Double-layer circuit board structure and oscilloscope server

Abstract

The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a double-layer circuit board structure, which comprises a first heat dissipation piece, a first circuit board, a first heat conduction assembly, a second heat conduction assembly, a second circuit board and a second heat dissipation piece which are arranged layer by layer along a first direction. A first heating piece is arranged on the first circuit board, heat on one side of the first heating piece is transmitted to the first heat dissipation piece through the first heat conduction pad, and heat on the other side of the first heating piece is transmitted to the first heat dissipation piece through the first heat conduction assembly. The second circuit board is provided with a second heating piece, heat on one side of the second heating piece is transmitted to the second heat dissipation piece through the second heat conduction pad, and heat on the other side of the second heating piece is transmitted to the second heat dissipation piece through the second heat conduction assembly. The double-layer circuit board structure is arranged layer by layer, space occupation can be reduced, heat on the front and back surfaces of the heating element is conducted to the heat dissipation element for heat dissipation, and heat dissipation efficiency can be improved. The utility model further provides an oscilloscope server which comprises a box body and the double-layer circuit board structure arranged in the box body.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic devices, in particular to a double-layer circuit board structure and an oscilloscope server. Background Art

[0002] The core sampling oscilloscope server in an oscilloscope product has a relatively high power consumption. In order to ensure that the size of the oscilloscope server chassis meets the standard, it is necessary to achieve efficient heat dissipation in a limited space. The prior art discloses a multi-layer circuit board structure. Taking the patent CN202022413050.6 as an example, the multi-layer circuit board can improve the space utilization rate, but its heat conduction and heat dissipation effects are average and it is not suitable for the oscilloscope sampling oscilloscope server. Summary of the Utility Model

[0003] An object of the utility model is to provide a double-layer circuit board structure, which can improve the heat dissipation efficiency on the premise of occupying less space.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] Provide a double-layer circuit board structure, including a first heat dissipation member, a first circuit board, a first heat conduction component, a second heat conduction component, a second circuit board, and a second heat dissipation member arranged layer by layer along a first direction;

[0006] A first heating element is arranged on the first circuit board. The heat on one side of the first heating element is transferred to the first heat dissipation member through a first heat conduction pad, and the heat on the other side is transferred to the first heat dissipation member through the first heat conduction component;

[0007] A second heating element is arranged on the second circuit board. The heat on one side of the second heating element is transferred to the second heat dissipation member through a second heat conduction pad, and the heat on the other side is transferred to the second heat dissipation member through the second heat conduction component.

[0008] Optionally, the first heat conduction component extends along a second direction to contact a first protruding portion protruding along the first direction of the first heat dissipation member;

[0009] The second heat conduction component extends along the second direction to contact a second protruding portion protruding along the first direction of the second heat dissipation member.

[0010] Optionally, the first heat conduction component includes a first heat conduction plate and a first heat conduction pipe in contact with each other. The first heat conduction plate contacts the first heating element, and the first heat conduction pipe extends along the second direction to contact the first protruding portion;

[0011] The second heat conduction component includes a second heat conduction plate and a second heat conduction tube in contact with each other. The second heat conduction plate contacts the second heating element, and the second heat conduction tube extends along the second direction to contact the second protrusion.

[0012] Optionally, a plurality of the first heating elements are provided on the first circuit board, and the first heat conduction component includes a plurality of the first heat conduction plates. The plurality of first heat conduction plates are arranged in one-to-one correspondence with the plurality of first heating elements.

[0013] And / or, a plurality of the second heating elements are provided on the second circuit board, and the second heat conduction component includes a plurality of the second heat conduction plates. The plurality of second heat conduction plates are arranged in one-to-one correspondence with the plurality of second heating elements.

[0014] Optionally, a support plate is further included. The support plate is clamped between the first heat conduction component and the second heat conduction component, and both the first heat conduction component and the second heat conduction component are connected to the support plate.

[0015] Optionally, a first limiting groove is formed on one surface of the support plate, and a first positioning groove is formed at the bottom of the first limiting groove. The first protrusion is located at the first limiting groove, and a part of the first heat conduction tube is located at the first positioning groove.

[0016] And / or, a second limiting groove is formed on the other surface of the support plate, and a second positioning groove is formed at the bottom of the second limiting groove. The second protrusion is located at the second limiting groove, and a part of the second heat conduction tube is located at the second positioning groove.

[0017] And / or, a third limiting groove is formed on one surface of the support plate, and a third positioning groove is formed at the bottom of the third limiting groove. The first heat conduction plate is located at the third limiting groove, and a part of the first heat conduction tube is located at the third positioning groove.

