Wafer heating device

Abstract

The utility model discloses a wafer heating device, which relates to the technical field of wafer processing equipment and comprises a heating table, a moving assembly is mounted at the top of the heating table, the moving assembly comprises a moving block, a first electric telescopic rod is fixedly mounted at the bottom of the moving block, and an adsorption part is arranged at the output end of the first electric telescopic rod. The adsorption part comprises an adsorption disc, adsorption holes are formed in the bottom of the adsorption disc, one side of the top of the adsorption disc is connected with an adsorption pipe, and the adsorption holes are communicated with the adsorption pipe. The adsorption pipe is connected with external air exhaust equipment for air exhaust, so that negative pressure is formed in the adsorption holes, adsorption force is generated to tightly adsorb the wafer on the adsorption disc, the wafer is prevented from falling off during movement, the uniformly arranged adsorption holes can provide more uniform adsorption force distribution, and the problem of non-uniform stress is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, and specifically relates to a wafer heating device. Background Technique

[0002] When wafers in a production line are processed, in some processes, the wafers need to be heated first and then processed.

[0003] The Chinese utility model patent with the patent application number 202322340749.8 provides a wafer heating device. By pumping out the air inside the adsorbent, the wafer is fixed on the adsorbent by atmospheric pressure, and the clamping member clamps the edge of the wafer to reduce the risk of wafer fragmentation.

[0004] However, it is found during the use of the above equipment that when the wafer needs to be taken out by the staff wearing gloves after heating, the gloves cannot provide sufficiently precise and stable grasping force, which easily leads to uneven force on the wafer when taken out or slipping during movement, increasing the risk of wafer damage. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a wafer heating device, which solves the problem that when the wafer needs to be taken out by the staff wearing gloves after heating in the background technique, the gloves cannot provide sufficiently precise and stable grasping force, which easily leads to uneven force on the wafer when taken out or slipping during movement.

[0006] To achieve the above purposes, the utility model is realized through the following technical solutions: A wafer heating device includes a heating table, a heating plate is installed on the heating table, a moving component is installed on the top of the heating table, the moving component includes a moving block, an electric telescopic rod I is fixedly installed at the bottom of the moving block, an adsorbent is arranged at the output end of the electric telescopic rod I, the adsorbent includes an adsorption disc, adsorption holes are opened at the bottom of the adsorption disc, one side of the top of the adsorption disc is connected with an adsorption pipe, and the adsorption holes are communicated with the adsorption pipe.

[0007] Preferably, the moving component includes a bracket, the bracket is fixedly arranged on the top of the heating table, a threaded rod is rotatably installed on the inner top of the bracket, one end of the threaded rod is connected with the output end of the motor, and the threaded rod is in screw connection with the moving block.

[0008] Preferably, a sliding rod is arranged in parallel below the threaded rod, both ends of the sliding rod are fixed on the inner wall of the bracket, and the sliding rod horizontally penetrates through the moving block.

[0009] Preferably, a fixing plate is fixedly installed on the top of the heating table. The fixing plates are symmetrically arranged on both sides of the heating plate. An electric telescopic rod II is installed on one side of the fixing plate close to the heating plate. The output end of the electric telescopic rod II is fixedly installed with an arc-shaped clamping plate, and the arc-shaped clamping plate is arranged above the heating plate.

[0010] Preferably, a connecting arm is fixedly welded on the heating table. The connecting arm is rotatably connected with the protective cover. Ventilation holes are symmetrically penetrated through both sides of the protective cover. A handle is fixedly connected to one end of the protective cover away from the connecting arm.

[0011] Preferably, an installation groove is formed on the heating table, and a tray is inserted into the installation groove. The tray is adapted to the installation groove.

