Adjustable turnover sealing device for cover plate of large-scale cavity of generic semiconductor

Abstract

The utility model discloses an adjustable turnover sealing device for a cover plate of a large-scale cavity of a generic semiconductor, which relates to the technical field of manufacturing of large-scale vacuum equipment of the generic semiconductor and comprises a turnover sealing cover plate arranged at the top end of the large-scale cavity of the generic semiconductor, and a reinforcing mounting frame is arranged at the top end of the turnover sealing cover plate. A plurality of flexible adjusting mechanisms are arranged on one side of the top end of the reinforcing mounting frame, and a driving mechanism is arranged at one end of each flexible adjusting mechanism; and a supporting rotating mechanism is arranged on one side of the overturning sealing cover plate. According to the utility model, the structure is reasonable and reliable, the adjusting process of the turnover cover plate is simplified through an adjustable bolt mechanism, the operation convenience and the sealing reliability are improved, the problem that the turnover sealing adjustment of the large cavity cover plate is difficult is solved, and the assembly time and the processing cost are saved for the early-stage installation and debugging.

Description

Technical Field

[0001] The utility model relates to the technical field of the manufacture of large-scale vacuum equipment for pan-semiconductors. Specifically, it relates to an adjustable flipping and sealing device for the cover plate of a large-scale cavity of pan-semiconductors. Background Art

[0002] Large-scale vacuum equipment for pan-semiconductors refers to a series of production equipment used in the semiconductor manufacturing process under high-precision and high-vacuum conditions. Such equipment is mainly used in processes such as material deposition, etching, ion implantation, chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), as well as cleaning and detection.

[0003] During the manufacturing process of large-scale vacuum equipment for pan-semiconductors, the sealing performance of the cavity is crucial for maintaining the stability of the process environment and the quality of products. Traditional flipping and sealing devices for cavity cover plates often have problems such as difficult adjustment and poor stability, resulting in long assembly time, high processing costs, and inconvenience for product debugging and maintenance. Traditional flipping and sealing devices are often difficult to adjust and are not convenient for maintenance and debugging, which limits the improvement of production efficiency.

[0004] In response to the problems in the related art, no effective solution has been proposed yet. Content of the Utility Model

[0005] In response to the problems in the related art, the utility model proposes an adjustable flipping and sealing device for the cover plate of a large-scale cavity of pan-semiconductors to overcome the above-mentioned technical problems existing in the existing related art.

[0006] For this reason, the specific technical solution adopted by the utility model is as follows:

[0007] An adjustable flipping and sealing device for the cover plate of a large-scale cavity of pan-semiconductors includes a flipping and sealing cover plate arranged at the top of the large-scale cavity of pan-semiconductors. A reinforcement mounting frame is arranged at the top of the flipping and sealing cover plate. A plurality of flexible adjustment mechanisms are arranged on one side at the top of the reinforcement mounting frame. One end of the flexible adjustment mechanism is provided with a driving mechanism. A support rotation mechanism is arranged on one side of the flipping and sealing cover plate.

[0008] Further, in order to realize the cooperative installation of the reinforcement mounting frame and the flexible adjustment mechanism, an installation groove matching with the flexible adjustment mechanism is opened on one side at the top of the reinforcement mounting frame, and a fixing threaded hole is opened at the top of the installation groove.

[0009] Furthermore, in order to adjust the adjusting plate, thereby enabling the adjustment of the relative position between the adjusting plate and the flipping and sealing cover plate, and solving the problem of difficult flipping and sealing adjustment of the large cavity cover plate, the flexible adjustment mechanism includes an adjusting plate arranged at the top end of the installation groove. Symmetrically arranged at the bottom end of the adjusting plate are flipping plates, and one end of each flipping plate is connected to the side wall of the reinforcement mounting frame through a flipping rotating shaft; at both ends on both sides of the top end of the adjusting plate, jacking bolts are penetrated through. Between the jacking bolts on both sides of the top end of the adjusting plate, tensioning bolts that cooperate with the fixed threaded holes are penetrated through; in the middle of the top end of the adjusting plate, a connecting plate connected to the driving mechanism is arranged.

