Reaction chamber assembly and epitaxial equipment

Abstract

The utility model provides a reaction chamber assembly and epitaxy equipment, the reaction chamber assembly comprises a heating ring and a reaction chamber, the heating ring is arranged in the reaction chamber, the inner side of the heating ring accommodates a tray used for placing a substrate, the reaction chamber comprises a bottom plate, two opposite side edges of the bottom plate are respectively provided with a first side wall and a second side wall, and the first side wall and the second side wall are arranged on the bottom plate. A flow guide plate is arranged between the first side wall and the second side wall, at least one first supporting part is arranged on the side face of each of the first side wall, the second side wall and the flow guide plate, and second supporting parts corresponding to the first supporting parts are arranged on the edge of the heating ring. According to the embodiment of the utility model, the heating ring is supported through a simple structure, the simple structure is convenient to mount, and the possibility of collision and fragmentation of parts in the mounting process can be reduced; the lower cavity of the reaction chamber is not provided with other redundant parts, so that the cleaning airflow is prevented from forming turbulent flow, and radiation light irradiated from the lower side can uniformly reach the tray.

Description

Technical Field

[0001] The utility model relates to the technical field of epitaxial manufacturing devices, and more specifically, to a reaction chamber assembly and an epitaxial device. Background Art

[0002] Epitaxy is a common thin film growth method in current semiconductor technology, characterized by the ability to deposit high-quality single crystal thin films. Therefore, in the reaction chamber for epitaxy, the surface temperature of the wafer (a type of substrate) usually reaches above 1000 °C, which poses specific requirements for the materials used for various components in the reaction chamber.

[0003] The heating of the epitaxial cavity is generally achieved by radiative heating. Generally speaking, the tray for supporting the substrate and some components close to the tray need to be made of graphite or silicon carbide with high heat absorption efficiency to maintain the high temperature required for wafer film formation. However, some components farther away from the tray, such as the outer wall of the cavity and the support components, need to be made of quartz with a relatively high light transmittance to ensure that the radiation serving as the heat source can reach the positions to be heated with low loss through the outer wall, support members, etc. Since there is a large difference in the thermal expansion coefficients of quartz and graphite / silicon carbide, these two materials usually cannot be in direct contact over a large area.

[0004] The support member of the heating ring in the existing epitaxial device is an annular member including a plurality of support pins. The lower end of the annular member is supported on the bottom wall of the reaction cavity through the support pins, and the upper end of the annular member abuts against the lower surface of the heating ring through the support pins. To avoid blocking light, the support member is made very thin. Therefore, it is fragile and difficult to install. In addition, the support member is located in the lower cavity of the reaction chamber, which causes a large disturbance to the purge gas flowing through the lower cavity, thereby affecting the uniformity and efficiency of cleaning.

[0005] In addition, the heating ring arranged around the tray needs to be heated to a relatively high temperature to ensure that there is no large temperature difference at the edge of the wafer. Therefore, the heating ring needs to be processed with graphite / silicon carbide materials; while the support member of the heating ring is made of quartz, which also makes the processing technology relatively complex. Summary of the Utility Model

[0006] In view of this, the utility model aims to provide a reaction chamber assembly and an epitaxial device to at least partially solve the problem of supporting the heating ring in the reaction chamber in the related art.

[0007] One aspect of the present utility model provides a reaction chamber assembly, including a heating ring and a reaction chamber. The heating ring is disposed inside the reaction chamber. A tray for placing a substrate is accommodated inside the heating ring. The reaction chamber includes a bottom plate. First sidewalls and second sidewalls are respectively disposed on two opposite sides of the bottom plate. A flow guide plate is disposed between the first sidewalls and the second sidewalls. At least one first support portion is disposed on the side surface of each of the first sidewalls, the second sidewalls, and the flow guide plate. A second support portion corresponding to the first support portion is disposed at the edge of the heating ring.

