Laser cutting device

By designing a laser cutting device, the linear moving module is used to drive the movement of components such as lasers and reflectors, and the cutting of customized paths is achieved, which solves the problems of low cutting efficiency and pollution in traditional mechanical processes, and improves the efficiency and accuracy of wafer coating cutting.

CN222999875UActive Publication Date: 2025-06-20SHENZHEN CPT PRECISION TECH CO LTD
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Patent Information

Application Number
CN202421729505.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2025-06-20
Estimated Expiration
2034-07-19

AI Technical Summary

Technical Problem

Traditional mechanical cutting technology is inefficient and poor in terms of cutting wafer coating, and is prone to burrs and dust pollution, affecting production efficiency.

Method used

A laser cutting device is designed, including a base bracket, a linear moving module, a mounting frame, a laser, a mirror and a galvanometer module. The linear moving module drives the laser and mirror components to move, realizing the cutting of a custom path.

Benefits of technology

It improves cutting efficiency and accuracy, and the path is customizable. It is suitable for cutting blue films with wafer shapes of 12 inches and below, greatly improving production efficiency and cutting accuracy, avoiding the limitations of traditional tool cutting.

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Abstract

The utility model relates to a laser cutting device which comprises a base support. The mounting plate is fixed on the base bracket; the linear moving module is fixed on the base bracket; the linear moving module drives the mounting frame to move linearly; the laser is fixed on the mounting frame; the upper reflecting mirror is fixed at the outlet end of the laser, and the laser emitted by the laser is transmitted to the upper reflecting mirror; the light cylinder is fixedly connected with the upper reflecting mirror in a sealed mode, and reflected laser of the upper reflecting mirror enters the light cylinder; the lower reflecting mirror is connected to one end, far away from the upper reflecting mirror, of the light barrel; and the vibrating mirror module is in butt joint with the lower reflecting mirror, the laser emitted from the interior of the light cylinder enters the vibrating mirror module through the lower reflecting mirror, and the vibrating mirror module is fixed on the mounting frame.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer film covering and cutting, in particular to a laser cutting device. Background Art

[0002] After the wafer is covered with a film, it usually needs to be cut. The traditional method is mechanical cutting. This method not only has poor versatility and low efficiency, but also is prone to burrs and dust particles when cutting the film, causing pollution, and the high tool change frequency affects the production efficiency. Content of the Utility Model

[0003] In view of the above situation, it is necessary to propose a laser cutting device that is not limited by the efficiency and path of traditional knife cutting.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a laser cutting device, comprising:

[0005] A base bracket;

[0006] A mounting plate, fixed on the base bracket;

[0007] A linear movement module, fixed on the base bracket;

[0008] A mounting frame, the linear movement module drives the mounting frame to move linearly;

[0009] A laser, fixed on the mounting frame;

[0010] An upper reflecting mirror, fixed at the outlet end of the laser, and the laser emitted by the laser is transmitted to the upper reflecting mirror;

[0011] A light cylinder, hermetically and fixedly connected with the upper reflecting mirror, and the reflected laser of the upper reflecting mirror enters the light cylinder;

[0012] A lower reflecting mirror, connected to one end of the light cylinder far from the upper reflecting mirror;

[0013] A galvanometer module, docked with the lower reflecting mirror, and the laser emitted from the light cylinder enters the galvanometer module through the lower reflecting mirror, and the galvanometer module is fixed on the mounting frame.

[0014] Further, the linear movement module includes a linear motor, a linear guide rail, a dust-free drag chain and a driving slider, and the linear motor drives the driving slider to move along the linear guide rail.

[0015] Further, it further includes an auxiliary guide rail, an auxiliary slider and a connecting frame, the auxiliary guide rail and the auxiliary slider are slidably matched, and further includes a connecting frame, both the driving slider and the auxiliary slider are connected to the connecting frame, and the connecting frame is fixed to the mounting frame.

[0016] Further, the connecting frame is in an inverted U shape. The connecting frame includes a first connecting plate connected to the driving slider, a second connecting plate connected to the auxiliary slider, and a support plate connected to the mounting frame. The first connecting plate and the second connecting plate are respectively connected to two ends of the support plate.

[0017] Further, there are two auxiliary sliders arranged at intervals, and both of the two auxiliary sliders are connected to the second connecting plate.

[0018] Further, the mounting frame includes a top plate, a back plate, side plates, a bottom plate, and inclined rib plates. The top plate is fixed on the support plate and extends outward. The two side plates are connected to the lower end of the top plate. The back plate is connected to the second connecting plate. The inclined rib plates are connected to the back plate and support and connect the top plate. The bottom plate is connected to one end of the side plate away from the top plate. The top plate, the bottom plate, and the side plates are all connected to the back plate. The laser is fixed on the top plate, and the galvanometer module is fixed on the bottom plate and protrudes outward.

[0019] Further, an upper closed box is configured for the upper reflecting mirror, and a lower closed box is configured for the lower reflecting mirror. The upper closed box and the lower closed box are respectively hermetically connected to two ends of the light tube.

