Pin ring crystal cleaning device and polishing machine table

Abstract

The utility model provides a pin ring crystal cleaning device and a polishing machine table. The pin ring crystal cleaning device comprises a cleaning cylinder, a cleaning unit and a driving unit. The cleaning unit comprises a plurality of cleaning tanks, and the cleaning tanks are filled with different cleaning solutions; the cleaning cylinder is used for containing a plurality of pin rings to be cleaned, through holes are formed in the side wall of the cleaning cylinder, and cleaning liquid flows into or out of the cleaning cylinder in the cleaning process through the through holes; the driving unit is connected with the cleaning cylinder and used for driving the cleaning cylinder to move among the different cleaning tanks, driving the cleaning cylinder to move in the direction close to or away from the cleaning tanks in the cleaning process and meanwhile driving the cleaning cylinder to rotate around a shaft. According to the configuration, the cleaning barrel capable of containing the multiple pin rings and the multiple cleaning tanks with different cleaning solutions are arranged, the driving unit is used for driving the cleaning barrel to move among the different cleaning tanks, crystals on the multiple pin rings are rapidly cleaned, the cleaning efficiency is improved, and the labor cost and the time cost are reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a pin ring crystallization cleaning device and a polishing machine. Background Art

[0002] In the process of semiconductor silicon wafer polishing and manufacturing, the polishing liquid used in a double-sided polishing machine contains a large amount of silicon dioxide particles, which are extremely likely to produce dry and hard white crystals attached to the surface of the polishing machine. During the daily maintenance of the polishing machine, the crystallization of the drive pin rings of the planetary wheels is particularly serious, and the cleaning is extremely time-consuming, laborious and difficult. During maintenance and cleaning, there are more than four hundred pin rings on each polishing machine that need to be cleaned. At present, it is necessary to use a blade to scrape and remove the crystals one by one, which is difficult and time-consuming to clean, and seriously affects the production efficiency of the semiconductor manufacturing process.

[0003] Based on this, how to quickly clean the crystals on a large number of pin rings has become a technical problem that needs to be solved by those skilled in the art. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a pin ring crystallization cleaning device and a polishing machine to solve the problem in the prior art that a large number of pin rings cannot be quickly cleaned, which affects the production efficiency of the semiconductor manufacturing process.

[0005] To achieve the above purpose, the utility model provides a pin ring crystallization cleaning device, including: a cleaning cylinder, a cleaning unit and a driving unit;

[0006] The cleaning unit includes a plurality of cleaning tanks filled with different cleaning liquids;

[0007] The cleaning cylinder is used to accommodate a plurality of pin rings to be cleaned. Through holes are provided on the side wall of the cleaning cylinder, and the through holes are used for the cleaning liquid to flow into or out of the cleaning cylinder during the cleaning process;

[0008] The driving unit is connected to the cleaning cylinder and is used to drive the cleaning cylinder to move between different cleaning tanks, and during the cleaning process, drive the cleaning cylinder to move in a direction close to or away from the cleaning tank, and at the same time drive the cleaning cylinder to rotate around its axis.

[0009] Optionally, the through holes cover each side wall of the cleaning cylinder, and the diameter of the through holes is smaller than the diameter of the pin ring.

[0010] Optionally, the cleaning unit includes a first cleaning tank, a first liquid supply pipeline and a second liquid supply pipeline;

[0011] The liquid outlet ends of the first liquid supply pipeline and the second liquid supply pipeline both extend into the first cleaning tank. The first liquid supply pipeline is used to supply an alkaline solution to the first cleaning tank, and the second liquid supply pipeline is used to supply ultrapure water to the first cleaning tank.

[0012] Optionally, the cleaning unit further includes a pH detector which extends below the liquid level of the cleaning liquid in the first cleaning tank and is used to detect the pH value of the cleaning liquid in the first cleaning tank.

[0013] Optionally, the cleaning unit includes a second cleaning tank and a third liquid supply pipeline;

[0014] The liquid outlet end of the third liquid supply pipeline extends into the second cleaning tank, and the third liquid supply pipeline is used to supply ultrapure water to the second cleaning tank.