[0008] In some embodiments, the heating ring includes a heating body. The shape of the heating body matches the shape of the inner cavity of the reaction chamber. A first hole for accommodating the tray is disposed on the heating body.

[0009] In some embodiments, the first support portion is a structure protruding towards the inside of the reaction chamber from the flow guide plate, the first sidewall, or the second sidewall, or a structure having a groove on the flow guide plate, the first sidewall, or the second sidewall and protruding towards the inside of the reaction chamber.

[0010] In some embodiments, the lower surface of the first support portion is not lower than the lower surface of the flow guide plate, and at the same time, the lower surface of the heating ring is not lower than the lower surface of the first support portion and / or the upper surface of the second support portion is not higher than the upper surface of the flow guide plate, and at the same time, the upper surface of the heating ring is not higher than the upper surface of the second support portion, wherein the second support portion corresponds to the first support portion on the flow guide plate.

[0011] In some embodiments, the lower surfaces of the flow guide plate, the first support portion, and the heating ring are kept horizontally coplanar and / or the upper surfaces of the flow guide plate, the second support portion, and the heating ring are kept horizontally coplanar.

[0012] In some embodiments, the lower surfaces of the flow guide plate, the first support portion, and the heating ring gradually rise in the direction of fluid flow and / or the upper surfaces of the flow guide plate, the second support portion, and the heating ring gradually decrease in the direction of fluid flow.

[0013] In some embodiments, the second support portion is a first groove portion including a first groove matching the shape of the first support portion. The first support portion is accommodated in the first groove to achieve position limitation.

[0014] In some embodiments, a fixing member is disposed in the first groove. A second groove is disposed on the first support portion to accommodate the fixing member. The fixing member is slidable in the second groove.

[0015] In some embodiments, the fixing member is integrally formed with the second supporting portion, wherein the fixing member is made of graphite and / or silicon carbide or the fixing member is detachable relative to the second supporting portion.

[0016] In some embodiments, the second supporting portion is provided with a plurality of the fixing members, and the plurality of fixing members are detachably connected to the second supporting portion, and the fixing member is a pin-shaped member.

[0017] In some embodiments, a fixing member is provided on the first supporting portion, the fixing member is integrally formed with the first supporting portion, and the fixing member is made of quartz.

[0018] Another aspect of the present invention provides an epitaxial device, which includes the reaction chamber assembly of any one of the above.

[0019] In the embodiment of the present invention, the support for the heating ring is realized through a simple structure, which is convenient for installation and can reduce the possibility of component collision and fragmentation during installation; there are no other redundant components in the lower cavity of the reaction chamber, which can prevent the cleaning air flow from forming turbulence and enable the radiation light coming in from the lower side to reach the tray more evenly.

[0020] To make the above objects, features and advantages of the present invention more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the drawings that are not necessarily drawn to scale, the same reference numerals may describe similar components in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar components. The drawings generally illustrate various embodiments by way of example and not limitation, and are used together with the description and the claims to illustrate the disclosed embodiments. When appropriate, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Such embodiments are illustrative and are not intended to be an exhaustive or exclusive embodiment of the device or method. The drawings described herein are used to provide a further understanding of the present invention, form a part of this application, and the schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 is a partial structural schematic diagram of a reaction chamber assembly according to an embodiment of the present invention;

[0023] Figure 2 is a schematic diagram of the arrangement of the first supporting portion in a reaction chamber assembly according to an embodiment of the present invention;

[0024] Figure 3 It is a schematic connection diagram of a first support part and a second support part in a reaction chamber assembly according to an embodiment of the present utility model;

[0025] Figure 4 It is a schematic diagram of the setting of the first support part in a reaction chamber assembly according to another embodiment of the present utility model;

[0026] Figure 5 is Figure 4 A schematic cross-sectional view along the A-A section line.