[0010] Furthermore, in order to adjust the adjusting plate, adjustment threaded holes that cooperate with the jacking bolts are opened at both ends on both sides of the top end of the adjusting plate, and slot holes that cooperate with the tensioning bolts are opened on both sides of the top end of the adjusting plate.

[0011] Furthermore, in order to open and close the flipping and sealing cover plate, under the action of the electric telescopic rod, the automation of the opening and closing process of the flipping and sealing cover plate is realized, reducing the labor intensity of the operator and improving the production efficiency. At the same time, the automated operation reduces the possibility of human errors and enhances safety. The driving mechanism includes a Y-shaped bracket connected to the connecting plate, and the Y-shaped bracket is connected to the connecting plate through a Y-shaped bracket rotating shaft; at the bottom end of the Y-shaped bracket, an electric telescopic rod is arranged, and at the bottom end of the electric telescopic rod, a movable bracket is arranged.

[0012] Furthermore, in order to flip the flipping and sealing cover plate, the support and rotation mechanism includes a bearing seat arranged on one side of the flipping and sealing cover plate, and inside the bearing seat, a support rotating shaft connected to the flipping plate is arranged.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. The structure of the present utility model is reasonable and reliable. Through the adjustable bolt mechanism, the adjustment process of the flipping cover plate is simplified, the operation convenience and the sealing reliability are improved, the problem of difficult flipping and sealing adjustment of the large cavity cover plate is solved, and the assembly time and processing cost are saved for the pre-installation and commissioning.

[0015] 2. Through the setting of the driving mechanism and the support and rotation mechanism, not only the fast and accurate sealing adjustment is realized, which is convenient for timely discovering and solving the sealing problems, improving the production efficiency and the convenience of equipment maintenance, ensuring the stable sealing between the flipping and sealing cover plate and the large cavity of the semiconductor, but also a stable process environment is provided for semiconductor manufacturing. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 is a schematic structural diagram of an adjustable large - cavity cover flipping and sealing device for pan - semiconductors according to an embodiment of the present invention;

[0018] Figure 2 is a three - dimensional assembly of an adjustable large - cavity cover flipping and sealing device for pan - semiconductors according to an embodiment of the present invention;

[0019] Figure 3 is Figure 2 a partial enlarged view of part A in

[0020] Figure 4 is a schematic structural diagram of an adjusting plate in an adjustable large - cavity cover flipping and sealing device for pan - semiconductors according to an embodiment of the present invention.

[0021] In the figure:

[0022] 1. Flipping and sealing cover plate; 2. Reinforcing installation frame; 201. Installation groove; 202. Threaded hole; 3. Flexible adjusting mechanism; 301. Adjusting plate; 3011. Adjusting threaded hole; 3012. Slot hole; 302. Flipping plate; 303. Flipping rotating shaft; 304. Jacking bolt; 305. Tightening bolt; 306. Connecting plate; 4. Driving mechanism; 401. Y - shaped bracket; 402. Y - shaped bracket rotating shaft; 403. Electric telescopic rod; 404. Movable bracket; 5. Supporting and rotating mechanism; 501. Bearing seat; 502. Supporting rotating shaft. Detailed implementation manners

[0023] To further illustrate each embodiment, the present invention provides drawings. These drawings are part of the disclosure of the present invention, mainly used to illustrate the embodiments and can cooperate with the relevant descriptions in the specification to explain the operation principle of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0024] According to an embodiment of the present invention, an adjustable large - cavity cover flipping and sealing device for pan - semiconductors is provided.

[0025] Now, in combination with the drawings and specific implementation manners, the present invention is further described as follows, as Figures 1 - 4As shown in the figure, the adjustable large - scale cavity cover flipping and sealing device according to the embodiment of the present utility model includes a flipping and sealing cover plate 1 arranged at the top of the large - scale cavity of the pan - semiconductor. A reinforcement mounting frame 2 is arranged at the top of the flipping and sealing cover plate 1. On one side of the top of the reinforcement mounting frame 2, a number of flexible adjustment mechanisms 3 are arranged. One end of the flexible adjustment mechanism 3 is provided with a driving mechanism 4; a support rotation mechanism 5 is arranged on one side of the flipping and sealing cover plate 1.

