Semiconductor part machining and drilling equipment

Abstract

The utility model discloses semiconductor part machining and drilling equipment, and relates to the technical field of semiconductor machining. A semiconductor substrate to be processed is placed in the U-shaped seat, and the U-shaped seat is connected with the inner side wall of the U-shaped seat in a sliding mode. The clamping piece is arranged on the [-shaped seat and is used for clamping and fixing a semiconductor substrate to be processed; and the L-shaped plate is fixedly arranged on the rear side of the [-shaped seat, a rectangular channel is formed in the side wall of the L-shaped plate, and a movable plate is arranged in the rectangular channel in a sliding mode. Through the combined design of the clamping piece, the L-shaped plate, the movable plate, the driving piece, the intermittent locking piece and the like, high-precision positioning of the semiconductor substrate is achieved, hole position deviation in the continuous punching process is reduced, the punching precision is improved, the semiconductor substrate to be machined is kept stable in the machining process due to the design of the clamping piece, and the machining efficiency is improved. And the punching error caused by the movement of the substrate is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, and particularly relates to a drilling device for processing semiconductor parts. Background Art

[0002] In the semiconductor industry, drilling is a crucial process for creating electrical connection paths on semiconductor wafers or providing space for subsequent component installation. With the development of electronic devices towards miniaturization and high-density integration, the requirements for drilling accuracy are getting higher and higher.

[0003] Although the existing drilling equipment can complete the drilling operation, it is difficult to achieve high-precision continuous drilling. Due to the inaccuracy of the positioning system, the relative position between the drill bit and the wafer shifts, thereby affecting the drilling accuracy. Therefore, it is of great significance to develop a semiconductor part processing drilling device with a higher-precision positioning system to effectively reduce or eliminate the hole position deviation during continuous drilling, so as to improve the efficiency and product quality of semiconductor manufacturing. Summary of the Utility Model

[0004] The utility model specifically adopts the following technical solutions to achieve the above purposes:

[0005] A drilling device for processing semiconductor parts, comprising:

[0006] A U-shaped seat, on which a semiconductor substrate to be processed is placed and is slidably connected to its inner side wall;

[0007] A clamping member, arranged on the U-shaped seat for clamping and fixing the semiconductor substrate to be processed;

[0008] An L-shaped plate, fixedly arranged at the rear side of the U-shaped seat, a rectangular channel is formed on the side wall of the L-shaped plate, and a movable plate is slidably arranged inside the rectangular channel;

[0009] A U-shaped plate, fixedly arranged on one side of the movable plate, and a laser drilling machine is installed at the bottom of the U-shaped plate;

[0010] A driving member, arranged on the movable plate for driving the movable plate to reciprocate in the rectangular channel;

[0011] An intermittent locking member, arranged on the top of the U-shaped plate for preventing the movement of the movable plate.

[0012] Further, the clamping member includes a fixing plate connected to the middle of the U-shaped seat, fastening bolts are threadedly connected at intervals on the top of the fixing plate, and rubber pads are fixedly arranged at the bottoms of the fastening bolts.

[0013] Further, scale lines are arranged on the edge of the U-shaped seat.

[0014] Furthermore, the driving member includes a driving motor installed in the middle inside the C-shaped plate. The output end of the driving motor penetrates through the movable plate and is connected with a gear. A support seat is fixedly arranged at a position on the back of the L-shaped plate close to the rectangular channel. A rack is fixedly arranged on the top of the support seat. The rack meshes with the gear.

[0015] Furthermore, rollers are rotatably arranged at the four corners of the movable plate. The mouth wall of the rectangular channel is slidably connected with the wheel grooves of the rollers.

[0016] Furthermore, the intermittent locking member includes an installation cylinder fixedly embedded in the top of the C-shaped plate. An energized coil is installed on the bottom side inside the installation cylinder. A limiting ring is connected to the upper side inside the installation cylinder. A movable rod is slidably inserted inside the limiting ring. An armature iron column is fixedly arranged at the bottom end of the movable rod. The armature iron column is slidably connected with the inner wall of the installation cylinder. A movable disc is fixedly arranged at the upper end of the movable rod. A spring is connected between the movable disc and the limiting ring. A plug pin is fixedly arranged on the top of the movable disc. The top end of the plug pin slidably penetrates through the top wall of the installation cylinder. A pin hole adapted to the plug pin is constructed at equal intervals on the top of the L-shaped plate.

