Pin welding device for MOS tube production

Abstract

The utility model provides a pin welding device for MOS tube production, and relates to the technical field of MOS tube welding equipment.The pin welding device for MOS tube production comprises a low-temperature bin, and the interior of the low-temperature bin is used for containing an MOS tube; the cold supply equipment communicates with the interior of the low-temperature bin and is used for introducing low-temperature air into the low-temperature bin; the transfer mechanism is used for moving the MOS tube out of the low-temperature bin and transferring the MOS tube to the circuit board; and the welding mechanism is used for welding the MOS tubes moved out of the low-temperature bin. The MOS tube to be welded is arranged in the low-temperature bin, and low-temperature air is introduced into the low-temperature bin through the cooling equipment, so that the MOS tube in the low-temperature bin is at a lower temperature, the MOS tube can be prevented from being overheated, cooling measures are not needed, and the welding quality is not influenced.

Description

Technical Field

[0001] This application relates to the technical field of MOS transistor welding equipment, and in particular to a pin welding device for MOS transistor production. Background Art

[0002] MOS transistor, fully known as metal-oxide-semiconductor field-effect transistor, is an electronic switching device that uses the electric field effect to control the conductivity of semiconductor devices. It is widely used in digital circuits, analog circuits, power electronics, microprocessors, integrated circuits and other fields. In digital circuits, MOS transistors are often used as switching elements to build various logic gate circuits, flip-flops, registers, etc.; in analog circuits, MOS transistors can be used to build amplifiers, analog switches, voltage followers, etc.; in the field of power electronics, such as motor drive, power management, inverters, etc., it can provide efficient power conversion and control functions. MOS transistors have the advantages of high input impedance, low drive power, good switching characteristics, fast switching speed, and easy compatibility with integrated circuit processes.

[0003] The MOS transistor pin welding device is a device used to fixedly electrically connect the MOS transistor to the circuit board. For example, the utility model patent with the publication number CN215615911U discloses a welding device for low-voltage MOS transistor production. This welding device for low-voltage MOS transistor production can quickly and stably fix the low-voltage MOS transistor by pressing down the pressing plate, prevent the low-voltage MOS transistor from shifting during welding, and can lift the support plate, so that the welding head can quickly weld the low-voltage MOS transistor.

[0004] However, since MOS transistors are relatively sensitive to temperature, the optimal temperature during welding is usually controlled between 260 - 280 °C. Overheating may cause damage to the MOS transistor. In related technologies, in order to avoid overheating during welding, the power-off welding method is adopted, that is, the soldering iron is heated and then the power is disconnected, and the residual heat is used for welding. However, when using this welding method, the welding temperature is unstable, which easily affects the welding quality. In addition to the above power-off welding method, in related technologies, a hot air gun is also used to blow air to achieve cooling. However, the wind force of the hot air gun is not easy to control. If the wind force is too small, the cooling effect cannot be achieved. If the wind force is too large, it is easy to blow the molten solder, affecting the welding quality. Summary of the Utility Model

[0005] The purpose of this application is to provide a pin welding device for MOS transistor production, which is used to solve the problems of insufficient cooling effect or easy influence on welding quality caused by using the power-off welding method or hot air gun cooling in related technologies.

[0006] A pin welding device for MOS transistor production provided by this application adopts the following technical solutions:

[0007] A pin welding device for MOS transistor production, comprising:

[0008] A low-temperature chamber, the interior of which is used to accommodate and place MOS transistors;

[0009] A cooling device, which is connected to the interior of the low-temperature chamber and is used to introduce low-temperature air into the low-temperature chamber;

[0010] A transfer mechanism, which is used to remove MOS transistors from the low-temperature chamber and transfer them to a circuit board;

[0011] A welding mechanism, which is used to weld the MOS transistors removed from the low-temperature chamber.

[0012] Optionally, the transfer mechanism includes a removal component and a grasping component. The removal component is used to remove MOS transistors from the low-temperature chamber, and the grasping component is used to grasp the MOS transistors removed from the low-temperature chamber and transfer them to a circuit board.

[0013] Optionally, the removal component includes a turntable and a rotary driving member. The turntable is rotatably arranged inside the low-temperature chamber. A plurality of placement parts for placing MOS transistors are provided on the turntable. An outlet and an inlet are provided on the low-temperature chamber. The rotary driving member is connected to the turntable and is used to drive the turntable to rotate. When the turntable rotates, the placement parts on the turntable can pass through the outlet and pass into the low-temperature chamber through the inlet.