[0015] Optionally, the cleaning unit further includes a heating device which is arranged in the second cleaning tank and immersed in the cleaning liquid in the second cleaning tank for heating the cleaning liquid in the second cleaning tank.

[0016] Optionally, the cleaning unit further includes a temperature sensor which extends below the liquid level of the cleaning liquid in the second cleaning tank for obtaining the temperature of the cleaning liquid in the second cleaning tank.

[0017] Optionally, the pin ring crystallization cleaning device further includes a drying unit;

[0018] The drying unit is located on one side of the cleaning tank and away from the cleaning liquid in the cleaning tank, and is used to dry the pin rings in the cleaning cylinder after the cleaning cylinder finishes cleaning.

[0019] Optionally, the driving unit includes a lead screw, a motor and a slide rail;

[0020] A plurality of the cleaning tanks are arranged at intervals along the extending direction of the slide rail. The lead screw is connected to the cleaning cylinder, and the motor is used to drive the lead screw to move and / or rotate around its axis.

[0021] To achieve the above object, the present utility model further provides a polishing machine table, including: a machine table body, a polishing fixture and the pin ring crystallization cleaning device as described above;

[0022] The polishing fixture is arranged on the machine table body, and the polishing fixture has pin rings;

[0023] The pin ring crystallization cleaning device is used to clean the pin rings on the polishing fixture when the machine table body is under maintenance.

[0024] Compared with the existing pin-ring crystallization cleaning method, the pin-ring crystallization cleaning device and polishing machine provided in this application have the following advantages:

[0025] The pin-ring crystallization cleaning device provided in this application includes a cleaning cylinder capable of accommodating multiple pin-rings and multiple cleaning tanks with different cleaning liquids. A driving unit is used to drive the cleaning cylinder to move between different cleaning tanks, so as to quickly clean the crystallization on multiple pin-rings. Compared with the existing cleaning method that requires manual scraping of the crystallization, the cleaning efficiency is improved, the labor cost and time cost are reduced, and thus the production efficiency of the semiconductor manufacturing process is improved. Description of the Drawings

[0026] Figure 1 It is a schematic structural diagram of the pin-ring crystallization cleaning device provided by an embodiment of the present invention;

[0027] Figure 2 It is a flowchart of the cleaning method of the pin-ring crystallization cleaning device provided by an embodiment of the present invention;

[0028] Among them, the descriptions of the reference numerals are as follows:

[0029] 10 - cleaning cylinder; 100 - through hole;

[0030] 20 - cleaning unit; 200 - first cleaning tank; 201 - first liquid supply pipeline; 202 - second liquid supply pipeline; 203 - pH value detector; 204 - second cleaning tank; 205 - third liquid supply pipeline; 206 - heating device; 207 - temperature sensor;

[0031] 30 - driving unit; 300 - lead screw; 301 - slide rail;

[0032] 40 - drying unit. Detailed Embodiments

[0033] To make the objectives, advantages and features of the present invention clearer, the following further describes the present invention in detail with reference to the drawings and specific embodiments. It should be noted that the drawings are in a very simplified form and not drawn to scale, only for facilitating and clearly assisting in explaining the objectives of the embodiments of the present invention. In addition, the structures shown in the drawings are often part of the actual structures. In particular, the emphasis to be shown in each drawing is different, and sometimes different scales are used.

