Mounting structure and assembly component of temperature sensor

Abstract

The utility model discloses a temperature sensor installation structure and an assembly component, the installation structure comprises an installation groove, the installation groove is used for accommodating a temperature sensor, the bottom of the installation groove is provided with a heat transfer cavity, the heat transfer cavity is filled with a heat conduction medium, the side wall of the installation groove is provided with an overflow channel, and the overflow channel is communicated with the heat conduction medium. The overflow channel extends in the axial direction of the mounting groove, communicates with the heat transfer cavity and is used for containing the heat conduction medium overflowing out of the heat transfer cavity. When the temperature sensor abuts against the heat-conducting medium, the redundant heat-conducting medium can flow to the overflow channel from the heat transfer cavity, and the situation that the detection result of the temperature sensor is affected due to temperature rise caused by extrusion of the heat-conducting medium in the heat transfer cavity is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature detection, in particular to an installation structure and an assembly component of a temperature sensor. Background Art

[0002] In the related art, when measuring structures such as water pumps with a temperature sensor, the temperature sensor needs to be assembled inside a pump body or the like. There is a heat-conducting medium filled inside the pump body or the like. The temperature sensor will squeeze the heat-conducting silicone, resulting in the formation of pressure inside the heat-conducting silicone and affecting the accuracy of the detection result. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this purpose, the utility model provides an installation structure. When the temperature sensor abuts against the heat-conducting medium, the redundant heat-conducting medium can flow from the heat transfer cavity to the overflow channel, avoiding the temperature rise caused by the extrusion of the heat-conducting medium in the heat transfer cavity and affecting the detection result of the temperature sensor.

[0004] The utility model also provides an assembly component of a temperature sensor.

[0005] According to the installation structure of the temperature sensor in the first aspect embodiment of the utility model, it includes: an installation groove for accommodating the temperature sensor. A heat transfer cavity is arranged at the bottom of the installation groove, and the heat transfer cavity is filled with a heat-conducting medium. An overflow channel is arranged on the side wall of the installation groove, and the overflow channel extends along the axial direction of the installation groove. The overflow channel is communicated with the heat transfer cavity, and the overflow channel is used for accommodating the heat-conducting medium overflowing from the heat transfer cavity.

[0006] According to the installation structure of the temperature sensor in the embodiment of the utility model, when the temperature sensor abuts against the heat-conducting medium, the redundant heat-conducting medium can flow from the heat transfer cavity to the overflow channel, avoiding the temperature rise caused by the extrusion of the heat-conducting medium in the heat transfer cavity and affecting the detection result of the temperature sensor.

[0007] According to some embodiments of the utility model, the installation groove is provided with a first threaded portion, and the first threaded portion is adjacent to the heat transfer cavity. The first threaded portion is used for threadedly connecting with a second threaded portion on the temperature sensor.

[0008] According to some embodiments of the utility model, an annular positioning groove is arranged at the upper part of the installation groove, and the positioning groove is arranged above the first threaded portion. The temperature sensor is in positioning cooperation with the positioning groove.

[0009] According to some embodiments of the utility model, the installation structure further includes: a sealing ring, and the sealing ring is arranged between the positioning groove and the positioning step.

[0010] According to some embodiments of the present utility model, the heat-conducting medium is a deformable heat-conducting medium.

[0011] An assembly component of a temperature sensor according to an embodiment of the second aspect of the present utility model includes: the mounting structure; a temperature sensor, including: two probes, the temperature sensor is installed in the installation groove and connected to the mounting structure; a thermistor, one end of each of the two probes is electrically connected to the thermistor, and one end of the thermistor extends into the heat transfer cavity and abuts against the heat-conducting medium; a main circuit board, the other ends of the two probes are electrically connected to the main circuit board.

[0012] According to some embodiments of the present utility model, in the axial direction of the temperature sensor, the center of one of the probes coincides with the center of the temperature sensor.

[0013] According to some embodiments of the present utility model, two contacts are provided on the main circuit board, the projection of one of the contacts on the main circuit board is circular, and the projection of the other contact on the main circuit board is an annular ring.

[0014] According to some embodiments of the present utility model, an insulating portion is provided between the two contacts, and the projection of the insulating portion on the main circuit board is an annular ring concentric with the two contacts.

[0015] According to some embodiments of the present utility model, the temperature sensor further includes: a probe circuit board, one end of the probe circuit board is connected to one end of the two probes, and the other end of the probe circuit board is connected to the thermistor.