[0012] The utility model provides a wafer heating device, which has the following beneficial effects:

[0013] (1) By setting an adsorbing member, the electric telescopic rod I is used to control the adsorption disc to fit with the wafer, so that the adsorption holes uniformly arranged on the adsorption disc are in close contact with the wafer. The external air extraction device is connected through the adsorption pipe to extract air, so that a negative pressure is formed in the adsorption holes, thereby generating an adsorption force to tightly adsorb the wafer on the adsorption disc, avoiding the wafer from falling during movement. The uniformly arranged adsorption holes can provide a more uniform adsorption force distribution to avoid the problem of uneven force.

[0014] (2) By setting a protective cover, when the wafer is heated by the heating plate, the protective cover is used to protect the wafer, which can reduce heat dissipation and prevent external impurities from entering the heating area.

[0015] (3) By setting a moving component, the moving component is used to control the movement of the wafer, which is convenient for the heated wafer to be accurately placed into the tray.

[0016] Thus, when the wafer needs to be taken out by the staff wearing gloves after heating, the gloves cannot provide sufficient precise and stable grasping force, which easily leads to the problem that the wafer is subjected to uneven force when taken out or slips during the movement process. Description of the Drawings

[0017] Figure 1 It is a schematic diagram showing the overall structure of the utility model;

[0018] Figure 2 For the utility model Figure 1 A schematic diagram showing the back view of the overall structure;

[0019] Figure 3 For the utility model Figure 1 A front view of the overall structure;

[0020] Figure 4 For the present utility model Figure 1 is a structural display diagram of the heating table;

[0021] Figure 5 For the present utility model Figure 3 is a structural display diagram of the adsorbing member.

[0022] In the figure, 1 is the heating table; 11 is the connecting arm; 12 is the fixing plate; 121 is the second electric telescopic rod; 122 is the arc-shaped clamping plate; 13 is the installation groove; 2 is the moving assembly; 21 is the bracket; 22 is the motor; 23 is the sliding rod; 24 is the threaded rod; 25 is the moving block; 3 is the heating plate; 4 is the tray; 5 is the protective cover; 51 is the ventilation hole; 52 is the handle; 6 is the first electric telescopic rod; 7 is the adsorbing member; 71 is the adsorption disc; 72 is the adsorption hole; 73 is the adsorption tube. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] Embodiment 1:

[0025] Please refer to Figures 1-5 , a wafer heating device, including a heating table 1, a heating plate 3 is installed on the heating table 1, a moving assembly 2 is installed on the top of the heating table 1, the moving assembly 2 includes a moving block 25, a first electric telescopic rod 6 is fixedly installed at the bottom of the moving block 25, an adsorbing member 7 is arranged at the output end of the first electric telescopic rod 6, the adsorbing member 7 includes an adsorption disc 71, adsorption holes 72 are opened at the bottom of the adsorption disc 71, an adsorption tube 73 is connected to one side of the top of the adsorption disc 71, and the adsorption holes 72 are communicated with the adsorption tube 73;

[0026] The moving assembly 2 includes a bracket 21, the bracket 21 is fixedly arranged on the top of the heating table 1, a threaded rod 24 is rotatably installed on the inner top of the bracket 21, one end of the threaded rod 24 is connected to the output end of the motor 22, and the threaded rod 24 is in screw connection with the moving block 25;

[0027] A sliding rod 23 is arranged in parallel below the threaded rod 24, both ends of the sliding rod 23 are fixed on the inner wall of the bracket 21, and the sliding rod 23 horizontally penetrates through the moving block 25.

[0028] Specifically, the telescopic movement of the electric telescopic rod 6 is utilized to control the suction attachment 7 to move up and down. The suction tube 73 in the suction attachment 7 is connected to an external air extraction device, and the suction tube 73 is communicated with the suction holes 72, so that when the air extraction device extracts air, the air in the suction holes 72 can be extracted through the suction tube 73;

[0029] When taking out the heated wafer, the motor 22 in the moving component 2 is used to drive the threaded rod 24 to rotate. By using the screw connection between the threaded rod 24 and the moving block 25, the moving block 25 can move along the sliding rod 23 when the threaded rod 24 rotates. In the moving component 2, the motor 22 can provide precise rotational speed and rotation angle control, so as to realize high-precision adjustment of the position of the moving block 25 and ensure that the suction attachment 7 accurately moves to the specified position above the wafer;