[0027] Among them, the above-mentioned drawings include the following reference numerals:

[0028] 1 - Heating main body; 2 - First hole; 10 - Heating ring; 11 - Second support part; 12 - Fixing part; 20 - Reaction chamber; 21 - Bottom plate; 22 - First side wall; 23 - Second side wall; 24 - Deflector; 25 - Second hole; 26 - First support part; 27 - Second groove. Detailed implementation manners

[0029] Next, specific embodiments of the present utility model will be described in detail with reference to the drawings, but it is not a limitation of the present utility model.

[0030] It should be understood that various modifications can be made to the embodiments disclosed herein. Therefore, the above description should not be regarded as a limitation, but only as an example of the embodiments. Those skilled in the art will think of other modifications within the scope and spirit of the present utility model.

[0031] The drawings included in the specification and constituting a part of the specification show the embodiments of the present utility model, and together with the general description of the present utility model given above and the detailed description of the embodiments given below, are used to explain the principles of the present utility model.

[0032] These and other features of the present utility model will become apparent from the following description of the preferred forms of the embodiments given by way of non-limiting examples with reference to the drawings.

[0033] It should also be understood that although the present utility model has been described with reference to some specific examples, those skilled in the art can surely implement many other equivalent forms of the present utility model, which have the features as described in the claims and thus are all within the protection scope defined hereby.

[0034] When combined with the drawings, in view of the following detailed description, the above and other aspects, features and advantages of the present utility model will become more apparent.

[0035] Specific embodiments of the present utility model will be described hereinafter with reference to the accompanying drawings; however, it should be understood that the disclosed embodiments are merely examples of the present utility model and can be implemented in various ways. Well-known and / or repetitive functions and structures are not described in detail to avoid obscuring the present utility model with unnecessary or redundant details. Therefore, the specific structural and functional details disclosed herein are not intended to be limiting, but merely serve as a basis and representative basis for the claims to teach those skilled in the art to use the present utility model in a substantially arbitrary suitable detailed structure in various ways.

[0036] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0037] This specification may use the phrase "in one embodiment", "in another embodiment", "in yet another embodiment", or "in other embodiments", which may each refer to one or more of the same or different embodiments according to the present utility model.

[0038] The first embodiment of the present utility model provides a reaction chamber assembly, as Figures 1 - 5 shown, which includes a heating ring 10 and a reaction chamber 20. The heating ring 10 is disposed inside the reaction chamber 20. The inner side of the heating ring 10 is used to accommodate a tray, and a wafer is placed on the tray. The wafer is a type of substrate. During epitaxial reaction, the heating ring 10 heats the edge of the wafer. Among them, the heating ring 10 and the tray maintain a concentric positional relationship to facilitate uniform heating of the wafer.

[0039] The reaction chamber 20 is a housing structure made of quartz material, which includes a bottom plate 21. The bottom plate 21 can be rectangular, and in other embodiments, the bottom plate 21 can also be other shapes. The first side wall 22 and the second side wall 23 are oppositely disposed on the bottom plate 21. As Figure 1As shown, the first side wall 22 and the second side wall 23 can be arranged on two opposite sides of the rectangular bottom plate 21, for example. A flow guide plate 24 is arranged between the first side wall 22 and the second side wall 23, and the fluid for the reaction flows into the reaction chamber 20 through the flow guide plate 24. The heating ring 10 is arranged between the first side wall 22, the second side wall 23 and the flow guide plate 24 and can be supported at a reaction position, where the reaction position corresponds to the position of the wafer during epitaxial reaction.

[0040] Only a part of the reaction chamber 20 is shown in the illustrated embodiment. It should be understood that the foregoing reaction chamber 20 may further include a top plate opposite to the bottom plate 21, a chamber flange located on the upstream side of the foregoing top plate, and a chamber flange located on the downstream side of the foregoing top plate.

[0041] It should be noted that when the bottom plate 21 is in a shape other than rectangular, as long as the first side wall 22 and the second side wall 23 are arranged opposite to each other, and the flow guide plate 24 is located between the first side wall 22 and the second side wall 23.

