SMT (Surface Mount Technology) audio frequency common-mode filter inductor and assembly shell thereof

Abstract

The utility model relates to the technical field of inductors, in particular to an SMT audio frequency common-mode filter inductor and an assembly shell thereof, the SMT audio frequency common-mode filter inductor comprises a shell and a barrier plate in the shell, the barrier plate is fixedly connected in the shell, the bottom of the shell is provided with a bottom shell used for installing the inductor, and two ends of the bottom shell are fixedly provided with a pair of pins. The inductors are separated through the baffle, so that electromagnetic interference between the inductors is effectively reduced, and the purity and stability of audio signals are improved. An effective isolation structure is arranged on the inner side of the bottom shell, so that a relatively independent space can be kept when the inductor is installed, and mutual interference is reduced. By means of the design, the consistency during bottom surface mounting can be improved, it is ensured that the position of the inductor on the circuit board is accurate and stable, and the performance problem caused by position deviation or poor contact can be avoided. The method has the effect of improving the consistency of bottom patches of the printed circuit board.

Description

Technical Field

[0001] This application relates to the technical field of inductors, in particular to an SMT audio common-mode filtering inductor and its assembly case. Background Art

[0002] An audio common-mode filtering inductor is an electronic component using surface mount technology, which is used in audio devices to filter out common-mode noise on power lines and improve the purity of audio signals. Through its special structure and parameter design, the common-mode filtering inductor can effectively block the transmission of common-mode signals and has little effect on differential-mode signals. It usually consists of coils wound on a magnetic core, and the coil parameters in the coils and the material selection of the magnetic core will affect the performance of the common-mode filtering inductor.

[0003] During the working process, the common-mode filtering inductor mainly plays two roles: First, it can provide a high-impedance path, making the common-mode signal unable to pass through the coils of the inductor; Second, it can also provide a low-impedance path, enabling the differential-mode signal to pass through the coils of the inductor smoothly and ensuring the transmission quality.

[0004] In the prior art, when manually performing bottom soldering of inductors, correction and fixation are usually required to improve the accuracy of soldering. However, excessive manual soldering will cause fatigue and may lead to errors. Therefore, this application provides an SMT audio common-mode filtering inductor and its assembly case. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the purpose of this application is an SMT audio common-mode filtering inductor and its assembly case, which is used to solve the technical problem of low accuracy during bottom soldering.

[0006] The above object of this application is achieved through the following technical solutions: An assembly case of an SMT audio common-mode filtering inductor includes a housing and a partition board inside the housing. The partition board is fixedly connected inside the housing. A bottom case for installing the inductor is provided at the bottom of the housing, and a pair of pins are fixedly provided at both ends of the bottom case.

[0007] By adopting the above technical solutions, by arranging a housing outside the bottom case and a partition board inside the housing, after being installed on the bottom case, the inductors are separated by the partition board, thereby effectively reducing the electromagnetic interference between the inductors and improving the purity and stability of the audio signal. By adopting the design of the partition board in this technical solution, an effective isolation structure can be set inside the bottom case, enabling the inductors to maintain a relatively independent space during installation and reducing the interference between each other. This design can not only improve the consistency during bottom soldering, ensure the accurate and stable position of the inductors on the circuit board, but also avoid performance problems caused by position deviation or poor contact.

[0008] Furthermore, the outer shell is plugged on the outside of the bottom shell.

[0009] By adopting the above technical solution, the design that the outer shell is plugged on the outside of the bottom shell realizes the modular assembly of the assembled shell, making the installation and disassembly processes more convenient and rapid. This plugging method not only improves the flexibility of assembly but also helps to quickly disassemble when repairing or replacing the inductor, reducing the maintenance cost.

[0010] Furthermore, chutes matching the partition board are provided at both ends inside the bottom shell, and the partition board is plugged on the bottom shell through the chutes.