[0030] After the suction attachment 7 reaches the specified position, the electric telescopic rod 6 is extended to make the suction disc 71 in the suction attachment 7 fit with the wafer, promoting the precise connection between the suction holes 72 and the wafer. Furthermore, when the air extraction device extracts air through the suction tube 73, a negative pressure is formed in the suction holes 72, thereby generating an adsorption force to tightly adsorb the wafer on the suction disc 71, avoiding the problem of the wafer falling when controlling the movement of the wafer. At the same time, the suction holes 72 start from the center of the suction disc 71 and are uniformly arranged in the form of concentric circles. The spacing between the suction holes 72 on the circle is equal, and the spacing between the circles is also consistent, realizing a relatively uniform adsorption effect and avoiding the problem of uneven force on the wafer.

[0031] Embodiment 2:

[0032] Please refer to Figures 1-5 , on the basis of Embodiment 1, a fixing plate 12 is fixedly installed on the top of the heating table 1. The fixing plates 12 are symmetrically arranged on both sides of the heating plate 3. An electric telescopic rod 121 is installed on one side of the fixing plate 12 close to the heating plate 3. The output end of the electric telescopic rod 121 is fixedly installed with an arc-shaped clamping plate 122, and the arc-shaped clamping plate 122 is arranged above the heating plate 3;

[0033] A connecting arm 11 is fixedly welded on the heating table 1. The connecting arm 11 is rotatably connected with the protective cover 5. Ventilation holes 51 are symmetrically formed through both sides of the protective cover 5. One end of the protective cover 5 far from the connecting arm 11 is fixedly connected with a handle 52;

[0034] An installation groove 13 is formed on the heating table 1, and a tray 4 is inserted into the installation groove 13. The tray 4 is adapted to the installation groove 13.

[0035] Specifically, the moving component 2 can be used to control the placement of the wafer on the heating plate 3 through the adsorbing component 7. After the wafer is placed, the electric telescopic rod II 121 on the fixing plates 12 on both sides of the heating plate 3 extends to control the movement of the arc-shaped clamping plates 122, so as to clamp the wafer from both sides of the wafer by using the arc-shaped clamping plates 122. The arc-shaped side of the arc-shaped clamping plate 122 fits with the side wall of the wafer, increasing the contact area, thereby improving the clamping stability and reliability. At the same time, the clamping force is more evenly distributed on the side wall of the wafer, reducing local stress concentration and the risk of wafer damage;

[0036] After the fixing is completed, the staff rotates the protective cover 5 through the handle 52 to cover it above the heating plate 3, which can protect the heating area, effectively prevent the operator from accidentally directly contacting the high-temperature heating plate 3 during the work process, reduce the risk of scalding, and at the same time reduce the diffusion of heat to the surrounding environment, improve the energy utilization efficiency, shorten the heating time and reduce the energy consumption. It can also prevent dust, impurities or other foreign objects from falling into the heating area, keep the heating environment clean, and avoid contaminating the wafer when the wafer is heated. The ventilation holes 51 opened on the protective cover 5 can connect the inside of the protective cover 5 with the outside world. When the gas in the heating area expands due to heat, the ventilation holes 51 can allow the gas to escape, avoid excessive internal pressure, and at the same time the hole-shaped design can avoid excessive heat dissipation;

[0037] The installation groove 13 provided on the heating table 1 can facilitate the accurate placement of the tray 4, making the tray 4 flush with the heating plate 3, which is convenient for accurately placing the wafer into the tray 4 when the moving component 2 controls the movement of the wafer, and avoiding deviation during placement.