[0018] And / or, a fourth limiting groove is formed on the other surface of the support plate, and a fourth positioning groove is formed at the bottom of the fourth limiting groove. The second heat conduction plate is located at the fourth limiting groove, and a part of the second heat conduction tube is located at the fourth positioning groove.

[0019] Optionally, a plurality of the first heating elements are provided on the first surface of the first circuit board, and the second surface of the first circuit board contacts a plurality of the first heat conduction pads, and the plurality of first heat conduction pads respectively correspond to the regions where the plurality of first heating elements are located.

[0020] And / or, a plurality of the second heating elements are provided on the third surface of the second circuit board, and the fourth surface of the second circuit board contacts a plurality of the second heat conduction pads, and the plurality of second heat conduction pads respectively correspond to the regions where the plurality of second heating elements are located.

[0021] Optionally, it further includes a first cover plate and a second cover plate connected to each other, and the third direction is perpendicular to both the first direction and the second direction;

[0022] The first cover plate is clamped between the first main body of the first heat sink and the first circuit board. The first main body extends along the second direction, and there are first circuit avoidance spaces on both sides of the first main body along the third direction. The third direction is perpendicular to both the first direction and the second direction;

[0023] And / or, the second cover plate is clamped between the second main body of the second heat sink and the second circuit board. The second main body extends along the second direction, and there are second circuit avoidance spaces on both sides of the second main body along the third direction.

[0024] Optionally, it further includes a fan. The first protruding part and the second protruding part are arranged opposite to each other along the first direction, and the fan is located at one end of the first protruding part and the second protruding part along the second direction. The fan is used to blow air to the first heat sink and the second heat sink.

[0025] Another object of the present invention is to provide an oscilloscope server, which can improve the heat dissipation efficiency on the premise of occupying less space.

[0026] To achieve this purpose, the present invention adopts the following technical solutions:

[0027] Provide an oscilloscope server, including a box body and the above-mentioned double-layer circuit board structure, and the double-layer circuit board structure is arranged in the box body.

[0028] The beneficial effects of the present invention:

[0029] The present invention provides a double-layer circuit board structure, including a first heat sink, a first circuit board, a first heat conduction component, a second heat conduction component, a second circuit board and a second heat sink arranged layer by layer along the first direction. A first heating element is arranged on the first circuit board. The heat on one side of the first heating element is transferred to the first heat sink through the first heat conduction pad, and the heat on the other side is transferred to the first heat sink through the first heat conduction component. A second heating element is arranged on the second circuit board. The heat on one side of the second heating element is transferred to the second heat sink through the second heat conduction pad, and the heat on the other side is transferred to the second heat sink through the second heat conduction component. The double-layer circuit board structure is arranged layer by layer, which can reduce the space occupation, and the heat on both the front and back sides of the heating element can be conducted to the heat sink for heat dissipation, thereby improving the heat dissipation efficiency of the heating element.

[0030] The present utility model also provides an oscilloscope server, which includes a box body and the above-mentioned double-layer circuit board structure. The double-layer circuit board structure is arranged inside the box body. This oscilloscope server can improve the heat dissipation efficiency on the premise of occupying less space. Description of the Drawings

[0031] Figure 1 is a partial exploded view of the double-layer circuit board structures provided by two embodiments of the present utility model;

[0032] Figure 2 is a partial structural schematic diagram of the oscilloscope server provided by an embodiment of the present utility model.

[0033] In the figure:

[0034] 1. First heat dissipation component; 101. First protruding part; 102. First main body part;

[0035] 2. First circuit board;

[0036] 3. First heat conduction component; 301. First heat conduction plate; 302. First heat conduction tube;

[0037] 4. Second heat conduction component; 401. Second heat conduction plate; 402. Second heat conduction tube;

[0038] 5. Second circuit board;

[0039] 6. Second heat dissipation component; 601. Second protruding part; 602. Second main body part;

[0040] 7. Fan; 8. First heat conduction pad; 9. Second heating component; 10. Second heat conduction pad;

[0041] 11. Support plate; 111. First limiting groove; 112. First positioning groove; 113. Third limiting groove; 114. Third positioning groove;

[0042] 12. First cover plate; 121. First circuit line avoidance space; 13. Second cover plate;

[0043] 800. Double-layer circuit board structure; 900. Box body; 901. Heat dissipation holes. Detailed Embodiments

[0044] Before explaining any embodiment of the present application in detail, it should be understood that the present application is not limited to the structural details and component arrangements described in the following description or shown in the above drawings.

[0045] In this application, the terms "comprise", "include", "have" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or apparatus. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising such element.

