Wafer edge detection device

Abstract

The utility model relates to the field of wafer micro-pollution detection, and discloses a wafer edge detection device, which comprises a platform, a calibration table fixed on the top surface of the platform, a linear sensor fixed on the top surface of the platform, a first driving groove fixed on the top surface of the platform, a first motor fixed on one side of the first driving groove, and a second motor fixed on the other side of the first driving groove. A second driving groove is slidably formed above the first driving groove, a second motor is fixed to one side of the second driving groove, a sliding plate is slidably arranged above the second driving groove, a lifting air cylinder is fixed to one side of the sliding plate, and a rotating disc is rotatably arranged at the top end of a telescopic rod of the lifting air cylinder; a suction cup is fixed to the top face of the rotary disc. According to the utility model, the central axis of the sucker and the central axis of the wafer are adjusted to the same straight line, so that the wafer detection precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer micro - pollution detection, and specifically relates to a wafer edge detection device. Background Technique

[0002] A wafer is the basic material used to fabricate silicon semiconductor integrated circuits, usually a thin slice made of high - purity silicon material. Through special processes, millions of transistors can be etched on the wafer, and these transistors are hundreds of times thinner than a human hair. In the field of semiconductor manufacturing, the wafer is an indispensable basic carrier.

[0003] Currently, the nozzle body structure for detecting metal contaminants in the edge area of the wafer mainly uses the tension of the scanning liquid at the test port position of the nozzle body to prevent the scanning liquid from overflowing. However, it still has the following disadvantages: the internal size of the detection port of the nozzle body is very small, just meeting the thickness of a single wafer to enter the test port for testing. Therefore, when an uncalibrated wafer enters the test port for testing, the scanning area of the wafer edge part is uneven, and even there is a collision problem, which cannot more comprehensively analyze the overall metal contaminant content level of the wafer, resulting in a reduction in the accuracy of the data. Content of the Utility Model

[0004] The purpose of the utility model is to provide a wafer edge detection device to solve the problems of uneven scanning area of the wafer edge part, even collision, and inability to more comprehensively analyze the overall metal contaminant content level of the wafer, resulting in a reduction in the accuracy of the data.

[0005] To achieve the above - mentioned utility model purpose, the utility model adopts the following technical solutions: A wafer edge detection device includes a platform, a calibration table is fixed on the top surface of the platform, a linear sensor is fixed on the top surface of the platform, a first driving groove is fixed on the top surface of the platform, a first motor is fixed on one side of the first driving groove, a second driving groove is slidably arranged above the first driving groove, a second motor is fixed on one side of the second driving groove, a sliding plate is slidably arranged above the second driving groove, a lifting cylinder is fixed on one side of the sliding plate, a turntable is rotatably arranged at the top end of the telescopic rod of the lifting cylinder, and a suction cup is fixed on the top surface of the turntable.

[0006] Preferably, a plurality of support columns are fixed on the top surface of the calibration table.

[0007] Preferably, a support plate is fixed on the top surface of the platform, a fixing plate is fixed on one side of the support plate, a nozzle body is arranged on one side of the support plate, a test port is opened on the surface of the nozzle body, two nozzle opening and closing heads are movably arranged on the outer wall of the nozzle body, and a nitrogen pipe is fixed on the surface of the nozzle opening and closing head.

[0008] Preferably, a number of partition tubes are fixedly inserted on the fixed plate, the partition tubes penetrate into the inside of the nozzle body, a balance force spring is wound around the surface of the upper nozzle body, the nozzle opening and closing head is connected to the nozzle body through the balance force spring, and a number of outlets are respectively arranged on two sides of the two nozzle opening and closing heads close to each other.

[0009] Preferably, a cleaning tank is fixed on one side of the support plate, and a waste discharge port is arranged on one side of the cleaning tank.

[0010] Preferably, a sampling fork is placed on the top surface of the platform.