[0026] By virtue of the above - mentioned technical solution of the present utility model, the structure of the present utility model is reasonable and reliable. Through the adjustable bolt mechanism, the adjustment process of the flipping cover plate is simplified, the convenience of operation and the reliability of sealing are improved, the problem of difficult adjustment of the flipping and sealing of the large - scale cavity cover plate is solved, and the assembly time and processing cost are saved for the pre - installation and commissioning.

[0027] In one embodiment, for the above - mentioned reinforcement mounting frame 2, an installation groove 201 matching with the flexible adjustment mechanism 3 is opened on one side of the top of the reinforcement mounting frame 2, and a fixed threaded hole 202 is opened at the top of the installation groove 201, thus realizing the matching installation of the reinforcement mounting frame 2 and the flexible adjustment mechanism 3.

[0028] In one embodiment, for the above - mentioned flexible adjustment mechanism 3, the flexible adjustment mechanism 3 includes an adjustment plate 301 arranged at the top of the installation groove 201. At the bottom end of the adjustment plate 301, flipping plates 302 are symmetrically arranged, and one end of the flipping plate 302 is connected to the side wall of the reinforcement mounting frame 2 through a flipping rotating shaft 303; at both ends of both sides of the top of the adjustment plate 301, jacking bolts 304 penetrate through. Between the jacking bolts 304 on both sides of the top of the adjustment plate 301, tensioning bolts 305 matching with the fixed threaded holes 202 penetrate through; a connecting plate 306 connected to the driving mechanism 4 is arranged in the middle of the top of the adjustment plate 301; adjustment threaded holes 3011 matching with the jacking bolts 304 are opened at both ends of both sides of the top of the adjustment plate 301, and slot holes 3012 matching with the tensioning bolts 305 are opened on both sides of the top of the adjustment plate 301, so as to realize the adjustment of the adjustment plate 301, and thus the relative position adjustment between the adjustment plate 301 and the flipping and sealing cover plate 1 can be realized, and the problem of difficult adjustment of the flipping and sealing of the large - scale cavity cover plate is solved.

[0029] The working principle of the flexible adjustment mechanism 3 is as follows: by loosening the tensioning bolt 305, then adjusting the position of the tensioning bolt 305 in the adjustment threaded hole 3011, the relative position adjustment between the adjustment plate 301 and the flipping and sealing cover plate 1 is realized, and then the tension adjustment between the adjustment plate 301 and the reinforcement mounting frame 2 can be adjusted through the jacking bolt 304.

[0030] In one embodiment, for the above-mentioned driving mechanism 4 and the supporting rotation mechanism 5, the driving mechanism 4 includes a Y-shaped bracket 401 connected to the connecting plate 306, and the Y-shaped bracket 401 is connected to the connecting plate 306 through a Y-shaped bracket rotating shaft 402; an electric telescopic rod 403 is arranged at the bottom end of the Y-shaped bracket 401, and a movable bracket 404 is arranged at the bottom end of the electric telescopic rod 403; the supporting rotation mechanism 5 includes a bearing seat 501 arranged on one side of the flipping and sealing cover plate 1, and a supporting rotating shaft 502 connected to the flipping plate 302 is arranged inside the bearing seat 501. It not only realizes fast and accurate sealing adjustment, facilitates timely discovery and solution of sealing problems, improves production efficiency and the convenience of equipment maintenance, ensures stable sealing between the flipping and sealing cover plate 1 and the large semiconductor cavity, and provides a stable process environment for semiconductor manufacturing.

[0031] In addition, it should be noted that several support frames are arranged on one side wall of the large semiconductor cavity, and the movable bracket 404 is movably connected to the support frames.

[0032] The working principle of the driving mechanism 4 and the supporting rotation mechanism 5 is as follows: driven by the electric telescopic rod 403, the piston rod of the electric telescopic rod 403 drives the Y-shaped bracket 401 and drives the connecting plate 306 under the action of the Y-shaped bracket rotating shaft 402, and then drives the flipping plate 302 to rotate around the supporting rotating shaft 502 under the action of the adjusting plate 301, so as to be able to reinforce the mounting frame 2 and the flipping and sealing cover plate 1 to be opened and sealed.