[0046] In this application, the term "and / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. Additionally, in this application, the character " / " generally indicates that the associated objects before and after are in an "and / or" relationship.

[0047] In this application, the terms "connect", "combine", "couple", "mount" may be direct connection, combination, coupling or mounting, or may be indirect connection, combination, coupling or mounting. Among them, by way of example, direct connection means that two parts or components are connected together without the need to provide an intermediate member, and indirect connection means that two parts or components are respectively connected to at least one intermediate member, and these two parts or components are connected through the intermediate member. In addition, "connect" and "couple" are not limited to physical or mechanical connection or coupling, and may include electrical connection or coupling.

[0048] In this application, those of ordinary skill in the art will understand that relative terms used in connection with quantities or conditions (such as "about", "approximately", "substantially", etc.) are intended to include the stated value and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances resulting from manufacturing, assembly, use, etc. associated with a particular value. Such terms should also be considered to disclose a range defined by the absolute values of two endpoints. Relative terms may refer to plus or minus a certain percentage (such as 1%, 5%, 10% or more) of the indicated value. Numerical values without the use of relative terms should also be disclosed as having tolerances. In addition, when expressing relative angular positional relationships (such as substantially parallel, substantially perpendicular), "substantially" may refer to plus or minus a certain number of degrees (such as 1 degree, 5 degrees, 10 degrees or more) based on the indicated angle.

[0049] In this application, those of ordinary skill in the art will understand that the functions performed by a component may be performed by one component, multiple components, one part, or multiple parts. Similarly, the functions performed by a part may also be performed by one part, one component, or a combination of multiple parts.

[0050] In this application, the directional terms such as "upper", "lower", "left", "right", "front", and "back" are described based on the orientation and positional relationship shown in the drawings, and should not be construed as limiting the embodiments of this application. In addition, in the context, it should also be understood that when it is mentioned that one component is connected "above" or "below" another component, it can not only be directly connected "above" or "below" another component, but also be indirectly connected "above" or "below" another component through an intermediate component. It should also be understood that the directional terms such as the upper side, the lower side, the left side, the right side, the front side, and the back side not only represent the positive direction, but can also be understood as the side direction. For example, the lower side can include directly below, lower left, lower right, lower front, and lower back, etc.

[0051] As Figure 1 shown, this embodiment discloses a double-layer circuit board structure 800. Figure 1 In it, the ab direction is the first direction, the cd direction is the second direction, and the ef direction is the third direction. The double-layer circuit board structure 800 includes a first heat dissipation member 1, a first circuit board 2, a first heat conduction component 3, a second heat conduction component 4, a second circuit board 5, and a second heat dissipation member 6 arranged layer by layer along the first direction. A first heating element is provided on the first circuit board 2. The heat on one side of the first heating element is transferred to the first heat dissipation member 1 through the first heat conduction pad 8, and the heat on the other side is transferred to the first heat dissipation member 1 through the first heat conduction component 3. A second heating element 9 is provided on the second circuit board 5. The heat on one side of the second heating element 9 is transferred to the second heat dissipation member 6 through the second heat conduction pad 10, and the heat on the other side is transferred to the second heat dissipation member 6 through the second heat conduction component 4. The double-layer circuit board structure 800 is arranged layer by layer, which can reduce the space occupation, and the heat on both the front and back sides of the heating element can be conducted to the heat dissipation member for heat dissipation, which can improve the heat dissipation efficiency of the heating element, and both heat dissipation members are arranged on the outermost layer, which can further ensure the heat dissipation efficiency of the heat dissipation member.

[0052] Optionally, the first heat conduction component 3 extends along the second direction to contact the first protruding portion 101 of the first heat dissipation member 1 protruding towards the first heat conduction component 3 along the first direction. That is, the length of the first circuit board 2 in the second direction between the first heat dissipation member 1 and the first heat conduction component 3 is smaller than the lengths of the first heat dissipation member 1 and the first heat conduction component 3 in the second direction, providing space for the contact between the first protruding portion 101 of the first heat dissipation member 1 and the first heat conduction component 3. Optionally, the first protruding portion 101 is made of copper material, and the heat dissipation effect is better.

[0053] Similarly, optionally, the second heat-conducting component 4 extends along the second direction to contact the second protrusion 601 protruding along the first direction of the second heat sink 6. That is, the length of the second circuit board 5 between the second heat sink 6 and the second heat-conducting component 4 along the second direction is smaller than the length of the second heat sink 6 and the second heat-conducting component 4 along the second direction, providing space for the contact between the second protrusion 601 of the second heat sink 6 and the second heat-conducting component 4.