[0017] The beneficial effects of the present utility model are as follows:

[0018] Through the combined design of structures such as the clamping member, the L-shaped plate, the movable plate, the driving member and the intermittent locking member, the present utility model realizes the high-precision positioning of the semiconductor substrate, reduces the hole position deviation during the continuous punching process, improves the punching precision. The design of the clamping member enables the semiconductor substrate to be processed to be stable during the processing, reduces the punching error caused by the movement of the substrate, and has high practicability and is worthy of general application and promotion. Description of the Drawings

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0020] Figure 2 is another three-dimensional structural schematic diagram of the present utility model;

[0021] Figure 3 is a top view schematic diagram of the present utility model;

[0022] Figure 4 is the present utility model Figure 3 a cross-sectional schematic diagram taken along the A-A direction in;

[0023] Figure 5 is the present utility model Figure 4 an enlarged structural schematic diagram of part B in.

[0024] Reference numerals: 1, C-shaped seat; 2, clamping member; 201, fixing plate; 202, fastening bolt; 3, L-shaped plate; 301, rectangular channel; 302, pin hole; 4, movable plate; 5, C-shaped plate; 6, laser drilling machine; 7, driving member; 701, driving motor; 702, gear; 703, support seat; 704, rack; 8, intermittent locking member; 801, mounting cylinder; 802, energized coil; 803, limiting ring; 804, movable rod; 805, armature iron column; 806, movable disk; 807, spring; 808, bolt pin; 9, scale line; 10, roller. Detailed implementation manners

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

[0026] This application provides a drilling device for semiconductor part processing, mainly used to solve the problem that although the existing drilling devices in the prior art can complete the drilling operation, they have difficulties in achieving high-precision continuous drilling. Due to the inaccuracy of the positioning system, the relative position between the drill bit and the wafer shifts, thereby affecting the accuracy of drilling. The following technical solutions are provided and will be described in detail below in combination with Figures 1 - 5 for a detailed description:

[0027] A drilling device for semiconductor part processing includes:

[0028] A C-shaped seat 1, on which a semiconductor substrate to be processed is placed and is slidably connected to its inner side wall;

[0029] A clamping member 2, arranged on the C-shaped seat 1, for clamping and fixing the semiconductor substrate to be processed;

[0030] An L-shaped plate 3, fixedly arranged at the rear side of the C-shaped seat 1. A rectangular channel 301 is formed on the side wall of the L-shaped plate 3, and a movable plate 4 is slidably arranged inside the rectangular channel 301;

[0031] A C-shaped plate 5, fixedly arranged on one side of the movable plate 4, and a laser drilling machine 6 is installed at the bottom of the C-shaped plate 5;

[0032] A driving member 7, arranged on the movable plate 4, for driving the movable plate 4 to reciprocate inside the rectangular channel 301;

[0033] An intermittent locking member 8, arranged on the top of the C-shaped plate 5, for preventing the movement of the movable plate 4.

[0034] The specific implementation process and principle description of this drilling device for semiconductor part processing:

[0035] In the first step, the semiconductor substrate to be processed is placed inside the C-shaped seat 1;

[0036] In the second step, the clamping member 2 is used to fix the semiconductor substrate to be processed to ensure its stability during the processing;

[0037] In the third step, the driving member 7 drives the movable plate 4 to reciprocate in the rectangular channel 301, thereby driving the laser drilling machine 6 to perform the drilling operation;

[0038] In the fourth step, at the position where drilling needs to be stopped, the intermittent locking member 8 prevents the movement of the movable plate 4 to achieve precise control of the drilling position;

[0039] In the fifth step, after the drilling is completed, the intermittent locking member 8 is unlocked, and the movable plate 4 is continuously driven to position and drill at the next drilling position;

[0040] Repeat the third to fifth steps until all the required drilling operations are completed.

