip removal chamber 301. The through groove 303 is penetrated and opened between the chip removal chamber 301 and the annealing insulation box 1. The swivel ring 304 is fixedly connected to the inner wall of the chip removal chamber 301. Two rotating shafts 305 are rotatably connected inside the swivel ring 304, and one end of the rotating shaft 305 extends outwards through the annealing insulation box 1. The first chip sweeping roller 306 is fixedly connected to the upper rotating shaft 305. The second chip sweeping roller 307 is fixedly connected to the lower rotating shaft 305. The transmission unit 308 is fixedly connected to one side of the annealing insulation box 1. The chip collection drawer 309 is slidably inserted inside the grooving 302. The handle 310 is fixedly connected to the outside of the chip collection drawer 309. The outer ends of the two rotating shafts 305 are connected to the output end of the transmission unit 308. The first chip sweeping roller 306 and the second chip sweeping roller 307 are rotatably connected inside the chip removal chamber 301. The chip collection drawer 309 is arranged directly below the first chip sweeping roller 306 and the second chip sweeping roller 307.

[0025] By setting the first chip sweeping roller 306 and the second chip sweeping roller 307, it is convenient to remove the chips generated on the surface of the solder tape. By setting the swivel ring 304, the rotating shaft 305 and the transmission unit 308, it is convenient to drive the first chip sweeping roller 306 and the second chip sweeping roller 307 to rotate simultaneously, and sweep the upper and lower surfaces of the solder tape at the same time. By setting the grooving 302, the chip collection drawer 309 and the handle 310, it is convenient to collect the removed chips.

[0026] Working principle: When a photovoltaic solder tape cooling and annealing device is in use, in the initial state, first, a temperature controller 103 and a feeding port 102 are respectively arranged on the top and both sides of the annealing insulation box 1. A first feeding belt 201 and a second feeding belt 202 are connected to the connecting plates 2 fixedly installed at both ends of the annealing insulation box 1, and both are supported by the second support legs 203 and connected to the gear set 204 and the motor 205 at the same time, so as to drive the first feeding belt 201 and the second feeding belt 202 to rotate and convey the long strip photovoltaic solder tape into the annealing insulation box 1 for heat preservation treatment. And in the chip removal chamber 301 arranged at the rear end of the annealing insulation box 1, a first chip sweeping roller 306 and a second chip sweeping roller 307 are rotatably connected. The first chip sweeping roller 306 and the second chip sweeping roller 307 are connected to the transmission unit 308 and a chip collection drawer 309 is arranged at the bottom at the same time, so as to perform surface sweeping treatment on the photovoltaic solder tape after heating and heat preservation;

[0027] When it is necessary to clean the debris on the surface of the photovoltaic solder strip, first, after the photovoltaic solder strip in the annealing insulation box 1 finishes heat preservation and enters the chip removal chamber 301 through the through groove 303, the working transmission unit 308 will drive the two rotating shafts 305 to rotate under the support of the rotating ring 304, so that the first chip sweeping roller 306 and the second chip sweeping roller 307 start to work. When the photovoltaic solder strip passes between the first chip sweeping roller 306 and the second chip sweeping roller 307, the rotating first chip sweeping roller 306 and the second chip sweeping roller 307 will quickly clean the debris generated on the surface of the solder strip with the surface bristles until a single solder strip is discharged from the feed port 102. At the same time, the brushed debris will fall on the bottom of the chip collection drawer 309 under the interception of the inner wall of the chip removal chamber 301. After the chip collection drawer 309 is full, hold the handle 310 and pull out the chip collection drawer 309 from the pulling groove 302 for cleaning. This device is convenient for cleaning the debris on the surface of the photovoltaic solder strip.

[0028] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A photovoltaic welding ribbon cooling annealing device, comprising an annealing insulation box (1), characterized in that: Connecting plates (2) are fixedly connected to both sides of the annealing and heat preservation box (1), and a chip removal mechanism (3) is provided inside the annealing and heat preservation box (1) for facilitating chip removal and collection on the surface of the welding strip; A chip removal mechanism (3), the chip removal mechanism (3) comprising a chip removal chamber (301), a pull groove (302), a through groove (303), a rotating ring (304), a rotating shaft (305), a first chip sweeping roller (306), a second chip sweeping roller (307), a transmission unit (308), a chip collecting drawer (309) and a handle (310), the chip removal chamber (301) being arranged inside the annealing and heat preservation box (1), the pull groove (302) penetrating through the inner wall of the chip removal chamber (301), the through groove (303) penetrating through the chip removal chamber (301) and the annealing and heat preservation box (1), the rotating ring (304) being fixed The two rotating shafts (305) are rotatably connected to the inside of the rotating ring (304), and one end of the rotating shaft (305) extends outward through the annealing and heat preservation box (1). The first chip sweeping roller (306) is fixedly connected to the upper rotating shaft (305), and the second chip sweeping roller (307) is fixedly connected to the lower rotating shaft (305). The transmission unit (308) is fixedly connected to one side of the annealing and heat preservation box (1). The chip collecting drawer (309) is slidably inserted into the inside of the pull groove (302), and the handle (310) is fixedly connected to the outside of the chip collecting drawer (309).

2. A photovoltaic welding strip cooling annealing device according to claim 1, characterized in that: The bottom of the annealing and heat preservation box (1) is fixedly connected to a first supporting leg (101), both sides of the annealing and heat preservation box (1) are provided with feed openings (102), and the top of the annealing and heat preservation box (1) is provided with a temperature controller (103).

3. A photovoltaic welding strip cooling annealing device according to claim 1, characterized in that: The inner side of the connecting plate (2) is rotatably connected to a first feeding belt (201), and the inner side of the connecting plate (2) is rotatably connected to a second feeding belt (202); the other ends of the first feeding belt (201) and the second feeding belt (202) are connected to a second supporting leg (203); a gear set (204) is installed on one side of the second supporting leg (203); and a motor (205) is installed on the gear set (204).

4. A photovoltaic welding strip cooling annealing device according to claim 2, characterized in that: The discharge port of the feed port (102) is in communication with the inner cavity of the chip removal chamber (301).

5. A photovoltaic welding strip cooling annealing device according to claim 3, characterized in that: One end of the first feeding belt (201) and the second feeding belt (202) passes through the second supporting leg (203) and is connected to the output end of the gear set (204).

6. A photovoltaic welding strip cooling annealing device according to claim 3, characterized in that: The output end of the motor (205) is connected to the input end of the gear set (204).

7. A photovoltaic welding strip cooling annealing device according to claim 1, characterized in that: The outer ends of the two rotating shafts (305) are connected to the output end of the transmission unit (308).

8. A photovoltaic welding ribbon cooling annealing device according to claim 1, characterized in that: The first chip sweeping roller (306) and the second chip sweeping roller (307) are rotatably connected inside the chip removal chamber (301), and the chip collecting bin (309) is arranged directly below the first chip sweeping roller (306) and the second chip sweeping roller (307).

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