Ultrasonic cleaning jig for SLD assembly
By designing an ultrasonic cleaning fixture with several grooves on the carrier plate, the problem of collision and friction damage of SLD components during ultrasonic cleaning is solved, achieving efficient, comprehensive cleaning and convenient operation.
Patent Information
- Application Number
- CN202421463073.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-06-25
AI Technical Summary
During the ultrasonic cleaning process of ultra-radiation light emitting diodes (SLDs), SLD components are prone to collide and rub against each other, causing damage. In addition, the traditional ultrasonic cleaning method is inconvenient to operate and has low cleaning efficiency.
An ultrasonic cleaning fixture for SLD components is designed. Several grooves are opened on the carrier plate for placing the SLD components. A gap is reserved between the inner wall of the groove and the outer wall of the SLD component to allow slight movement to allow for cleaning fluid to penetrate. A leak hole is provided on the bottom of the groove for comprehensive cleaning. A hanging rod and hook are provided on the side of the carrier plate to reduce the intensity of labor.
Through this ultrasonic cleaning tool, multiple SLD components can be cleaned simultaneously, avoid collision and friction damage, improve cleaning efficiency and cleanliness, and reduce manual labor intensity.
Smart Images
Figure CN222985113U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of superluminescent diode manufacturing, and particularly relates to an ultrasonic cleaning jig for SLD components. Background Art
[0002] Superluminescent diodes (SLDs) have developed rapidly in recent years. It is a semiconductor optoelectronic device between a laser diode (LD) and a light-emitting diode (LED), with characteristics such as high output power and wide spectral width, and is suitable for applications such as optical coherence tomography (OCT) imaging systems and fiber optic gyroscopes (FOGs).
[0003] In the production process of superluminescent diodes (SLDs), assembling the bottom components (including the thermal layer and the transition block) is the first step of production, and the cleanliness of the bottom components directly affects subsequent production work. In the production process of superluminescent diodes (SLDs), after the thermal layer and the transition block are assembled, ultrasonic cleaning is carried out to remove dirt and other attachments on the surface to ensure the cleanliness of the SLD components, and the cleanliness of the SLD components directly affects the welding quality of the SLD chips.
[0004] Traditional ultrasonic cleaning often directly places the SLD components in an ultrasonic cleaning machine, which not only has low cleaning efficiency, but also the SLD components are prone to collide and rub against each other, causing damage to the SLD components and being inconvenient for the operation of the staff. Summary of the Invention
[0005] This application provides an ultrasonic cleaning jig for SLD components, which solves the problems that the SLD components are prone to collide and rub against each other during ultrasonic cleaning, resulting in damage to the SLD components and inconvenient operation.
[0006] This application provides an ultrasonic cleaning jig for SLD components, and the ultrasonic cleaning jig includes a carrier plate, and a plurality of grooves for placing SLD components are opened on the top surface of the carrier plate.
[0007] In the technical solution provided by this application, by opening a plurality of grooves for placing SLD components on the top surface of the carrier plate, it is possible to simultaneously clean multiple SLD components, improving the cleaning efficiency of the SLD components; it is also possible to avoid collisions and frictions between the SLD components, causing damage to the SLD components.
[0008] In some embodiments, a gap is reserved between the inner wall of the groove and the outer wall of the SLD component, which can not only ensure that the groove can fix the SLD component, but also allow the SLD component to move slightly in the groove, facilitating the cleaning liquid to penetrate into the gap between the inner wall of the groove and the outer wall of the SLD component, thereby realizing a more comprehensive cleaning of the SLD component.
[0009] In some embodiments, leakage holes are provided in the bottom surface of the groove, facilitating the cleaning liquid to enter the groove through the leakage holes during cleaning to clean the bottom surface of the SLD component, making the cleaning of the SLD component more comprehensive.