[0011] By adopting the above technical solution, the partition board is plugged on the bottom shell through the chutes, further enhancing the convenience and stability of the assembled shell. This design allows the partition board to be precisely inserted into the predetermined position, ensuring proper isolation and support of the inductor inside the assembled shell. The design of the chutes makes the installation process of the partition board simpler and more intuitive, reducing the risk of installation errors or position offsets caused by improper operation.

[0012] Furthermore, an SMT patch red glue layer is coated on the chute connection of the partition board.

[0013] By adopting the above technical solution, an SMT patch red glue layer is coated on the chute connection of the partition board, significantly enhancing the connection stability and reliability between the partition board and the bottom shell. SMT patch red glue is an adhesive designed specifically for the SMT process. It has characteristics such as high temperature resistance, no component dropping, and no wire drawing, which can ensure that the partition board is firmly fixed on the bottom shell after being inserted into the chute, preventing loosening or falling off caused by vibration or impact.

[0014] Furthermore, the distance between the pins on each side is 2.1 - 2.5 mm.

[0015] By adopting the above technical solution, this distance design meets the requirements of most SMT processes for pin pitch, ensuring that the inductor assembled shell can be easily matched and integrated with a standard circuit board, improving the compatibility and versatility of the assembly.

[0016] Furthermore, an identification board is fixedly arranged on the top of the outer shell.

[0017] By adopting the above technical solution, the presence of the identification board enables users to quickly find the required inductor when assembling or repairing the circuit board, improving work efficiency. Users no longer need to spend time searching or confirming the model and specifications of the inductor. They can easily complete the matching and installation according to the information on the identification board.

[0018] Further, an SMT audio common-mode filtering inductor is applicable to the assembly case of the SMT audio common-mode filtering inductor described in any one of the above technical solutions, and includes a pair of inductor coils. A magnetic core is arranged inside each of the pair of inductor coils, and pins are fixedly connected to both ends of the magnetic core.

[0019] By adopting the above technical solution, the magnetic core, as an important part of the inductor, the pins fixedly connected to both ends thereof not only facilitate the connection between the inductor and the circuit board, but also ensure that the current can pass through the inductor smoothly. This design enables the inductor to effectively filter out common-mode noise in the audio circuit and improve the purity and quality of the audio signal.

[0020] Further, the distance between the inductor coils is 4 - 4.5 mm.

[0021] By adopting the above technical solution, an appropriate distance between the inductor coils helps to reduce the electromagnetic coupling between the inductors, reduce mutual interference, and thus improve the independence and filtering effect of the inductor. Secondly, a reasonable distance between the inductor coils also helps to optimize the heat dissipation performance of the inductor.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. By arranging a partition board inside the outer shell, the electromagnetic interference between the inductors is effectively reduced, and the purity and stability of the audio signal are improved. This design not only improves the consistency during bottom soldering, but also ensures that the inductors are accurately and stably positioned on the circuit board.

[0024] 2. The partition board is inserted into the bottom shell through a chute. Combining with the use of the SMT patch red glue layer, the stability and reliability of the assembly case are significantly enhanced. This modular design simplifies the installation and disassembly processes and reduces the maintenance cost.

[0025] 3. The distance between the inductor coils is controlled within 4 - 4.5 mm, which not only reduces the electromagnetic coupling and interference, but also optimizes the heat dissipation performance of the inductor. This design ensures the high-efficiency filtering effect of the inductor in the audio circuit and improves the quality of the audio signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of the overall structure in the embodiment;

[0027] Figure 2 is a schematic diagram of the overall structure from another perspective in the embodiment;

[0028] Figure 3 is in the embodiment Figure 2 partial enlarged schematic diagram of part A therein.

[0029] Reference signs: 1, outer shell; 11, partition board; 2, bottom shell; 3, pin; 4, chute; 5, SMT patch red glue layer; 6, identification board; 7, inductor coil; 71, magnetic core. Specific implementation mode

[0030] The following further details the present application in conjunction with the accompanying drawings.

