Heat dissipation device and vehicle lamp

Abstract

The utility model discloses a heat dissipation device, which comprises a driving board, a shielding box and a plurality of heat conduction structures, a plurality of electronic components are arranged on the driving board, the shielding box is arranged on the driving board, a cavity is enclosed by the shielding box and the driving board, each electronic component is arranged in the cavity, and the heat conduction structures are arranged on the shielding box. And the plurality of terminals are respectively arranged between the shielding box and each electronic component. According to the heat dissipation device disclosed by the utility model, the heat conduction structures are respectively arranged between each electronic component and the shielding box, and the heat generated by each electronic component can be respectively conducted to the shielding box through the arrangement of the plurality of heat conduction structures, so that the heat can be dissipated through the shielding box, the heat dissipation effect can be improved, and the overheating damage of the electronic components can be reduced; and the service life of an electrical component can be prolonged. The utility model further discloses a car lamp.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, and more specifically, to a heat dissipation device and a vehicle lamp. Background Art

[0002] At present, a shielding box is arranged on a driving board of a vehicle tail lamp. The driving board is wrapped by the shielding box. When electronic components on the driving board work, heat is generated, resulting in a high space temperature. If the heat dissipation is insufficient, the electronic components may be damaged by overheating, affecting normal use.

[0003] Therefore, how to improve the heat dissipation effect of electronic components, reduce the overheating damage of electronic components, and extend the service life of electronic components has become a technical problem to be solved urgently by those skilled in the art. Summary of the Utility Model

[0004] In view of this, an object of the utility model is to provide a heat dissipation device to improve the heat dissipation effect of electronic components, reduce the overheating damage of electronic components, and extend the service life of electronic components.

[0005] Another core of the utility model lies in disclosing a vehicle lamp including the above heat dissipation device.

[0006] To achieve the above object, the utility model provides the following technical solutions:

[0007] A heat dissipation device includes:

[0008] A driving board, on which a plurality of electronic components are arranged;

[0009] A shielding box, which is arranged on the driving board and encloses a cavity with the driving board, and each electronic component is arranged in the cavity;

[0010] A heat conduction structure, including a plurality of heat conduction structures, which are respectively arranged between the shielding box and each electronic component.

[0011] Optionally, in the above heat dissipation device, heat dissipation columns or heat dissipation holes are arranged on the outer wall of the shielding box for installing the heat conduction structure.

[0012] Optionally, in the above heat dissipation device, a concave part and a convex part are arranged on the shielding box so that the shielding box is respectively in contact with each electronic component.

[0013] Optionally, in the above heat dissipation device, a mounting part for installing the heat conduction structure is arranged on one of the shielding box and the electronic component.

[0014] Optionally, in the above heat dissipation device, the heat conduction structure is adhesively connected to at least one of the electronic component and the shielding box; or,

[0015] The heat-conducting structure is in butt-joint connection with both the electronic component and the shielding box; or,

[0016] The heat-conducting structure is in snap connection with at least one of the electronic component and the shielding box.

[0017] Optionally, in the above heat dissipation device, the form of the heat-conducting structure includes one or more of liquid and solid.

[0018] Optionally, in the above heat dissipation device, the material of the heat-conducting structure includes one or more of metal material, graphite material, phase change material, nanotube material, silica gel material and graphene.

[0019] Optionally, in the above heat dissipation device, the shielding box is connected to the driving board by welding or by fasteners.

[0020] Optionally, in the above heat dissipation device, a heat dissipation fan is arranged on the shielding box.

[0021] A vehicle lamp includes a heat dissipation device, and the heat dissipation device is the above heat dissipation device.

[0022] As can be seen from the above solution, in the heat dissipation device disclosed by the present utility model, by respectively arranging heat-conducting structures between each electronic component and the shielding box, the arrangement of multiple heat-conducting structures can conduct the heat generated by each electronic component to the shielding box respectively, so as to dissipate the heat through the shielding box, which can improve the heat dissipation effect, reduce the overheat damage to the electronic components, and can extend the service life of the electrical components.

[0023] The vehicle lamp disclosed by the present utility model includes a heat dissipation device, so it has all the technical effects of the above heat dissipation device, which will not be elaborated herein. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings.

[0025] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation device disclosed in the embodiment of the present utility model;

[0026] Figure 2 It is a schematic diagram of the internal structure of the heat dissipation device disclosed in the embodiment of the present utility model Figure 1 ;

[0027] Figure 3 It is a schematic diagram of the internal structure of the heat dissipation device disclosed in the embodiment of the present utility model Figure 2;

[0028] Figure 4 For Figure 3 Partial enlarged view of A in

[0029] Among them, 10 is a driving board, 11 is an electronic component, 20 is a shielding box, and 30 is a heat conduction structure. Specific implementation mode

[0030] The core of the present utility model lies in disclosing a heat dissipation device to enhance the heat dissipation effect of electronic components, reduce the overheating damage of electronic components, and extend the service life of electronic components.

