Wafer material box placing carrying platform

Abstract

The utility model relates to the field of wafer processing, and discloses a wafer material box placing platform deck which can position and install a wafer material box on the platform deck and can balance the wafer material box. The device comprises a base, the first positioning pin is arranged in the middle of the base; the plurality of second positioning pins are arranged on the base, and the plurality of second positioning pins are arranged towards a plurality of directions by taking the first positioning pin as the center; and the position adjusting mechanisms are arranged between the second positioning pins and can move in the vertical direction.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer cassette placement stage. Background Art

[0002] Wafer cassettes play a crucial role in the semiconductor manufacturing process. They are not only used to safely store wafers but also responsible for efficiently transporting these precious materials on the production line. To optimize the transportation process and minimize the risk of contamination, chip manufacturers widely use wafer cassettes to handle and store wafers.

[0003] During the wafer processing, the use of wafer cassettes is crucial. The wafer cassette is placed on the stage. The wafer structure is relatively thin, and the manipulator takes out the wafer from the cassette for processing through its precise grasping function. However, with the increase in the number of uses, the wafer cassette may suffer wear, causing the wafer cassette to skew in position, which not only leads to its structural imbalance but may also affect the grasping accuracy of the manipulator. In the worst case, this wear may even cause damage to the wafer, thus affecting the quality and efficiency of the entire production process. Summary of the Utility Model

[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a wafer cassette placement stage, which can position and install the wafer cassette on the stage and balance the wafer cassette.

[0005] The wafer cassette placement stage according to the embodiment of the utility model includes:

[0006] A base;

[0007] A first positioning pin, arranged in the middle of the base;

[0008] A plurality of second positioning pins, arranged on the base, and the plurality of second positioning pins are arranged in multiple directions with the first positioning pin as the center;

[0009] A plurality of position adjustment mechanisms, arranged between adjacent second positioning pins, and the position adjustment mechanism can move in the up and down direction.

[0010] According to some embodiments of the utility model, it further includes a detection mechanism, and the detection mechanism is arranged on the base and is used to detect whether the wafer cassette is installed in place.

[0011] According to some embodiments of the utility model, the detection mechanism includes a plurality of sensors, and the sensors are arranged on the first positioning pin and the second positioning pin.

[0012] According to some embodiments of the present utility model, the sensor is one of a displacement sensor, a pressure sensor, and an infrared sensor.

[0013] According to some embodiments of the present utility model, the position adjusting mechanism includes an adjusting nut, and the adjusting nut is threadedly connected to the base.

[0014] According to some embodiments of the present utility model, the position adjusting mechanism includes a telescopic motor.

[0015] According to some embodiments of the present utility model, a third positioning pin is further included, the third positioning pin is disposed in front of the base, and the third positioning pin is used to position the front of the wafer cassette.

[0016] According to some embodiments of the present utility model, a fourth positioning pin is further included, the fourth positioning pin is disposed on the left and right sides of the base, and the second positioning pin is used to position the left and right sides of the wafer.

[0017] According to some embodiments of the present utility model, at least two second positioning pins are provided in each direction.

[0018] The embodiments of the present utility model at least have the following beneficial effects:

[0019] The positioning and adjustment process of the wafer cassette is carefully designed to ensure the accuracy and efficiency of the operation. First, the first positioning pin accurately aligns with the groove in the middle of the wafer cassette, while the second positioning pin is responsible for positioning the groove on the peripheral side of the cassette; this dual positioning mechanism provides a stable foundation for the wafer cassette; further, through multiple position adjusting mechanisms, the height of the wafer cassette on the stage can be finely adjusted at different positions respectively, ensuring that it can maintain perfect balance during any operation process; when the wafer cassette is stably placed on the stage, the manipulator can then exert its precise grasping function and easily pick up the wafer from the cassette, preparing for the subsequent processing process; the design of the entire system aims to achieve automation and precise control, not only improving production efficiency, but also ensuring the quality and consistency of the processing process.

[0020] The additional aspects and advantages of the present utility model will be partially given in the following description, partially will become obvious from the following description, or will be understood through the practice of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present utility model will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0022] Figure 1 It is a schematic diagram of the overall structure of the wafer cassette placement stage according to the embodiment of the present utility model;

[0023] Figure 2 is Figure 1 a schematic diagram of the back side of the wafer cassette placement stage shown;

[0024] Figure 3 is a schematic diagram of a wafer cassette.