[0031] Example, referring to Figure 1 , Figure 2 and Figure 3 , an assembly shell for an SMT audio common-mode filtering inductor, including an outer shell 1 and a partition board 11 inside the outer shell 1. The partition board 11 is fixedly connected inside the outer shell 1. A bottom shell 2 for installing the inductor is arranged at the bottom of the outer shell 1. A pair of pins 3 are fixedly arranged at both ends of the bottom shell 2. By arranging the outer shell 1 on the outside of the bottom shell 2 and the partition board 11 on the inside of the outer shell 1, after being installed on the bottom shell 2, the inductors are separated by the partition board 11, thereby effectively reducing the electromagnetic interference between the inductors and improving the purity and stability of the audio signal. By adopting the design of the partition board 11 in this technical solution, an effective isolation structure can be arranged on the inside of the bottom shell 2, so that the inductors can maintain relatively independent spaces during installation and reduce the interference between each other. This design can not only improve the consistency during bottom patching, ensure the accurate and stable position of the inductors on the circuit board, but also avoid performance problems caused by position deviation or poor contact.

[0032] In this embodiment, the outer shell 1 is inserted on the outside of the bottom shell 2. The design of inserting the outer shell 1 on the outside of the bottom shell 2 realizes the modular assembly of the assembly shell, making the installation and disassembly processes simpler and faster. This insertion method not only improves the flexibility of assembly, but also helps to quickly disassemble during the maintenance or replacement of the inductor, reducing the maintenance cost.

[0033] In this embodiment, chutes 4 matching the partition board 11 are opened at both ends inside the bottom shell 2, and the partition board 11 is inserted on the bottom shell 2 through the chutes 4. The partition board 11 is inserted on the bottom shell 2 through the chutes 4, further enhancing the convenience and stability of the assembly shell. This design allows the partition board 11 to be accurately inserted into the predetermined position, ensuring proper isolation and support of the inductors inside the assembly shell. The design of the chutes 4 makes the installation process of the partition board 11 simpler and more intuitive, reducing the risk of installation errors or position deviation caused by improper operation.

[0034] In this embodiment, an SMT patch red glue layer 5 is coated on the connection part of the partition board 11 and the chute 4. Coating the SMT patch red glue layer 5 on the connection part of the partition board 11 and the chute 4 significantly enhances the connection stability and reliability between the partition board 11 and the bottom shell 2. SMT patch red glue is an adhesive specifically designed for the SMT process. It has characteristics such as high temperature resistance, no component dropping, and no wire drawing, which can ensure that the partition board 11 is firmly fixed on the bottom shell 2 after being inserted into the chute 4, preventing loosening or falling off caused by vibration or impact.

[0035] In this embodiment, the distance between the pins 3 on each side is 2.1 - 2.5 mm. This distance design meets the requirements of most SMT processes for the pin 3 pitch, ensuring that the inductance assembly case can be easily matched and integrated with a standard circuit board, improving the compatibility and versatility of the assembly.

[0036] In this embodiment, an identification board 6 is fixedly arranged on the top of the outer shell 1. The presence of the identification board 6 enables users to quickly find the required inductor when assembling or repairing the circuit board, improving work efficiency. Users no longer need to spend time searching or confirming the model and specifications of the inductor. They can easily complete matching and installation according to the information on the identification board 6.

[0037] In this embodiment, an SMT audio common mode filter inductor includes a pair of inductor coils 7. A magnetic core 71 is arranged inside each of the pair of inductor coils 7. Pins 3 are fixedly connected to both ends of the magnetic core 71. As an important part of the inductor, the pins 3 fixedly connected to both ends of the magnetic core 71 not only facilitate the connection between the inductor and the circuit board but also ensure that current can flow smoothly through the inductor. This design enables the inductor to effectively filter out common mode noise in the audio circuit, improving the purity and quality of the audio signal.