[0054] Optionally, the first heat-conducting assembly 3 includes a first heat-conducting plate 301 and a first heat-conducting pipe 302 in contact with each other, the first heat-conducting plate 301 contacts the first heat-generating element, and the first heat-conducting pipe 302 extends along the second direction to contact the first protrusion 101. Optionally, one side of the first heat-conducting plate 301 covers and contacts the first heat-generating element, and the other side contacts the first heat-conducting pipe 302.

[0055] Optionally, a plurality of first heating elements are provided on the first circuit board 2, and the first heat-conducting assembly 3 includes a plurality of first heat-conducting plates 301, and the plurality of first heat-conducting plates 301 are provided in one-to-one correspondence with the plurality of first heating elements. The first heating element may be a chip, and the heat generation or the size of the plurality of first heating elements is different. In the present embodiment, the first heating element includes a smaller heating element and a larger heating element. Correspondingly, the first heat-conducting plate 301 includes a smaller heat-conducting plate and a larger heat-conducting plate to correspond to the first heating element. Optionally, a plurality of first heat-conducting pipes 302 are provided, and the plurality of first heat-conducting pipes 302 contact the plurality of first heat-conducting plates 301 respectively. Optionally, in the present embodiment, the smaller heat-conducting plate contacts one end of a first heat-conducting pipe 302, and the larger heat-conducting plate contacts the middle of a first heat-conducting pipe 302, so that the heat of the larger heat-conducting plate can be exported through the two ends of the first heat-conducting pipe 302, thereby improving the efficiency of heat export of the larger heat-conducting plate.

[0056] Optionally, the second heat-conducting assembly 4 includes a second heat-conducting plate 401 and a second heat-conducting pipe 402 in contact with each other, the second heat-conducting plate 401 contacts the second heating element 9, and the second heat-conducting pipe 402 extends along the second direction to contact the second protrusion 601. Optionally, one side of the second heat-conducting plate 401 covers and contacts the second heating element 9, and the other side contacts the second heat-conducting pipe 402.

[0057] Optionally, a plurality of second heating elements 9 are provided on the second circuit board 5, and the second heat-conducting assembly 4 includes a plurality of second heat-conducting plates 401, and the plurality of second heat-conducting plates 401 are arranged one by one with the plurality of second heating elements 9. The second heating element 9 may also be a chip, and the heat generation or the size of the plurality of second heating elements 9 is different. In this embodiment, the second heating element 9 includes a smaller heating element and a larger heating element. Correspondingly, the second heat-conducting plate 401 includes a smaller heat-conducting plate and a larger heat-conducting plate to correspond to the second heating element 9. Optionally, a plurality of second heat-conducting pipes 402 are provided, and the plurality of second heat-conducting pipes 402 contact the plurality of second heat-conducting plates 401 respectively. Optionally, in this embodiment, the smaller heat-conducting plate contacts one end of a second heat-conducting pipe 402, and the larger heat-conducting plate contacts the middle of a second heat-conducting pipe 402, so that the heat of the larger heat-conducting plate can be exported through the two ends of the second heat-conducting pipe 402, thereby improving the efficiency of heat export of the larger heat-conducting plate.

[0058] In order to position and support the first heat-conducting component 3 and the second heat-conducting component 4, optionally, the double-layer circuit board structure 800 also includes a support plate 11, which is clamped between the first heat-conducting component 3 and the second heat-conducting component 4, and the first heat-conducting component 3 and the second heat-conducting component 4 are both connected to the support plate 11.

[0059] Optionally, a first limiting groove 111 is provided on one surface of the support plate 11, and a first positioning groove 112 is provided at the bottom of the first limiting groove 111. The first protrusion 101 is located at the first limiting groove 111, that is, the first protrusion 101 contacts the bottom of the first limiting groove 111, and the first limiting groove 111 can limit the position of the first protrusion 101 to prevent it from shifting. The first heat pipe 302 is partially located at the first positioning groove 112, and the first positioning groove 112 can limit the first heat pipe 302 to prevent the first heat pipe 302 from shifting, thereby helping to ensure that the first heat pipe 302 and the first protrusion 101 are not relatively shifted, ensuring good contact between the two, and thus ensuring stable heat transfer between the two.

[0060] Optionally, a second limiting groove is provided on the other side of the support plate 11, and a second positioning groove is provided at the bottom of the second limiting groove. The second protrusion 601 is located at the second limiting groove, and the second limiting groove can limit the position of the second protrusion 601 to prevent it from shifting. The second heat pipe 402 is partially located at the second positioning groove, and the second positioning groove can limit the second heat pipe 402 to prevent the second heat pipe 402 from shifting, thereby helping to ensure that the second heat pipe 402 and the second protrusion 601 are not relatively shifted, ensuring good contact between the two, thereby ensuring stable heat transfer between the two.

