Liquid refrigeration sheet for semiconductor laser

Abstract

The utility model provides a liquid chilling plate for a semiconductor laser, which belongs to the technical field of heat conduction and heat dissipation, and comprises a main body frame and an access cover, a fin heat dissipation mechanism is arranged in the main body frame, the fin heat dissipation mechanism comprises a tube plate and a fin tube bundle, the tube plate is fixedly arranged in the main body frame, and the fin tube bundle is arranged in the main body frame. And the finned tube bundle is fixedly mounted in the tube plate. According to the liquid chilling plate for the semiconductor laser, the fin heat dissipation mechanism is arranged, the better and faster heat dissipation effect of the device in the using process can be effectively achieved, the heat dissipation surface area of the fin heat dissipation mechanism is increased, and the heat exchange efficiency of the cooling plate and surrounding media is effectively improved; the heat dissipation performance of the semiconductor laser is remarkably improved, the design of the fins can increase the contact area between the cooling fins and surrounding air, the heat transfer rate is increased, the heat dissipation efficiency is improved, and the semiconductor laser can be cooled more quickly.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat conduction and heat dissipation, and particularly relates to a liquid cooling sheet for a semiconductor laser. Background Technique

[0002] The application industries of semiconductor lasers involve fields such as lighting, projection, communication, medical treatment, military, and scientific research. They have the advantages of small size, light weight, high photoelectric conversion efficiency, stable performance, high reliability, and long service life, and have broad development prospects. The increase in the power of semiconductor lasers will lead to heat deposition, which has an important impact on the threshold, wavelength, and polarization of the lasers. In severe cases, it will cause the lasers to fail. Therefore, in order to improve the reliability and stability of semiconductor lasers and reduce production costs, it is very necessary to design a low-cost and efficient heat dissipation structure.

[0003] At present, an existing liquid cooling sheet for a semiconductor laser lacks the function of fin heat dissipation. Fins can increase the heat dissipation surface area and effectively improve the heat transfer efficiency. The lack of fin heat dissipation function will lead to a decline in the heat dissipation performance of the liquid cooling plate, making it unable to effectively dissipate heat, thus affecting the stable operation of the semiconductor laser. Due to the poor heat dissipation effect, the reliability of the system may decline, making the equipment more prone to failures or requiring more frequent maintenance. Content of the Utility Model

[0004] The purpose of the utility model is to provide a liquid cooling sheet for a semiconductor laser, aiming to solve the problems proposed in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A liquid cooling sheet for a semiconductor laser includes a main body frame and a maintenance cover. A fin heat dissipation mechanism is arranged inside the main body frame. The fin heat dissipation mechanism includes a tube plate and a fin tube bundle. The tube plate is fixedly installed inside the main body frame, and the fin tube bundle is fixedly installed inside the tube plate.

[0007] As a preferred scheme of the utility model, a connection mechanism is arranged on the surface of the main body frame. The connection mechanism includes a flange and a plum blossom bolt. The flange is fixedly installed on the surface of the main body frame, and the plum blossom bolt is threadedly connected inside the main body frame and penetrates through the flange.

[0008] As a preferred scheme of the utility model, a circulation mechanism is arranged on the top of the main body frame. The circulation mechanism includes a coolant tank, a water pump, and a connection pipeline. The coolant tank is fixedly installed on the top of the maintenance cover. The water pump is fixedly installed on the top of the maintenance cover and is fixedly connected to the coolant tank. The connection pipeline is fixedly installed on the surface of the coolant tank and is fixedly connected to the input end of the water pump.

[0009] As a preferred embodiment of the present utility model, a ventilation mechanism is provided at the top of the main body frame. The ventilation mechanism includes a ventilation duct, support columns, a motor, a movable shaft, and fan blades. The ventilation duct is fixedly installed on the top of the coolant tank, and the support columns are fixedly installed inside the ventilation duct.