[0010] In some embodiments, at least one side surface of the carrier plate is provided with hanging rods, and hooks are provided at the tops of the hanging rods. During cleaning, the hooks can be hung on the edge of the ultrasonic cleaning tank, eliminating the need for manual holding of the hanging rods all the time and reducing the manual labor intensity.
[0011] In some embodiments, a number of the grooves are arranged in an equidistant array on the top surface of the carrier plate, with a neat arrangement, improving the utilization rate of the carrier plate.
[0012] In some embodiments, a buckle assembly is detachably installed on the top surface of the carrier plate. The buckle assembly includes a number of parallel pressing strips. The distance between adjacent pressing strips is equal to the distance between adjacent rows of grooves, and the position of each pressing strip matches the position of the corresponding row of grooves. The two ends of the number of pressing strips are respectively connected by connecting rods. By installing the buckle assembly on the top surface of the carrier plate, the SLD component can be limited in the vertical direction, preventing the SLD component from detaching from the groove during the cleaning process.
[0013] In some embodiments, a first magnetic attraction element is provided at the end of the connecting rod, and a second magnetic attraction element matching the first magnetic attraction element is provided on the top surface of the carrier plate. Through the cooperation of the first magnetic attraction element and the second magnetic attraction element, the quick disassembly and assembly cooperation between the buckle assembly and the carrier plate can be realized, making the operation more convenient.
[0014] In some embodiments, the first magnetic attraction element or the second magnetic attraction element is a magnetic attraction column. By providing the magnetic attraction column, on the one hand, it facilitates the quick disassembly and assembly cooperation between the carrier plate and the buckle assembly; on the other hand, the pressing strip can be lifted to a certain height, reserving a certain space for the movement of the SLD component in the groove, avoiding the pressing strip firmly fixing the SLD component and making the cleaning of the SLD component in the ultrasonic cleaning tank more comprehensive.
[0015] In some embodiments, the carrier plate and the pressing strip are made of polytetrafluoroethylene material, and the polytetrafluoroethylene has an extremely low coefficient of friction and is not likely to cause frictional damage to the SLD component.
[0016] The above description is only an overview of the technical solution of the present application. In order to be able to understand the technical means of the present application more clearly, it can be implemented according to the content of the description. And in order to make the above and other purposes, features and advantages of the present application more obvious and understandable, the following specifically gives the specific embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings in this application are used to illustrate the preferred embodiments, facilitating the clear understanding of various other advantages and benefits by those of ordinary skill in the art, and should not be considered as a limitation to this application. Moreover, in all the accompanying drawings, the same reference numerals are used to represent the same or similar components.
[0018] Figure 1 It is a schematic installation structure diagram of an ultrasonic cleaning fixture for an SLD component in an embodiment of this application;
[0019] Figure 2 It is a schematic diagram of the usage state of an ultrasonic cleaning fixture for an SLD component in an embodiment of this application;
[0020] Reference numerals: 1, carrier plate; 2, groove; 3, SLD component; 4, leakage hole; 5, hanging rod; 6, hook; 7, pressing strip; 8, connecting rod; 9, magnetic attraction column. Detailed implementation manners
[0021] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
[0022] Referring to "embodiment" in this text means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of this application. The phrase appears in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0023] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality of" means two or more (including two), unless otherwise clearly and specifically defined.
[0024] In the description of the embodiments of this application, the term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the associated objects before and after.
[0025] In the description of the embodiments of the present application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of the present application.
[0026] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.
[0027] Please refer to Figure 1 - Figure 2 , the embodiments of the present application provide an ultrasonic cleaning fixture for an SLD component. The SLD component 3 includes a thermal layer and a transition block (in this embodiment, the material of the thermal layer is nickel, the material of the transition block is alumina, and gold layers are plated on the surfaces of both the transition block and the thermal layer. In the specific implementation process, the materials of the thermal layer and the transition block can be flexibly selected according to actual situations, and the materials need to meet solderability and the reliability of connection with gold wires). The transition block is installed on the thermal layer; both the thermal layer and the transition block are rectangular block structures, and the size of the transition block is smaller than that of the thermal layer; the ultrasonic cleaning fixture includes a carrier plate 1, and a plurality of grooves 2 for placing the SLD component 3 are opened on the top surface of the carrier plate 1; after the SLD component 3 is placed in the groove 2, the thermal layer is embedded in the groove 2, and the transition block protrudes out of the groove 2.