[0061] Optionally, a third limiting groove 113 is formed on one surface of the support plate 11, and a third positioning groove 114 is formed at the bottom of the third limiting groove 113. The first heat conducting plate 301 is located at the third limiting groove 113, and the third limiting groove 113 can limit the first heat conducting plate 301 to prevent the first heat conducting plate 301 from shifting. A part of the first heat conducting tube 302 is located at the third positioning groove 114, and the third positioning groove 114 can limit the first heat conducting tube 302 to prevent the first heat conducting tube 302 from shifting, thereby helping to ensure that there is no relative displacement between the first heat conducting tube 302 and the first heat conducting plate 301, ensuring good contact between the two, and thus ensuring stable heat transfer between the two.

[0062] Optionally, a fourth limiting groove is formed on the other surface of the support plate 11, and a fourth positioning groove is formed at the bottom of the fourth limiting groove. The second heat conducting plate 401 is located at the fourth limiting groove, and the fourth limiting groove can limit the second heat conducting plate 401 to prevent the second heat conducting plate 401 from shifting. A part of the second heat conducting tube 402 is located at the fourth positioning groove, and the fourth positioning groove can limit the second heat conducting tube 402 to prevent the second heat conducting tube 402 from shifting, thereby helping to ensure that there is no relative displacement between the second heat conducting tube 402 and the second heat conducting plate 401, ensuring good contact between the two, and thus ensuring stable heat transfer between the two.

[0063] Optionally, a first heat pipe groove is formed on one surface of the support plate 11, and the first heat pipe groove can communicate the first positioning groove 112 and the third positioning groove 114, and the other part of the first heat conducting tube 302 is located in the first heat pipe groove. Optionally, a second heat pipe groove is formed on the other surface of the support plate 11, and the second heat pipe groove can communicate the second positioning groove and the fourth positioning groove, and the other part of the second heat conducting tube 402 is located in the second heat pipe groove.

[0064] The first limiting groove 111 and the third limiting groove 113 are simultaneously formed on one surface of the support plate 11. Among them, the bottoms of the first limiting groove 111 and the third limiting groove 113 can be on the same plane. The first protruding portion 101 is partially embedded in the first limiting groove 111, and the first heat conducting plate 301 is embedded in the third limiting groove 113. The first positioning groove 112 and the third positioning groove 114 can penetrate each other through the first heat pipe groove to jointly form a complete upper positioning groove, and the shape thereof matches the shape of the first heat conducting plate 301, so that the first heat conducting plate 301 is located in the above-mentioned upper positioning groove, which not only facilitates positioning during assembly, but also can fix the relative position of the first heat conducting plate 301 and the support plate 11 during subsequent use.

[0065] Similarly, a second limiting groove and a fourth limiting groove are simultaneously formed on the other surface of the support plate 11. The bottoms of the second limiting groove and the fourth limiting groove may be on the same plane. A part of the second protruding portion 601 is embedded in the second limiting groove, and the second heat conducting plate 401 is embedded in the fourth limiting groove. The second positioning groove and the fourth positioning groove communicate with each other to jointly form a complete lower positioning groove, and the shape thereof matches the shape of the second heat conducting plate 401, so that the second heat conducting plate 401 is located in the above-mentioned lower positioning groove, which not only facilitates positioning during assembly, but also can fix the relative positions of the second heat conducting plate 401 and the support plate 11 during subsequent use.

[0066] Optionally, a plurality of first heating elements are arranged on the first surface of the first circuit board 2. The second surface of the first circuit board 2 contacts a plurality of first heat conducting pads 8, and the plurality of first heat conducting pads 8 respectively correspond to the regions where the plurality of first heating elements are located. That is, a plurality of first heat conducting pads 8 are arranged at the back of the first circuit board 2 where the first heating elements are arranged, so that the heat on the surface of the first circuit board 2 connecting the plurality of first heating elements is conducted to the first heat dissipating member 1 through the first heat conducting pads 8. Optionally, the first heat conducting pads 8 cover the first heating elements. If the sizes of the plurality of first heating elements are different, the sizes of the plurality of first heat conducting pads 8 are also different.