[0014] Optionally, the grasping component includes a clamping member, a rotary driving member, and a three-axis moving module. The three-axis moving module is connected to the rotary driving member. The rotary driving member is connected to the clamping member and is used to drive the clamping member to rotate. The clamping member is used to clamp MOS transistors.

[0015] Optionally, it further includes sealing plates. There are two sealing plates, which are respectively arranged at the outlet and the inlet of the low-temperature chamber in an openable and closable manner. The rotary driving member is connected to the two sealing plates through a linkage component. When the rotary driving member drives the turntable to rotate, it can drive the sealing plates to open.

[0016] Optionally, the linkage component includes an incomplete gear, an elastic member, an opening and closing gear, and an intermediate gear. The elastic member is arranged on the low-temperature chamber and is used to push the sealing plates to close at the outlet and the inlet. A rack is provided on the sealing plates. The opening and closing gear is rotatably arranged on the low-temperature chamber and meshes with the rack. The incomplete gear and the intermediate gear are rotatably arranged on the low-temperature chamber and mesh with each other. The incomplete gear is connected to the rotary driving member, and the intermediate gear is connected to the opening and closing gear.

[0017] Optionally, it further includes a clamping block and a telescopic driving member. A cartridge is provided on the low-temperature bin. The cartridge is used for stacking and storing MOS transistors. The MOS transistors in the cartridge can fall to the placement portion. The telescopic driving member is provided on the cartridge and is connected to the clamping block. The telescopic driving member is used to drive the clamping block to clamp and fix the MOS transistors in the cartridge.

[0018] Optionally, it further includes a carrier, a belt conveyor and a positioning member. The belt conveyor is used to convey the carrier. The carrier is used to carry a circuit board. When the carrier is conveyed to the welding position, the positioning member can position the carrier.

[0019] In summary, the present application includes at least one of the following beneficial technical effects: The MOS transistors to be welded are placed in the low-temperature bin. Low-temperature air is introduced into the low-temperature bin through a cooling device, so that the MOS transistors in the low-temperature bin are at a relatively low temperature. When welding the MOS transistors is required, the MOS transistors are removed from the low-temperature bin through a transfer mechanism and transferred onto the circuit board, and then the MOS transistors removed from the low-temperature bin are welded through a welding mechanism. Since the MOS transistors taken out of the low-temperature bin are at a relatively low temperature, overheating of the MOS transistors can be avoided, and at the same time, without taking cooling measures, the welding quality is ensured not to be affected. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of a pin welding device for MOS transistor production in an embodiment of the present application;

[0021] Figure 2 is a cross-sectional view of a pin welding device for MOS transistor production in an embodiment of the present application;

[0022] Figure 3 is Figure 2 a partial enlarged schematic view of part A in

[0023] Figure 4 is a schematic structural diagram of parts such as a low-temperature bin and a linkage assembly in an embodiment of the present application;

[0024] Figure 5 is Figure 4 a first perspective cross-sectional view of the part shown;

[0025] Figure 6 is Figure 4 a second perspective cross-sectional view of the part shown;

[0026] Figure 7 is Figure 4 a partial enlarged schematic view of part C in

[0027] Figure 8 is Figure 4 a partial enlarged schematic view of part D in

[0028] Figure 9 For Figure 2 Partial enlarged schematic view of part B in

[0029] Explanation of reference numerals:

[0030] 10, Low-temperature bin; 11, Outlet; 12, Inlet; 13, Boss; 14, Barrel; 141, Barrel cover;

[0031] 20, Removal assembly; 21, Turntable; 211, Groove; 212, Central axis; 213, Driven gear; 22, Rotary motor; 221, Driving gear;

[0032] 30, Gripping assembly; 31, Micro electromagnetic gripper; 32, Rotary motor; 33, Three-axis moving module;

[0033] 40, Sealing plate; 41, Rack; 42, Guide post; 43, Bracket;

[0034] 50, Linkage assembly; 51, Incomplete gear; 511, Toothless part; 52, Spring; 53, Opening and closing gear; 531, Transmission shaft; 532, First bevel gear; 54, Intermediate gear; 541, Second bevel gear;

[0035] 60, Carrier; 61, Tapered hole; 70, Belt conveyor; 71, Frame; 72, Roller; 73, Conveyor belt; 74, Conveyor motor; 80, Clamping block; 90, Electromagnetic push rod; 100, MOS tube;

[0036] 110, Position sensor; 120, Positioning electric push rod; 121, Telescopic rod; 130, Air conditioner; 140, Welding torch; 150, Three-axis sliding drive member. Specific implementation manner

[0037] The following will further elaborate on this application in conjunction with the attached Figure 1 - attached Figure 9 , and make a more detailed description of this application.

