Electronic equipment

Abstract

The utility model is suitable for the technical field of heat dissipation, and provides electronic equipment, the electronic equipment comprises a shell with a cavity, and a circuit board, a battery and a first heat-conducting fin which are arranged in the cavity, the first heat-conducting fin comprises a first part and a second part which are in heat-conducting connection, the first part is in heat-conducting connection with the surface of the circuit board, and the second part is in heat-conducting connection with the surface of the battery. The second portion is thermally conductively connected to the surface of the battery. The circuit board and the battery are in heat-conducting connection through the first heat-conducting fin, so that heat generated when the circuit board works can be transmitted to the battery, the circuit board is prevented from being overheated relative to the battery, normal work of the circuit board is prevented from being affected, local oversize of the electronic equipment is reduced, and the use experience of a user is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly to an electronic device. Background Art

[0002] With the continuous development of the diversification, integration, and miniaturization of the functions of electronic devices on the market, how to dissipate and conduct heat in a limited space also largely determines the user experience of electronic devices. Generally, there are components such as batteries, circuit boards, and chips in electronic devices. The circuit board has a small size but generates the most obvious heat. If the circuit board has poor heat dissipation, it will conduct heat and cause local overheating. For example, if the circuit board is close to the housing, the local part of the housing will overheat, resulting in a poor user experience. In severe cases, it will cause damage to electronic components. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide an electronic device, aiming to solve the technical problem that the internal circuit board of the existing electronic device has poor heat dissipation, resulting in local overheating of the product.

[0004] The embodiments of this application are implemented as follows. An electronic device includes a housing having a cavity, and a circuit board, a battery, and a first heat conducting sheet disposed in the cavity. The first heat conducting sheet includes a first part and a second part that are thermally connected. The first part is thermally connected to the surface of the circuit board, and the second part is thermally connected to the surface of the battery.

[0005] In one embodiment, the first heat conducting sheet further includes a third part bent and connected between the first part and the second part.

[0006] In one embodiment, the housing includes an outer shell and a frame disposed inside the outer shell. The frame divides a first space for accommodating the circuit board and a second space for accommodating the battery inside the outer shell. The frame is provided with a through hole communicating the first space and the second space, and the third part passes through the through hole.

[0007] In one embodiment, the electronic device further includes a second heat conducting sheet;

[0008] The second heat conducting sheet is disposed between the first part and the circuit board, and the area of the second heat conducting sheet is larger than the area of the first part; and / or, the second heat conducting sheet is disposed between the second part and the surface of the battery.

[0009] In one embodiment, the first heat conducting sheet is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil; and / or, the second heat conducting sheet is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

[0010] In one embodiment, the circuit board includes a first surface and a second surface which are oppositely arranged, and the second surface faces the first part; at least one first shielding cover is provided on the second surface, and a first heat-conducting material is filled in the first shielding cover; the surface of the first shielding cover is thermally connected to the first part.

[0011] In one embodiment, at least one second shielding cover is provided on the first surface, and a second heat-conducting material is filled in the second shielding cover.

[0012] In one embodiment, the projections of at least one of the first shielding covers and at least one of the second shielding covers on the surface of the circuit board overlap.

[0013] In one embodiment, the electronic device further includes a third heat-conducting sheet, and the third heat-conducting sheet is thermally connected to a plurality of the second shielding covers.

[0014] In one embodiment, a groove is provided on the inner surface of the housing corresponding to at least a partial area of the circuit board.

[0015] The beneficial effects of the electronic device provided by the embodiments of the present application are as follows:

[0016] The electronic device provided by the embodiments of the present application includes a housing, a circuit board, a battery, and a first heat-conducting sheet disposed in the housing. The first heat-conducting sheet includes a first part and a second part that are thermally connected. The first part is thermally connected to the surface of the circuit board, and the second part is thermally connected to the surface of the battery. The circuit board and the battery are thermally connected through the first heat-conducting sheet, so that the heat generated when the circuit board works can be transferred to the battery, avoiding overheating of the circuit board relative to the battery, preventing the normal operation of the circuit board from being affected, reducing local overheating of the electronic device, and improving the user experience; after the heat distribution in the housing is relatively uniform, the whole dissipates heat evenly through the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 is a sectional view of the electronic device provided by the embodiments of the present application;

[0019] Figure 2 is an exploded perspective view of the electronic device provided by the embodiments of the present application;

[0020] Figure 3 is an exploded perspective view of the housing of the electronic device provided by the embodiments of the present application;

[0021] Figure 4 is a further three-dimensional exploded view of the housing of the electronic device provided by the embodiment of the present application;

[0022] Figure 5 is a simplified schematic diagram of the structure of the electronic device provided by the embodiment of the present application.

