Radiator

Abstract

The utility model relates to a radiator, and belongs to the field of radiating devices. The radiator comprises a shell and a first heat absorption assembly. A first containing space and a second containing space which are sequentially arranged in the first direction are arranged in the shell, the second containing space is used for containing media, the shell is provided with a first wall, the first containing space is located between the first wall and the second containing space in the first direction, and the first wall is provided with a first opening communicated with the first containing space. The first direction is parallel to the thickness direction of the housing. The first heat absorption assembly is arranged in the first containing space so as to adjust the temperature in the second containing space. Wherein the first heat absorption assembly comprises a first semiconductor chilling plate and a first heat dissipation module, the first heat dissipation module is located between the first semiconductor chilling plate and the first opening in the first direction, and the first semiconductor chilling plate is used for absorbing heat in the second containing space and discharging the heat to the first heat dissipation module; the first heat dissipation module is used for receiving heat and discharging the heat to the first opening.

Description

Technical Field

[0001] The utility model belongs to the field of heat dissipation devices, and particularly relates to a radiator. Background Art

[0002] In a water-cooling heat dissipation system, the device for cooling water is usually called a radiator or a cooling radiator. The radiator is one of the core components in the water-cooling system. Its main function is to transfer the heat of the water-cooling liquid (usually water or a mixture of water and antifreeze) passing through the heat source (CPU, GPU or other heat-generating components) to the radiator, and then dissipate the heat into the air through the fins and fans of the radiator, thereby reducing the temperature of the water-cooling liquid.

[0003] In the prior art, the radiator generally drives air to flow through the fins to cool the water-cooling liquid, so as to meet the heat dissipation requirements of the device. Therefore, the lowest temperature of the water-cooling liquid is affected by the temperature of the environment where the radiator is located. Therefore, in the case of a higher ambient temperature, the lowest temperature of the water-cooling liquid in the radiator will also be higher, which in turn weakens the cooling ability of the water-cooling liquid for the heat source. Summary of the Utility Model

[0004] In view of the above problems, the embodiments of the present application provide a radiator, which can improve the cooling ability of the radiator for the water-cooling liquid in a high-temperature environment, and further reduce the lowest temperature of the water-cooling liquid in the radiator in a high-temperature environment.

[0005] The embodiments of the present application provide a radiator, which includes a housing and a first heat absorption component. The housing has a first accommodation space and a second accommodation space arranged in sequence along a first direction. The second accommodation space is used to accommodate a medium. The housing has a first wall. Along the first direction, the first accommodation space is located between the first wall and the second accommodation space. The first wall has a first opening communicating with the first accommodation space. The first direction is parallel to the thickness direction of the housing. The first heat absorption component is arranged in the first accommodation space to adjust the temperature in the second accommodation space. Wherein, the first heat absorption component includes a first thermoelectric cooler and a first heat dissipation module. Along the first direction, the first heat dissipation module is located between the first thermoelectric cooler and the first opening. The first thermoelectric cooler is used to absorb the heat in the second accommodation space and discharge it to the first heat dissipation module, and the first heat dissipation module is used to receive the heat and discharge it to the first opening.

[0006] In the above technical solution, the first heat absorption component includes a first thermoelectric cooler and a first heat dissipation module. Along the first direction, the first heat dissipation module is located between the first thermoelectric cooler and the first opening. The first thermoelectric cooler is used to absorb the heat in the second accommodation space and discharge it to the first heat dissipation module, and the first heat dissipation module is used to receive the heat and discharge it to the first opening. Thus, in a high-temperature environment, the first thermoelectric cooler can still further absorb the heat in the second accommodation space, so that the temperature in the second accommodation space is further reduced, so that the temperature of the medium in the second accommodation space is lower than the ambient temperature, and then the minimum temperature of the water-cooled liquid in the radiator is reduced in a high-temperature environment to provide a medium with a lower temperature to the heat source.

[0007] In this embodiment, the first heat dissipation module includes first heat dissipation fins, and the first heat dissipation fins are multiple and arranged at intervals along the second direction. Each first heat dissipation fin extends along the third direction, and the first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0008] In this embodiment, the first heat dissipation module further includes a first installation frame, the first installation frame is arranged in the first accommodation space, and two ends of the first heat dissipation fin in the third direction are respectively connected to two inner walls of the first installation frame that are oppositely arranged in the third direction.