[0016] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0017] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0018] Figure 1 is a schematic structural diagram of an assembly component according to an embodiment of the present utility model;

[0019] Figure 2 is a cross-sectional view of the mounting structure according to an embodiment of the present utility model;

[0020] Figure 3 is an internal schematic diagram of the mounting structure according to an embodiment of the present utility model;

[0021] Figure 4 is a front view of the temperature sensor according to an embodiment of the present utility model;

[0022] Figure 5 is a cross-sectional view of a temperature sensor according to an embodiment of the present utility model;

[0023] Figure 6 is a top view of a temperature sensor according to an embodiment of the present utility model;

[0024] Figure 7 is a schematic diagram of contacts and an insulating portion on a main circuit board according to an embodiment of the present utility model.

[0025] Reference numerals:

[0026] 100, assembly component;

[0027] 10, mounting structure; 11, mounting groove; 12, heat transfer cavity; 13, overflow channel; 14, first threaded portion; 15, positioning groove;

[0028] 20, temperature sensor; 21, second threaded portion; 22, positioning step; 23, probe; 24, thermistor;

[0029] 30, main circuit board; 31, contact; 32, insulating portion;

[0030] 41, sealing ring. Detailed implementation manners

[0031] The embodiments of the present utility model will be described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present utility model will be described in detail below.

[0032] Reference will be made below to Figures 1-7 describe the mounting structure 10 of the temperature sensor 20 according to an embodiment of the present utility model, and an assembly component 100 including the above-mentioned mounting structure 10 is also proposed.

[0033] The mounting structure 10 includes: a mounting groove 11 for accommodating the temperature sensor 20. The temperature sensor 20 is arranged in the mounting groove 11 to realize the mounting and positioning of the temperature sensor 20.

[0034] A heat transfer cavity 12 is provided at the bottom of the mounting groove 11, and the heat transfer cavity 12 is filled with a heat-conducting medium. Specifically, the temperature sensor 20 is inserted into the mounting groove 11, and the temperature sensor 20 is inserted into the heat transfer cavity 12 and abuts against the heat-conducting medium. The temperature of the object to be measured is transmitted to the temperature sensor 20 through the heat-conducting medium, thereby measuring the temperature of the object to be measured.

[0035] The side wall of the installation groove 11 is provided with an overflow channel 13. The overflow channel 13 extends along the axial direction of the installation groove 11. The overflow channel 13 communicates with the heat transfer cavity 12. The overflow channel 13 is used to accommodate the heat-conducting medium overflowing from the heat transfer cavity 12. Specifically, the overflow channel 13 is arranged on the side wall of the installation groove 11, and the overflow channel 13 extends along the axial direction of the installation groove 11. The overflow channel 13 is recessed inward to accommodate the heat-conducting medium overflowing from the heat transfer cavity 12.

[0036] When the temperature sensor 20 is assembled in the installation groove 11, the temperature sensor 20 is inserted into the heat transfer cavity 12 and abuts against the heat-conducting medium, which will squeeze the heat-conducting medium. The excess heat-conducting medium can overflow from the heat transfer cavity 12 and flow into the overflow channel 13, preventing the temperature of the heat-conducting medium from rising due to extrusion in the heat transfer cavity 12 and affecting the detection result of the temperature sensor 20.

[0037] Thus, when the temperature sensor 20 is assembled, the temperature sensor 20 is inserted into the heat transfer cavity 12 and abuts against the heat-conducting medium. The excess heat-conducting medium can flow into the overflow channel 13, preventing the temperature of the heat-conducting medium from rising due to extrusion in the heat transfer cavity 12 and affecting the accuracy of the detection result of the temperature sensor 20.

[0038] Combined with Figures 1-5 As shown, the installation groove 11 is provided with a first thread portion 14. The first thread portion 14 is adjacent to the heat transfer cavity 12. The first thread portion 14 is used for threaded connection with the second thread portion 21 on the temperature sensor 20. Specifically, the inner peripheral side of the installation groove 11 is provided with the first thread portion 14. The first thread portion 14 is adjacent to the heat transfer cavity 12. The overflow channel 13 can axially penetrate the first thread portion 14 along the installation groove 11. The outer periphery of the temperature sensor 20 is provided with the second thread portion 21. The second thread portion 21 is threadedly connected with the first thread portion 14 to connect the temperature sensor 20 with the installation groove 11 and ensure the connection stability between the temperature sensor 20 and the installation groove 11.