[0010] As a preferred embodiment of the present utility model, the motor is fixedly installed on the surface of the support column, the movable shaft is movably connected to the output end of the motor, and the fan blades are fixedly installed on the surface of the movable shaft.

[0011] As a preferred embodiment of the present utility model, a maintenance cover is fixedly installed on the top of the main body frame, and hexagon bolts are threadedly connected to the surface of the maintenance cover.

[0012] As a preferred embodiment of the present utility model, ventilation holes are provided on the surface of the maintenance cover, and an air intake grille is fixedly installed at the bottom of the main body frame.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. For this liquid cooling sheet for semiconductor lasers, by providing a fin heat dissipation mechanism, it can effectively achieve better and faster heat dissipation during the use of the device. The fin heat dissipation mechanism effectively improves the heat exchange efficiency between the cooling sheet and the surrounding medium by increasing the heat dissipation surface area, significantly enhancing the heat dissipation performance of the semiconductor laser. The design of the fins can increase the contact area between the cooling sheet and the surrounding air, accelerating the heat transfer rate, thereby improving the heat dissipation efficiency and enabling the semiconductor laser to cool down more quickly. Compared with other heat dissipation structures, the fin heat dissipation mechanism usually has a more compact design, which can reduce the volume and weight of the cooling sheet while ensuring the heat dissipation effect, facilitating the compactness and portability of the entire system.

[0015] 2. For this liquid cooling sheet for semiconductor lasers, by providing a ventilation mechanism, it can effectively achieve the ventilation function during the use of the device. The ventilation mechanism can enhance the heat dissipation effect by increasing air flow, further improving the heat dissipation efficiency of the liquid cooling sheet, helping to more quickly reduce the operating temperature of the semiconductor laser. The use of the ventilation mechanism can ensure that the temperature difference between the coolant and the radiator remains at a relatively low level, contributing to maintaining a stable operating temperature, thereby improving the stability of the semiconductor laser. The ventilation mechanism 5 can effectively eliminate hot spots on the surface of the radiator, avoiding local overheating, and thus extending the service life of the liquid cooling sheet and the semiconductor laser. Description of the Drawings

[0016] The accompanying drawings are used to provide a further understanding of the present utility model and form a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model and do not constitute a limitation to the present utility model.

[0017] In the accompanying drawings:

[0018] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0019] Figure 2 is a schematic diagram of the bottom structure of the overall structure in the structure of the present utility model;

[0020] Figure 3 is a schematic diagram of the fin heat dissipation mechanism structure in the structure of the present utility model;

[0021] Figure 4 is a schematic diagram of the ventilation mechanism structure in the structure of the present utility model;

[0022] Figure 5 is a schematic diagram of the connection mechanism structure in the structure of the present utility model.

[0023] In the figure: 1, main body frame; 2, fin heat dissipation mechanism; 201, tube sheet; 202, fin tube bundle; 3, connection mechanism; 301, flange; 302, plum blossom bolt; 4, circulation mechanism; 401, coolant tank; 402, water pump; 403, connecting pipe; 5, ventilation mechanism; 501, ventilation duct; 502, support column; 503, motor; 504, movable shaft; 505, fan blade; 6, maintenance cover; 7, hexagon bolt; 8, ventilation hole; 9, air intake grille. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment 1:

[0026] Please refer to Figures 1-5 , which is the first embodiment of the present utility model. The technical solution provided by this embodiment is as follows:

[0027] A liquid cooling sheet for a semiconductor laser includes a main body frame 1 and a maintenance cover 6. A fin heat dissipation mechanism 2 is arranged inside the main body frame 1. The fin heat dissipation mechanism 2 includes a tube sheet 201 and a fin tube bundle 202. The tube sheet 201 is fixedly installed inside the main body frame 1, and the fin tube bundle 202 is fixedly installed inside the tube sheet 201.