[0031] Another core of the present utility model lies in disclosing a vehicle lamp including the above heat dissipation device.

[0032] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

[0033] As Figure 1 And Figure 2 As shown, an embodiment of the present utility model discloses a heat dissipation device, including a driving board 10, a shielding box 20, and a heat conduction structure 30.

[0034] Among them, a plurality of electronic components 11 are arranged on the driving board 10, the shielding box 20 is arranged on the driving board 10, and encloses a cavity with the driving board 10, and each electronic component 11 is arranged in the cavity. The setting of the shielding box 20 can reduce external electromagnetic interference and protect the driving board 10 and the electronic components 11 thereon. The heat conduction structure 30 includes a plurality of them, and is respectively arranged between the shielding box 20 and the electronic components 11, and is in direct contact with both the shielding box 20 and the electronic components 11, so that the heat generated by the electronic component 11 is conducted to the shielding box 20 through the heat conduction structure 30, and the heat is dissipated into the air through the shielding box 20.

[0035] The heat dissipation device disclosed in the embodiment of the present utility model respectively arranges a heat conduction structure 30 between each electronic component 11 and the shielding box 20 to dissipate the heat through the shielding box 20. The setting of a plurality of heat conduction structures 30 can respectively conduct the heat generated by each electronic component 11 to the shielding box 20. Compared with the prior art in which a heat dissipation device is integrally arranged on the shielding box 20 to dissipate heat from the electronic components 11, the heat dissipation effect can be improved, the overheating damage of the electronic components 11 can be reduced, and the service life of the electrical components 11 can be extended.

[0036] It should be noted that the sizes and heights of the various electronic components 11 may be different. To adapt to the sizes of the various electronic components 11, the heat conduction structure 30 can have various sizes; or a heat conduction structure 30 that can meet the heat conduction requirements of the larger-sized electronic components 11 can be selected, and the same-sized heat conduction structure 30 is used for all other electronic components 11. This method is simpler and only the same-specification heat conduction structure 30 is needed.

[0037] The heat conduction structure 30 can be a heat conduction block, a heat conduction plate, a heat conduction sheet, or a heat conduction adhesive. Or part of the heat conduction structure 30 uses a heat conduction block, part of the heat conduction structure 30 uses a heat conduction sheet, and part of the heat conduction structure 30 uses a heat conduction plate, or a combination of multiple of them is used. No specific limitation is made here as long as it can conduct the heat of the electronic component 11 to the shielding box 20. To improve the heat dissipation effect, the contact area between the heat conduction structure 30 and the electronic component 11 is not less than the area of the top surface of the electronic component 11.

[0038] To enhance the heat dissipation effect of the shielding box 20, in some specific embodiments, heat dissipation columns or heat dissipation holes are provided on the outer wall of the shielding box 20 where the heat conduction structure 30 is installed. The number of heat dissipation columns is multiple and they are arranged at intervals. This arrangement can increase the contact area between the shielding box 20 and the air, which is beneficial to heat dissipation. The heat dissipation holes can be set to one or more. When one heat dissipation hole is provided, the heat conduction structure 30 can be directly in contact with the air; or the heat dissipation effect of the shielding box 20 can be enhanced by setting multiple heat dissipation holes.

[0039] As Figure 2 shown, in some specific embodiments, the shielding box 20 is provided with a recessed portion and a protruding portion so that the shielding box 20 abuts against the electronic component 11, that is, the inner wall of the shielding box 20 abuts against one end face of the electronic component 11. The heat conduction structure 30 is provided between the shielding box 20 and the electronic component 11 and abuts against both of them respectively. This arrangement can keep the distances between the inner wall of the shielding box 20 and the various electronic components 11 consistent, which is beneficial to heat dissipation.

[0040] To facilitate the installation of the heat conduction structure 30, an installation portion for installing the heat conduction structure 30 is provided on one of the shielding box 20 and the electronic component 11. Specifically, an installation groove can be provided on the shielding box 20, and the corresponding heat conduction structure 30 can be installed in the installation groove. The heat conduction structure 30 abuts against the electronic component 11 or is connected by bonding; or a protrusion is provided on one or both of the shielding box 20 and the electronic component 11, and a corresponding groove is provided on the heat conduction structure 30, and the heat conduction structure 30 is in concave-convex fit with the shielding box 20 or the electronic component 11. The setting of the installation portion facilitates the positioning and installation of the heat conduction structure 30.

[0041] In some specific embodiments, the heat-conducting structure 30 is adhesively connected to both the electronic component 11 and the shielding box 20, or the heat-conducting structure 30 is adhesively connected to one of the electronic component 11 and the shielding box 20 and abuts against the other; or the heat-conducting structure 30 is in abutting connection with both the electronic component 11 and the shielding box 20, and is fixed by the connection between the shielding box 20 and the driving board 10. In some other specific embodiments, the heat-conducting structure 30 is in snap connection with both the electronic component 11 and the shielding box 20, or is in snap connection with one of them and in adhesive connection or abutting connection with the other.