[0039] As Figures 1-3 shown, the upper part of the installation groove 11 is provided with a circumferentially arranged positioning groove 15. The positioning groove 15 is arranged above the first thread portion 14. The temperature sensor 20 is in positioning cooperation with the positioning groove 15. Specifically, the positioning groove 15 is arranged in the upper part of the installation groove 11. The positioning groove 15 is located above the first thread portion 14. The positioning groove 15 is circumferentially arranged around the upper week of the installation groove 11. The temperature sensor 20 is provided with a positioning step 22. The positioning step 22 is in limit cooperation with the positioning groove 15 to make the temperature sensor 20 in positioning cooperation with the positioning groove 15.

[0040] According to Figure 1 、 Figure 4 and Figure 5As shown, the mounting structure 10 further includes: a sealing ring 41, which is disposed between the positioning groove 15 and the positioning step 22. Specifically, the sealing ring 41 is disposed within the positioning groove 15. When the temperature sensor 20 is assembled within the mounting groove 11, the sealing ring 41 abuts between the positioning step 22 and the positioning groove 15, and the sealing ring 41 is in interference fit with the positioning step 22 and the positioning groove 15, ensuring a sealed fit between the temperature sensor 20 and the mounting groove 11, preventing foreign objects from entering the mounting groove 11 and affecting the measurement result of the temperature sensor 20 and the measurement accuracy of the temperature sensor 20.

[0041] In some embodiments, the heat-conducting medium is a deformable heat-conducting medium. Specifically, the heat-conducting medium has the property of being deformable, such that after the excess heat-conducting medium comes into contact with the temperature sensor 20 within the heat transfer cavity 12, it can flow into the overflow channel 13.

[0042] Furthermore, the heat-conducting medium can be thermal grease.

[0043] Combined Figure 1 、 Figure 4 and Figure 7 As shown in

[0044] the assembly component 100 according to the second aspect embodiment of the present utility model includes: a mounting structure 10, a temperature sensor 20, and a main circuit board 30. The temperature sensor 20 is mounted within the mounting groove 11 of the mounting structure 10, and the second threaded portion 21 of the temperature sensor 20 is threadedly connected to the first threaded portion 14 of the mounting structure 10. Thus, the temperature sensor 20 is fixedly connected to the mounting structure 10 to measure the temperature of the object to be measured through the mounting structure 10. The temperature sensor 20 is electrically connected to the main circuit board 30. A controller can be mounted on the main circuit board 30. The controller is electrically connected to the temperature sensor 20 through the main circuit board 30, and the detection result of the temperature sensor 20 can be transmitted to the controller to facilitate monitoring the temperature of the object to be measured.

[0045] As Figures 4-6As shown, the temperature sensor 20 includes two probes 23 and a thermistor 24. One end of each of the two probes 23 is electrically connected to the thermistor 24. One end of the thermistor 24 extends into the heat transfer cavity 12 and abuts against the heat conducting medium. The other ends of the two probes 23 are electrically connected to the main circuit board 30. Specifically, when the temperature sensor 20 is assembled in the mounting groove 11, the thermistor 24 enters the heat transfer cavity 12, one end of the thermistor 24 extends into the heat transfer cavity 12, and one end of the thermistor 24 abuts against the heat conducting medium to measure the temperature of the object to be measured through the heat conducting medium. The thermistor 24 is electrically connected to one end of each of the two probes 23, and the other ends of the two probes 23 are electrically connected to the main circuit board 30, thereby electrically connecting the temperature sensor 20 to the main circuit board 30 to facilitate monitoring the temperature of the object to be measured.

[0046] As Figure 6 shown, in the axial direction of the temperature sensor 20, the center of one of the probes 23 coincides with the center of the temperature sensor 20. Specifically, the two probes 23 are spaced apart, and one of the probes 23 is located at the center of the temperature sensor 20. In the axial direction, the center of one of the probes 23 coincides with the center of the second threaded portion 21.

[0047] As Figure 7 shown, two contacts 31 are provided on the main circuit board 30. The projection of one of the contacts 31 on the main circuit board 30 is a circle, and the projection of the other contact 31 on the main circuit board 30 is an annular ring, and the annular ring and the circle are concentrically arranged. That is to say, the two contacts 31 are concentric circle contacts. Then, when the second threaded portion 21 on the sensor is threadedly connected to the first threaded portion 14 in the mounting groove 11, regardless of the positions of the two probes 23, the probe 23 located at the center of the temperature sensor 20 abuts against one of the contacts 31, and the other probe 23 can abut against the other contact 31, so that the two probes 23 can be better connected to the main circuit board 30, the loading and unloading are more convenient, and situations such as missed connection and wrong connection are effectively avoided.