[0038] In this embodiment, the distance between the inductor coils 7 is 4 mm. An appropriate distance between the inductor coils 7 helps reduce the electromagnetic coupling between the inductors, reduce mutual interference, and thus improve the independence and filtering effect of the inductor. Secondly, a reasonable distance between the inductor coils 7 also helps optimize the heat dissipation performance of the inductor.

[0039] Specific implementation process:

[0040] First, place the printed circuit board (PCB) on a horizontal plane in advance, and apply a thin layer of SMT patch red glue at the connection between the partition board 11 and the chute 4 of the bottom case 2. Ensure that the red glue is evenly distributed without being too much or too little. Align the outer shell 1 with the position where the SMT audio common mode inductor needs to be installed, align the partition board 11 with the chute 4 inside the bottom case 2, and gently insert it. Ensure that the partition board 11 is fully inserted and in the correct position, and gently press the partition board 11 to make it fit tightly with the chute 4 of the bottom case 2, ensuring that the SMT patch red glue can fully play its bonding role. Wait for a period of time according to the curing time of the SMT patch red glue to ensure a firm connection between the partition board 11 and the bottom case 2. Place a pair of inductor coils 7 (with the magnetic core 71 and pins 3 already installed) on the bottom case 2, ensuring an appropriate spacing between the inductor coils 7 and the partition board 11. Check whether the pins 3 are aligned with the pin 3 holes on the bottom case 2, and gently press the inductor into the bottom case 2 to ensure that the pins 3 are firmly inserted into the pin 3 holes. Align the outer shell 1 with the bottom case 2, ensuring that the interfaces of the outer shell 1 and the bottom case 2 are aligned. Gently press the outer shell 1 to make it fit completely with the bottom case 2 to complete the assembly of the assembled shell. According to needs, fixedly set an identification board 6 on the top of the outer shell 1, and the identification board 6 should contain information such as the model and specifications of the inductor.

[0041] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of the application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application shall be covered within the protection scope of this application.

Claims

1. An assembly shell of an SMT audio common mode filter inductor, characterized in that: The invention comprises a housing (1) and a baffle plate (11) inside the housing (1), wherein the baffle plate (11) is fixedly connected inside the housing (1), a bottom housing (2) for mounting an inductor is arranged at the bottom of the housing (1), and a pair of pins (3) are fixedly arranged at both ends of the bottom housing (2).

2. The assembly shell of an SMT audio common mode filter inductor according to claim 1, characterized in that: The inner surface of the outer shell (1) is in contact with the outer surface of the bottom shell (2).

3. The assembly shell of an SMT audio common mode filter inductor according to claim 2, characterized in that: Slide grooves (4) matching the blocking plate (11) are provided at both ends of the inner side of the bottom shell (2), and the blocking plate (11) is plugged into the bottom shell (2) through the slide grooves (4).

4. The assembly shell of an SMT audio common mode filter inductor according to claim 3, characterized in that: The barrier plate (11) is coated with an SMT patch red glue layer (5) at the connection point of the slide groove (4).

5. The assembly shell of an SMT audio common mode filter inductor according to claim 1, characterized in that: The distance between the pins (3) on each side is 2.1-2.5 mm.

6. The assembly shell of an SMT audio common mode filter inductor according to claim 1, characterized in that: A marking plate (6) is fixedly arranged on the top of the housing (1).

7. An SMT audio common mode filter inductor, suitable for an assembly shell of an SMT audio common mode filter inductor as claimed in any one of claims 1 to 6, characterized in that: It also comprises a pair of inductors (7), each of which has a magnetic core (71) disposed therein, and both ends of the magnetic core (71) are fixedly connected to the pins (3).

8. The SMT audio common mode filter inductor according to claim 7, characterized in that: The distance between a pair of the inductor coils (7) is 4-4.5 mm.

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