[0041] The semiconductor part processing and drilling equipment drives the movable plate 4 to reciprocate in the rectangular channel 301 through the driving member 7, so as to realize the drilling operation of the laser drilling machine 6 on the semiconductor substrate to be processed. At the position where drilling needs to be stopped, the intermittent locking member 8 prevents the movement of the movable plate 4 by inserting the pin 808 into the pin hole 302, so as to achieve precise control of the drilling position. Through the coordinated action of structures such as the clamping member 2, the L-shaped plate 3, the movable plate 4, the driving member 7 and the intermittent locking member 8, the whole device realizes the high-precision continuous drilling operation of the semiconductor substrate.

[0042] As Figure 1 shown, in some embodiments, the clamping member 2 includes a fixing plate 201 connected to the middle of the C-shaped seat 1. The top of the fixing plate 201 is threadedly connected with fastening bolts 202 at intervals. A rubber pad is fixed at the bottom of the fastening bolts 202. More specifically, through the structure of the fixing plate 201 and the fastening bolts 202, the clamping member 2 can stably fix the semiconductor substrate to be processed, prevent any slight movement or vibration of the substrate during the drilling process, thereby ensuring the accuracy of drilling. The rubber pad at the bottom of the fastening bolts 202 provides buffering for the substrate, avoiding scratches or indentations that may be caused by direct contact with hard objects, and protecting the integrity and quality of the semiconductor substrate.

[0043] As Figure 1 shown, in some embodiments, a scale line 9 is provided on the edge of the C-shaped seat 1. More specifically, the scale line 9 can be used as a calibration reference to help the operator correct the position of the substrate. Before drilling, the operator can quickly measure and determine the position of the substrate through the scale line 9, reducing the need to use additional measuring tools and improving work efficiency.

[0044] As Figure 2As shown, in some embodiments, the driving member 7 includes a driving motor 701 installed in the middle inside the C-shaped plate 5. The output end of the driving motor 701 penetrates through the movable plate 4 and is connected with a gear 702. A support base 703 is fixedly provided at the position on the back of the L-shaped plate 3 close to the rectangular channel 301. A rack 704 is fixedly provided on the top of the support base 703. The rack 704 meshes with the gear 702. More specifically, when the driving motor 701 rotates, the gear 702 rotates accordingly. Due to the meshing of the gear 702 and the rack 704, the rotational motion of the gear 702 is converted into a reciprocating linear motion of the movable plate 4 in the rectangular channel 301.

[0045] As Figure 1 shown, in some embodiments, rollers 10 are rotatably provided at the four corners of the movable plate 4. The mouth wall of the rectangular channel 301 is slidably connected with the wheel grooves of the rollers 10. More specifically, the slidable connection between the rollers 10 and the mouth wall of the rectangular channel 301 changes the sliding friction into rolling friction, significantly reducing the frictional resistance during the movement of the movable plate 4 and making the movement smoother. Since the rollers 10 bear most of the wear, the movable plate 4 and the mouth wall of the rectangular channel 301 are not easily worn, thus extending the service life of the device.

[0046] As Figure 5 shown, in some embodiments, the intermittent locking member 8 includes an installation cylinder 801 fixedly embedded in the top of the C-shaped plate 5. An energized coil 802 is installed on the bottom side inside the installation cylinder 801. A limiting ring 803 is connected to the upper side inside the installation cylinder 801. A movable rod 804 is slidably inserted through the inside of the limiting ring 803. An armature column 805 is fixedly provided at the bottom end of the movable rod 804. The armature column 805 is slidably connected with the inner wall of the installation cylinder 801. An activity disk 806 is fixedly provided at the upper end of the movable rod 804. A spring 807 is connected between the activity disk 806 and the limiting ring 803. A bolt 808 is fixedly provided on the top of the activity disk 806. The top end of the bolt 808 slidably penetrates through the top wall of the installation cylinder 801. The top of the L-shaped plate 3 is equally spaced with pin holes 302 adapted to the bolt 808. More specifically, in the non-energized state, the spring 807 pushes the activity disk 806 and the bolt 808 thereon upward, so that the top end of the bolt 808 is inserted into the corresponding pin hole 302 on the L-shaped plate 3, thereby locking the position of the movable plate 4. When the energized coil 802 is connected to an electric current, an electromagnetic field is generated to attract the armature column 805 to move downward. Since the armature column 805 is fixedly provided with the movable rod 804, the movable rod 804 also moves downward accordingly. The downward movement of the movable rod 804 causes the activity disk 806 to move downward against the elastic force of the spring 807, and the bolt 808 is withdrawn from the pin hole 302 of the L-shaped plate 3, thereby releasing the locking state of the movable plate 4. When the current is disconnected and the electromagnetic field disappears, the spring 807 pushes the activity disk 806 upward again, and the bolt 808 is inserted into the pin hole 302 of the L-shaped plate 3 again to complete the locking.