[0034] As used in this specification, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally used in the sense of including "and / or", the term "several" is generally used in the sense of including "at least one", the term "at least two" is generally used in the sense of including "two or more". In addition, the terms "first", "second", "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", "third" may explicitly or implicitly include one or at least two of such features. "One end" and "the other end", as well as "proximal end" and "distal end" generally refer to two corresponding parts, which include not only the endpoints. The terms "mounted", "connected", "coupled" shall be construed broadly. For example, it may be a fixed connection, a detachable connection, or integral; it may be directly connected or indirectly connected through an intermediate medium, and may be the internal communication of two components or the interaction relationship between two components. In addition, as used in this specification, one component being disposed on another component generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two components, and the two components may be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate component, and should not be construed as indicating or implying the spatial position relationship between the two components, that is, one component may be inside, outside, above, below or on one side of the other component in any orientation, unless otherwise expressly specified in the content. The terms "upper", "lower", "top", "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction along the gravity direction, which is generally perpendicular to the ground, and the "horizontal, horizontal plane direction" is generally along the direction parallel to the ground; for those of ordinary skill in the art, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0035] The object of the present utility model is to provide a pin ring crystallization cleaning device and a polishing machine table to solve the problem in the prior art that a large number of pin rings cannot be quickly cleaned, which affects the production efficiency of the semiconductor manufacturing process.

[0036] Those skilled in the art can understand that polishing is an important process in wafer processing. Mechanical chemical polishing can obtain a surface without a processed deteriorated layer. Under high-speed and high-pressure polishing conditions, a closed polishing agent layer is formed between the polishing pad and the wafer. At the same time, a soft hydrated film is formed on the wafer surface. The polishing pad polishes the wafer by continuously removing the hydrated film. During the polishing process, an aqueous solution of weakly alkaline colloidal SiO2 (particle size about 10 nm) is usually used as the polishing liquid, which is prone to produce more crystals attached to the polishing machine table, especially on the drive pin ring of the polishing fixture (i.e., the planetary wheel). In the prior art, there is no device for cleaning the pin ring. Therefore, it is necessary for the operator to manually scrape the crystals, which is time-consuming and laborious and seriously reduces the production efficiency. Based on this, this embodiment provides a pin ring crystal cleaning device and a polishing machine table. By adding a drive unit, a cleaning unit, and a cleaning cylinder, the crystals that originally needed to be manually scraped can also be quickly cleaned in large quantities, improving the maintenance efficiency of the polishing machine table and thus improving the production efficiency of the wafer.

[0037] Please refer to Figure 1 , the present utility model provides a pin ring crystal cleaning device, including: a cleaning cylinder 10, a cleaning unit 20, and a drive unit 30; the cleaning unit 20 includes a plurality of cleaning tanks filled with different cleaning liquids; the cleaning cylinder 10 is used to accommodate a plurality of pins to be cleaned (not shown in the figure). A through hole 100 is provided on the side wall of the cleaning cylinder 10 for the cleaning liquid to flow into or out of the cleaning cylinder 10 during the cleaning process; the drive unit 30 is connected to the cleaning cylinder 10 for driving the cleaning cylinder 10 to move between different cleaning tanks, and during the cleaning process, driving the cleaning cylinder 10 to move in a direction close to or away from the cleaning tank, and at the same time driving the cleaning cylinder 10 to rotate around its axis. It should be noted that, in Figure 1 the illustrated exemplary example, the number of cleaning tanks is two, which are respectively filled with an alkaline solution and ultrapure water. In this embodiment, the alkaline solution is a potassium hydroxide (KOH) solution. Those skilled in the art can understand that ultrapure water refers to water in which almost all the conductive media in the water are removed, and the colloidal substances, gases, and organic substances that do not dissociate in the water are also removed to a very low contrast. Ultrapure water can be used as water for various high-end precision instruments. In this embodiment, the side wall of the cleaning cylinder 10 is covered with through holes 100, and the diameter of the through holes 100 is 3 cm to 10 cm. The cleaning cylinder 10 is a cylindrical member, and through holes 100 can be covered on both its bottom wall and side wall to increase the liquid inflow of the through holes 100, so as to realize the cleaning of the crystals on the pin ring. In some other embodiments, the through holes 100 can also be only provided on a part of the bottom wall or side wall of the cleaning cylinder 10, and those skilled in the art can configure this according to the actual situation. At the same time, during the cleaning process, the cleaning cylinder 10 needs to move in the up and down direction (such as Figure 1reciprocates and rotates around its axis simultaneously as shown in the figure, so as to achieve the flushing effect of the cleaning liquid on the pin ring, thereby ensuring a good cleaning effect. The reciprocating rate of the cleaning cylinder 10 up and down is proportional to the rotation rate around its axis. Those skilled in the art can adjust the movement rate of the cleaning cylinder 10 according to the actual situation.