[0033] To facilitate understanding of the above technical solution of the present invention, the working principle or operation method of the present invention in the actual process will be described in detail below.

[0034] In actual application, first, the position of the flipping and sealing cover plate 1 is adjusted through the flexible adjusting mechanism 3. When sealing is required, the driving mechanism 4 drives the flexible adjusting mechanism 3, and the flipping and sealing cover plate 1 is driven under the action of the reinforcing mounting frame 2 and the supporting rotation mechanism 5, so as to be able to open and seal the flipping and sealing cover plate 1.

[0035] In summary, with the above technical solution of the present invention, the structure of the present invention is reasonable and reliable. Through the adjustable bolt mechanism, the adjustment process of the flipping cover plate is simplified, the convenience of operation and the reliability of sealing are improved, the problem of difficult flipping and sealing adjustment of the large cavity cover plate is solved, and the assembly time and processing cost are saved for the pre-installation and commissioning. Through the setting of the driving mechanism 4 and the supporting rotation mechanism 5, not only fast and accurate sealing adjustment is realized, it is convenient to timely discover and solve sealing problems, the production efficiency and the convenience of equipment maintenance are improved, the stable sealing between the flipping and sealing cover plate 1 and the large semiconductor cavity is ensured, and a stable process environment is provided for semiconductor manufacturing.

[0036] In the present utility model, unless otherwise clearly defined and limited, the terms "installation", "setting", "connection", "fixation", "swivel connection" and other terms shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0037] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. An adjustable pan-semiconductor large cavity cover flip sealing device, comprising a flip sealing cover (1) arranged at the top of the pan-semiconductor large cavity, characterized in that: A reinforcement mounting frame (2) is arranged at the top end of the flip sealing cover plate (1), a plurality of flexible adjustment mechanisms (3) are arranged on one side of the top end of the reinforcement mounting frame (2), and a driving mechanism (4) is arranged at one end of the flexible adjustment mechanism (3); A supporting rotation mechanism (5) is provided on one side of the flip sealing cover plate (1).

2. The adjustable pan-semiconductor large cavity cover flip sealing device according to claim 1, characterized in that: A mounting groove (201) matching with the flexible adjustment mechanism (3) is provided on one side of the top end of the reinforcement mounting frame (2), and a fixing threaded hole (202) is provided on the top end of the mounting groove (201).

3. The adjustable pan-semiconductor large cavity cover flip sealing device according to claim 2, characterized in that: The flexible adjustment mechanism (3) comprises an adjustment plate (301) arranged at the top end of the installation groove (201), a flip plate (302) is symmetrically arranged at the bottom end of the adjustment plate (301), and one end of the flip plate (302) is connected to the side wall of the reinforcement mounting frame (2) via a flip shaft (303); Both ends of the top of the adjusting plate (301) are penetrated with lifting bolts (304), and both ends of the top of the adjusting plate (301) and between the lifting bolts (304) are penetrated with tensioning bolts (305) that cooperate with the fixing threaded holes (202); A connecting plate (306) connected to the driving mechanism (4) is provided at the middle of the top end of the adjusting plate (301).

4. The adjustable pan-semiconductor large cavity cover flip sealing device according to claim 3, characterized in that: Both ends of the top of the adjustment plate (301) are provided with adjustment threaded holes (3011) that match the lifting bolts (304), and both ends of the top of the adjustment plate (301) are provided with slot holes (3012) that match the tightening bolts (305).

5. The adjustable pan-semiconductor large cavity cover flip sealing device according to claim 3, characterized in that: The driving mechanism (4) comprises a Y-shaped bracket (401) connected to the connecting plate (306), and the Y-shaped bracket (401) and the connecting plate (306) are connected via a Y-shaped bracket rotating shaft (402); The bottom end of the Y-shaped bracket (401) is provided with an electric telescopic rod (403), and the bottom end of the electric telescopic rod (403) is provided with a movable bracket (404).

6. The adjustable pan-semiconductor large cavity cover flip sealing device according to claim 4, characterized in that: The supporting rotating mechanism (5) comprises a bearing seat (501) arranged on one side of the flip sealing cover plate (1), and a supporting rotating shaft (502) connected to the flip plate (302) is arranged inside the bearing seat (501).

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