[0047] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the embodiments shown herein, but rather should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor parts processing drilling equipment, characterized in that: Including: A U-shaped seat (1), inside which the semiconductor substrate to be processed is placed and is slidably connected to its inner side wall; A clamping member (2), arranged on the U-shaped seat (1) for clamping and fixing the semiconductor substrate to be processed; An L-shaped plate (3), fixedly arranged at the rear side of the U-shaped seat (1). A rectangular channel (301) is formed on the side wall of the L-shaped plate (3), and a movable plate (4) is slidably arranged inside the rectangular channel (301); A U-shaped plate (5), fixedly arranged on one side of the movable plate (4). A laser drilling machine (6) is installed at the bottom of the U-shaped plate (5); A driving member (7), arranged on the movable plate (4) for driving the movable plate (4) to reciprocate in the rectangular channel (301); An intermittent locking member (8), arranged on the top of the U-shaped plate (5) for preventing the movement of the movable plate (4).

2. A semiconductor parts processing drilling equipment according to claim 1, characterized in that: The clamping member (2) includes a fixing plate (201) connected to the middle of the U-shaped seat (1). At the top of the fixing plate (201), fastening bolts (202) are threadedly connected at intervals, and a rubber pad is fixedly arranged at the bottom of the fastening bolts (202).

3. The semiconductor parts processing drilling equipment according to claim 1, characterized in that: Scale lines (9) are arranged on the edge of the U-shaped seat (1).

4. The semiconductor parts processing drilling equipment according to claim 1, characterized in that: The driving member (7) includes a driving motor (701) installed in the middle inside the U-shaped plate (5). The output end of the driving motor (701) penetrates through the movable plate (4) and is connected with a gear (702). A support seat (703) is fixedly arranged on the back surface of the L-shaped plate (3) near the rectangular channel (301), and a rack (704) is fixedly arranged on the top of the support seat (703). The rack (704) is meshed with the gear (702).

5. The semiconductor parts processing drilling equipment according to claim 1, characterized in that: Rollers (10) are rotatably arranged at the four corners of the movable plate (4), and the mouth wall of the rectangular channel (301) is slidably connected with the wheel grooves of the rollers (10).

6. The semiconductor parts processing drilling equipment according to claim 1, characterized in that: The intermittent locking member (8) includes an installation cylinder (801) fixedly embedded in the top of the U-shaped plate (5). An energized coil (802) is installed at the bottom side inside the installation cylinder (801). A limiting ring (803) is connected to the upper side inside the installation cylinder (801). A movable rod (804) is slidably inserted inside the limiting ring (803). An armature column (805) is fixedly arranged at the bottom end of the movable rod (804), and the armature column (805) is slidably connected with the inner wall of the installation cylinder (801). A movable disk (806) is fixedly arranged at the upper end of the movable rod (804). A spring (807) is connected between the movable disk (806) and the limiting ring (803). A plug pin (808) is fixedly arranged at the top of the movable disk (806), and the top end of the plug pin (808) slidably penetrates through the top wall of the installation cylinder (801). Equal-spacing pin holes (302) adapted to the plug pin (808) are formed on the top of the L-shaped plate (3).

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