[0038] It should be noted that by providing the cleaning cylinder 10 capable of accommodating multiple pin rings and multiple cleaning tanks with different cleaning liquids, and using the driving unit 30 to drive the cleaning cylinder 10 to move between different cleaning tanks, the rapid cleaning of the crystals on multiple pin rings can be achieved. Compared with the existing cleaning method that requires manual scraping of the crystals, the cleaning efficiency is improved, the labor cost and time cost are reduced, and thus the production efficiency of the semiconductor manufacturing process is improved.

[0039] As an optional embodiment, through holes 100 are distributed on each side wall of the cleaning cylinder 10, and the diameter of the through holes 100 is smaller than the diameter of the pin ring. It should be noted that since the cleaning cylinder 10 is in an open cylindrical shape (i.e., the cleaning cylinder 10 has no top surface), the side wall of the cleaning cylinder 10 is an arc surface. The fact that the through holes 100 are distributed on the side wall of the cleaning cylinder 10 can be understood as that the through holes 100 are evenly arranged on the side wall with a distance left between two adjacent through holes 100, or it can also be understood as that the through holes 100 are arranged irregularly on the side wall with a distance left between two adjacent through holes 100. In some other embodiments, the cleaning cylinder 10 can also be in the shape of a cuboid, a frustum of a cone or other irregular shapes, and this embodiment does not limit this.

[0040] Please continue to refer to Figure 1, the cleaning unit 20 includes a first cleaning tank 200, a first liquid supply pipeline 201, and a second liquid supply pipeline 202; the liquid outlet ends of the first liquid supply pipeline 201 and the second liquid supply pipeline 202 both extend into the first cleaning tank 200. The first liquid supply pipeline 201 is used to supply an alkaline solution to the first cleaning tank 200, and the second liquid supply pipeline 202 is used to supply ultrapure water to the first cleaning tank 200. Further, the cleaning unit 20 further includes a pH detector 203, and the pH detector 203 extends below the liquid level of the cleaning liquid in the first cleaning tank 200 for detecting the pH value of the cleaning liquid in the first cleaning tank 200. In this embodiment, a strong alkaline reagent (a mixed reagent of an alkaline solution and ultrapure water) is provided in the first cleaning tank 200, and it is necessary to ensure that its pH value is within the range of 13 to 14. Therefore, a pH detector 203 is also provided in the first cleaning tank 200, and the probe of the pH detector 203 is extended below the liquid level of the cleaning liquid in the first cleaning tank 200 to obtain the pH value of the cleaning liquid in real time, and based on the detection result of the pH value, control the flow rates of the first liquid supply pipeline 201 and the second liquid supply pipeline 202. At the same time, during the process of cleaning the pin ring in the first cleaning tank 200, it is necessary to soak first and then rinse. During the soaking process, only the driving unit 30 needs to drive the cleaning cylinder 10 to move towards the first cleaning tank 200 until the pin ring in the cleaning cylinder 10 is completely immersed in the cleaning liquid and remains stationary; while during the rinsing process, the driving unit 30 needs to drive the cleaning cylinder 10 to reciprocate in the direction close to or away from the first cleaning tank 200 and rotate around the axis at the same time, so that the cleaning liquid in the first cleaning tank 200 can be disturbed by the movement of the cleaning cylinder 10, thereby generating a certain impact force to realize the scouring of the crystals on the pin ring. In addition, the liquid inlet ends of the first liquid supply pipeline 201 and the second liquid supply pipeline 202 should be respectively connected to the corresponding liquid storage devices, and at the same time, a motor should be configured to realize the circulation of the alkaline solution and ultrapure water in their respective liquid supply pipelines.