[0011] Compared with the prior art, a wafer edge detection device adopting the above technical scheme has the following

[0012] beneficial effects:

[0013] First, the manipulator will first place the wafer above the calibration table and on the turntable. At the same time, the suction cup will adsorb and fix the wafer on the turntable. Subsequently, the linear sensor will scan the wafer in a circle to obtain the eccentricity of the wafer relative to the suction cup. When the central axis of the wafer and the central axis of the suction cup are not on the same straight line, the output end of the lifting cylinder drives the wafer to move downward through the turntable and the suction cup. When the top surface of the suction cup is lower than the top surface of the calibration table, the top surface of the calibration table supports the bottom surface of the wafer upward; Subsequently, according to the eccentricity value, the positions between the second driving groove and the first driving groove and between the second driving groove and the sliding plate are adjusted, and then the output end of the lifting cylinder is extended upward. The output end of the lifting cylinder drives the wafer to move upward through the turntable and the suction cup. At the same time, the suction cup adsorbs the wafer, and finally the central axis of the suction cup and the central axis of the wafer are adjusted to the same straight line, increasing the accuracy of wafer detection;

[0014] Second, during the process of detecting the wafer, the edge of the wafer will slide inside the test port. During the sliding process, the contact surface between the scanning liquid and the edge area of the wafer is relatively uniform. The scanning liquid is used to scan the edge of the wafer and recycle the scanning liquid, so as to more comprehensively analyze the level of metal contaminants on the wafer surface, and thus improve the overall utilization rate of the wafer;

[0015] Third, when the wafer is above the calibration table, the bottom surface of the wafer will fit with the top surface of the support column, increasing the stability of the position of the wafer on the calibration table; In addition, when taking out or putting in the wafer, the manipulator operates through the sampling fork, and the sampling fork applies a force to the wafer. Therefore, when moving the wafer, it is not necessary to contact the wafer, preventing contamination of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic diagram of the embodiment.

[0017] Figure 2Another perspective three-dimensional schematic diagram of the embodiment.

[0018] Figure 3 Three-dimensional schematic diagram of the support plate and the cleaning tank in the embodiment.

[0019] Figure 4 Three-dimensional schematic diagram of the sliding plate and the turntable in the embodiment.

[0020] In the figure: 1, platform; 2, calibration table; 3, linear sensor; 4, first drive groove; 5, second drive groove; 6, sliding plate; 7, first motor; 8, second motor; 9, lifting cylinder; 10, turntable; 11, suction cup; 12, support plate; 13, fixing plate; 14, nozzle body; 15, test port; 16, nozzle opening and closing head; 17, nitrogen pipe; 18, outlet; 19, balance spring; 20, separation pipe; 21, cleaning tank; 22, waste discharge port; 23, support column; 24, sampling fork. Specific embodiments

[0021] The following will describe in detail the preferred embodiments of the present invention with reference to the accompanying drawings.

[0022] As Figure 1 , Figure 2 and Figure 4 shown, a wafer edge detection device includes a platform 1, a calibration table 2 is fixed on the top surface of the platform 1, a linear sensor 3 is fixed on the top surface of the platform 1, a first drive groove 4 is fixed on the top surface of the platform 1, a first motor 7 is fixed on one side of the first drive groove 4, a second drive groove 5 is slidably arranged above the first drive groove 4, a second motor 8 is fixed on one side of the second drive groove 5, a sliding plate 6 is slidably arranged above the second drive groove 5, a lifting cylinder 9 is fixed on one side of the sliding plate 6, a turntable 10 is rotatably arranged at the top end of the telescopic rod of the lifting cylinder 9, and a suction cup 11 is fixed on the top surface of the turntable 10.

[0023] In use, the manipulator will first place the wafer above the calibration table 2 and on the turntable 10, and at the same time the suction cup 11 will adsorb and fix the wafer on the turntable 10. Subsequently, the linear sensor 3 will scan the wafer in a circle to obtain the eccentricity of the wafer relative to the suction cup 11. If the central axis of the wafer and the central axis of the suction cup 11 are not on the same straight line, the output end of the lifting cylinder 9 will drive the wafer to move downward through the turntable 10 and the suction cup 11. When the top surface of the suction cup 11 is lower than the top surface of the calibration table 2, the top surface of the calibration table 2 will support the bottom surface of the wafer upward; subsequently, according to the eccentricity value, the positions between the second drive groove 5 and the first drive groove 4 and between the second drive groove 5 and the sliding plate 6 are adjusted, and then the output end of the lifting cylinder 9 is extended upward. The output end of the lifting cylinder 9 drives the wafer to move upward through the turntable 10 and the suction cup 11, and at the same time the suction cup 11 adsorbs the wafer, and finally the central axis of the suction cup 11 and the central axis of the wafer are adjusted to be on the same straight line, improving the accuracy of wafer detection.