[0023] The meanings of the marks in the figure are as follows:

[0024] 100 - electronic device;

[0025] 3 - housing,

[0026] 4 - outer shell, 40 - cavity, 401 - first space, 402 - second space, 41 - groove, 42 - half-shell part;

[0027] 5 - frame, 53 - through hole;

[0028] 6 - circuit board, 61 - first surface, 62 - second surface, 63 - first shielding cover, 64 - second shielding cover;

[0029] 7 - battery;

[0030] 81 - first heat conducting sheet, 811 - first part, 812 - second part, 813 - third part, 82 - second heat conducting sheet, 83 - third heat conducting sheet;

[0031] 9 - display screen. Detailed implementation manners

[0032] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly or indirectly fixed or disposed on the other component. When a component is referred to as being "connected to" another component, it can be directly or indirectly connected to the other component. The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this patent. Terms "first" and "second" are only used for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0034] To illustrate the technical solution described in this application, the following provides a detailed description in conjunction with specific drawings and embodiments.

[0035] Please refer to Figure 1 、 Figure 2 and Figure 5 As shown, an embodiment of this application provides an electronic device 100, which includes a housing 3 having a cavity 40, and a circuit board 6 and a battery 7 disposed in the cavity 40. The battery 7 and the circuit board 6 are electrically connected, and the battery 7 provides the current required for the circuit board 6 to operate. Depending on the type of the electronic device 100, the electronic device 100 may further include other corresponding functional modules. For example, the electronic device 100 may be an earphone, a watch, etc.

[0036] In an embodiment of this application, as shown in Figure 2 and Figure 5 the electronic device 100 further includes a first heat conducting sheet 81. The first heat conducting sheet 81 includes a first portion 811 disposed on the surface of the circuit board 6 and a second portion 812 disposed on the surface of the battery 7. The first portion 811 and the second portion 812 are physically and thermally connected to each other. That is to say, the first portion 811 is thermally connected to the surface of the circuit board 6, the second portion 812 is thermally connected to the surface of the battery 7, and the circuit board 6 and the battery 7 are thermally connected through the first heat conducting sheet 81. In this way, the heat generated when the circuit board 6 operates can be transferred to one side of the battery 7 through the first portion 811 and the second portion 812. Furthermore, the heat generated by the circuit board 6 can be transferred to other regions with relatively lower temperatures in the cavity 40, avoiding the problem that the temperature of the circuit board 6 itself is too high and affecting its normal operation. For example, it can avoid damaging the electronic components on the circuit board 6.

[0037] By transferring the heat of the circuit board 6 to other components and other regions in the housing 3, overheating of the circuit board 6 can be avoided. Then, the components in the housing 3 jointly dissipate heat to the outside through the housing 3 to achieve overall heat dissipation.

[0038] Among them, when the circuit board 6 is disposed close to the inner wall of the housing 3, since the heat of the circuit board 6 has been transferred to the battery 7 through the first heat conducting sheet 81, at this time, the problem of local heating on the housing 3 can be avoided, improving the user experience.

[0039] In addition, it should also be noted that generally, in the electronic device 100, the battery 7 occupies a larger volume and has a greater density relative to the circuit board 6. Therefore, after the heat of the circuit board 6 is transferred to the battery 7, the temperature rise of the battery 7 is not obvious and will not have an obvious impact on the normal operation of the battery 7.

[0040] Please refer to Figure 2As shown, in one embodiment, the first heat conducting sheet 81 further includes a third portion 813 bent and connected between the first portion 811 and the second portion 812.

[0041] Since the first portion 811 is adapted to the surface of the circuit board 6 and the second portion 812 is adapted to the surface of the battery 7, generally, the first portion 811 and the second portion 812 are usually thin sheets with a certain area.