[0048] Furthermore, an insulating portion 32 is provided between the two contacts 31. The projection of the insulating portion 32 on the main circuit board 30 is an annular ring concentric with the two contacts 31. Specifically, the projection of the insulating portion 32 on the main circuit board 30 is an annular ring, and the center of the projection of the insulating portion 32 on the main circuit board 30 coincides with the center of the projections of the two contacts 31. The insulating portion 32 is provided between the two contacts 31 to prevent the two contacts 31 from being short-circuited.

[0049] In some embodiments, the temperature sensor 20 further includes: a probe 23 circuit board, one end of the probe 23 circuit board is connected to one end of two probes 23, and the other end of the probe 23 circuit board is connected to the thermistor 24. Specifically, the probe 23 circuit board is disposed inside the temperature sensor 20. One end of the probe 23 circuit board is electrically connected to one end of two probes 23, and the other end of the probe 23 circuit board is electrically connected to the thermistor 24, so that the thermal circuit is electrically connected to the two probes 23. The other ends of the two probes 23 are electrically connected to the main circuit board 30. Thus, the temperature of the object to be measured is electrically connected to the main circuit board 30 through the two probes 23, facilitating the monitoring of the temperature of the object to be measured.

[0050] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0052] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirits of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A temperature sensor installation structure, characterized in that: include: A mounting groove (11), the mounting groove (11) being used to accommodate a temperature sensor (20), a heat transfer cavity (12) being provided at the bottom of the mounting groove (11), the heat transfer cavity (12) being filled with a heat-conducting medium, an overflow channel (13) being provided on a side wall of the mounting groove (11), the overflow channel (13) extending along the axial direction of the mounting groove (11), the overflow channel (13) being communicated with the heat transfer cavity (12), and the overflow channel (13) being used to accommodate the heat-conducting medium overflowing from the heat transfer cavity (12).

2. The temperature sensor installation structure according to claim 1, characterized in that: The mounting groove (11) is provided with a first threaded portion (14), the first threaded portion (14) being arranged adjacent to the heat transfer cavity (12), and the first threaded portion (14) being used for being threadedly connected to a second threaded portion (21) on the temperature sensor (20).

3. The temperature sensor installation structure according to claim 1, characterized in that: An annular positioning groove (15) is provided at the upper portion of the installation groove (11), and the positioning groove (15) is positioned and matched with a positioning step (22) on the temperature sensor (20).

4. The temperature sensor installation structure according to claim 3, characterized in that: Also includes: A sealing ring (41), wherein the sealing ring (41) is arranged between the positioning groove (15) and the positioning step (22).

5. The temperature sensor installation structure according to claim 1, characterized in that: The heat-conducting medium is a deformable heat-conducting medium.

6. An assembly component of a temperature sensor, characterized in that: include: The mounting structure (10) according to any one of claims 1 to 5; The temperature sensor (20) comprises: two probes (23), the temperature sensor (20) being installed in the installation groove (11) and connected to the installation structure (10); a thermistor (24), one end of each of the two probes (23) being electrically connected to the thermistor (24), and one end of the thermistor (24) being inserted into the heat transfer cavity (12) and abutting against the heat conducting medium; A main circuit board (30), the other ends of the two probes (23) being electrically connected to the main circuit board (30).

7. The temperature sensor assembly according to claim 6, characterized in that: In the axial direction of the temperature sensor (20), the center of one of the probes (23) coincides with the center of the temperature sensor (20).

8. The temperature sensor assembly according to claim 7, characterized in that: Two contacts (31) are arranged on the main circuit board (30), wherein the projection of one of the contacts (31) on the main circuit board (30) is a circle, and the projection of the other contact (31) on the main circuit board (30) is a ring, and the ring is arranged concentrically with the circle.

9. The temperature sensor assembly according to claim 8, characterized in that: An insulating portion (32) is provided between the two contacts (31), and a projection of the insulating portion (32) on the main circuit board (30) is a circular ring concentric with the two contacts (31).

10. The temperature sensor assembly according to claim 6, characterized in that: The temperature sensor (20) further comprises: a probe (23) circuit board, one end of the probe (23) circuit board is connected to one end of the two probes (23), and the other end of the probe (23) circuit board is connected to the thermistor (24).

Images