[0067] Optionally, a plurality of second heating elements 9 are arranged on the third surface of the second circuit board 5. The fourth surface of the second circuit board 5 contacts a plurality of second heat conducting pads 10, and the plurality of second heat conducting pads 10 respectively correspond to the regions where the plurality of second heating elements 9 are located. That is, a plurality of second heat conducting pads 10 are arranged at the back of the second circuit board 5 where the second heating elements 9 are arranged, so that the heat on the surface of the second circuit board 5 connecting the plurality of second heating elements 9 is conducted to the second heat dissipating member 6 through the second heat conducting pads 10. Optionally, the second heat conducting pads 10 cover the second heating elements 9. If the sizes of the plurality of second heating elements 9 are different, the sizes of the plurality of second heat conducting pads 10 are also different.

[0068] Optionally, the double-layer circuit board structure 800 further includes a first cover plate 12 and a second cover plate 13 which are connected. The first cover plate 12 is clamped between the first main body portion 102 of the first heat dissipating member 1 and the first circuit board 2. Optionally, the first cover plate 12 and the first main body portion 102 are integrated, that is, the first cover plate 12 functions as a heat dissipating cover plate. A groove for placing the first heat conducting pad 8 is formed on the surface of the first cover plate 12 facing the first circuit board 2, and the first heat conducting pad 8 is attached to the bottom of the groove to ensure that the heat at the first heat conducting pad 8 can be quickly conducted to the first main body portion 102 through the first cover plate 12 and released. Optionally, the first main body portion 102 is made of an aluminum alloy material.

[0069] Optionally, the first main body portion 102 extends in the second direction. The first main body portion 102 has first circuit line avoidance spaces 121 on both sides in the third direction, and the third direction is perpendicular to both the first direction and the second direction. That is, there are first circuit line avoidance spaces 121 on both sides of the first main body portion 102. Optionally, cables of the first circuit board 2 and the like can be arranged at the first circuit line avoidance spaces 121. The first circuit line avoidance spaces 121 penetrate in the second direction, which can facilitate the docking of the cables with other components in the oscilloscope server.

[0070] Optionally, the second cover plate 13 is clamped between the second main body portion 602 of the second heat dissipation member 6 and the second circuit board 5. Optionally, the second cover plate 13 and the second main body portion 602 are integrated, that is, the second cover plate 13 functions as a heat dissipation cover plate. A groove for placing the second heat conducting pad 10 is formed on the surface of the second cover plate 13 facing the second circuit board 5, and the second heat conducting pad 10 is attached to the bottom of the groove to ensure that the heat at the second heat conducting pad 10 can be quickly transferred to the second main body portion 602 through the second cover plate 13 and released. Optionally, the second main body portion 602 is also made of an aluminum alloy material.

[0071] Optionally, the second main body portion 602 extends in the second direction. The second main body portion 602 has second circuit line avoidance spaces on both sides in the third direction. That is, there are second circuit line avoidance spaces on both sides of the second main body portion 602. Optionally, cables of the second circuit board 5 and the like can be arranged at the second circuit line avoidance spaces. The second circuit line avoidance spaces also penetrate in the second direction, which can facilitate the docking of the cables with other components in the oscilloscope server.

[0072] Optionally, the double-layer circuit board structure 800 further includes a fan 7. The first protruding portion 101 and the second protruding portion 601 are arranged opposite to each other in the first direction, that is, the first protruding portion 101 and the second protruding portion 601 are located at the same end of the support plate 11 in the second direction. The fan 7 is located at one end of the first protruding portion 101 and the second protruding portion 601 in the second direction. The fan 7 is used to blow air to the first heat dissipation member 1 and the second heat dissipation member 6. Optionally, in this embodiment, two fans 7 are correspondingly arranged for the first double-layer circuit board structure 800, and the two fans 7 are arranged in sequence in the third direction. The main air blowing ranges of the two fans 7 can generally cover the first heat dissipation member 1 and the second heat dissipation member 6. Of course, in other embodiments, different numbers of fans 7 can also be set according to the size of the fan 7 and the width of the heat dissipation member, which is not limited herein.

[0073] It can be known that, in the present embodiment, the positions of the first heating element and the second heating element 9 are relatively arranged. Optionally, the first circuit board 2 and the second circuit board 5 have the same structure and are relatively arranged, and the other heat-conducting and heat-dissipating structures are also arranged accordingly. Specifically, the first heat-conducting component 3 has the same structure as the second heat-conducting component 4 and is relatively arranged. The placement orientations of the first thermal pad 8 and the second thermal pad 10 are also relatively arranged, and the first heat sink 1 and the second heat sink 6 have the same structure and are relatively arranged. The first cover plate 12 and the second cover plate 13 have the same structure and are relatively arranged. The groove settings on the two surfaces of the support plate 11 are also the same, but because they are located on two relatively opposite surfaces, the openings are in opposite directions.