[0042] Furthermore, the heating ring 10 includes a heating body 1, and the shape of the heating body 1 matches the shape of the bottom plate 21 so as to be arranged in the reaction chamber 20. For example, it also has a rectangular shape, and its size is determined based on the size of the bottom plate 21.

[0043] A first hole 2 is arranged on the heating body 1, and the first hole 2 is used to accommodate the tray, so that the heating ring 10 and the tray can be located on the same or nearly the same plane. The first hole 2 is arranged at the center of the heating body 1, for example, and its size is determined based on the size of the tray. In this way, the heating ring 10 is arranged around the tray to achieve uniform heating. The wafer is placed on the tray and the heating of the wafer is realized from the edge of the wafer through the heating body 1 of the heating ring 10.

[0044] Furthermore, in order to realize the movement of the tray, a second hole 25 is arranged on the bottom plate 21 of the reaction chamber 20. When transporting the tray, one end of the connecting rod can be passed through the second hole 25 from the outside of the bottom of the reaction chamber 20 to support the tray, so that the movement and rotation of the tray can be controlled by operating the connecting rod. When the tray moves to the reaction position, the flow guide plate 24, the heating ring 10 and the tray located on the same or nearly the same plane isolate the reaction chamber 20 into an upper chamber for the reaction gas to pass horizontally and a lower chamber for introducing purge gas.

[0045] Furthermore, when the tray moves to the reaction position, the wafer placed on the tray is relatively close to the heating ring 10. The heating ring 10 needs to be heated to a relatively high temperature to ensure that there is no large temperature difference at the edge of the wafer. Therefore, the heating ring 10 needs to be made of a material with good heat transfer performance. In this embodiment, the heating ring 10 is made of graphite / silicon carbide material.

[0046] In order to support the heating ring 10 in the reaction chamber 20, the prior art generally sets a separate support on the bottom plate 21 of the reaction chamber 20, such as the annular member mentioned in the background art. However, this annular member has disadvantages such as being fragile, difficult to install, and disturbing the lower chamber fluid.

[0047] To overcome the above problems, in this embodiment, at least one first support portion 26 is provided on the side surface of each of the first side wall 22, the second side wall 23, and the flow guide plate 24. The plurality of first support portions 26 are uniformly arranged outside the outer edge of the tray, so as to achieve stable support for the heating ring 10. In addition, the heating ring 10 can also heat the wafer in the tray more evenly.

[0048] In one embodiment, the first support portion 26 is a structure protruding from the flow guide plate 24 or the first side wall 22 or the second side wall 23 into the interior of the reaction chamber 20 (as shown by the dotted line in Figure 3 ), that is, the first support portion 26 protrudes into the interior of the reaction chamber 20 on the inner surfaces of the first side wall 22, the second side wall 23, and the flow guide plate 24. Among them, the first support portion 26 can be, for example, a step, so that the heating ring 10 can be disposed on the first support portion 26 and fixed in the reaction chamber 20 through the first support portion 26.

[0049] Specifically, the first support portion 26 on the flow guide plate 24 can be located at the central axis position of the width of the flow guide plate 24. The upper surface of the first support portion 26 is located at approximately the middle position of the thickness of the flow guide plate 24. Among them, the first support portion 26 can be made of quartz, for example, and can be integrally processed and formed with the flow guide plate 24. The positions of the first support portions 26 on the first side wall 22 and the second side wall 23 can be determined according to the size of the heating ring 10.

[0050] Furthermore, the first support portion 26 can be triangular in shape, or rectangular or semi-circular in shape, or other shapes that are easy to process and have sufficient strength.

[0051] Taking the example that one of the first support portions 26 is provided on each side surface of the first side wall 22, the second side wall 23, and the flow guiding plate 24, the center of gravity of the heating ring 10 falls inside the triangle formed by the three first support portions 26 and is as close as possible to the center point of the triangle, which can significantly improve the stability of the heating ring 10 and thus improve the heating effect. It should be understood that more of the first support portions 26 can be provided on the side surface of any one of the first side wall 22, the second side wall 23, and the flow guiding plate 24 to improve the stability of the placement of the heating ring 10.

