Bubble generation prevention device for electroplating copper dissolving tank

Abstract

The utility model relates to the technical field of electroplating, in particular to an anti-bubble generation device for an electroplating copper dissolving tank. The electroplating copper dissolving tank comprises an electroplating copper dissolving tank and a plurality of partition plates, the partition plates are vertically arranged in the electroplating copper dissolving tank and divide the electroplating copper dissolving tank into a plurality of tank bodies, and arc-shaped speed reducing plates are arranged on part of the partition plates; one end of the arc-shaped speed brake is vertically connected with the partition plate which is in the bottoming state, the other end of the arc-shaped speed brake is the partition plate which is in the close state and is in the bottom suspension state, and the partition plate on the right side of the arc-shaped speed brake is higher than the partition plate on the left side of the arc-shaped speed brake. The device can slow down the descending speed of liquid medicine, prevents the liquid medicine from splashing to generate bubbles, and improves the quality of the liquid medicine.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a device for preventing bubble generation in an electroplating copper dissolving tank. Background Art

[0002] The overflow of the traditional overflow tank from top to bottom causes the liquid to splash and generate bubbles due to the liquid level difference. The residual bubbles in the liquid will have an adverse effect on the copper plating process. Therefore, how to eliminate the bubble problem is an urgent problem to be solved. The Chinese patent with the authorization announcement number CN220099257U discloses a device for eliminating electroplating bubbles. By setting an electroplating sub-tank, the flow path of the solution is increased, and the pressure of the solution flowing out of the filter can be fully released. The electroplating sub-tank and the electroplating main tank are connected in an overflow manner. The solution in the electroplating sub-tank can overflow to the electroplating main tank, avoiding the generation of bubbles. However, the setting of the electroplating sub-tank in the above patent causes the upper and lower drop of the electroplating solution to still generate bubbles. The residual bubbles in the liquid will cause uneven copper plating, and ultimately cause the pad to be missing. Utility Model Content

[0003] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a device for preventing bubble generation in a copper electroplating bath, which can prevent the problem of bubble generation caused by splashing of liquid due to liquid level difference.

[0004] The technical solution of the utility model is:

[0005] A device for preventing bubble generation in a copper electroplating tank comprises a copper electroplating tank and a plurality of partitions, wherein the plurality of partitions are vertically arranged in the copper electroplating tank to divide the copper electroplating tank into a plurality of tank bodies, and an arc-shaped deceleration plate is arranged on the partition.

[0006] Preferably, the partition has two states: touching the bottom and having the bottom suspended in the air.

[0007] Preferably, one end of the arc-shaped speed reducer is in a vertically connected state to be a partition touching the bottom, and the other end of the arc-shaped speed reducer is in a close state to be a partition suspended from the bottom.

[0008] Preferably, the height of the partition on the right side of the arc-shaped speed reducer is higher than the height of the partition on the left side of the arc-shaped speed reducer.

[0009] Preferably, the state is that the partitions, which are in the bottom-touching or bottom-suspended state, decrease in height from left to right.

[0010] Preferably, a liquid medicine outlet is provided at the bottom of the right side of the overflow tank.

[0011] Preferably, a gap is left between the arc-shaped deceleration plate and the partition with the bottom suspended in the air for the medicine to flow out.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] By providing an arc-shaped deceleration plate, the speed of the liquid medicine flowing down can be slowed down when it passes through the top of the arc-shaped deceleration plate; there is a gap for the liquid medicine to flow out between the arc-shaped deceleration plate and the partition plate with a bottom-suspended state, and this gap allows the liquid medicine to flow down smoothly along the gap, avoiding the generation of bubbles caused by splashing of the liquid medicine and improving the quality of the liquid medicine. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 It is a side cross-sectional view of the device of the present invention.

[0016] Figure 2 It is a side cross-sectional view of the structure of a conventional electroplating copper dissolution tank.