[0041] Please continue to refer to Figure 1, the cleaning unit 20 includes a second cleaning tank 204 and a third liquid supply pipeline 205; the liquid outlet end of the third liquid supply pipeline 205 extends into the second cleaning tank 204, and the third liquid supply pipeline 205 is used to supply ultrapure water to the second cleaning tank 204. Further, the cleaning unit 20 further includes a heating device 206, the heating device 206 is arranged in the second cleaning tank 204 and immersed in the cleaning liquid in the second cleaning tank 204, and is used to heat the cleaning liquid in the second cleaning tank 204. Even further, the cleaning unit 20 further includes a temperature sensor 207, the temperature sensor 207 extends below the liquid level of the cleaning liquid in the second cleaning tank 204, and is used to obtain the temperature of the cleaning liquid in the second cleaning tank 204. In this embodiment, ultrapure water is provided in the second cleaning tank 204, and it is necessary to ensure that its temperature is within the range of 70°C to 80°C. Therefore, a heating device 206 and a temperature sensor 207 are also provided in the second cleaning tank 204. The heating device 206 can be a plate heater, which is used to heat the ultrapure water in the second cleaning tank 204. The temperature sensor 207 is used to monitor the temperature of the ultrapure water in the second cleaning tank 204 in real time, and based on the temperature data, control the power of the heating device 206 to ensure that the temperature is always within the temperature range. At the same time, during the process of cleaning the pin ring in the second cleaning tank 204, it is necessary to rinse it in ultrapure water. Therefore, when the driving unit 30 drives the cleaning cylinder 10 to move from the first cleaning tank 200 to the second cleaning tank 204, the cleaning cylinder 10 can be driven to reciprocate in a direction close to or away from the second cleaning tank 204, and at the same time rotate around the axis, so that the cleaning liquid in the second cleaning tank 204 can be disturbed by the movement of the cleaning cylinder 10, thereby generating a certain impact force to achieve the flushing of the pin ring. In addition, the liquid inlet end of the third liquid supply pipeline 205 should be connected to the corresponding liquid storage device, and a motor should be configured to realize the circulation of ultrapure water in the liquid supply pipeline.

[0042] As an alternative embodiment, please refer to Figure 1, the pin ring crystallization cleaning device further includes a drying unit 40; the drying unit 40 is located on one side of the cleaning tank and away from the cleaning liquid in the cleaning tank. The drying unit 40 is used to dry the pin rings in the cleaning cylinder 10 after the cleaning cylinder 10 finishes cleaning. It should be noted that the drying unit 40 can be an air knife, which can blow hot air to the object to be dried to evaporate the liquid on the surface of the object to be dried, thereby achieving drying. In this embodiment, the drying unit 40 is located above the second cleaning tank 204. When the driving unit 30 finishes flushing in the second cleaning tank 204, it can directly move in the direction away from the second cleaning tank 204 and move to a position flush with the drying unit 40. At this time, the drying unit 40 is driven to dry the cleaned pin rings. The hot air blown out by the drying unit 40 enters the cleaning cylinder 10 through the through holes 100 on the side wall of the cleaning cylinder 10 to achieve drying of the surface of the pin rings. In some other embodiments, the drying unit 40 can also be separately arranged near the cleaning unit 20. After the pin rings are cleaned by the driving unit 30, the cleaning cylinder 10 can be separately moved to the drying unit 40. Those skilled in the art can configure this according to the actual situation.

[0043] In an alternative embodiment, the driving unit 30 includes a lead screw 300, a motor (not shown in the figure), and a slide rail 301; a plurality of cleaning tanks are arranged at intervals along the extension direction of the slide rail 301. The lead screw 300 is connected to the cleaning cylinder 10, and the motor is used to drive the lead screw 300 to move and / or rotate around its axis. It should be noted that the lead screw 300 can be connected to the bottom wall of the cleaning cylinder 10. The motor can control the moving direction of the lead screw 300 by forward and reverse rotation. At the same time, the moving speed of the lead screw 300 is proportional to the rotation speed, that is, the faster the lead screw 300 moves in the direction of approaching or leaving the cleaning tank, the faster its rotation speed around its axis. The motor drives the lead screw 300 to move and rotate, thereby driving the movement and rotation of the cleaning cylinder 10 until the entire cleaning process is completed.