[0009] In this embodiment, the first heat dissipation module further includes a fan, and the fan is arranged at the first opening to drive the air in the first accommodation space to leave the first accommodation space from the first opening.

[0010] In this embodiment, along the first direction, the first thermoelectric cooler has a first surface and a second surface that are oppositely arranged. The first surface is attached to the inner surface of the first accommodation space close to the second accommodation space, and the second surface is attached to the first heat dissipation module.

[0011] In this embodiment, the first surface and the second surface are the surfaces with the largest area of the first thermoelectric cooler.

[0012] In this embodiment, the first thermoelectric coolers are arranged in multiple rows at intervals along the second direction, and each row of the first thermoelectric coolers is arranged in multiple pieces at intervals along the third direction. The first direction, the second direction, and the third direction are perpendicular to each other in pairs.

[0013] In this embodiment, the radiator further includes an inlet pipe and an outlet pipe. Along the second direction, the housing has a third wall and a fourth wall which are oppositely arranged. The inlet pipe is arranged on the third wall and communicates with the inside of the second accommodation space. The outlet pipe is arranged on the fourth wall and communicates with the inside of the second accommodation space. The second accommodation space is a flow channel arranged in a meandering manner, and the second direction is perpendicular to the first direction.

[0014] In this embodiment, the housing includes an outer shell and an inner shell. The inner shell is arranged inside the outer shell. The second accommodation space is provided inside the inner shell, and a part of the outer surface of the inner shell and a part of the inner surface of the outer shell enclose to form the first accommodation space.

[0015] In this embodiment, the radiator further includes a second heat absorption component. A third accommodation space is also provided inside the housing. Along the first direction, the second accommodation space is located between the first accommodation space and the third accommodation space. The housing has a second wall corresponding to the first wall, and a second opening communicating with the second accommodation space is provided on the second wall. The second heat absorption component is arranged in the third accommodation space to adjust the temperature inside the second accommodation space. Wherein, the second heat absorption component includes a second semiconductor refrigeration chip and a second heat dissipation module. Along the first direction, the second heat dissipation module is located between the second semiconductor refrigeration chip and the second opening. The second semiconductor refrigeration chip is used to absorb the heat inside the second accommodation space and discharge it to the second heat dissipation module, and the second heat dissipation module is used to receive the heat and discharge it to the second opening. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0017] Figure 1 It is a schematic structural diagram of the radiator provided by the embodiment of the present invention;

[0018] Figure 2 It is a sectional view of the radiator provided by the embodiment of the present invention;

[0019] Figure 3 It is an exploded view of the radiator provided by the embodiment of the present invention;

[0020] Figure 4 It is an exploded view of the first heat dissipation module or the second heat dissipation module provided by the embodiment of the present invention;

[0021] Figure 5 Schematic diagram of another radiator provided by an embodiment of the present utility model;

[0022] Figure 6 Cross-sectional view of the inner shell provided by an embodiment of the present utility model;

[0023] Figure 7 Exploded view of still another radiator provided by an embodiment of the present utility model. Detailed implementation manners

[0024] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0025] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0026] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0027] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection, it may be a mechanical connection, it may be an electrical connection, it may be directly connected, or it may be indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0028] In a water-cooled heat dissipation system, the device for cooling water is usually called a radiator or a cooling radiator. The radiator is one of the core components in the water-cooled system. Its main function is to transfer the heat of the water-cooled liquid (usually water or a mixture of water and antifreeze) passing through the heat source (CPU, GPU or other heat-generating components) to the radiator, and then dissipate the heat into the air through the fins and fans of the radiator, thereby reducing the temperature of the water-cooled liquid.

[0029] In the prior art, a radiator generally drives air to flow through fins to cool the water-cooling liquid, so as to meet the heat dissipation requirements of the device. Therefore, the lowest temperature of the water-cooling liquid is affected by the temperature of the environment where the radiator is located. Therefore, when the ambient temperature is relatively high, the lowest temperature of the water-cooling liquid in the radiator will also be relatively high, thereby weakening the cooling ability of the water-cooling liquid for the heat source.