[0042] In the heat dissipation device disclosed in the embodiment of the present utility model, the form of the heat-conducting structure 30 includes one or more of liquid and solid, that is, the form of the heat-conducting structure 30 can be in liquid form, such as using heat-conducting glue, or in solid form, such as using heat-conducting sheet or heat-conducting plate, and the material of the heat-conducting sheet or heat-conducting plate is preferably metal material; the form of the heat-conducting structure 30 can include liquid form and fixed form, such as combining heat-conducting sheet and heat-conducting glue; or the specific form of the heat-conducting structure 30 is selected according to the temperature of each electronic component 11.

[0043] In the heat dissipation device disclosed in the embodiment of the present utility model, the material of the heat-conducting structure 30 includes one or more of metal material, graphite material, phase change material, nanotube material, silica gel material and graphene.

[0044] In some specific embodiments, the shielding box 20 is connected to the driving board 10 by welding or by fasteners. If the welding connection method is adopted, the soldering method is preferably used. If the heat-conducting structure 30 is selected as heat-conducting glue, during installation, the heat-conducting glue can be coated on each electronic component 11, and then the shielding box 20 can be installed on the driving board 10.

[0045] In some other specific embodiments, the heat-conducting structure 30 includes a heat-conducting plate and heat-conducting glue. The heat-conducting plate is arranged on the shielding box 20, and the heat-conducting glue is arranged between the heat-conducting plate and the driving board 10. In order to enhance heat dissipation, the position on the shielding box 20 where the heat-conducting plate is installed is hollowed out so that the heat-conducting plate is in direct contact with air; in some other specific embodiments, a plurality of heat dissipation columns can be arranged at intervals on the position where the heat-conducting plate is exposed outside the shielding box.

[0046] In order to further improve the heat dissipation effect, in some specific embodiments, a heat dissipation fan is arranged on the shielding box 20, and the arrangement of the heat dissipation fan can enhance air flow and improve the heat dissipation effect.

[0047] In addition, the embodiment of the present utility model also discloses a vehicle lamp, including the above heat dissipation device, so it has all the technical effects of the above heat dissipation device, which will not be elaborated here.

[0048] It should be noted that the embodiments in this specification are all described in a progressive manner. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0049] As shown in this application and the claims, unless the context clearly indicates an exception, words such as "a", "an", "one", and / or "the" are not specifically singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of another identical element in the process, method, commodity, or device that includes the element.

[0050] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0051] The terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0052] Specific examples are used herein to elaborate on the principles and implementation manners of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention. It should be pointed out that for those of ordinary skill in the art of this technology, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A driving board (10), wherein a plurality of electronic components (11) are arranged on the driving board (10); a shielding box (20), the shielding box (20) being arranged on the driving board (10) and enclosing a cavity with the driving board (10), and each of the electronic components (11) being arranged in the cavity; A heat-conducting structure (30), comprising a plurality of heat-conducting structures (30) which are respectively arranged between the shielding box (20) and each of the electronic components (11).

2. The heat dissipation device according to claim 1, characterized in that: The outer wall of the shielding box (20) on which the heat-conducting structure (30) is mounted is provided with heat-dissipating columns or heat-dissipating holes.

3. The heat dissipation device according to claim 1, characterized in that: The shielding box (20) is provided with a recessed portion and a raised portion, so that the shielding box (20) is in contact with each of the electronic components (11) respectively.

4. The heat dissipation device according to claim 3, characterized in that: A mounting portion for mounting the heat-conducting structure (30) is provided on one of the shielding box (20) and the electronic component (11).

5. The heat dissipation device according to claim 4, characterized in that: The heat-conducting structure (30) is adhesively connected to at least one of the electronic component (11) and the shielding box (20); or, The heat-conducting structure (30) is in abutment connection with both the electronic component (11) and the shielding box (20); or, The heat-conducting structure (30) is snap-connected to at least one of the electronic component (11) and the shielding box (20).

6. The heat dissipation device according to claim 1, characterized in that: The form of the heat-conducting structure (30) includes one or more of liquid and solid.

7. The heat dissipation device according to claim 1, characterized in that: The material of the heat-conducting structure (30) includes one or more of metal material, graphite material, phase change material, nanotube material, silica gel material and graphene.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The shielding box (20) is connected to the driving plate (10) by welding or by fasteners.

9. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The shielding box (20) is provided with a heat dissipation fan.

10. A vehicle lamp, comprising a heat dissipation device, characterized in that: The heat dissipation device is the heat dissipation device according to any one of claims 1 to 9.

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