[0038] The embodiment of this application discloses a pin welding device for MOS tube production.

[0039] A pin welding device for MOS tube production includes a low-temperature bin 10, a cooling device, a transfer mechanism, a welding mechanism, a sealing plate 40, a clamping block 80, a telescopic driving member, a carrier 60, a belt conveyor 70 and a positioning member.

[0040] Referring to Figures 1 to 5 , the interior of the low-temperature bin 10 is used to accommodate and place the MOS tube 100. The cooling device is connected to the interior of the low-temperature bin 10 and is used to introduce low-temperature air into the low-temperature bin 10. The cooling device can adopt the air conditioner 130.

[0041] The transfer mechanism is used to move the MOS transistor 100 out of the low-temperature chamber 10 and transfer it onto the circuit board. More specifically, the transfer mechanism includes a removal component 20 and a grasping component 30. The removal component 20 is used to move the MOS transistor 100 out of the low-temperature chamber 10, and the grasping component 30 is used to grasp the MOS transistor 100 removed from the low-temperature chamber 10 and transfer it onto the circuit board.

[0042] Refer to Figures 4 to 7 , in an alternative embodiment, the removal component 20 and the grasping component 30 may adopt the following structures:

[0043] The removal component 20 includes a turntable 21 and a rotary driving member. The turntable 21 is rotatably disposed in the low-temperature chamber 10. A plurality of placement portions for placing the MOS transistor 100 are provided on the turntable 21. The placement portions are grooves 211. The rotary driving member is connected to the turntable 21 and is used to drive the turntable 21 to rotate. More specifically, a central shaft 212 is provided on the turntable 21, a driven gear 213 is provided on the central shaft 212, the rotary driving member is a rotary motor 22, the rotary motor 22 is fixedly disposed on the low-temperature chamber 10, and a driving gear 221 is provided on the output shaft of the rotary motor 22. The driving gear 221 meshes with the driven gear 213.

[0044] An outlet 11 and an inlet 12 are provided on the low-temperature chamber 10. When the turntable 21 rotates, the placement portions on the turntable 21 can pass through the outlet 11 and penetrate into the low-temperature chamber 10 through the inlet 12.

[0045] The grasping component 30 includes a clamping member, a rotary driving member, and a three-axis moving module 33. The three-axis moving module 33 is connected to the rotary driving member, the rotary driving member is connected to the clamping member, and is used to drive the clamping member to rotate. The clamping member is used to clamp the MOS transistor 100. The rotary driving member may adopt a rotary motor 32, and the clamping member may adopt a micro electromagnetic gripper 31.

[0046] Refer to Figure 5 , a cartridge 14 is provided on the low-temperature chamber 10. A cartridge cover 141 is detachably provided on the cartridge 14. The cartridge 14 is used for stacking and storing the MOS transistors 100. The MOS transistors 100 in the cartridge 14 can fall onto the placement portions. A telescopic driving member is provided on the cartridge 14 and is connected to the clamping block 80. The telescopic driving member is used to drive the clamping block 80 to clamp and fix the MOS transistors 100 in the cartridge 14. The telescopic driving member may adopt an electromagnetic push rod 90.

[0047] Refer to Figure 4 , Figures 6 to 8 , two sealing plates 40 are provided and are respectively openably and closably disposed at the outlet 11 and the inlet 12 of the low-temperature chamber 10. The rotary driving member is connected to the two sealing plates 40 through a linkage component 50. When the rotary driving member drives the turntable 21 to rotate, it can drive the sealing plates 40 to open.

[0048] In an alternative embodiment, the linkage assembly 50 may adopt the following structure: The linkage assembly 50 includes an incomplete gear 51, an elastic member, an opening and closing gear 53, and an intermediate gear 54. The elastic member is disposed on the low-temperature chamber 10 and is used to push the sealing plate 40 to close at the outlet 11 and the inlet 12. More specifically, a boss 13 is provided on the low-temperature chamber 10, a guide post 42 is provided on the sealing plate 40, and the guide post 42 slidably passes through the boss 13. The elastic member is a spring 52, and the spring 52 is sleeved outside the guide post 42. The two ends of the spring 52 are respectively abutted against the boss 13 and the sealing plate 40.