[0020] Further, it further includes a mounting plate. The mounting plate is fixed on the base bracket, and the linear movement module is fixed on the mounting plate.

[0021] The beneficial effects of the present utility model are as follows: The linear movement module drives the laser, the upper reflecting mirror, the light tube, the lower reflecting mirror, and the galvanometer module to move, which is compatible with the cutting of blue films with the shape of wafers of 12 inches and below; The cutting efficiency is high, the path can be customized, and it can move in the XY directions relative to the product, that is, the movement of the linear movement module and the XY deflection of the galvanometer module itself are used to achieve multi-point positioning; It is not restricted by the efficiency and path of traditional knife cutting, and greatly improves the production efficiency and cutting accuracy. Description of the Drawings

[0022] Figure 1 is an exploded structural schematic diagram of a laser cutting device according to an embodiment of the present utility model;

[0023] Figure 2 is a structural schematic diagram of a laser cutting device according to an embodiment of the present utility model.

[0024] Label Description:

[0025] 100, base bracket; 200, linear movement module; 210, linear motor; 220, linear guide rail;

[0026] 230, Dust-free drag chain; 300, Mounting bracket; 310, Top plate; 320, Side plate; 330, Back plate;

[0027] 340, Bottom plate; 350, Inclined rib plate; 400, Laser; 510, Upper reflector; 520, Light cylinder;

[0028] 530, Lower reflector; 540, Galvo module; 610, Auxiliary guide rail; 620, Auxiliary slider;

[0029] 630, Connecting frame; 631, First connecting plate; 632, Second connecting plate; 633, Support plate;

[0030] 700, Mounting plate. Detailed implementation mode

[0031] In order to make the purpose, technical solution and advantages of the present utility model clearer, the following further details a laser cutting device of the present utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0032] Please refer to Figure 1 and Figure 2 , a laser cutting device, comprising:

[0033] Base bracket 100;

[0034] Mounting plate 700, fixed on the base bracket 100;

[0035] Linear movement module 200, fixed on the base bracket 100;

[0036] Mounting bracket 300, the linear movement module 200 drives the mounting bracket 300 to move linearly;

[0037] Laser 400, fixed on the mounting bracket 300;

[0038] Upper reflector 510, fixed at the outlet end of the laser 400, and the laser emitted by the laser 400 is transmitted to the upper reflector 510;

[0039] Light cylinder 520, hermetically and fixedly connected to the upper reflector 510, and the reflected laser of the upper reflector 510 enters the light cylinder 520;

[0040] Lower reflector 530, connected to one end of the light cylinder 520 away from the upper reflector 510;

[0041] Galvo module, docked with the lower reflector 530, and the laser emitted from the light cylinder 520 enters the galvo module through the lower reflector 530, and the galvo module is fixed on the mounting bracket 300.

[0042] The linear motion module 200 drives the laser 400, the upper mirror 510, the optical cylinder 520, the lower mirror 530 and the galvanometer module 540 to move, which is compatible with the cutting of blue films with the shape of wafers of 12 inches or less; it has high cutting efficiency, the path can be customized, and it can move in the XY directions relative to the product, that is, the movement of the linear motion module 200 and the XY deflection of the galvanometer module 540 itself to achieve multi-point positioning; it is not restricted by the efficiency and path of traditional knife cutting, greatly improving the production efficiency and cutting accuracy.

[0043] Please refer to Figure 1 and Figure 2 , the linear motion module 200 includes a linear motor 210, a linear guide 220, a dust-free cable carrier 230 and a driving slider, and the linear motor 210 drives the driving slider to move along the linear guide 220. The dust-free cable carrier 230 is used for the electrical connection and signal connection of the laser 400 and the galvanometer module 540.

[0044] Please refer to Figure 1 and Figure 2 , it further includes an auxiliary guide 610, an auxiliary slider 620 and a connecting frame 630. The auxiliary guide 610 and the auxiliary slider 620 are in sliding fit, and it further includes a connecting frame 630. Both the driving slider and the auxiliary slider 620 are connected to the connecting frame 630, and the connecting frame 630 is fixed to the mounting frame 300. Through the auxiliary slider 620, the auxiliary guide 610 and the connecting frame 630, the stability of movement and the load-bearing capacity are improved.

[0045] Specifically, please refer to Figure 1 and Figure 2 , the connecting frame 630 is in an inverted U shape. The connecting frame 630 includes a first connecting plate 631 connected to the driving slider, a second connecting plate 632 connected to the auxiliary slider 620 and a support plate 633 connected to the mounting frame 300. The first connecting plate 631 and the second connecting plate 632 are respectively connected to both ends of the support plate 633.

[0046] Please refer to Figure 1 , there are two auxiliary sliders 620 arranged at intervals, and both two auxiliary sliders 620 are connected to the second connecting plate 632. The stability of movement and the load-bearing capacity are improved.