[0017] In the figure: 1, electroplating copper dissolution tank; 2, partition plate; 3, arc-shaped deceleration plate; 4, gap; 5, discharge port; 6, liquid medicine; 7, bubble; 8, liquid pumping pump; 9, liquid level sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment

[0020] As Figure 1-2 shown, this embodiment provides an anti-bubble generation device for an electroplating copper dissolution tank, including an electroplating copper dissolution tank 1 and a plurality of partition plates 2. The plurality of partition plates 2 are vertically arranged in the electroplating copper dissolution tank 1 to divide the electroplating copper dissolution tank 1 into a plurality of tank bodies. An arc-shaped deceleration plate 3 is provided on the partition plate 2. A liquid pumping pump 8 is provided on the left side of the electroplating copper dissolution tank 1, and the flow rate of the liquid pumping pump 8 for pumping the liquid medicine 6 is controllable. The liquid pumping pump 8 pumps the external liquid medicine 6 into the electroplating copper dissolution tank 1.

[0021] Preferably, the partition plate 2 has two states: touching the bottom and bottom-suspended. By setting these two states, an undulating liquid medicine flow channel can be constructed to better control the flow rate of the liquid medicine.

[0022] Preferably, one end of the arc-shaped baffle 3 is vertically connected to the baffle 2 in a state of touching the bottom, and the other end of the arc-shaped baffle 3 is close to the baffle 2 in a state of having a suspended bottom.

[0023] Preferably, the height of the baffle 2 on the right side of the arc-shaped baffle 3 is higher than the height of the baffle 2 on the left side of the arc-shaped baffle 3. By setting the height of the baffle 2 on the right side of the arc-shaped baffle 3 to be higher than the height of the baffle 2 on the left side of the arc-shaped baffle 3, it is ensured that the liquid medicine will not flow out from above the baffle 2 on the right side of the arc-shaped baffle 3, avoiding the generation of bubbles due to too large a drop of the liquid medicine.

[0024] Preferably, the heights of the baffles 2 in the state of touching the bottom or having a suspended bottom decrease sequentially from left to right. By setting the heights of the baffles 2 in the state of touching the bottom or having a suspended bottom to decrease sequentially from left to right, the liquid medicine can flow down to the next layer step by step, controlling the liquid medicine from generating bubbles.

[0025] Preferably, a liquid medicine discharge port 5 is provided at the bottom on the right side of the overflow tank.

[0026] Preferably, flow meters are connected to both the liquid medicine discharge port 5 and the liquid pumping pump 8 to ensure that the flow rate of the liquid medicine 6 pumped into the electroplating copper dissolving tank 1 by the liquid pumping pump 8 is consistent with the flow rate of the liquid medicine 6 flowing out of the electroplating copper dissolving tank 1 through the liquid medicine discharge port 5.

[0027] Preferably, a gap 4 for the liquid medicine to flow out is left between the arc-shaped baffle 3 and the baffle 2 in a state of having a suspended bottom.

[0028] Preferably, a liquid level sensor 9 is provided at the top of the baffle 2 in a state of having a suspended bottom. The liquid level sensor 9 is electrically connected to the liquid pumping pump 8. When the liquid medicine 6 in the electroplating copper dissolving tank 1 reaches the height of the liquid level sensor 9, which is the warning line at this time, the liquid pumping pump 8 slows down or stops working to avoid the liquid medicine 6 overflowing from the top of the baffle 2.