[0044] The following combines Figure 1 to Figure 2 , and further illustrates the usage method of the pin ring crystallization cleaning device.

[0045] An alkaline solution and ultrapure water are respectively supplied to the first cleaning tank 200 through the first liquid supply pipeline 201 and the second liquid supply pipeline 202, and the pH value of the mixed solvent is monitored based on the pH detector 203 until its pH value is stabilized between 13 and 14; the driving unit 30 drives the cleaning cylinder 10 to move in the direction approaching the first cleaning tank 200 until all the pin rings in the cleaning cylinder 10 are immersed in the cleaning liquid of the first cleaning tank 200 and soaked for 15 minutes; then the driving unit 30 drives the cleaning cylinder 10 along Figure 1reciprocally move in the vertical direction and rotate around the axis to realize the flushing of the pin ring, and this process lasts for 15 minutes; during this period, ultrapure water can be supplied to the second cleaning tank 204 through the third liquid supply pipeline 205, and the ultrapure water is heated by the heating device 206. Based on the water temperature measured in real time by the temperature sensor 207, the power of the heating device 206 is controlled until the water temperature is maintained between 70 °C and 80 °C; after the first cleaning tank 200 finishes flushing the pin ring, the cleaning cylinder 10 is moved from the first cleaning tank 200 to the second cleaning tank 204 by the driving unit 30, and then the driving unit 30 drives the cleaning cylinder 10 to reciprocally move in the vertical direction along Figure 1 the vertical direction in it and rotate around the axis, so that the pin ring is rinsed in ultrapure water for another 10 minutes; after completing the above steps, the cleaning cylinder 10 is moved by the driving unit 30 along the direction away from the second cleaning tank 204 to a position flush with the drying unit 40, and the drying unit 40 is used to dry the cleaned pin ring for 5 minutes. Then a cleaning process is completed. In case of too many pin rings, the above steps can be repeated multiple times to clean the crystallization of the pin ring.

[0046] In another embodiment, the present invention also provides a polishing machine table, including: a machine table body (not shown in the figure), a polishing fixture (not shown in the figure), and the pin ring crystallization cleaning device as described above; the polishing fixture is arranged on the machine table body, and there is a pin ring on the polishing fixture; the pin ring crystallization cleaning device is used to clean the pin ring on the polishing fixture when the machine table body is being maintained. Those skilled in the art can understand that the polishing fixture is a planetary wheel, which is a fixture for various planar polishing processes, and has characteristics such as stable electrical insulation performance, good flatness, smooth surface, no pits, and standard thickness tolerance, and is suitable for products with high-performance electronic insulation requirements. And the pin ring on the planetary wheel is one of the most severely crystallized parts, and it is necessary to focus on cleaning the crystallization on the pin ring when the polishing machine table is being maintained. With such a configuration, after using the above-mentioned pin ring crystallization cleaning device, the maintenance efficiency of the polishing machine table can be effectively improved, the human and material resources can be reduced, and at the same time, the downtime of the polishing machine table can be reduced, further improving the efficiency of silicon wafer polishing and thus improving the production capacity.

[0047] In summary, in the pin ring crystallization cleaning device and the polishing machine table provided by the embodiments of the present invention, the pin ring crystallization cleaning device includes: a cleaning cylinder, a cleaning unit, and a driving unit; the cleaning unit includes a plurality of cleaning tanks, and different cleaning liquids are filled in the cleaning tanks; the cleaning cylinder is used to accommodate a plurality of pin rings to be cleaned, and through holes are provided on the side wall of the cleaning cylinder, and the through holes are used for the cleaning liquid to flow into or out of the cleaning cylinder during the cleaning process; the driving unit is connected to the cleaning cylinder and is used to drive the cleaning cylinder to move between different cleaning tanks, and during the cleaning process, drive the cleaning cylinder to move in the direction close to or away from the cleaning tank, and at the same time drive the cleaning cylinder to rotate around the axis.