[0074] Optionally, in this embodiment, the first heating element and the second heating element 9 are arranged opposite to each other, but in other embodiments, they can also be arranged to be arranged opposite to each other or in the same direction. In this embodiment, the front of the heating element contacts the heat-conducting component, and the back of the circuit board contacts the heat-conducting pad at a position corresponding to the heating element. In other embodiments, it can also be arranged that the front of the heating element contacts the heat-conducting pad, and the back of the circuit board contacts the heat-conducting component at a position corresponding to the heating element.

[0075] The assembly process of the double-layer circuit board structure 800 includes:

[0076] The second circuit board 5 is passed through the positioning pins of the second cover plate 13 and is installed and fixed at the corresponding screw hole positions. According to the installation method of the second circuit board 5, the first circuit board 2 and the first cover plate 12 are installed and fixed.

[0077] Then, the first heat conducting pipe 302 is placed in the first heat conducting groove and welded, and then the first heat conducting plate 301 is placed in the third limiting groove 113, and the first heat conducting plate 301 and the first heat conducting pipe 302 are welded, and the first heat conducting plate 301 and the support plate 11 are welded to ensure that the first heat conducting assembly 3 is welded to the support plate 11 as a whole. According to the above method, the second heat conducting pipe 402 and the second heat conducting plate 401 are welded accordingly, and welded to the support plate 11, and the two are welded and fixed.

[0078] Next, the first cover plate 12 with the first circuit board 2 installed is passed through the positioning pins on the support plate 11, and is installed and fixed at the corresponding screw hole positions. Similarly, the second cover plate 13 is installed and fixed to the support plate 11. The first protrusion 101 is placed in the first limiting groove 111 of the support plate 11, and the first protrusion 101 and the first heat pipe 302 are pressed and screwed to connect the first heat sink 1 to the support plate 11. Similarly, the second heat sink 6 is connected and fixed to the support plate 11 in the above manner. At this point, the double-layer circuit board structure 800 is assembled.

[0079] like Figure 2As shown in the figure, this embodiment also provides an oscilloscope server, which includes a box body 900 and the above-mentioned double-layer circuit board structure 800. The double-layer circuit board structure 800 is arranged inside the box body 900. This oscilloscope server can improve the heat dissipation efficiency while occupying less space.

[0080] Optionally, installation positioning holes are reserved on the first cover plate 12, and a plurality of screw mounting holes are reserved on both sides of the first main body portion 102 of the first heat dissipation member 1. The double-layer circuit board structure 800 can be installed and fixed on the box body 900 through the installation positioning holes and the screw mounting holes.

[0081] Optionally, a plurality of heat dissipation holes 901 are formed in the box body 900 to quickly release the heat inside the box body 900 to the outside.

[0082] The above-mentioned double-layer circuit board structure 800 has many advantages. First of all, there are multiple heating components, that is, heat sources, on the circuit board, and this design can achieve multi-point efficient heat dissipation. In addition, the two circuit boards conduct heat simultaneously on the upper and lower sides of the heating components, which can improve the heat dissipation efficiency. While ensuring heat dissipation, a line avoidance space is reserved, which is convenient for arranging the wiring inside the oscilloscope server. Moreover, the integration degree of the double-layer circuit board structure 800 is relatively high, which is convenient for assembly and maintenance during the manufacturing process. With extremely precise physical size control, it can ensure that multiple double-layer circuit board structures 800 can be installed in the box body 900 of a standard 2U oscilloscope server, realizing higher product performance.

[0083] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Double-layer circuit board structure, characterized in that: It comprises a first heat sink (1), a first circuit board (2), a first heat conducting component (3), a second heat conducting component (4), a second circuit board (5) and a second heat sink (6) which are arranged layer by layer along a first direction; A first heating element is provided on the first circuit board (2); heat from one side of the first heating element is transferred to the first heat sink (1) via a first heat conductive pad (8), and heat from the other side of the first heating element is transferred to the first heat sink (1) via the first heat conductive component (3); A second heating element (9) is provided on the second circuit board (5); heat from one side of the second heating element (9) is transferred to the second heat dissipation element (6) via a second thermal pad (10), and heat from the other side is transferred to the second heat dissipation element (6) via the second thermal conductive component (4).

2. The double-layer circuit board structure according to claim 1, characterized in that: The first heat-conducting component (3) extends along a second direction to contact a first protruding portion (101) of the first heat dissipating element (1) that is protruding along the first direction; The second heat-conducting component (4) extends along the second direction to contact a second protruding portion (601) of the second heat dissipating element (6) that is protruding along the first direction.