[0029] Working principle:

[0030] During use, the electroplating copper dissolution tank 1 is the main electroplating container. The liquid extraction pump 8 pumps the liquid medicine 6 into the electroplating copper dissolution tank 1. A plurality of partition plates 2 are vertically arranged in the electroplating copper dissolution tank 1, dividing the electroplating copper dissolution tank 1 into multiple tank bodies. Arc-shaped deceleration plates 3 are provided on two adjacent partition plates 2. The arc-shaped deceleration plates 3 can change the flow rate and direction of the liquid medicine 6, thereby reducing the generation of bubbles 7. One end of the arc-shaped deceleration plate 3 is vertically connected to the partition plate 2 in a state of touching the bottom, and the other end is close to the partition plate 2 in a state of being suspended at the bottom, so that when the liquid medicine 6 flows through the arc-shaped deceleration plate 3, both the flow rate and direction will change. A gap 4 for the liquid medicine 6 to flow out is left between the arc-shaped deceleration plate 3 and the partition plate 2 in a state of being suspended at the bottom. This gap 4 ensures that the liquid medicine 6 can smoothly flow from one tank body along the tank wall into another tank body during the flowing process, avoiding the direct drop of the liquid medicine, restricting the flow rate of the liquid medicine 6 at the same time and reducing the accumulation of bubbles. The height of the partition plate 2 on the right side of the arc-shaped deceleration plate 3 is higher than that of the partition plate 2 on the left side, which can prevent the liquid medicine 6 from flowing out from the partition plate 2 on the right side and slow down the flow rate at the same time, further reducing the generation of bubbles 7. Finally, the qualified liquid medicine 6 flows out from the liquid medicine discharge port 5. At the same time, flow meters are connected to both the liquid extraction pump 8 and the liquid medicine discharge port 5 to control the inflow and outflow of the liquid medicine 6 in the electroplating copper dissolution tank 1 to be consistent. A liquid level sensor 9 is provided at the top of the partition plate 2 in a suspended state. When the liquid medicine 6 reaches the height of the liquid level sensor 9, the liquid extraction pump 8 will stop pumping, avoiding the situation that the flow of the liquid medicine 6 is not timely due to less gap in the electroplating copper dissolution tank 1 and the liquid medicine 6 overflowing when crossing the suspended partition plate 2.

[0031] Although the present invention has been described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all be within the scope of the present invention. / Any person skilled in the art in the technical field disclosed by the present invention can easily think of changes or substitutions within the technical scope disclosed by the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A device for preventing bubble generation in a copper electroplating tank, characterized in that: The invention comprises an electroplating copper dissolving tank (1) and a plurality of partitions (2), wherein the plurality of partitions (2) are vertically arranged in the electroplating copper dissolving tank (1) to divide the electroplating copper dissolving tank (1) into a plurality of tank bodies, and arc-shaped deceleration plates (3) are arranged on some of the partitions (2).

2. The device for preventing bubble generation in a copper electroplating tank according to claim 1, characterized in that: The partition (2) has two states: touching the bottom and having the bottom suspended.

3. The device for preventing bubble generation in a copper electroplating tank as claimed in claim 2, characterized in that: One end of the arc-shaped deceleration plate (3) is vertically connected to the partition plate (2) in a state of touching the bottom, and the other end of the arc-shaped deceleration plate (3) is close to the partition plate (2) in a state of being suspended at the bottom.

4. The device for preventing bubble generation in a copper electroplating tank according to claim 1, characterized in that: The height of the partition plate (2) on the right side of the arc-shaped deceleration plate (3) is higher than the height of the partition plate (2) on the left side of the arc-shaped deceleration plate (3).

5. The device for preventing bubble generation in a copper electroplating tank as claimed in claim 2, characterized in that: The state is that the partition (2) touches the bottom or the bottom is suspended, and the height decreases from left to right.

6. The device for preventing bubble generation in a copper electroplating tank according to claim 1, characterized in that: The bottom of the right side of the electroplating copper dissolving tank (1) is provided with a liquid discharge outlet (5).

7. The device for preventing bubble generation in a copper electroplating tank as claimed in claim 2, characterized in that: A gap (4) for the medicine liquid to flow out is reserved between the arc-shaped deceleration plate (3) and the partition plate (2) in a state where the bottom is suspended.

8. The device for preventing bubble generation in a copper electroplating tank as claimed in claim 2, characterized in that: A liquid level sensor (9) is provided on the top of the partition (2) in a suspended bottom state.

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