[0038] Working principle: When the device is in use, the tray 4 with the wafer is placed in the installation groove 13. The electric telescopic rod I 6 extends to control the suction disc 71 in the adsorbing component 7 to fit with the wafer. The air in the suction holes 72 is extracted by the air extraction device externally connected to the suction tube 73, so that the wafer is firmly adsorbed on the suction disc 71. Then, the electric telescopic rod I 6 contracts to drive the wafer to lift;

[0039] The motor 22 in the moving component 2 is used to control the rotation of the threaded rod 24. By using the screw connection between the threaded rod 24 and the moving block 25, the moving block 25 moves along the slide rod 23, thereby driving the wafer to move above the heating plate 3. Then, the electric telescopic rod I 6 extends so that the wafer can be placed on the heating plate 3. The air extraction device stops extracting air and inflates in the reverse direction, so that the suction disc 71 can be detached from the wafer. Then, the electric telescopic rod II 121 extends to control the arc-shaped clamping plates 122 to clamp the wafer from both sides of the wafer, so that the wafer remains fixed during heating. At the same time, the adsorbing component 7 is controlled to move away to facilitate the staff to rotate the protective cover 5 and cover it on the heating area to protect the heating area;

[0040] After the heating is completed, the staff member opens the protective cover 5, and uses the moving component 2 to control the suction attachment 7 to move above the heated wafer. The heated wafer is adsorbed on the suction plate 71 through the electric telescopic rod 1 6 and the air extraction device. The motor 22 drives the threaded rod 24 to rotate reversely, so that the wafer can move above the tray 4, and the wafer is placed in the tray 4 through the electric telescopic rod 1 6 and the air extraction device. The staff member can drive the wafer to move by moving the tray 4, avoiding direct contact with the surface of the heated wafer.

[0041] The foregoing has shown and described the basic principles, main features and advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed claim.

[0042] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer heating device, comprising a heating platform (1), on which a heating plate (3) is mounted, characterized in that: A moving assembly (2) is installed on the top of the heating table (1), the moving assembly (2) comprising a moving block (25), an electric telescopic rod (6) is fixedly installed on the bottom of the moving block (25), an adsorption component (7) is arranged on the output end of the electric telescopic rod (6), the adsorption component (7) comprises an adsorption disk (71), an adsorption hole (72) is provided at the bottom of the adsorption disk (71), an adsorption tube (73) is connected to one side of the top of the adsorption disk (71), and the adsorption hole (72) is communicated with the adsorption tube (73).

2. A wafer heating device according to claim 1, characterized in that: The moving assembly (2) comprises a bracket (21), the bracket (21) is fixedly arranged on the top of the heating platform (1), a threaded rod (24) is rotatably installed on the top of the bracket (21), one end of the threaded rod (24) is connected to the output end of the motor (22), and the threaded rod (24) is spirally connected to the moving block (25).

3. A wafer heating device according to claim 2, characterized in that: A sliding rod (23) is arranged parallel to the bottom of the threaded rod (24), both ends of the sliding rod (23) are fixed on the inner wall of the bracket (21), and the sliding rod (23) passes through the moving block (25) horizontally.

4. The wafer heating device according to claim 1, characterized in that: A fixing plate (12) is fixedly mounted on the top of the heating platform (1), and the fixing plate (12) is symmetrically arranged on both sides of the heating plate (3). A second electric telescopic rod (121) is mounted on the side of the fixing plate (12) close to the heating plate (3), and an arc-shaped clamping plate (122) is fixedly mounted on the output end of the second electric telescopic rod (121), and the arc-shaped clamping plate (122) is arranged above the heating plate (3).

5. The wafer heating device according to claim 4, characterized in that: A connecting arm (11) is fixedly welded on the heating platform (1), and the connecting arm (11) is rotatably connected to the protective cover (5). Ventilation holes (51) are symmetrically opened on both sides of the protective cover (5), and a handle (52) is fixedly connected to one end of the protective cover (5) away from the connecting arm (11).

6. The wafer heating device according to claim 1, characterized in that: The heating platform (1) is provided with a mounting groove (13), a tray (4) is inserted into the mounting groove (13), and the tray (4) is adapted to fit the mounting groove (13).

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