PCB capable of preventing short circuit of PINs and electronic equipment

By setting green oil blocks with larger thickness between the soldering copper on the PCB board, using their repulsion characteristics with solder paste, the problem of shorting of the PIN foot is solved, and the product's functional stability and production quality are improved.

CN222996734UActive Publication Date: 2025-06-17TRULY OPTO ELECTRONICS
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Patent Information

Application Number
CN202421502566.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-06-17
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

In the prior art, the PIN pins of PCB boards are prone to short-circuit during welding, resulting in abnormal functions and product damage.

Method used

A green oil block with a thickness of at least 10um greater than the thickness of the solder copper is provided between the solder copper leakage, so that when the PIN pin is subsequently soldered, the repulsive characteristics of the green oil and the solder paste are avoided from being shorted after the tin is applied.

Benefits of technology

It effectively avoids the problem of shorting of PIN foot, ensures the functionality and production quality of the product, and improves the yield of production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model provides a PCB capable of preventing short circuit of PINs and an electronic device, and the PCB comprises a substrate and a plurality of welding leakage copper. A green oil block is arranged between every two welding leakage copper; the plurality of welding exposed copper and the green oil block are arranged on the upper surface of the base material; the thickness of the green oil block is at least 10 microns larger than the thickness of the welding leakage copper. According to the technical scheme, the green oil blocks with the thickness being at least 10 microns larger than the thickness of the welding leakage copper are arranged in the gaps among the welding leakage copper, so that during subsequent PIN welding, due to the repulsion characteristic of green oil and solder paste, short circuit of adjacent welding leakage copper after tinning can be avoided, and the phenomenon of poor short circuit of golden finger PINs caused by short circuit of the adjacent welding leakage copper after tinning can be avoided, and the service life of the golden finger PINs is prolonged. The functional problem of the product is avoided, the production quality is ensured, and the production yield is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of PCB, in particular to a PCB for preventing PIN pin short - circuit and an electronic device. Background Technique

[0002] Most of the existing electronic devices use a PCB board as a carrier of the circuit. However, when welding the PIN pins of the PCB board, since the connection between the gold fingers on the PCB board is relatively tight, and the connection between the PIN pins of the gold fingers is also relatively tight, the problem that adjacent PIN pins are short - circuited together often occurs, which will cause functional abnormalities and lead to product damage. Content of the Utility Model

[0003] The purpose of the utility model is to solve the deficiencies existing in the prior art, and to propose a PCB for preventing PIN pin short - circuit and an electronic device.

[0004] In order to achieve the above - mentioned purpose, the utility model adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the utility model provides a PCB for preventing PIN pin short - circuit, including: a base material and a plurality of welding copper leakage;

[0006] There are green oil blocks between every two of the plurality of welding copper leakage;

[0007] The plurality of welding copper leakage and the green oil blocks are all arranged on the upper surface of the base material;

[0008] The thickness of the green oil block is at least 10um greater than the thickness of the plurality of welding copper leakage.

[0009] As a preferred embodiment of the utility model, the thickness of the plurality of welding copper leakage is 15um.

[0010] As a preferred embodiment of the utility model, the thickness of the green oil block is 25um.

[0011] As a preferred embodiment of the utility model, a PIN pin is welded on each of the plurality of welding copper leakage.

[0012] As a preferred embodiment of the utility model, the thickness of the PIN pin is at least 0.5cm.

[0013] As a preferred embodiment of the utility model, the PIN pin is welded on the welding copper leakage through solder paste.

[0014] As a preferred embodiment of the present utility model, a conductive coarse sand layer is covered on each of the several welding copper leakage parts, and the thickness of the solder mask block is at least 10um greater than the total thickness of the welding copper leakage and the conductive coarse sand layer.

[0015] As a preferred embodiment of the present utility model, the substrate is an epoxy glass cloth substrate (FR-4).

[0016] As a preferred embodiment of the present utility model, the solder mask block is a liquid photoimageable solder mask.

[0017] In a second aspect, the present utility model further provides an electronic device, including a PCB for preventing PIN foot short circuit as described in any embodiment of the present utility model.

[0018] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0019] The technical solution of the embodiment of the present utility model is to set a solder mask block with a thickness at least 10um greater than the thickness of the several welding copper leakage parts at the gaps between the several welding copper leakage parts. When welding PIN feet subsequently, due to the repulsive characteristics of the solder mask and the solder paste, adjacent welding copper leakage parts can be prevented from being short-circuited after tinning, thereby avoiding the short-circuit defect of the gold finger PIN feet, preventing functional problems of the product, ensuring production quality, and improving production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic side view structure diagram of a PCB for preventing PIN foot short circuit provided by the present utility model;

[0021] Figure 2 It is a schematic top view structure diagram of a PCB for preventing PIN foot short circuit provided by the present utility model;

[0022] Figure 3 It is a schematic side view structure diagram of a PCB for preventing PIN foot short circuit provided by the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] In order to more clearly understand the above objects, features, and advantages of the present utility model, the present utility model will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0024] Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can also be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the limitations of the specific embodiments disclosed in the following specification.