[0030] To solve the above technical problems, with reference to Figure 1 , Figure 2 and Figure 3 , an embodiment of the present application provides a radiator, which includes a housing 1 and a first heat absorption component 2. The housing 1 has a first accommodation space 1A and a second accommodation space 1B arranged in sequence along a first direction X. The second accommodation space 1B is used to accommodate a medium. The housing 1 has a first wall 101. Along the first direction X, the first accommodation space 1A is located between the first wall 101 and the second accommodation space 1B. The first wall 101 has a first opening 101A communicating with the first accommodation space 1A. The first direction X is parallel to the thickness direction of the housing 1. The first heat absorption component 2 is arranged in the first accommodation space 1A to adjust the temperature in the second accommodation space 1B. Among them, the first heat absorption component 2 includes a first semiconductor refrigeration chip 21 and a first heat dissipation module 22. Along the first direction X, the first heat dissipation module 22 is located between the first semiconductor refrigeration chip 21 and the first opening 101A. The first semiconductor refrigeration chip 21 is used to absorb the heat in the second accommodation space 1B and discharge it to the first heat dissipation module 22, and the first heat dissipation module 22 is used to receive the heat and discharge it to the first opening 101A.

[0031] The housing 1 is a component for accommodating the remaining components of the radiator to provide a stable working environment for the remaining components.

[0032] The first accommodation space 1A and the second accommodation space 1B are spaces arranged in sequence along the first direction X in the housing 1. It can be understood that the first accommodation space 1A and the second accommodation space 1B are different from each other. Among them, the second accommodation space 1B is used to accommodate a medium, and the above medium can be a liquid medium with fluidity. Exemplarily, the medium can be cooling water.

[0033] The first direction X can be parallel to the thickness direction of the housing 1, the second direction Y can be parallel to the width direction of the housing 1, and the third direction Z can be parallel to the length direction of the housing 1.

[0034] The first wall 101 is a wall portion of the housing 1 that is far from the second accommodation space 1B in the first direction X. Exemplarily, along the first direction X, the first accommodation space 1A is located between the first wall 101 and the second accommodation space 1B.

[0035] The first opening 101A is an opening provided on the first wall 101 for connecting the first accommodation space 1A to the outside. The first opening 101A can be of various shapes. Exemplarily, the first opening 101A can be circular, square, polygonal, etc., and this embodiment does not limit this.

[0036] The first thermoelectric cooler 21 is a component in the first heat absorption component 2 for absorbing the heat in the second accommodation space 1B. Specifically, a thermoelectric cooler refers to a device that utilizes the thermoelectric effect of semiconductors to produce cooling capacity, also known as a thermoelectric refrigerator. It is manufactured using heavily doped N-type and P-type bismuth telluride and two ceramic electrodes. The bismuth telluride elements are electrically connected in series and generate heat in parallel. The thermoelectric refrigerator includes some P-type and N-type pairs (groups), which are connected together through electrodes and sandwiched between two ceramic electrodes. When an electric current flows through the thermoelectric refrigerator, the heat generated by the current will be transferred from one side of the thermoelectric refrigerator to the other side, generating a "hot" side and a "cold" side on the thermoelectric refrigerator. (That is, the Peltier effect: when a direct current passes through an electric couple composed of two semiconductor materials, one end absorbs heat and the other end releases heat.) This is the heating and cooling principle of the thermoelectric refrigerator.

[0037] It can be understood that the cold side of the first thermoelectric cooler 21 is close to the second accommodation space 1B, and the hot side of the first thermoelectric cooler 21 is close to the first heat dissipation module 22.

[0038] The first heat dissipation module 22 is used to receive the heat dissipated from the hot side of the first thermoelectric cooler 21 and discharge it to the outside through the first opening 101A.

[0039] In this technical solution, the first heat absorption component 2 includes the first thermoelectric cooler 21 and the first heat dissipation module 22. Along the first direction X, the first heat dissipation module 22 is located between the first thermoelectric cooler 21 and the first opening 101A. The first thermoelectric cooler 21 is used to absorb the heat in the second accommodation space 1B and discharge it to the first heat dissipation module 22. The first heat dissipation module 22 is used to receive the heat and discharge it to the first opening 101A. Thus, in a high-temperature environment, the first thermoelectric cooler 21 can still further absorb the heat in the second accommodation space 1B, so that the temperature in the second accommodation space 1B is further reduced, so that the temperature of the medium in the second accommodation space 1B is lower than the ambient temperature, and then the lowest temperature of the water-cooled liquid in the radiator is reduced in a high-temperature environment to provide a medium with a lower temperature to the heat source.

