Radiator for domain controller and domain controller

Abstract

The utility model relates to the field of domain controllers, in particular to a radiator (1) for a domain controller, which comprises a first wall (11) and a second wall (12) which are oppositely arranged, a first heating element (21) is connected to the first wall (11) in a heat conducting manner, and a second heating element (22) is connected to the second wall (12) in a heat conducting manner; and at least one heat dissipation portion (13) extending between the first wall (11) and the second wall (12), where each heat dissipation portion (13) of the at least one heat dissipation portion (13) has a discontinuity (133) away from the first wall (11) and the second wall (12) within a first extension dimension between the first wall (11) and the second wall (12). According to the radiator, heat dissipation can be provided for the two circuit boards in the domain controller at the same time, heat dissipation is more efficient, and the radiator and the domain controller are more compact in structure and lower in manufacturing cost.

Description

Technical Field

[0001] The present application generally relates to the field of domain controllers, and more particularly to a radiator for a domain controller and a domain controller. Background Art

[0002] Currently, with the increasing requirements for the entertainment experience of automobile driving and riding, the configuration requirements for domain controllers are also getting higher and higher. Therefore, most current domain controllers basically have at least two circuit boards, and the power consumption of the chips on the circuit boards is also getting higher and higher. When the chips on both circuit boards need to dissipate heat, die-cast aluminum radiators are usually used, and heat-conducting glue is dot-coated between the chips and the radiators to transfer the heat generated by the chips to the radiators, so as to use the radiators to dissipate the generated heat. Air-cooled radiators are usually used, which, based on the principle of forced convection heat dissipation, use fans to continuously send air flows into the radiators to exchange heat with the fins in the radiators and take away the heat. Compared with water-cooled radiators, air-cooled radiators have less structural design redundancy and lower costs. However, existing air-cooled radiators cannot provide efficient heat dissipation for two circuit boards, so it is necessary to propose an improved radiator to achieve simultaneous heat dissipation for two circuit boards. Summary of the Utility Model

[0003] The purpose of the present application is to propose an improved radiator for a domain controller, which can provide efficient bilateral heat dissipation.

[0004] According to a first aspect of the present application, there is provided a radiator for a domain controller, the radiator comprising: a first wall and a second wall arranged opposite to each other, a first heating element being thermally connected to the first wall, and a second heating element being thermally connected to the second wall; and at least one heat dissipation portion extending between the first wall and the second wall, wherein each heat dissipation portion of the at least one heat dissipation portion has a discontinuous portion away from the first wall and the second wall within a first extension scale between the first wall and the second wall.

[0005] Optionally, the heat dissipation portion extends substantially perpendicular to the first wall and the second wall.

[0006] Optionally, the heat dissipation portion is generally in a substantially wavy shape as a whole.

[0007] Optionally, a second extension scale of the heat dissipation portion extends from one side of the radiator to the other side, and the second extension scale is substantially parallel to the air-cooling direction of the radiator.

[0008] Optionally, the heat dissipation portion includes a first heat dissipation portion extending from the first wall to the second wall and a second heat dissipation portion extending from the second wall to the first wall, and the distal ends of the first heat dissipation portion and the second heat dissipation portion are separated from each other and define the discontinuous portion therebetween.

[0009] Optionally, among the different heat dissipation parts, the relative lengths of the first heat dissipation part and the second heat dissipation part are the same or different, and the intermittent part is formed at the same or different positions of the corresponding heat dissipation part.

[0010] Optionally, for a plurality of the heat dissipation parts arranged continuously, the positions of the intermittent parts on the corresponding heat dissipation parts have periodic changes.

[0011] Optionally, the positions of the intermittent parts on the corresponding heat dissipation parts depend on the power consumptions of the first heating element and the second heating element.

[0012] Optionally, the first wall has a first receiving part adapted to receive the first heating element.

[0013] Optionally, the second wall has a second receiving part adapted to receive the second heating element.