[0025] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "height", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0026] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation", "setting", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can also be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] Please refer to Figure 1-2 , in a first aspect, an embodiment of the present utility model provides a PCB for preventing PIN pin short circuit, including: a base material 10 and a plurality of soldering copper leakage 20;

[0028] There is a green oil block 30 provided between every two of the plurality of soldering copper leakage 20;

[0029] The plurality of soldering copper leakage 20 and the green oil block 30 are both arranged on the upper surface of the base material 10;

[0030] The thickness of the green oil block 30 is at least 10 um greater than the thickness of the plurality of soldering copper leakage 20.

[0031] The technical solution of the embodiment of the present utility model, by arranging a green oil block with a thickness at least 10 um greater than the thickness of the plurality of soldering copper leakage at the gap between the plurality of soldering copper leakage, when soldering PIN pins subsequently, due to the repulsive characteristics of the green oil and the solder paste, it can avoid the short circuit of adjacent soldering copper leakage after tinning, thus causing the short circuit defect of the gold finger PIN pins, avoiding functional problems of the product, ensuring production quality, and improving production yield.

[0032] As a preferred embodiment of the present utility model, the thickness of the plurality of soldering copper leakage 20 is 15 um. The setting of the above thickness ensures the electrical conductivity of the soldering copper leakage 20.

[0033] As a preferred embodiment of the present utility model, the thickness of the green oil block 30 is 25 um. The setting of the above thickness can effectively avoid the short circuit of adjacent soldering copper leakage 20 after tinning.

[0034] As a preferred embodiment of the present utility model, please refer to Figure 3 , PIN pins 40 are welded on each of the several welding copper leakage 20. The PIN pins 40 can be used for wiring with other circuits.

[0035] As a preferred embodiment of the present utility model, please refer to Figure 3 , the thickness of the PIN pin 40 is at least 0.5 cm. The PIN pin 40 protrudes from the solder mask block 30 after welding, thus ensuring the stability of the wiring with other circuits.

[0036] As a preferred embodiment of the present utility model, please refer to Figure 3 , the PIN pin 40 is welded on the welding copper leakage 20 through solder paste 50. The setting of the solder mask block 30 can effectively avoid the phenomenon that the solder pastes of adjacent welding copper leakages 20 are connected and short-circuited when applying solder paste.

[0037] As a preferred embodiment of the present utility model, please refer to Figure 3 , a conductive coarse sand layer 60 is covered on each of the several welding copper leakages 20, and the thickness of the solder mask block 30 is at least 10 um greater than the total thickness of the welding copper leakage 20 and the conductive coarse sand layer 60. The setting of the above total thickness can effectively avoid the short circuit between adjacent welding copper leakages 20 after soldering.

[0038] As a preferred embodiment of the present utility model, the base material is an epoxy glass cloth substrate (FR-4).

[0039] As a preferred embodiment of the present utility model, the solder mask block is a liquid photoimageable solder mask. The material of the solder mask block can effectively avoid the short circuit between adjacent welding copper leakages 20 after soldering.

[0040] In a second aspect, the present utility model further provides an electronic device, including a PCB for preventing PIN foot short circuit as described in any embodiment of the present utility model.

[0041] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent change equivalent embodiments and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.

Claims

1. A PCB for preventing PIN pin short circuit, characterized in that: include: Base material and some welding copper leaks; Green oil blocks are provided between each of the plurality of welding copper leaks; The plurality of welding copper leaks and the green oil block are both arranged on the upper surface of the substrate; The thickness of the green oil block is at least 10 um greater than the thickness of the plurality of welding copper leaks.

2. The PCB for preventing PIN pin short circuit according to claim 1, characterized in that: The thickness of the plurality of welded copper leaks is 15 um.

3. The PCB for preventing PIN pin short circuit according to claim 2, characterized in that: The thickness of the green oil block is 25 um.

4. The PCB for preventing PIN pin short circuit according to claim 1, characterized in that: Each of the plurality of welding copper leaks is welded with a PIN pin.

5. The PCB for preventing PIN pin short circuit according to claim 4, characterized in that: The thickness of the PIN pin is at least 0.5 cm.

6. The PCB for preventing PIN pin short circuit according to claim 4, characterized in that: The PIN pin is soldered on the soldering copper via solder paste.

7. The PCB for preventing PIN pin short circuit according to claim 6, characterized in that: Each of the plurality of welded copper leaks is covered with a conductive coarse sand layer, and the thickness of the green oil block is at least 10 um greater than the total thickness of the welded copper leaks and the conductive coarse sand layer.

8. The PCB for preventing PIN pin short circuit according to claim 1, characterized in that: The substrate is an epoxy glass fiber cloth substrate (FR-4).

9. The PCB for preventing PIN pin short circuit according to claim 1, characterized in that: The green oil block is liquid photoresist.

10. An electronic device, characterized in that: A PCB comprising the method for preventing PIN pin short circuit as claimed in any one of claims 1 to 9.