[0028] In the technical solution provided by the present application, by opening a plurality of grooves 2 for placing the SLD component 3 on the top surface of the carrier plate 1, it is possible to simultaneously clean multiple SLD components 3, improving the cleaning efficiency of the SLD components 3; it can also prevent collisions and frictions between the SLD components 3, causing damage to the SLD components 3.
[0029] In some embodiments, a gap is reserved between the inner wall of the groove 2 and the outer wall of the SLD component 3, which can not only ensure that the groove 2 can fix the SLD component 3, but also allow the SLD component 3 to move slightly in the groove 2, facilitating the penetration of the cleaning liquid into the gap between the inner wall of the groove 2 and the outer wall of the SLD component 3, thereby achieving a more comprehensive cleaning of the SLD component 3.
[0030] Please continue to refer to Figure 1 , in some embodiments, a leakage hole 4 is formed in the bottom surface of the groove 2, which facilitates the cleaning liquid to enter the groove 2 from the leakage hole 4 during cleaning to clean the bottom surface of the SLD component 3, making the cleaning of the SLD component 3 more comprehensive.
[0031] Please continue to refer to Figure 1 , in some embodiments, at least one side surface of the carrier plate 1 is provided with a hanging rod 5, and a hook 6 is provided at the top of the hanging rod 5. During cleaning, the hook 6 can be hung on the edge of the ultrasonic cleaning tank, eliminating the need for manual holding of the hanging rod 5 all the time, reducing the labor intensity of the operator.
[0032] Please continue to refer to Figure 1 , in some embodiments, a plurality of the grooves 2 are arranged in an equidistant array on the top surface of the carrier plate 1, with neat arrangement, improving the utilization rate of the carrier plate 1.
[0033] Please continue to refer to Figure 1 、 Figure 2 , in some embodiments, a snap component is detachably installed on the top surface of the carrier plate 1. The snap component includes a plurality of parallel pressure bars 7, and the distance between adjacent pressure bars 7 is equal to the distance between adjacent rows of grooves 2. The position of each pressure bar 7 matches the position of a corresponding row of SLD components 3 (the pressure bar 7 is located in the non-transition layer area above the thermal layer, and the transition layer is located on one side of the pressure bar 7). The two ends of the plurality of pressure bars 7 are respectively connected by connecting rods 8; by installing the snap component on the top surface of the carrier plate 1, the SLD component 3 can be limited in the vertical direction to prevent the SLD component 3 from detaching from the groove 2 during the cleaning process.
[0034] In some embodiments, a first magnetic attraction element is provided at the end of the connecting rod 8, and a second magnetic attraction element matching the first magnetic attraction element is provided on the top surface of the carrier plate 1; through the cooperation of the first magnetic attraction element and the second magnetic attraction element, the snap component and the carrier plate 1 can be quickly disassembled and assembled, making the operation more convenient.
[0035] In a specific embodiment, when the first magnetic attraction element is a magnet, the second magnetic attraction element can be a magnet or a metal that can be adsorbed by a magnet; when the second magnetic attraction element is a magnet, the first magnetic attraction element can be a magnet or a metal that can be adsorbed by a magnet.
[0036] In some embodiments, the first magnetic attraction element or the second magnetic attraction element is a magnetic attraction column 9. By providing the magnetic attraction column 9, on the one hand, it facilitates the quick disassembly and assembly of the carrier plate 1 and the snap component; on the other hand, the pressure bar 7 can be lifted to a certain height, reserving a certain space for the movement of the SLD component 3 in the groove 2, avoiding the pressure bar 7 firmly fixing the SLD component 3 and making the cleaning of the SLD component 3 in the ultrasonic cleaning tank more comprehensive.