[0042] According to the different shapes of the electronic device 100, the positions of the circuit board 6 and the battery 7 in the housing 3 are different. Generally speaking, the circuit board 6 and the battery 7 are not arranged side by side, but are generally stacked, that is, projected in the direction perpendicular to the surface of the circuit board 6, and at least a part of the projection of the battery 7 falls on the surface of the circuit board 6. At this time, relative bending occurs between the first portion 811 and the second portion 812. Therefore, the third portion 813 thermally connects the first portion 811 and the second portion 812 and allows the circuit board 6 and the battery 7 to be arranged to adapt to the shape of the cavity 40.

[0043] In an alternative embodiment, the first portion 811 and the second portion 812 are parallel to each other. The third portion 813 is smoothly connected to the first portion 811, and the third portion 813 is circularly connected to the second portion 812.

[0044] In an alternative embodiment, the first portion 811, the second portion 812 and the third portion 813 are integrally formed.

[0045] In an alternative embodiment, the material of the first heat conducting sheet 81 can be selected from one of a graphite sheet, an aluminum sheet, and a copper foil, or the first heat conducting sheet 81 is a laminated combination of multiple ones of a graphite sheet, an aluminum sheet, and a copper foil.

[0046] In an alternative embodiment, either the first portion 811 or the second portion 812 can be independently manufactured from the other. For example, the first portion 811 and the third portion 813 are integrally formed and are a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil, and the second portion 812 and the third portion 813 are integrally formed and are a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

[0047] In an alternative embodiment, the first portion 811, the second portion 812, and the third portion 813 are all independently manufactured. The first portion 811 is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil, the second portion 812 is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil, and the third portion 813 is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

[0048] Please refer to Figure 1 、 Figure 3 andFigure 4 As shown, in one example, the housing 3 includes an outer shell 4 and a frame 5 disposed inside the outer shell 4. The cavity 40 is defined by the outer shell 4. The frame 5 further divides the space inside the outer shell 4 into multiple sub-spaces. For example, the cavity 40 may at least include a first space 401 for mounting a circuit board 6 and a second space 402 for mounting a battery 7. In addition, the circuit board 6 and the battery 7 are respectively fixed on the frame 5. That is, the frame 5 functions to fix various components inside the outer shell 4.

[0049] To facilitate the formation of the outer shell 4 and the installation of the frame 5 inside it, the outer shell 4 may optionally be formed by splicing and connecting multiple half-shell parts 42. For example Figure 3 As shown, the outer shell 4 includes two relatively spliced half-shell parts 42. The frame 5 is located between the two half-shell parts 42.

[0050] Not limited to this, in other alternative embodiments, according to the design requirements and the fixing requirements for the frame 5, the outer shell 4 may include more half-shell parts 42.

[0051] As Figure 1 and Figure 5 shown, the frame 5 is provided with a through hole 53 communicating the first space 401 and the second space 402. The first space 401 and the second space 402 are respectively disposed on different sides of the frame 5. In one embodiment, a third part 813 passes through the through hole 53, a first part 811 is disposed on the surface of the circuit board 6 facing the through hole 53, and a second part 812 is disposed on the surface of the battery 7 facing the through hole 53. Thus, the third part 813 can conductively connect the battery 7 and the circuit board 6.

[0052] Please refer to Figure 2 shown, in one embodiment, the electronic device 100 further includes a second heat conducting sheet 82, and the second heat conducting sheet 82 is disposed between the surface of the first part 811 and the circuit board 6, and / or between the surface of the second part 812 and the battery 7.

[0053] The purpose of such a setting is that the circuit board 6 and the battery 7 are respectively fixed in the first space 401 and the second space 402, and the widths of the first space 401 and the second space 402 are generally greater than the width of the through hole 53. In this way, in order to ensure that the third part 813 can pass through the through hole 53, the size of the third part 813 will be smaller; and when the first part 811 to the third part 813 of the first heat conducting sheet 81 are integrally formed, in order to smoothly pass the third part 813 through the through hole 53 during assembly, it should first pass through the first part 811 or the second part 812. Then, the area of at least one of the first part 811 and the second part 812 should not be much different from the area of the third part 813. For example, when the width dimensions of the second part 812 and the third part 813 are not much different, the second heat conducting sheet 82 can be optionally arranged between the surface of the second part 812 and the battery 7. The second heat conducting sheet 82 is independently manufactured, and thus can have a larger area to cover the surface of the battery 7 as much as possible, so as to realize heat conduction connection between a larger surface area on the battery 7 and the first heat conducting sheet 81.