[0049] The two sealing plates 40 are connected by a bracket 43. A rack 41 is provided on one of the sealing plates 40. The opening and closing gear 53 is rotatably disposed on the low-temperature chamber 10 and meshes with the rack 41. The incomplete gear 51 and the intermediate gear 54 are rotatably disposed on the low-temperature chamber 10 and mesh with each other. The incomplete gear 51 is connected to the rotary driving member. More specifically, the incomplete gear 51 is connected to the output shaft of the rotary motor 22.

[0050] The intermediate gear 54 is connected to the opening and closing gear 53. More specifically, a transmission shaft 531 is provided on the opening and closing gear 53, and the transmission shaft 531 is connected to the intermediate gear 54 through a first bevel gear 532 and a second bevel gear 541.

[0051] Refer to Figure 1 、 Figure 2 and Figure 9 As shown in FIGS.

[0052] The carrier 60 is used to carry the circuit board. When the carrier 60 is conveyed to the welding position, the positioning member can position the carrier 60. More specifically, the positioning member includes a position sensor 110 and a positioning electric push rod 120. The position sensor 110 is fixedly disposed on the frame 71 and corresponds to the carrier 60. Tapered holes 61 are provided on both sides of the carrier 60. The positioning electric push rod 120 is fixedly disposed on the frame 71. The end of the telescopic rod 121 of the positioning electric push rod 120 is tapered and can be inserted into the tapered hole 61.

[0053] Refer to Figure 1 As shown in FIGS.

[0054] The implementation principle of a pin welding device for MOS transistor production in this embodiment is as follows: The MOS transistor 100 to be welded is placed in the groove 211 of the turntable 21, and low-temperature air is introduced into the low-temperature chamber 10 through a cooling device, so that the MOS transistor 100 in the low-temperature chamber 10 is at a relatively low temperature.

[0055] When it is necessary to weld the MOS transistor 100, the rotary motor 22 drives the driving gear 221 to rotate one week, and then drives the turntable 21 to rotate through the driven gear 213 and the central shaft 212. When the driving gear 221 rotates, the incomplete gear 51 rotates synchronously, and drives the opening and closing gear 53 to rotate through the intermediate gear 54, the second bevel gear 541, the first bevel gear 532 and the transmission shaft 531. Under the interaction between the opening and closing gear 53 and the rack 41, the sealing plate 40 is driven to move upward, opening the outlet 11 and the inlet 12. When the turntable 21 rotates, the MOS transistor 100 closest to the outlet 11 in the low-temperature chamber 10 is moved outside the low-temperature chamber 10. After the MOS transistor 100 is moved outside the low-temperature chamber 10, the incomplete gear 51 rotates one week and returns to the starting position, that is, the position where the toothless part 511 of the incomplete gear 51 faces the intermediate gear 54. At this time, the intermediate gear 54 and the incomplete gear 51 are in a non-engaged state. Therefore, under the elastic force of the spring 52, the sealing plate 40 is pushed to move downward to close the outlet 11 and the inlet 12, preventing the cold air in the low-temperature chamber 10 from overflowing.

[0056] The circuit board to be welded to the MOS transistor 100 is placed on the carrier 60, and the carrier 60 and the circuit board are conveyed to the welding gun 140 through the belt conveyor 70. During the conveying process, when the carrier 60 moves to the position sensor 110, the position sensor 110 sends a signal to control the belt conveyor 70 to stop conveying. Then, the telescopic rod 121 of the positioning electric push rod 120 is extended to be inserted into the tapered hole 61 to accurately position the carrier 60.

[0057] During welding, the three-axis moving module 33 and the rotary motor 32 are used to control the movement of the micro electromagnetic gripper 31 to grasp the MOS transistor 100 moved outside the low-temperature chamber 10 and move the MOS transistor 100 to the circuit board. Then, the three-axis sliding driving member 150 is used to control the movement of the welding gun 140 to weld the MOS transistor 100. After the MOS transistor 100 outside the low-temperature chamber 10 is removed from the groove 211 of the turntable 21, the groove 211 is in a state of vacancy for the MOS transistor 100. When the turntable 21 rotates next time, the vacant groove 211 moves below the cartridge 14. Then, the electromagnetic push rod 90 is used to drive the clamping block 80 to contract, so that the lowermost MOS transistor 100 in the cartridge 14 falls into the vacant groove 211. Then, the electromagnetic push rod 90 is used to drive the clamping block 80 to act to clamp and fix the second lowermost MOS transistor 100, preventing the MOS transistor 100 in the cartridge 14 from falling when the turntable 21 rotates.