[0040] According to some embodiments of the present application, refer to Figure 1 and Figure 4, the first heat dissipation module 22 includes first heat dissipation fins 221. The first heat dissipation fins 221 are multiple and are spaced along the second direction Y. Each first heat dissipation fin 221 extends along the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other in pairs.

[0041] The first heat dissipation fin 221 can be a plate-shaped part. Understandably, the first heat dissipation fin 221 should be made of a heat-conducting material. Exemplarily, the first heat dissipation fin 221 is made of a metal material.

[0042] In some embodiments, the width direction of the first heat dissipation fin 221 is parallel to the first direction X, the length direction of the first heat dissipation fin 221 is parallel to the third direction Z, and the thickness direction of the first heat dissipation fin 221 is parallel to the second direction Y.

[0043] In some embodiments, the two ends of the first heat dissipation fin 221 in the third direction Z are respectively connected to the third wall 103 and the fourth wall 104 that are oppositely arranged in the third direction Z of the first mounting frame 222.

[0044] In this technical solution, the first heat dissipation fins 221 are multiple and are spaced along the second direction Y. Each first heat dissipation fin 221 extends along the third direction Z, thereby increasing the heat dissipation area of the first heat dissipation module 22 through the first heat dissipation fins 221 and increasing the heat dissipation efficiency of the first heat dissipation module 22.

[0045] According to some embodiments of the present application, refer to Figure 4 , the first heat dissipation module 22 further includes a first mounting frame 222. The first mounting frame 222 is arranged in the first accommodation space 1A. The two ends of the first heat dissipation fin 221 in the third direction Z are respectively connected to the two inner walls of the first mounting frame 222 that are oppositely arranged in the third direction Z.

[0046] The first mounting frame 222 is a component for connecting multiple first heat dissipation fins 221. Understandably, the first mounting frame 222 should be made of a heat-conducting material. Exemplarily, the first mounting frame 222 is made of a metal material.

[0047] In some embodiments, the first heat dissipation module 22 further includes a first support plate 223. The first support plate 223 is arranged on the side of the first mounting frame 222 close to the first semiconductor refrigeration chip 21 in the first direction X and abuts against the first heat dissipation fin 221.

[0048] Specifically, on the one hand, the first support plate 223 is arranged on one side of the first mounting frame 222 close to the first semiconductor refrigeration chip 21 in the first direction X, which increases the structural strength of the first mounting frame 222. On the other hand, the first support plate 223 abuts against the first heat sink 221, thereby increasing the area where the first heat dissipation module 22 can abut against the first semiconductor refrigeration chip 21, and thus increasing the heat exchange area between the first heat dissipation module 22 and the first semiconductor refrigeration chip 21.

[0049] In this technical solution, a plurality of first heat sinks 221 are connected by the first mounting frame 222 to increase the integrity of the first heat dissipation module 22, facilitating the disassembly and installation of the first heat dissipation module 22.

[0050] According to some embodiments of the present application, referring to Figure 5 , the first heat dissipation module 22 further includes a blower 5, and the blower 5 is arranged at the first opening 101A to drive the air in the first accommodation space 1A to leave the first accommodation space 1A from the first opening 101A.

[0051] The blower 5 is a device for driving the air in the first accommodation space 1A to leave the first accommodation space 1A from the first opening 101A. Exemplarily, the blower 5 can be a fan.

[0052] In this technical solution, the device drives the air in the first accommodation space 1A to leave the first accommodation space 1A through the blower 5, so as to drive the heat to be quickly released to the outside, and the structure is simple and easy to implement.

[0053] According to some embodiments of the present application, referring to Figure 2 and Figure 3 , along the first direction X, the first semiconductor refrigeration chip 21 has a first surface and a second surface arranged opposite to each other. The first surface is attached to the inner surface of the first accommodation space 1A close to the second accommodation space 1B, and the second surface is attached to the first heat dissipation module 22.

[0054] It can be understood that the first surface is the cold side of the first semiconductor refrigeration chip 21, and the second surface is the hot side of the first semiconductor refrigeration chip 21.

[0055] According to some embodiments of the present application, referring to Figure 2 and Figure 3 , the first surface and the second surface are the surfaces with the largest area of the first semiconductor refrigeration chip 21.