[0054] Similarly, when the width dimensions of the first part 811 and the third part 813 are not much different, the second heat conducting sheet 82 can be optionally arranged between the surface of the first part 811 and the circuit board 6. The second heat conducting sheet 82 is independently manufactured, and thus can have a larger area to cover the surface of the circuit board 6 as much as possible, so that a larger area on the circuit board 6 is in heat conduction connection with the first heat conducting sheet 81.

[0055] In addition, as required, the second heat conducting sheet 82 can be simultaneously arranged between the surface of the first part 811 and the circuit board 6, and between the surface of the second part 812 and the battery 7.

[0056] In an optional embodiment, the second heat conducting sheet 82 is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

[0057] Please refer to Figure 2 and Figure 5 As shown, the circuit board 6 includes a first surface 61 and a second surface 62 which are oppositely arranged, and the second surface 62 faces the first part 811. In an embodiment of the present application, at least one first shielding cover 63 is provided on the second surface 62. The first shielding cover 63 is filled with a first heat conducting material, and the surface of the first shielding cover 63 is in heat conduction connection with the first part 811. The first shielding cover 63 is used to fill the first heat conducting material around at least one electronic component, so that the heat generated by the electronic component can be quickly transferred to other positions of the circuit board 6, and further transferred to the battery 7.

[0058] Moreover, the surface of the first shielding cover 63 can be set to be relatively flat, which is more convenient for fitting and heat conduction connection with the first part 811.

[0059] The position of the first shielding cover 63 should be selected based on the principle of first covering the electronic components with relatively high heat generation during operation on the second surface 62.

[0060] In an alternative embodiment, a plurality of first shielding covers 63 are provided on the second surface 62.

[0061] The first heat-conducting material mentioned above can be optionally a material with certain fluidity, high thermal conductivity, and stable chemical properties. For example, the first heat-conducting material is thermal grease.

[0062] Please continue to refer to Figure 2 and Figure 5 As shown in and, in an embodiment, at least one second shielding cover 64 is provided on the first surface 61 of the circuit board 6, and the second shielding cover 64 is filled with a second heat-conducting material. The second shielding cover 64 is used to fill the second heat-conducting material around at least one electronic component, so that the heat generated by the electronic component can be quickly transferred to other positions of the circuit board 6, and further transferred to the battery 7.

[0063] The position of the second shielding cover 64 should be selected based on the principle of first covering the electronic components with relatively high heat generation during operation on the first surface 61.

[0064] In an alternative embodiment, a plurality of second shielding covers 64 are provided on the first surface 61.

[0065] The second heat-conducting material mentioned above can be optionally a material with certain fluidity, high thermal conductivity, and stable chemical properties. For example, the second heat-conducting material is thermal grease.

[0066] Please refer to in combination with Figure 5 As shown in an alternative embodiment, at least a part of the projections of at least one first shielding cover 63 and at least one second shielding cover 64 on the surface of the circuit board 6 overlap. This enables the first shielding cover 63 and the second shielding cover 64 to cover the opposite sides of a partial area of the circuit board 6 simultaneously, which further facilitates the heat transfer between different areas on the first surface 61 and the second surface 62. That is to say, this is conducive to the heat generated by the electronic components on the first surface 61 being transferred to the first heat-conducting material through the second heat-conducting material more quickly.

[0067] In other alternative embodiments, according to the arrangement positions of the electronic components, the projections of the first shielding cover 63 and the second shielding cover 64 may not need to overlap.

[0068] Then, please refer to Figure 2 and Figure 5As shown, in one embodiment, the electronic device 100 further includes at least one third heat conducting sheet 83. The third heat conducting sheet 83 is disposed on the surface of the second shielding cover 64. Optionally, it is disposed on the surfaces of a plurality of second shielding covers 64, and is used to further transfer and equalize the heat between the plurality of second shielding covers 64.

[0069] The third heat conducting sheet 83 is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

[0070] Finally, please refer to Figure 5 As shown, in one embodiment, a groove 41 is provided on the inner surface of the housing 4 corresponding to at least a partial area of the circuit board 6. A gap is formed between the bottom of the groove 41 and the first surface 61 of the circuit board 6.