[0037] Please continue to refer to Figure 1 , in this embodiment, the first magnetic attraction element is a magnetic attraction column 9, the second magnetic attraction element is iron, and the second magnetic attraction element is embedded inside the four corners of the carrier plate 1 (therefore, the second magnetic attraction element is not shown in the figure).
[0038] In a specific implementation process, positioning grooves (not shown in the figure) matching the magnetic attraction columns 9 can be respectively arranged at the four corners of the carrier plate 1, and the second magnetic attraction element can be arranged in the positioning grooves. When the snap component needs to be assembled onto the carrier plate 1, the magnetic attraction columns 9 at the four corners of the bottom of the snap component can be inserted into the positioning grooves at the four corners of the top surface of the carrier plate 1, improving the assembly efficiency of the snap component and the carrier plate 1.
[0039] In some embodiments, the carrier plate 1 and the pressure strip 7 are made of polytetrafluoroethylene material. The polytetrafluoroethylene has an extremely low coefficient of friction and is not likely to cause frictional damage to the SLD component 3. (In a specific implementation process, the polytetrafluoroethylene can also be replaced with other materials having similar properties).
[0040] The usage method of the ultrasonic cleaning fixture in this embodiment is as follows:
[0041] First, place a plurality of SLD components 3 to be cleaned into several grooves 2 on the top surface of the carrier plate 1, and then cover the snap component on the top surface of the carrier plate 1, ensuring that each pressure strip 7 corresponds to a row of SLD components 3 on the carrier plate 1 respectively, and the snap component is magnetically fixed to the carrier plate 1; then turn on the ultrasonic cleaning machine, hold the hanging rod 5 by hand to immerse the carrier plate 1 into the cleaning pool of the ultrasonic cleaning machine, and hang the hook 6 on the edge of the cleaning pool, and wait for the cleaning to be completed.
[0042] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered within the scope of the claims and the description of the present application. In particular, as long as there is no conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.
Claims
1. An ultrasonic cleaning jig for SLD components, characterized in that: The ultrasonic cleaning jig comprises a carrier plate (1), the top surface of which is provided with a plurality of grooves (2) for placing SLD components (3); at least one side surface of the carrier plate (1) is provided with a hanging rod (5), and the top of the hanging rod (5) is provided with a hook (6).
2. The ultrasonic cleaning jig for SLD components according to claim 1, characterized in that: A gap is reserved between the inner wall of the groove (2) and the outer wall of the SLD component (3).
3. The ultrasonic cleaning jig for SLD components according to claim 1, characterized in that: A leakage hole (4) is provided on the bottom surface of the groove (2).
4. The ultrasonic cleaning jig for SLD components according to claim 1, characterized in that: A plurality of the grooves (2) are arranged in an array at equal intervals on the top surface of the carrier plate (1).
5. The ultrasonic cleaning jig for SLD components according to claim 4, characterized in that: A buckle assembly is detachably mounted on the top surface of the carrier plate (1), and the buckle assembly comprises a plurality of parallel pressure strips (7), the spacing between adjacent pressure strips (7) being equal to the spacing between adjacent rows of grooves (2), the position of each pressure strip (7) matching the position of a corresponding row of grooves (2), and the two ends of the plurality of pressure strips (7) being connected respectively by connecting rods (8).
6. The ultrasonic cleaning jig for SLD components according to claim 5, characterized in that: A first magnetic attraction element is provided at the end of the connecting rod (8), and a second magnetic attraction element matching the first magnetic attraction element is provided on the top surface of the carrier plate (1).
7. The ultrasonic cleaning jig for SLD components according to claim 6, characterized in that: The first magnetic attraction element or the second magnetic attraction element is a magnetic attraction column (9).
8. The ultrasonic cleaning jig for SLD components according to claim 5, characterized in that: The carrier plate (1) and the pressure strip (7) are made of polytetrafluoroethylene material.