[0052] In this embodiment, by removing the separate support member and realizing the support for the heating ring 10 through the cooperation of the first support portion 26 and the second support portion 11 provided on the side wall of the flow guiding plate 24 and the reaction chamber 20, the possibility of collision and fragmentation during the installation process can be reduced. In addition, there are no other redundant components in the lower cavity of the reaction chamber 20, which prevents the purge gas from forming turbulence, and at the same time, the radiation light coming in from the lower side will also reach the tray more evenly.

[0053] In order to more stably and reliably arrange the heating ring 10 on the first support portion 26, the second support portion 11 may include, for example, a first groove portion (the second support portion 11 can be seen in Figure 3 the dotted line framed by the midpoint). The first groove portion includes a first groove that matches the shape of the first support portion 26. The first groove can be a cut groove. By accommodating the first support portion 26 through the first groove and forming a structure of mutual clamping and limiting, the heating ring 10 can be arranged more stably between the first side wall 22, the second side wall 23, and the flow guiding plate 24.

[0054] In order to avoid generating steps and thus causing the air flow in the upper cavity or the lower cavity to be disordered, in one embodiment, the lower surface of the first support portion 26 is not lower than the lower surface of the flow guiding plate 24 while the lower surface of the heating ring 10 is not lower than the lower surface of the first support portion 26 and / or the upper surface of the second support portion 11 is not higher than the upper surface of the flow guiding plate 24 while the upper surface of the heating ring 10 is not higher than the upper surface of the second support portion 11, wherein the second support portion 11 corresponds to the first support portion 26 on the flow guiding plate 24.

[0055] Preferably, the lower surface of the flow guiding plate 24, the lower surface of the first support portion 26, and the lower surface of the heating ring 10 are coplanar and / or the upper surface of the flow guiding plate 24, the upper surface of the second support portion 11, and the upper surface of the heating ring 10 are horizontally coplanar.

[0056] Further preferably, the lower surface of the flow guide plate 24, the lower surface of the first support portion 26, and the lower surface of the heating ring 10 gradually rise in the direction of fluid flow and / or the upper surface of the flow guide plate 24, the upper surface of the second support portion 11, and the upper surface of the heating ring 10 gradually decrease in the direction of fluid flow.

[0057] Considering that the heating ring 10 is made of, for example, graphite / silicon carbide material, and the flow guide plate 24 and the side wall of the reaction chamber 20 are made of quartz material, in order to reduce heat transfer, the contact area between the graphite material and the quartz material needs to be kept as small as possible. Therefore, a fixing member 12 is provided inside the second support portion 11. The fixing member 12 is disposed in the first groove and extends in the vertical direction, and realizes point contact with the first support portion 26. In this way, point contact connection is achieved between the first support portion 26 and the second support portion 11 by using the fixing member 12. In one embodiment, the shape of the fixing member 12 can be a pin-shaped member or other shapes that can achieve point contact with the first support portion 26. Preferably, the fixing member 12 can be made of graphite to facilitate integral processing of the second support portion 11.

[0058] Due to tolerance control reasons, the levelness of the heating ring 10 usually cannot be ensured. Therefore, when installing, the fixing member 12 with a suitable height can be selected according to the inclination degree of the heating ring 10 to adjust the levelness of the heating ring 10. For this purpose, the fixing member 12 adopts a detachable structure, such as a detachable pin with different heights, which is not integrally formed with the heating ring 10, so as to facilitate the selection of pins with different lengths according to the inclination degree of the heating ring 10.

[0059] In order to further realize the cooperation between the first support portion 26 and the second support portion 11, a second groove 27 is provided on the first support portion 26 to accommodate the fixing member 12 such as the pin. The second groove 27 can be a waist-shaped groove, the axis of which passes through the center of the tray, and the width of the second groove 27 is approximately equivalent to the diameter of the pin such as.