[0071] It should be noted that this does not mean that there is no gap between the area on the inner surface of the housing 4 outside the groove 41 and the circuit board 6. Generally, for the overall miniaturization of the volume of the electronic device 100, the space reserved between the housing 4 and the circuit board 6 is very small. Except for the areas that need functional contact, for example, a communication card (not shown) is provided on the housing 4 and needs to be in contact with the circuit board 6. To meet the assembly requirements and ensure that the inner surface of the housing 4 does not exert an undesired pressure on the first surface 61 of the circuit board 6, a certain space is usually reserved, that is, the first surface 61 of the circuit board 6 is very close to the inner surface of the housing 4. In this embodiment, the position on the inner surface of the housing 4 corresponding to at least a partial area of the circuit board 6 is hollowed out to form the groove 41, which can increase the gap between the housing 4 and the first surface 61 of the circuit board 6. The increase in this gap can reduce the heat transfer from the circuit board 6 to the housing 4, avoid the problem that some positions on the housing 4 overheat when the circuit board 6 is working, and improve the user experience and feel.

[0072] In an alternative embodiment, the electronic device 100 further includes a communication card disposed on the inner surface of the housing 4. The surface of the communication card is pressed and connected to the connection thimble (not shown) on the first surface 61 of the circuit board 6 with a certain pressure. At this time, the groove 41 can be disposed at a position avoiding the communication card.

[0073] Please refer to Figure 2 and Figure 5 As shown, in one embodiment, the electronic device 100 further includes a display screen 9. The display screen 9 is fixed to the housing 4 and is connected to the circuit board 6. The circuit board 6 provides the electrical energy and control signals required for the operation of the display screen 9.

[0074] In an alternative embodiment, the display screen 9 and the circuit board 6 can be respectively disposed on opposite sides of the battery 7, and the overall weight distribution of the electronic device 100 is relatively balanced. When the user holds the electronic device 100, the circuit board 6 is actually located at the bottom of the electronic device 100, close to the human hand. Therefore, for the electronic device 100 provided in the embodiment of the present application, the heat generated during the operation of the circuit board 6 is quickly dissipated and transferred to the battery 7, which can avoid the problem of heat generation at the bottom of the housing 4.

[0075] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. An electronic device, characterized in that: The invention comprises a shell having a cavity, and a circuit board, a battery and a first heat conductive sheet arranged in the cavity. The first heat conductive sheet comprises a first part and a second part which are heat conductively connected. The first part is heat conductively connected to the surface of the circuit board, and the second part is heat conductively connected to the surface of the battery.

2. The electronic device according to claim 1, wherein: The first heat conductive sheet further includes a third portion bent and connected between the first portion and the second portion.

3. The electronic device according to claim 2, characterized in that: The shell includes an outer shell and a frame arranged in the outer shell, the frame divides the outer shell into a first space for accommodating the circuit board and a second space for accommodating the battery, the frame is provided with a through hole connecting the first space and the second space, and the third part passes through the through hole.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises a second heat conducting sheet; The second heat conductive sheet is disposed between the first portion and the circuit board, and an area of ​​the second heat conductive sheet is larger than an area of ​​the first portion; and / or the second heat conductive sheet is disposed between the second portion and a surface of the battery.

5. The electronic device according to claim 4, characterized in that: The first heat conductive sheet is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil; and / or the second heat conductive sheet is a laminated combination of one or more of a graphite sheet, an aluminum sheet, and a copper foil.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The circuit board comprises a first surface and a second surface arranged opposite to each other, wherein the second surface is arranged toward the first portion; At least one first shielding cover is disposed on the second surface, and the first shielding cover is filled with a first heat-conducting material; The surface of the first shielding cover is thermally connected to the first part.

7. The electronic device according to claim 6, characterized in that: The first surface is provided with at least one second shielding cover, and the second shielding cover is filled with a second heat-conducting material.

8. The electronic device according to claim 7, characterized in that: Projections of at least one of the first shielding covers and at least one of the second shielding covers on the surface of the circuit board overlap.

9. The electronic device according to claim 7, characterized in that: The electronic device further includes a third heat conducting sheet, and the third heat conducting sheet is thermally connected to the plurality of second shielding covers.

10. The electronic device according to any one of claims 1 to 5, characterized in that: A groove is provided on the inner surface of the housing corresponding to at least a portion of the circuit board.

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