[0058] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. The same components are denoted by the same reference numerals. Therefore, all equivalent changes made according to the structure, shape, and principle of this application shall be covered within the protection scope of this application.

Claims

1. A pin welding device for MOS tube production, characterized in that: include: A low temperature chamber (10), wherein the interior of the low temperature chamber (10) is used to accommodate and place the MOS tube (100); A cooling device, the cooling device being in communication with the interior of the low-temperature warehouse (10) and being used to introduce low-temperature air into the low-temperature warehouse (10); A transfer mechanism, the transfer mechanism being used to move the MOS tube (100) out of the low-temperature warehouse (10) and transfer it to a circuit board; A welding mechanism, wherein the welding mechanism is used to weld the MOS tube (100) removed from the low-temperature warehouse (10).

2. A pin welding device for MOS tube production according to claim 1, characterized in that: The transfer mechanism comprises a removal component (20) and a grabbing component (30), wherein the removal component (20) is used to remove the MOS tube (100) from the low-temperature warehouse (10), and the grabbing component (30) is used to grab the MOS tube (100) removed from the low-temperature warehouse (10) and transfer it to a circuit board.

3. A pin welding device for MOS tube production according to claim 2, characterized in that: The removal assembly (20) comprises a turntable (21) and a rotary drive member. The turntable (21) is rotatably disposed in the low-temperature warehouse (10). The turntable (21) is provided with a plurality of placement portions for placing MOS tubes (100). The low-temperature warehouse (10) is provided with an outlet (11) and an inlet (12). The rotary drive member is connected to the turntable (21) and is used to drive the turntable (21) to rotate. When the turntable (21) rotates, the placement portions on the turntable (21) can pass through the outlet (11) and pass through the inlet (12) into the low-temperature warehouse (10).

4. A pin welding device for MOS tube production according to claim 2, characterized in that: The gripping assembly (30) comprises a clamping member, a rotating driving member and a three-axis moving module (33); the three-axis moving module (33) is connected to the rotating driving member; the rotating driving member is connected to the clamping member and is used to drive the clamping member to rotate; and the clamping member is used to clamp the MOS tube (100).

5. A pin welding device for MOS tube production according to claim 3, characterized in that: It also includes a sealing plate (40), wherein the sealing plate (40) is provided with two pieces and is respectively opened and closed at the outlet (11) and the inlet (12) of the low-temperature warehouse (10), and the rotary drive member is connected to the two sealing plates (40) via a linkage assembly (50), and when the rotary drive member drives the turntable (21) to rotate, it can drive the sealing plate (40) to open.

6. A pin welding device for MOS tube production according to claim 5, characterized in that: The linkage assembly (50) comprises an incomplete gear (51), an elastic member, an opening and closing gear (53) and an intermediate gear (54); the elastic member is arranged on the low-temperature warehouse (10) and is used to push the sealing plate (40) to close at the outlet (11) and the inlet (12); a rack (41) is arranged on the sealing plate (40); the opening and closing gear (53) is rotatably arranged on the low-temperature warehouse (10) and meshes with the rack (41); the incomplete gear (51) and the intermediate gear (54) are rotatably arranged on the low-temperature warehouse (10) and mesh with each other; the incomplete gear (51) is connected to the rotary drive member, and the intermediate gear (54) is connected to the opening and closing gear (53).

7. A pin welding device for MOS tube production according to claim 3, characterized in that: The invention also comprises a clamping block (80) and a telescopic driving member. The low-temperature warehouse (10) is provided with a barrel (14), and the barrel (14) is used for stacking and storing MOS tubes (100). The MOS tubes (100) in the barrel (14) can fall onto the placement portion. The telescopic driving member is provided on the barrel (14) and connected to the clamping block (80). The telescopic driving member is used to drive the clamping block (80) to clamp and fix the MOS tubes (100) in the barrel (14).

8. The pin welding device for MOS tube production according to claim 1, characterized in that: It also includes a carrier (60), a belt conveyor (70) and a positioning member, wherein the belt conveyor (70) is used to convey the carrier (60), the carrier (60) is used to carry a circuit board, and when the carrier (60) is conveyed to a welding position, the positioning member can position the carrier (60).

Images