[0056] In this technical solution, on the one hand, the first surface is the largest surface area of the first semiconductor refrigeration chip 21, thereby increasing the area of the first semiconductor refrigeration chip 21 for heat exchange with the second accommodation space 1B, thus enhancing the cooling effect of the first semiconductor refrigeration chip 21. On the other hand, the second surface is the largest surface area of the first semiconductor refrigeration chip 21, thereby increasing the area of the first semiconductor refrigeration chip 21 for heat exchange with the first heat dissipation module 22, thus enhancing the heat dissipation effect of the first semiconductor refrigeration chip 21.

[0057] According to some embodiments of the present application, the first semiconductor refrigeration chips 21 are arranged in multiple rows spaced along the second direction Y, and each row of the first semiconductor refrigeration chips 21 is arranged in multiple pieces spaced along the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other in pairs.

[0058] In this technical solution, the first semiconductor refrigeration chips 21 are arranged in multiple rows spaced along the second direction Y, and each row of the first semiconductor refrigeration chips 21 is arranged in multiple pieces spaced along the third direction Z, thereby making full use of the space of the first accommodation space 1A in the second direction Y and the third direction Z, and enhancing the cooling capacity of the radiator for the medium.

[0059] According to some embodiments of the present application, referring to Figure 2 and Figure 6 , the radiator further includes an inlet pipe 4 and an outlet pipe 41. Along the second direction Y, the housing 1 has a third wall 103 and a fourth wall 104 which are oppositely arranged. The inlet pipe 4 is arranged on the third wall 103 and is in communication with the interior of the second accommodation space 1B, and the outlet pipe 41 is arranged on the fourth wall 104 and is in communication with the interior of the second accommodation space 1B. The second accommodation space 1B is a flow channel arranged in a meandering manner, and the second direction Y is perpendicular to the first direction X.

[0060] The third wall 103 and the fourth wall 104 are two wall portions of the housing 1 oppositely arranged in the third direction Z.

[0061] The inlet pipe 4 is a pipe body for supplying the medium to flow into the second accommodation space 1B, and the outlet pipe 41 is a pipe body for supplying the medium to flow out of the second accommodation space 1B.

[0062] It can be understood that the inlet pipe 4 and the outlet pipe 41 are respectively located on the third wall 103 and the fourth wall 104 to reduce the risk of interference between the inlet pipe 4 and the outlet pipe 41 and the first heat absorption component 2.

[0063] In this technical solution, the second accommodation space 1B is a flow channel arranged in a meandering manner, thereby increasing the flow distance of the medium in the second accommodation space 1B, so as to facilitate the first semiconductor refrigeration chip 21 to fully absorb the heat of the medium.

[0064] According to some embodiments of the present application, referring to Figure 3 、Figure 5 and Figure 6 The housing 1 includes an outer housing 11 and an inner housing 12. The inner housing 12 is disposed inside the outer housing 11. A second accommodation space 1B is provided inside the inner housing 12. A part of the outer surface of the inner housing 12 and a part of the inner surface of the outer housing 11 enclose to form a first accommodation space 1A.

[0065] In this technical solution, by setting the housing 1 as a split design including the outer housing 11 and the inner housing 12, and by providing the second accommodation space 1B inside the inner housing 12, the processing difficulty of the housing 1 is reduced compared with the integral design of the housing 1, and thus the production cost of the radiator is reduced.

[0066] According to some embodiments of the present application, referring to Figure 4 and Figure 6 The radiator further includes a second heat absorption component 3. A third accommodation space is also provided inside the housing 1. Along the first direction X, the second accommodation space 1B is located between the first accommodation space 1A and the third accommodation space. The housing 1 has a second wall corresponding to the first wall 101, and a second opening communicating with the second accommodation space 1B is provided on the second wall. The second heat absorption component 3 is disposed in the third accommodation space to adjust the temperature inside the second accommodation space 1B. Wherein, the second heat absorption component 3 includes a second semiconductor refrigeration sheet 31 and a second heat dissipation module 32. Along the first direction X, the second heat dissipation module 32 is located between the second semiconductor refrigeration sheet 31 and the second opening. The second semiconductor refrigeration sheet 31 is used to absorb the heat inside the second accommodation space 1B and discharge it to the second heat dissipation module 32, and the second heat dissipation module 32 is used to receive the heat and discharge it to the second opening.