[0048] Configured in this way, by setting a cleaning cylinder capable of accommodating multiple pin rings and multiple cleaning tanks with different cleaning liquids, and using a driving unit to drive the cleaning cylinder to move between different cleaning tanks, the crystallization on multiple pin rings can be quickly cleaned. Compared with the existing cleaning method that requires manual scraping of crystallization, the cleaning efficiency is improved, the labor cost and time cost are reduced, and thus the production efficiency of the semiconductor manufacturing process is improved.

[0049] The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. Any changes and modifications made by those of ordinary skill in the field of the present invention according to the above disclosure are within the scope of protection of the claims.

Claims

1. A pin ring crystal cleaning device, characterized in that: include: A cleaning cylinder, a cleaning unit and a driving unit; The cleaning unit comprises a plurality of cleaning tanks, wherein the cleaning tanks are filled with different cleaning liquids; The cleaning cylinder is used to accommodate a plurality of pin rings to be cleaned, and a through hole is provided on the side wall of the cleaning cylinder, and the through hole is used for the cleaning liquid to flow into or out of the cleaning cylinder during the cleaning process; The driving unit is connected to the cleaning cylinder and is used to drive the cleaning cylinder to move between different cleaning tanks. During the cleaning process, the driving unit drives the cleaning cylinder to move in a direction close to or away from the cleaning tank, and drives the cleaning cylinder to rotate around its axis.

2. The pin ring crystal cleaning device according to claim 1, characterized in that: The through holes are distributed on each side wall of the cleaning cylinder, and the diameter of the through holes is smaller than the diameter of the pin ring.

3. The pin ring crystal cleaning device according to claim 1, characterized in that: The cleaning unit comprises a first cleaning tank, a first liquid supply pipeline and a second liquid supply pipeline; The liquid outlet end of the first liquid supply pipeline and the liquid outlet end of the second liquid supply pipeline both extend into the first cleaning tank. The first liquid supply pipeline is used to provide alkaline solution to the first cleaning tank, and the second liquid supply pipeline is used to provide ultrapure water to the first cleaning tank.

4. The pin ring crystal cleaning device according to claim 3, characterized in that: The cleaning unit further includes a pH value detector, which extends below the liquid level of the cleaning liquid in the first cleaning tank and is used to detect the pH value of the cleaning liquid in the first cleaning tank.

5. The pin ring crystal cleaning device according to claim 1, characterized in that: The cleaning unit includes a second cleaning tank and a third liquid supply pipeline; The liquid outlet end of the third liquid supply pipeline extends into the second cleaning tank, and the third liquid supply pipeline is used to provide ultrapure water to the second cleaning tank.

6. The pin ring crystal cleaning device according to claim 5, characterized in that: The cleaning unit further includes a heating device, which is disposed in the second cleaning tank and immersed in the cleaning liquid in the second cleaning tank, and is used to heat the cleaning liquid in the second cleaning tank.

7. The pin ring crystal cleaning device according to claim 5, characterized in that: The cleaning unit further includes a temperature sensor, which extends below the liquid level of the cleaning liquid in the second cleaning tank and is used to obtain the temperature of the cleaning liquid in the second cleaning tank.

8. The pin ring crystal cleaning device according to claim 1, characterized in that: The pin ring crystal cleaning device also includes a drying unit; The drying unit is located at one side of the cleaning tank and away from the cleaning liquid in the cleaning tank. The drying unit is used to dry the pin ring in the cleaning cylinder after the cleaning cylinder completes cleaning.

9. The pin ring crystal cleaning device according to claim 1, characterized in that: The driving unit includes a lead screw, a motor and a slide rail; The plurality of cleaning grooves are arranged at intervals along the extension direction of the slide rail, the lead screw is connected to the cleaning cylinder, and the motor is used to drive the lead screw to move and / or rotate around its axis.

10. A polishing machine, characterized in that: include: A machine body, a polishing jig, and a pin ring crystal cleaning device as claimed in any one of claims 1 to 9; The polishing jig is arranged on the machine body, and the polishing jig is provided with a pin ring; The pin ring crystal cleaning device is used to clean the pin ring on the polishing jig when the machine body is maintained.

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