[0024] As shown Figures 1 - 3 in the figure, a support plate 12 is fixed on the top surface of the platform 1, a fixing plate 13 is fixed on one side of the support plate 12, a nozzle body 14 is arranged on one side of the support plate 12, a test port 15 is formed on the surface of the nozzle body 14, two nozzle opening and closing heads 16 are movably arranged on the outer wall of the nozzle body 14, a nitrogen pipe 17 is fixed on the surface of the nozzle opening and closing head 16, a plurality of separating pipes 20 are fixedly inserted on the fixing plate 13, the separating pipes 20 extend into the nozzle body 14, a balance force spring 19 is wound around the surface of the upper nozzle body 14, the nozzle opening and closing head 16 is connected with the nozzle body 14 through the balance force spring 19, a plurality of outlets 18 are respectively formed on two sides of the two nozzle opening and closing heads 16 close to each other, a cleaning tank 21 is fixed on one side of the support plate 12, and a waste discharge port 22 is arranged on one side of the cleaning tank 21.

[0025] During use, after nitrogen is input through the nitrogen pipe 17, it is discharged from a plurality of outlets 18. Relying on the balance force spring 19, a certain distance is maintained between the two nozzle opening and closing heads 16, which is convenient for the wafer to enter. The edge of the wafer will slide inside the test port 15, and during the sliding process, the contact surface between the scanning liquid and the edge area of the wafer is relatively uniform. The edge of the wafer is scanned by the scanning liquid and the scanning liquid is recovered, so as to more comprehensively analyze the level of metal contaminants on the wafer surface, and further improve the overall utilization rate of the wafer;

[0026] As shown Figure 2 in the figure, a plurality of support columns 23 are fixed on the top surface of the calibration table 2, and a sampling fork 24 is placed on the top surface of the platform 1.

[0027] During use, when the wafer is above the calibration table 2, the bottom surface of the wafer will fit with the top surface of the support column 23, which increases the stability of the position of the wafer on the calibration table 2; in addition, when taking out or putting in the wafer, the manipulator operates through the sampling fork 24, and the sampling fork 24 applies a force to the wafer, so that it is not necessary to contact the wafer when moving the wafer, preventing contamination of the wafer.

[0028] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wafer edge detection device, comprising a platform (1), characterized in that: A calibration table (2) is fixed on the top surface of the platform (1), a linear sensor (3) is fixed on the top surface of the platform (1), a first driving slot (4) is fixed on the top surface of the platform (1), a first motor (7) is fixed on one side of the first driving slot (4), a second driving slot (5) is slidably arranged above the first driving slot (4), a second motor (8) is fixed on one side of the second driving slot (5), a sliding plate (6) is slidably arranged above the second driving slot (5), a lifting cylinder (9) is fixed on one side of the sliding plate (6), a turntable (10) is rotatably arranged at the top end of the telescopic rod of the lifting cylinder (9), and a suction cup (11) is fixed on the top surface of the turntable (10).

2. A wafer edge detection device according to claim 1, characterized in that: A support plate (12) is fixed on the top surface of the platform (1), a fixing plate (13) is fixed on one side of the support plate (12), a nozzle body (14) is provided on one side of the support plate (12), a test port (15) is provided on the surface of the nozzle body (14), two nozzle opening and closing heads (16) are movably provided on the outer wall of the nozzle body (14), and a nitrogen pipe (17) is fixed on the surface of the nozzle opening and closing head (16).

3. A wafer edge detection device according to claim 2, characterized in that: A plurality of dividing tubes (20) are fixedly inserted on the fixing plate (13), and the dividing tubes (20) extend deep into the nozzle body (14). A balancing force spring (19) surrounds the surface of the nozzle body (14) above. The nozzle opening and closing head (16) is connected to the nozzle body (14) via the balancing force spring (19), and a plurality of outlets (18) are respectively provided on two sides of the two nozzle opening and closing heads (16) close to each other.

4. The wafer edge detection device according to claim 2, characterized in that: A cleaning tank (21) is fixed on one side of the support plate (12), and a waste discharge port (22) is provided on one side of the cleaning tank (21).

5. The wafer edge detection device according to claim 1, characterized in that: A plurality of support columns (23) are fixed on the top surface of the calibration platform (2).

6. The wafer edge detection device according to claim 1, characterized in that: A sampling fork (24) is placed on the top surface of the platform (1).

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