[0025] Reference numerals:

[0026] Name Mark Name Mark Base 100 Detection mechanism 500 First positioning pin 200 Third positioning pin 600 Second positioning pin 300 Fourth positioning pin 700 Position adjustment mechanism 400 Detailed implementation manners

[0027] The following content will describe several embodiments of the present invention, including the embodiments corresponding to the drawings. It can be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present invention, and should not be construed as a limitation on the protection scope of the present invention.

[0028] The following will clearly and completely describe the concept, specific structure and technical effects generated by the present invention in combination with the embodiments and the drawings, so as to fully understand the purpose, solution and effects of the present invention. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0029] It should be noted that unless otherwise clearly defined, when a certain feature is referred to as "fixed", "connected", "installed" to another feature, it can be directly fixed or connected to another feature, or indirectly fixed or connected to another feature. The words such as "fixed", "connected", "installed" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0030] It should be noted that the descriptions of the orientation or positional relationship indicated by the upper, lower, left, right, top, bottom, front, back, inside, outside, etc. used in the present invention are based on the orientation or positional relationship of the drawings or embodiments, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present invention.

[0031] It should be noted that the term "and / or" used in the present invention includes any combination of one or more of the related listed items. The meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number.

[0032] It should be noted that in the present utility model, if the first and second are described, it is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features or implicitly specifying the sequence relationship of the indicated technical features.

[0033] It should be noted that unless otherwise clearly defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this technology belongs. The terms used in the description of this specification are only for describing specific embodiments, and are not intended to limit the present utility model.

[0034] Referring to Figures 1 - 3 , a basic embodiment of the present utility model provides a wafer cassette placement stage, including:

[0035] A base 100;

[0036] A first positioning pin 200, provided in the middle of the base 100;

[0037] A plurality of second positioning pins 300, provided on the base 100, and the plurality of second positioning pins 300 are arranged in multiple directions with the first positioning pin 200 as the center;

[0038] A plurality of position adjustment mechanisms 400, provided between adjacent second positioning pins 300, and the position adjustment mechanism 400 can move in the up and down directions.

[0039] According to the embodiments of the present utility model, by setting like this, at least the following effects can be achieved. The positioning and adjustment process of the wafer cassette is carefully designed to ensure the accuracy and efficiency of the operation. First, the first positioning pin 200 accurately aligns with the groove in the middle of the wafer cassette, while the second positioning pins 300 are responsible for positioning the grooves on the periphery of the cassette; this dual positioning mechanism provides a stable foundation for the wafer cassette; further, through a plurality of position adjustment mechanisms 400, the height of the wafer cassette on the stage can be finely adjusted at different positions respectively, ensuring that it can maintain perfect balance during any operation process; when the wafer cassette is stably placed on the stage, the manipulator can play its precise grasping function and easily take out the wafers from the cassette to prepare for the subsequent processing process; the design of the entire system aims to achieve automation and precise control, which not only improves production efficiency but also ensures the quality and consistency of the processing process.

[0040] It can be understood that the first positioning pin 200, the second positioning pins 300 cooperate with the corresponding grooves on the wafer cassette, so that the wafer cassette can be installed on the base 100.

[0041] In some embodiments, it further includes a detection mechanism 500. The detection mechanism 500 is arranged on the base 100 and is used to detect whether the wafer cassette is installed in place. By means of the detection mechanism 500, it can be detected whether the wafer cassette is installed in place, preventing the wafer cassette from being unstable due to improper installation, which affects the use.

[0042] In some embodiments, the detection mechanism 500 includes a plurality of sensors. The sensors are arranged on the first positioning pin 200 and the second positioning pin 300. The sensors are respectively arranged on the first positioning pin 200 and the second positioning pin 300, and are respectively used to detect whether the structures corresponding to the first positioning pin 200 and the second positioning pin 300 are installed in place. A sensor is a detection device that can sense the measured information and transform the sensed information into an electrical signal or other required form of information output according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording, and control.

[0043] In some embodiments, the sensor is one of a displacement sensor, a pressure sensor, and an infrared sensor. The displacement sensor judges whether the wafer cassette is installed in place by detecting the moving distance of the wafer cassette; the pressure sensor judges whether the wafer cassette is installed in place by the weight after the wafer cassette contacts the sensor; the infrared sensor judges whether the wafer cassette is installed in place by the reflection distance after the infrared ray contacts the wafer cassette.