3. The double-layer circuit board structure according to claim 2, characterized in that: The first heat-conducting component (3) comprises a first heat-conducting plate (301) and a first heat-conducting pipe (302) that are in contact with each other, the first heat-conducting plate (301) contacts the first heat-generating element, and the first heat-conducting pipe (302) extends along the second direction to contact the first protrusion (101); The second heat-conducting component (4) comprises a second heat-conducting plate (401) and a second heat-conducting pipe (402) that are in contact with each other, the second heat-conducting plate (401) contacts the second heating element (9), and the second heat-conducting pipe (402) extends along the second direction to contact the second protrusion (601).

4. The double-layer circuit board structure according to claim 3, characterized in that: The first circuit board (2) is provided with a plurality of the first heat-generating elements, the first heat-conducting assembly (3) comprises a plurality of the first heat-conducting plates (301), and the plurality of the first heat-conducting plates (301) are provided in a one-to-one correspondence with the plurality of the first heat-generating elements; And / or, a plurality of the second heat-generating elements (9) are arranged on the second circuit board (5), the second heat-conducting assembly (4) comprises a plurality of the second heat-conducting plates (401), and the plurality of the second heat-conducting plates (401) are arranged in a one-to-one correspondence with the plurality of the second heat-generating elements (9).

5. The double-layer circuit board structure according to claim 3, characterized in that: It also comprises a support plate (11), wherein the support plate (11) is sandwiched between the first heat-conducting component (3) and the second heat-conducting component (4), and the first heat-conducting component (3) and the second heat-conducting component (4) are both connected to the support plate (11).

6. The double-layer circuit board structure according to claim 5, characterized in that: A first limiting groove (111) is provided on one surface of the support plate (11), a first positioning groove (112) is provided at the bottom of the first limiting groove (111), the first protruding portion (101) is located at the first limiting groove (111), and a portion of the first heat conducting pipe (302) is located at the first positioning groove (112); And / or, a second limiting groove is provided on the other surface of the support plate (11), a second positioning groove is provided at the bottom of the second limiting groove, the second protrusion (601) is located at the second limiting groove, and the second heat conducting pipe (402) is partially located at the second positioning groove; And / or, a third limiting groove (113) is provided on one surface of the support plate (11), a third positioning groove (114) is provided at the bottom of the third limiting groove (113), the first heat conducting plate (301) is located at the third limiting groove (113), and a portion of the first heat conducting pipe (302) is located at the third positioning groove (114); And / or, a fourth limiting groove is provided on the other surface of the support plate (11), a fourth positioning groove is provided at the bottom of the fourth limiting groove, the second heat conducting plate (401) is located at the fourth limiting groove, and a portion of the second heat conducting pipe (402) is located at the fourth positioning groove.

7. The double-layer circuit board structure according to any one of claims 1 to 6, characterized in that: A plurality of the first heat generating components are arranged on the first surface of the first circuit board (2), the second surface of the first circuit board (2) contacts a plurality of the first heat conducting pads (8), and the plurality of the first heat conducting pads (8) respectively correspond to the areas where the plurality of the first heat generating components are located; And / or, a plurality of the second heating elements (9) are arranged on the third surface of the second circuit board (5), and a fourth surface of the second circuit board (5) contacts a plurality of the second thermal conductive pads (10), and the plurality of the second thermal conductive pads (10) respectively correspond to the areas where the plurality of the second heating elements (9) are located.

8. The double-layer circuit board structure according to any one of claims 1 to 6, characterized in that: It also includes a first cover plate (12) and a second cover plate (13) connected to each other, and the third direction is perpendicular to both the first direction and the second direction; The first cover plate (12) is sandwiched between the first main body (102) of the first heat sink (1) and the first circuit board (2); the first main body (102) extends along the second direction; and the first main body (102) has first circuit avoidance spaces (121) on both sides along the third direction; And / or, the second cover plate (13) is sandwiched between the second main body (602) of the second heat sink (6) and the second circuit board (5), the second main body (602) extends along the second direction, and the second main body (602) has a second circuit avoidance space on both sides along the third direction.

9. The double-layer circuit board structure according to any one of claims 2 to 6, characterized in that: The heat sink further comprises a fan (7), wherein the first protrusion (101) and the second protrusion (601) are arranged opposite to each other along the first direction, and the fan (7) is located at one end of the first protrusion (101) and the second protrusion (601) along the second direction, and the fan (7) is used to blow air toward the first heat sink (1) and the second heat sink (6).

10. An oscilloscope server, characterized in that: It comprises a box body (900) and a double-layer circuit board structure according to any one of claims 1 to 9, wherein the double-layer circuit board structure (800) is arranged in the box body (900).

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