[0060] Since the thermal expansion coefficients of the graphite part and the quartz part are different, during the heating and cooling process of the reaction chamber 20, a relative displacement will occur between the two components. The fixing member 12 can slide in the second groove 27, and the displacement direction of the fixing member 12 is restricted by the second groove 27, so that the displacement only occurs in the radial direction radiating from the center of the tray, thereby ensuring that the center of the heating ring 10 remains in a fixed position and does not shift during the process of thermal expansion and contraction, and thus ensuring that the center position relationship between the tray and the heating ring 10 is maintained.

[0061] Of course, according to the actual requirements of the cavity, the fixing member 12 can also be arranged on the first supporting portion 26. In this way, the fixing member 12 can be made of quartz, so as to be integrally processed and formed with the first supporting portion 26, thereby simplifying the processing procedure. Correspondingly, when the fixing member 12 is fixedly connected to the first supporting portion 26, a third groove with a shape matching that of the fixing member 12 can be arranged at the bottom of the first groove of the second supporting portion 11, so as to limit the movement of the heating ring 10.

[0062] In an implementation manner of the present utility model, the fixing member 12 can also be detachably connected to the first supporting portion 26. Similar to the foregoing, at this time, the fixing member 12 can also be provided with multiple heights to level the heating ring 10.

[0063] In the foregoing embodiment, the first supporting portion 26 is a structure protruding from the flow guiding plate 24, the first side wall 22 and the second side wall 23 into the interior of the reaction chamber 20. Correspondingly, the second supporting portion 11 is a structure including a groove adapted to the first supporting portion 26. Of course, in other implementation manners of the present utility model, the first supporting portion 26 can also be arranged as a structure with a groove.

[0064] For example, in other implementation manners of the present utility model, the structural forms of the first supporting portions 26 located on the flow guiding plate 24, the first side wall 22 and the second side wall 23 can be inconsistent. For example, the first supporting portion 26 located on the flow guiding plate 24 is a structure with a groove facing the interior of the reaction chamber 20 (as shown by the dotted line in Figure 5 ), where the first supporting portion 26 is the part of the flow guiding plate 24 facing the reaction chamber 20, and the second supporting portion 11 at the corresponding position is arranged as a structure protruding outward from the heating ring 10 and adapted to the foregoing groove; at the same time, the first supporting portions 26 located on the first side wall 22 and the second side wall 23 are structures protruding from the first side wall 22 and the second side wall 23 into the interior of the reaction chamber 20.

[0065] In the above specific implementation manner, it can be ensured that the lower surface of the first supporting portion 26 is not lower than the lower surface of the flow guiding plate 24 and the lower surface of the heating ring 10 is not lower than the lower surface of the first supporting portion 26, and / or, the upper surface of the second supporting portion 11 is not higher than the upper surface of the flow guiding plate 24 and the upper surface of the heating ring 10 is not higher than the upper surface of the second supporting portion, wherein the second supporting portion 11 corresponds to the first supporting portion 26 on the flow guiding plate 24.

[0066] Preferably, the lower surfaces of the flow guide plate 24, the first support portion 26, and the heating ring 10 are coplanar, and / or the upper surfaces of the flow guide plate 24, the second support portion 11, and the heating ring 10 are horizontally coplanar.

[0067] In another preferred embodiment, it can also be arranged that the lower surfaces of the flow guide plate 24, the first support portion 26, and the heating ring 10 gradually rise in the direction of fluid flow, and / or the upper surfaces of the flow guide plate 24, the second support portion 11, and the heating ring 10 gradually decrease in the direction of fluid flow. The above examples are not intended to limit the present disclosure.

[0068] The second embodiment of the present invention provides an epitaxial device, which includes the reaction chamber assembly of any one of the above embodiments.

[0069] The embodiment of the present invention realizes the support for the heating ring through a simple structure. This simple structure is convenient for installation and can reduce the possibility of component collision and fragmentation during installation; there are no other redundant components in the lower chamber of the reaction chamber, which can prevent the cleaning air flow from forming turbulence and also make the radiation light coming in from the lower side reach the tray more evenly.

