Carrier tape structure of double-interface intelligent card module

Abstract

The utility model belongs to the double-interface intelligent card chip packaging technology, and particularly relates to a carrier tape structure of a double-interface intelligent card module, which comprises a contact surface metal layer and a polymer fiber layer which are connected with each other, a plurality of grooves and a plurality of bonding wire holes are arranged on the polymer fiber layer, and the grooves and the bonding wire holes penetrate through the polymer fiber layer. And printing a conductive paste layer in the grooves and between the grooves. According to the utility model, the contact surface metal layer is fully utilized, the bonding wire and the conductive slurry layer are connected, the conduction of the chip welding spot and the external antenna is completed, and the non-contact function of the double-interface module is realized; etching metal copper for conducting antenna welding spots is not used any more, so that environmental pollution and resource waste caused by etching a large amount of copper are avoided; by printing the conductive paste layer, internal and external antenna welding spots can be quickly attached and filled on the polymer fiber layer.

Description

Technical Field

[0001] The utility model relates to a dual-interface smart card chip packaging technology, which is used for packaging a dual-interface smart card module, and particularly relates to a carrier tape structure of a dual-interface smart card module. Background Art

[0002] As Figure 1 shown, the carrier tape of a traditional dual-interface smart card module is a three-layer structure, including a metal layer on the contact surface, a middle polymer fiber layer, and a welding layer for antenna connection.

[0003] The metal pads for connecting the card base antenna, the metal lines of the connecting solder joints, and the antenna solder joints are all made of a whole piece of metal copper foil etched and bonded on the fiber layer. The antenna solder joints on the chip are connected to the solder joints on the carrier tape through bonding wires, and then connected to the pads for connecting the card base antenna through the etched metal lines to complete the conduction of the circuit.

[0004] Since the dual-interface smart card module has the functions of contact and non-contact conduction, its application fields are wider than those of single-interface contact smart cards. However, due to the addition of a metal copper foil layer for connecting the antenna compared with the single-interface contact module, the cost has almost doubled or even increased more. Only one-tenth of the whole copper foil layer is etched and reserved for the antenna and connection parts, which is a great waste of material application. Content of the Utility Model

[0005] The purpose of the utility model is to solve the technical problem of high material cost of the carrier tape of the dual-interface module. For this reason, a carrier tape structure of a dual-interface smart card module is provided, in which a conductive metal paste is printed on the polymer fiber layer instead of etching metal copper.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] A carrier tape structure of a dual-interface smart card module includes a contact surface metal layer and a polymer fiber layer connected to each other. A plurality of grooves are formed in the polymer fiber layer, and the grooves penetrate through the polymer fiber layer. A conductive paste layer is printed in the grooves and between the grooves.

[0008] The following is a further limited technical solution of the utility model. A plurality of bonding wire holes are formed in the polymer fiber layer, and the bonding wire holes penetrate through the polymer fiber layer.

[0009] The following is a further limited technical solution of the utility model. The conductive paste layer is connected to the contact surface metal layer, and the contact surface metal layer is connected to the bonding wires in the bonding wire holes.

[0010] The following are the further defined technical solutions of the present utility model. The cross-section of the groove is set as a rectangle, and the cross-section of the wire bonding hole is set as a circle or an ellipse.

[0011] Compared with the prior art, the present utility model has the following technical effects:

[0012] The present utility model makes full use of the contact surface metal layer, connects the wire bonding and the conductive paste layer, completes the conduction between the chip solder joint and the external antenna, and realizes the non-contact function of the dual-interface module; it no longer uses etched metallic copper for the conductive antenna solder joints, eliminating environmental pollution and waste of resources caused by etching a large amount of copper; by printing the conductive paste layer, the internal and external antenna solder joints can be quickly attached and filled on the polymer fiber layer.