[0028] Specifically, a connection mechanism 3 is provided on the surface of the main body frame 1. The connection mechanism 3 includes a flange 301 and a plum blossom bolt 302. The flange 301 is fixedly installed on the surface of the main body frame 1. The plum blossom bolt 302 is threadedly connected inside the main body frame 1 and penetrates through the flange 301. A circulation mechanism 4 is provided on the top of the main body frame 1. The circulation mechanism 4 includes a coolant tank 401, a water pump 402, and a connecting pipe 403. The coolant tank 401 is fixedly installed on the top of the inspection cover 6. The water pump 402 is fixedly installed on the top of the inspection cover 6 and is fixedly connected to the coolant tank 401. The connecting pipe 403 is fixedly installed on the surface of the coolant tank 401 and is fixedly connected to the input end of the water pump 402. Vent holes 8 are provided on the surface of the inspection cover 6. An air intake grille 9 is fixedly installed at the bottom of the main body frame 1.

[0029] Furthermore: Through the setting of the flange 301, the connecting pipe 403 can be hermetically connected to the fin tube bundle 202 inside the main body frame 1. Through the setting of the plum blossom bolt 302, it is convenient to maintain and replace the flange 301. Through the setting of the coolant tank 401, the coolant required by the device can be provided and the circulation of the coolant can be maintained. Through the setting of the water pump 402, power can be provided to make the coolant circulate inside the device and maintain the cooling effect of the equipment. Through the setting of the inspection cover 6, it is convenient for the operator to inspect and maintain the device. Through the setting of the vent holes 8 and the air intake grille 9, the air circulation inside the device can be facilitated to achieve a better heat dissipation effect.

[0030] In summary: The tube sheet 201 and the fin tube bundle 202 contained in the fin heat dissipation mechanism 2 can enable the equipment to have a better and faster heat dissipation effect during use. The fin heat dissipation mechanism 2 effectively improves the heat exchange efficiency between the cooling fins and the surrounding medium by increasing the heat dissipation surface area, significantly enhancing the heat dissipation performance of the semiconductor laser. The design of the fins can increase the contact area between the cooling fins and the surrounding air, accelerate the heat transfer rate, thereby improving the heat dissipation efficiency and enabling the semiconductor laser to cool down more quickly. Compared with other heat dissipation structures, the fin heat dissipation mechanism 2 usually has a more compact design, which can reduce the volume and weight of the cooling fins while ensuring the heat dissipation effect, facilitating the compactness and portability of the entire system.

[0031] Embodiment 2:

[0032] Please refer to Figure 1 、 Figure 2 and Figure 4 , which is the second embodiment of the present invention.

[0033] Specifically, a ventilation mechanism 5 is provided at the top of the main frame 1. The ventilation mechanism 5 includes a ventilation duct 501, a support column 502, a motor 503, a movable shaft 504, and a fan blade 505. The ventilation duct 501 is fixedly installed on the top of the coolant tank 401. The support column 502 is fixedly installed inside the ventilation duct 501. The motor 503 is fixedly installed on the surface of the support column 502. The movable shaft 504 is movably connected to the output end of the motor 503. The fan blade 505 is fixedly installed on the surface of the movable shaft 504. An inspection cover 6 is fixedly installed on the top of the main frame 1, and a hexagonal bolt 7 is threadedly connected to the surface of the inspection cover 6.

[0034] Furthermore: Through the setting of the ventilation duct 501, it is convenient to install the support column 502. Through the setting of the support column 502, it is convenient to install the motor 503. Through the setting of the motor 503, power can be generated to drive the fan blade 505 to rotate. Through the setting of the movable shaft 504, the power generated by the motor 503 can be transmitted to the fan blade 505. Through the setting of the fan blade 505, ventilation work can be better carried out. Through the setting of the inspection cover 6, it is convenient for operators to inspect and maintain the device. The setting of the hexagonal bolt 7 makes it convenient for operators to disassemble and install the inspection cover 6.