[0047] Please refer to Figure 1 and Figure 2, the mounting bracket 300 includes a top plate 310, a back plate 330, side plates 320, a bottom plate 340, and diagonal rib plates 350. The top plate 310 is fixed on the support plate 633 and extends outward. Two side plates 320 are connected to the lower end of the top plate 310. The back plate 330 is connected to the second connecting plate 632. The diagonal rib plates 350 are connected to the back plate 330 and support the connection with the top plate 310. The bottom plate 340 is connected to one end of the side plates 320 away from the top plate 310. The top plate 310, the bottom plate 340, and the side plates 320 are all connected to the back plate 330. The laser 400 is fixed on the top plate 310, and the galvanometer module is fixed on the bottom plate 340 and protrudes outward. The mounting bracket 300 is generally connected by screws and bolts, and welding can also be used when necessary.

[0048] Please refer to Figure 1 and Figure 2 , the upper mirror 510 is configured with an upper closed box, and the lower mirror 530 is configured with a lower closed box. The upper closed box and the lower closed box are respectively hermetically connected to both ends of the optical cylinder 520. The closed boxes and the optical cylinder 520 are provided to ensure the sealing of the optical path, avoid leakage, and ensure the efficiency of the laser.

[0049] Please refer to Figure 1 and Figure 2 , it further includes a mounting plate 700. The mounting plate 700 is fixed on the base bracket 100, and the linear motion module 200 is fixed on the mounting plate 700. The provision of the mounting plate 700 can more stably fix and support the linear motion module 200. In particular, the auxiliary guide rail 610 is fixed on the mounting plate 700.

[0050] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, then such directional indications are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0051] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, then such descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0052] In summary, a laser cutting device provided by the present utility model drives a laser, an upper reflector, a light cylinder, a lower reflector and a galvanometer module to move through a linear motion module, and is compatible with the cutting of blue films with a wafer shape of 12 inches or less; it has high cutting efficiency, the path can be customized, and the relative product can move in the XY direction, that is, the movement of the linear motion module and the XY deflection of the galvanometer module itself to achieve multi-point positioning; it is not restricted by the efficiency and path of traditional knife cutting, greatly improving the production efficiency and cutting accuracy.

[0053] The above are only the preferred embodiments of the present utility model and do not impose any form of limitation on the present utility model. Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the disclosed technical content within the scope of the technical solution of the present utility model. However, as long as it does not depart from the content of the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. A laser cutting device, characterized in that: include: Base bracket; A linear moving module is fixed on the base support; A mounting frame, wherein the linear motion module drives the mounting frame to move linearly; A laser, fixed on the mounting frame; An upper reflector, fixed at the exit end of the laser, and the laser light emitted by the laser is transmitted to the upper reflector; A light cylinder is sealed and fixedly connected to the upper reflector, and the reflected laser of the upper reflector enters the light cylinder; A lower reflector, connected to an end of the light tube away from the upper reflector; The galvanometer module is connected to the lower reflector, and the laser emitted from the light tube enters the galvanometer module through the lower reflector. The galvanometer module is fixed on the mounting frame.

2. A laser cutting device according to claim 1, characterized in that: The linear motion module comprises a linear motor, a linear guide rail, a dust-free drag chain and a driving slider, and the linear motor drives the driving slider to move along the linear guide rail.

3. A laser cutting device according to claim 2, characterized in that: It also includes an auxiliary guide rail, an auxiliary slider and a connecting frame, the auxiliary guide rail and the auxiliary slider are slidably matched, and also includes a connecting frame, the driving slider and the auxiliary slider are both connected to the connecting frame, and the connecting frame is fixed to the mounting frame.

4. A laser cutting device according to claim 3, characterized in that: The connecting frame is in an inverted U-shape, and includes a first connecting plate connected to the driving slider, a second connecting plate connected to the auxiliary slider, and a supporting plate connected to the mounting frame, and the first connecting plate and the second connecting plate are respectively connected to both ends of the supporting plate.

5. A laser cutting device according to claim 4, characterized in that: Two auxiliary sliding blocks are arranged at intervals, and both of the two auxiliary sliding blocks are connected to the second connecting plate.

6. The laser cutting device according to claim 4, characterized in that: The mounting frame includes a top plate, a back plate, a side plate, a bottom plate and an oblique rib plate, the top plate is fixed to the support plate and extends outward, the two side plates are connected to the lower end of the top plate, the back plate is connected to the second connecting plate, the oblique rib plate is connected to the back plate and supports the top plate, the bottom plate is connected to one end of the side plate away from the top plate, the top plate, the bottom plate and the side plates are all connected to the back plate, the laser is fixed to the top plate, and the galvanometer module is fixed to the bottom plate and protrudes outward.

7. The laser cutting device according to claim 1, characterized in that: The upper reflector is provided with an upper closed box, and the lower reflector is provided with a lower closed box. The upper closed box and the lower closed box are respectively sealed and connected to the two ends of the light tube.

8. The laser cutting device according to claim 1, characterized in that: It also includes a mounting plate, which is fixed on the base bracket, and the linear motion module is fixed on the mounting plate.