[0013] The following further describes the present utility model in conjunction with the drawings and embodiments. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the embodiments or the prior art. Obviously, the following-described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0015] Figure 1 is a schematic structural diagram of the carrier tape of a dual-interface smart card module in the prior art;

[0016] Figure 2 is a schematic structural diagram of the present utility model without the printed conductive paste layer;

[0017] Figure 3 On the left is a schematic structural diagram of the printing screen plate when the present utility model prints the conductive paste layer, Figure 3 and on the right is a schematic structural diagram of the present utility model after printing the conductive paste layer;

[0018] Figure 4 is a schematic structural diagram of the contact surface and the encapsulation surface of the present utility model after printing the conductive paste layer;

[0019] Figure 5 is a schematic partial structural diagram of the present utility model without the printed conductive paste layer, where, Figure 5 the upper side is a top view structural diagram; Figure 5 the lower side is a cross-sectional structural diagram;

[0020] Figure 6 is a schematic diagram of the present utility model realizing the conduction between the chip antenna solder joint and the conductive paste.

[0021] Figure numerals: 1. contact surface metal layer; 2. polymer fiber layer; 3. groove; 4. conductive paste layer; 5. welding wire hole; 6. welding wire. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0023] In the embodiments of the present invention, unless otherwise clearly specified and limited, the term "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0024] like Figure 2-6 As shown, a carrier tape structure of a dual-interface smart card module is provided.

[0025] like Figure 5 and 6 As shown, the carrier structure includes a contact surface metal layer 1 and a polymer fiber layer 2 connected to each other. Figure 2 As shown, 2-4 elliptical or circular welding holes 5 are cut on the polymer fiber layer 2 for connecting with the antenna welding points on the chip through welding wires 6. At the same time, 2-4 rectangular grooves 3 are cut on the polymer fiber layer 2. The grooves 3 and the welding holes 5 both penetrate the polymer fiber layer 2.

[0026] like Figure 3 As shown, a conductive paste is printed using a printing screen, so that a conductive paste layer 4 is printed in the groove 3 and between the grooves 3. The conductive paste layer 4 is connected to the contact surface metal layer 1, and the contact surface metal layer 1 is connected to the welding wire 6 in the welding wire hole 5, as shown in FIG. Figure 6 As shown, with the help of the contact surface metal layer 1, the bonding wire 6 and the conductive paste layer 4 are connected, the conduction between the chip solder joint and the external antenna is completed, and the non-contact function of the dual-interface module is realized.

[0027] like Figure 4 As shown, after printing the conductive paste layer 4, the left side is the contact surface of the carrier structure, and the right side is the packaging surface of the carrier structure.

[0028] The above are only the preferred embodiments of the present utility model, and do not impose any formal restrictions on the present utility model. Any person skilled in the art can, without departing from the scope of the technical solution of the present utility model, make many possible changes and modifications to the technical solution of the present utility model by using the methods and technical contents disclosed above, or modify it into equivalent embodiments with equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the present utility model without departing from the content of the technical solution of the present utility model shall be covered by the protection scope of the present utility model.

Claims

1. A carrier structure of a dual-interface smart card module, characterized in that: The invention comprises a contact surface metal layer (1) and a polymer fiber layer (2) connected to each other, wherein a plurality of grooves (3) are provided on the polymer fiber layer (2), the grooves (3) penetrate the polymer fiber layer (2), and a conductive paste layer (4) is printed in the grooves (3) and between the grooves (3).

2. The carrier tape structure of a dual-interface smart card module according to claim 1, characterized in that: A plurality of welding wire holes (5) are provided on the polymer fiber layer (2), and the welding wire holes (5) penetrate the polymer fiber layer (2).

3. The carrier tape structure of a dual-interface smart card module according to claim 2, characterized in that: The conductive paste layer (4) is connected to the contact surface metal layer (1), and the contact surface metal layer (1) is connected to the welding wire (6) in the welding wire hole (5).

4. The carrier tape structure of a dual-interface smart card module according to claim 2, characterized in that: The cross section of the groove (3) is set to be rectangular, and the cross section of the welding wire hole (5) is set to be circular or elliptical.

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