[0044] In some embodiments, the position adjustment mechanism 400 includes an adjusting nut. The adjusting nut is threadedly connected to the base 100. Through the rotational action of the adjusting nut on the base 100, the adjusting nut can move up and down to adjust the height of the corresponding wafer cassette. Through the adjustment of the adjusting nut, the structure is simple and the operation is easy, which is beneficial to installation and use.

[0045] In some embodiments, the position adjustment mechanism 400 includes a telescopic motor. Through the telescopic motor, the height of the corresponding wafer cassette can be freely adjusted. Driven by the motor, the operation is simple, and it can be electrically connected to the detection mechanism 500 and feedback to determine whether it is installed in place.

[0046] In some embodiments, it further includes a third positioning pin 600. The third positioning pin 600 is arranged in front of the base 100, and the third positioning pin 600 is used to position the front of the wafer cassette. The third positioning pin 600 is used to determine the position of the front of the wafer cassette to ensure the firmness of the installation of the front of the wafer cassette.

[0047] In some embodiments, it further includes a fourth positioning pin 700. The fourth positioning pin 700 is arranged on the left and right sides of the base 100, and the second positioning pin 300 is used to position the left and right sides of the wafer. The fourth positioning pin 700 is used to determine the position of the left and right sides of the wafer cassette to ensure the firmness of the installation of the front of the wafer cassette.

[0048] In some embodiments, at least two second positioning pins 300 are provided in each direction. By providing a plurality of second positioning pins 300, the installation stability can be improved.

[0049] When placing the wafer cassette, the middle pod hole of the wafer cassette can be roughly determined visually above the first positioning pin 200. There are two third positioning pins 600 in front of the base 100, and their approximate positions can also be determined visually. Then, after placing the wafer cassette, multiple positioning pins will automatically position the wafer cassette in a position under the action of the grooves on the bottom surface of the wafer cassette. Moreover, the fourth positioning pins 700 on both left and right sides can also ensure the firmness of the wafer cassette in all directions (left, right, front, and back). A plurality of detection mechanisms 500 are provided under the carrier stage, which can detect whether the wafer cassette is on the carrier stage in a combined manner, and can also detect whether the wafer cassette is placed flat on the carrier stage surface.

[0050] It should be noted that in this specification, terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment" can be used to describe several embodiments of the present invention. The specific features, structures, materials or characteristics in several embodiments can be combined under the premise of conforming to the principles and purposes of the present invention.

[0051] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above embodiments. As long as it achieves the technical effects of the present invention by the same or equivalent means, any changes, modifications, equivalent substitutions, and equivalent variations made to these embodiments within the spirit and principles disclosed in the present invention, without departing from the principles and purposes of the present invention, should be included within the scope of protection disclosed by the present invention and should be considered to belong to the protection scope of the present invention.

Claims

1. A wafer cassette placement platform, characterized in that: include: Base (100); A first positioning pin (200) is disposed in the middle of the base (100); A plurality of second positioning pins (300) are disposed on the base (100), and the plurality of second positioning pins (300) are disposed in a plurality of directions with the first positioning pin (200) as the center; A plurality of positioning mechanisms (400) are arranged between adjacent second positioning pins (300), and the positioning mechanisms (400) are movable in an up-and-down direction.

2. The wafer cassette placement platform according to claim 1, characterized in that: It also comprises a detection mechanism (500), wherein the detection mechanism (500) is arranged on the base (100), and the detection mechanism (500) is used to detect whether the wafer material box is installed in place.

3. The wafer cassette placement platform according to claim 2, characterized in that: The detection mechanism (500) comprises a plurality of sensors, and the sensors are arranged on the first positioning pin (200) and the second positioning pin (300).

4. The wafer cassette placement platform according to claim 3, characterized in that: The sensor is one of a displacement sensor, a pressure sensor and an infrared sensor.

5. The wafer cassette placement platform according to claim 1, characterized in that: The positioning mechanism (400) comprises an adjusting nut, and the adjusting nut is threadedly connected to the base (100).

6. The wafer cassette placement platform according to claim 1, characterized in that: The positioning mechanism (400) comprises a telescopic motor.

7. The wafer cassette placement platform according to claim 1, characterized in that: It also includes a third positioning pin (600), which is arranged in front of the base (100) and is used to position the front of the wafer box.

8. The wafer cassette placement platform according to claim 1, characterized in that: It also includes a fourth positioning pin (700), which is arranged on the left and right sides of the base (100), and the second positioning pin (300) is used to position the left and right sides of the wafer.

9. The wafer cassette placement platform according to claim 1, characterized in that: At least two of the second positioning pins (300) are provided in each direction.

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