[0070] In the above embodiments of the present invention, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0071] For the sake of convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "upper" etc. can be used here to describe the spatial position relationship between a device or feature shown in the figure and other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the figure is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned or rotated in other different ways by 90 degrees or in other orientations, and corresponding interpretations should be made for the spatial relative descriptions used here.

[0072] In addition to the above, it should be noted that the "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in connection with that embodiment being included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in connection with any one embodiment, it is intended that the implementation of such feature, structure or characteristic in connection with other embodiments also falls within the scope of the present utility model.

[0073] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0074] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A reaction chamber assembly, characterized in that: The invention comprises a heating ring and a reaction chamber, wherein the heating ring is arranged in the reaction chamber, the inner side of the heating ring accommodates a tray for placing a substrate, the reaction chamber comprises a bottom plate, a first side wall and a second side wall are respectively arranged on two opposite sides of the bottom plate, a guide plate is arranged between the first side wall and the second side wall, at least one first supporting portion is arranged on the side surface of each of the first side wall, the second side wall and the guide plate, and a second supporting portion corresponding to the first supporting portion is arranged at the edge of the heating ring.

2. The reaction chamber assembly according to claim 1, characterized in that: The heating ring comprises a heating body, the shape of the heating body matches the shape of the interior of the reaction chamber, and the heating body is provided with a first hole for accommodating the tray.

3. The reaction chamber assembly according to claim 1, characterized in that: The first supporting portion is a structure protruding from the guide plate or the first side wall or the second side wall toward the interior of the reaction chamber, or a structure having a groove disposed on the guide plate or the first side wall or the second side wall toward the interior of the reaction chamber.

4. The reaction chamber assembly according to claim 1, characterized in that: The lower surface of the first support portion is not lower than the lower surface of the guide plate and the lower surface of the heating ring is not lower than the lower surface of the first support portion and / or the upper surface of the second support portion is not higher than the upper surface of the guide plate and the upper surface of the heating ring is not higher than the upper surface of the second support portion, wherein the second support portion corresponds to the first support portion on the guide plate.

5. The reaction chamber assembly according to claim 4, characterized in that: The lower surface of the guide plate, the lower surface of the first support portion and the lower surface of the heating ring remain horizontally coplanar and / or the upper surface of the guide plate, the upper surface of the second support portion and the upper surface of the heating ring remain horizontally coplanar.

6. The reaction chamber assembly according to claim 4, characterized in that: The lower surface of the guide plate, the lower surface of the first support part and the lower surface of the heating ring gradually rise in the direction of fluid flow and / or the upper surface of the guide plate, the upper surface of the second support part and the upper surface of the heating ring gradually lower in the direction of fluid flow.

7. The reaction chamber assembly according to claim 1, characterized in that: The second supporting portion is a first groove portion including a first groove matching the shape of the first supporting portion, and the first supporting portion is accommodated in the first groove to achieve positioning.

8. The reaction chamber assembly according to claim 7, characterized in that: A fixing piece is arranged in the first groove, and a second groove is arranged on the first supporting part to accommodate the fixing piece, and the fixing piece can slide in the second groove.

9. The reaction chamber assembly according to claim 8, characterized in that: The fixing member is integrally formed with the second supporting portion, wherein the fixing member is made of graphite and / or silicon carbide or the fixing member is detachable relative to the second supporting portion.

10. The reaction chamber assembly according to claim 9, characterized in that: The second supporting portion is provided with a plurality of the fixing members, and the plurality of the fixing members can be detachably connected to the second supporting portion, and the fixing members are pin-shaped members.

11. The reaction chamber assembly according to claim 7, characterized in that: A fixing piece is arranged on the first supporting part. The fixing piece is integrally formed with the first supporting part and is made of quartz.

12. An epitaxial device, characterized in that: The reaction chamber assembly comprises any one of claims 1-11.

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