[0035] In summary: The ventilation duct 501, support column 502, motor 503, movable shaft 504, and fan blade 505 contained in the ventilation mechanism 5 can enable the device to have a ventilation function during use. The ventilation mechanism 5 can enhance the heat dissipation effect by increasing air flow, further improving the heat dissipation efficiency of the liquid cooling fin, helping to more quickly reduce the working temperature of the semiconductor laser. The use of the ventilation mechanism 5 can ensure that the temperature difference between the coolant and the radiator remains at a relatively low level, helping to maintain a stable working temperature, thereby improving the stability of the semiconductor laser. The ventilation mechanism 5 can effectively eliminate the hot spots on the surface of the radiator, avoid local overheating, and thus extend the service life of the liquid cooling fin and the semiconductor laser.

[0036] During use, ensure that the liquid cooling fin is correctly installed on the semiconductor laser, the main frame 1 and the inspection cover 6 are tightly connected, and all components are free of looseness. Turn on the motor 503 of the ventilation mechanism 5 to ensure that the fan blade 505 rotates normally to promote the heat dissipation effect. Monitor the temperature change during the operation of the liquid cooling fin to ensure that the semiconductor laser can maintain a stable temperature during operation. Through the operation of the water pump 402, the coolant can be kept circulating in the device. The coolant flows into the finned tube bundle 202 through the connecting pipe 403. Through the design of the finned tube bundle 202, the contact area between the cooling fin and the surrounding air can be increased, accelerating the heat transfer rate, thereby improving the heat dissipation efficiency and enabling the semiconductor laser to cool down more quickly.

[0037] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A liquid cooling sheet for a semiconductor laser, comprising a main frame (1) and an inspection cover (6), characterized in that: A fin heat dissipation mechanism (2) is arranged inside the main frame (1), and the fin heat dissipation mechanism (2) comprises a tube plate (201) and a fin tube bundle (202), the tube plate (201) is fixedly installed inside the main frame (1), and the fin tube bundle (202) is fixedly installed inside the tube plate (201).

2. The liquid cooling sheet for semiconductor laser according to claim 1, characterized in that: A connection mechanism (3) is provided on the surface of the main frame (1), and the connection mechanism (3) comprises a flange (301) and a plum bolt (302). The flange (301) is fixedly mounted on the surface of the main frame (1), and the plum bolt (302) is threadedly connected to the inside of the main frame (1) and passes through the flange (301).

3. The liquid cooling sheet for semiconductor laser according to claim 1, characterized in that: A circulation mechanism (4) is arranged on the top of the main frame (1), and the circulation mechanism (4) comprises a coolant tank (401), a water pump (402) and a connecting pipe (403); the coolant tank (401) is fixedly mounted on the top of the inspection cover (6); the water pump (402) is fixedly mounted on the top of the inspection cover (6) and is fixedly connected to the coolant tank (401); and the connecting pipe (403) is fixedly mounted on the surface of the coolant tank (401) and is fixedly connected to the input end of the water pump (402).

4. The liquid cooling sheet for semiconductor laser according to claim 1, characterized in that: A ventilation mechanism (5) is arranged on the top of the main frame (1), and the ventilation mechanism (5) comprises a ventilation duct (501), a support column (502), a motor (503), a movable shaft (504) and a fan blade (505); the ventilation duct (501) is fixedly mounted on the top of the coolant tank (401), and the support column (502) is fixedly mounted inside the ventilation duct (501).

5. The liquid cooling sheet for semiconductor laser according to claim 4, characterized in that: The motor (503) is fixedly mounted on the surface of the support column (502), the movable shaft (504) is movably connected to the output end of the motor (503), and the fan blade (505) is fixedly mounted on the surface of the movable shaft (504).

6. The liquid cooling sheet for semiconductor laser according to claim 1, characterized in that: An inspection cover (6) is fixedly mounted on the top of the main frame (1), and a hexagonal bolt (7) is threadedly connected to the surface of the inspection cover (6).

7. The liquid cooling sheet for semiconductor laser according to claim 1, characterized in that: A vent hole (8) is provided on the surface of the inspection cover (6), and an air intake fence (9) is fixedly installed on the bottom of the main frame (1).

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