[0067] In some embodiments, the second heat dissipation module 32 includes a second heat dissipation fin 321. The second heat dissipation fins 321 are multiple and are spaced apart along the second direction Y. Each second heat dissipation fin 321 extends along the third direction Z. The second heat dissipation module 32 further includes a second mounting frame 322. The second mounting frame 322 is disposed inside the second accommodation space 1B. Two ends of the second heat dissipation fin 321 in the third direction Z are respectively connected to two inner walls of the second mounting frame 322 that are oppositely disposed in the third direction Z. The second heat dissipation module 32 further includes a second support plate 323. The second support plate 323 is disposed on a side of the second mounting frame 322 close to the second semiconductor refrigeration sheet 31 in the first direction X and abuts against the second heat dissipation fin 321.

[0068] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other.

[0069] The above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. For those skilled in the art, various modifications and variations can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A radiator, characterized in that: include: A shell having a first accommodating space and a second accommodating space arranged in sequence along a first direction, wherein the second accommodating space is used to accommodate a medium, the shell having a first wall, along the first direction, the first accommodating space is located between the first wall and the second accommodating space, the first wall having a first opening communicating with the first accommodating space, and the first direction is parallel to a thickness direction of the shell; A first heat absorbing component is disposed in the first accommodation space to adjust the temperature in the second accommodation space; Among them, the first heat absorption component includes a first semiconductor refrigeration plate and a first heat dissipation module. Along the first direction, the first heat dissipation module is located between the first semiconductor refrigeration plate and the first opening. The first semiconductor refrigeration plate is used to absorb heat in the second accommodation space and discharge it to the first heat dissipation module. The first heat dissipation module is used to receive heat and discharge it to the first opening.

2. The heat sink according to claim 1, characterized in that: The first heat dissipation module includes a plurality of first heat dissipation fins spaced apart along a second direction, each of the first heat dissipation fins extends along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

3. The heat sink according to claim 2, characterized in that: The first heat dissipation module further includes a first installation frame, which is disposed in the first accommodation space, and the first heat sink is connected at two ends in the third direction to two inner walls of the first installation frame that are oppositely disposed in the third direction.

4. The heat sink according to claim 2, characterized in that: The first heat dissipation module further includes a fan, and the fan is disposed at the first opening to drive the air in the first accommodation space to leave the first accommodation space through the first opening.

5. The heat sink according to claim 1, characterized in that Along the first direction, the first semiconductor refrigeration sheet has a first surface and a second surface that are arranged opposite to each other, the first surface is attached to the inner surface of the first accommodation space close to the second accommodation space, and the second surface is attached to the first heat dissipation module.

6. The heat sink according to claim 5, characterized in that: The first surface and the second surface are surfaces with the largest areas of the first semiconductor refrigeration plate.

7. The heat sink according to claim 5, characterized in that: The first semiconductor refrigeration plates are arranged in a plurality of rows at intervals along the second direction, and each row of the first semiconductor refrigeration plates is arranged in a plurality at intervals along the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

8. The heat sink according to claim 1, characterized in that The radiator also includes a liquid inlet pipe and a liquid outlet pipe. Along the second direction, the shell has a third wall and a fourth wall arranged opposite to each other. The liquid inlet pipe is arranged on the third wall and communicated with the second storage space. The liquid outlet pipe is arranged on the fourth wall and communicated with the second storage space. The second storage space is a circuitous flow channel. The second direction is perpendicular to the first direction.

9. The heat sink according to claim 8, characterized in that: The housing comprises: An outer shell and an inner shell, wherein the inner shell is arranged inside the outer shell, the inner shell has the second accommodation space, and a part of the outer surface of the inner shell and a part of the inner surface of the outer shell are arranged to enclose the first accommodation space.

10. The radiator according to any one of claims 1 to 9, characterized in that: The radiator further includes a second heat absorption component, the shell further includes a third accommodation space, along the first direction, the second accommodation space is located between the first accommodation space and the third accommodation space, the shell includes a second wall corresponding to the first wall, and the second wall includes a second opening communicating with the second accommodation space; The second heat absorption component is disposed in the third accommodation space to adjust the temperature in the second accommodation space; Among them, the second heat absorption component includes a second semiconductor refrigeration plate and a second heat dissipation module. Along the first direction, the second heat dissipation module is located between the second semiconductor refrigeration plate and the second opening. The second semiconductor refrigeration plate is used to absorb heat in the second accommodation space and discharge it to the second heat dissipation module. The second heat dissipation module is used to receive heat and discharge it to the second opening.

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