[0014] Optionally, the radiator is an aluminum extrusion.

[0015] Optionally, the radiator further includes lugs adapted to connect the radiator to a circuit board of a domain controller.

[0016] According to a second aspect of the present application, there is provided a domain controller, which includes: any radiator according to the present application; a first circuit board adapted to hold a first heating element; and a second circuit board adapted to hold a second heating element, wherein the first circuit board and the second circuit board are respectively arranged on opposite sides of the radiator.

[0017] Optionally, the first heating element and the second heating element are respectively connected to the first wall and the second wall of the radiator through thermal conductive adhesives.

[0018] Optionally, the domain controller further includes a fan arranged on one side of the radiator, and the fan is adapted to force air to flow through the radiator along a second extension dimension of the heat dissipation part.

[0019] Optionally, the fan of the radiator is electrically connected to a port in the second circuit board through a plug connector for driving the fan.

[0020] Optionally, both the first circuit board and the second circuit board have relief recesses to make way for the fan, so as to allow the fan to extend upward from the second circuit board and protrude above the first circuit board.

[0021] Optionally, the fan further has a holding part adapted to stably hold it within the domain controller.

[0022] Optionally, the domain controller has a housing having opposite top and bottom surfaces and opposite air inlet and air outlet sides.

[0023] Optionally, the top surface has an inward protrusion protruding towards the interior, and the inward protrusion is adapted to be coupled to a holding portion of the fan to press the fan downward against the bottom surface.

[0024] Optionally, the air inlet side has a plurality of air inlets, the air outlet side has a plurality of air outlets, and the regions where the air inlets are located and the regions where the air outlets are located are substantially aligned along a second extension dimension of the heat dissipation portion.

[0025] Optionally, the fan is disposed adjacent to the air outlet side, and the shape of the region where the air outlets are located is substantially annular corresponding to the fan.

[0026] Optionally, the bottom surface, the air inlet side, and the air outlet side are integrally formed.

[0027] The radiator according to the present application can simultaneously provide heat dissipation to two circuit boards in the domain controller, with more efficient heat dissipation, and a more compact structure of the radiator and the domain controller, and lower manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, the present application will be described in more detail by referring to the drawings, and the principles, features, and advantages of the present application can be better understood. In the drawings:

[0029] Figure 1 A perspective view of a domain controller according to an exemplary embodiment of the present application is shown;

[0030] Figure 2 Shown is Figure 1 a perspective view of the domain controller from another perspective;

[0031] Figure 3 Shown is Figure 1 an exploded view of the domain controller;

[0032] Figure 4 Shown is Figure 1 a partial perspective view of the domain controller, which shows the radiator, the circuit board, and the fan;

[0033] Figure 5 A cross-sectional view of a radiator according to an exemplary embodiment of the present application is shown;

[0034] Figure 6 Shown is Figure 1 a top view of the domain controller;

[0035] Figure 7 Shown is Figure 6Cross-sectional view taken along line B-B of the domain controller; and

[0036] Figure 8 Shows Figure 7 An enlarged view of area C circled in

[0037] List of reference numerals

[0038] 1 Radiator

[0039] 11 First wall

[0040] 111 First receiving part

[0041] 12 Second wall

[0042] 121 Second receiving part

[0043] 13 Heat dissipation part

[0044] 131 First extension part

[0045] 132 Second extension part

[0046] 133 Discontinuous part

[0047] 14 Lug

[0048] 100 Domain controller

[0049] 21 First heating element

[0050] 22 Second heating element

[0051] 3 Thermal conductive adhesive

[0052] 41 First circuit board

[0053] 411 Relief recess

[0054] 42 Second circuit board

[0055] 421 Relief recess

[0056] 5 Fan

[0057] 51 Plug-in connector

[0058] 52 Holding part

[0059] 6 Screw

[0060] 9 Housing

[0061] 91 Top surface

[0062] 911 Inner convex part

[0063] 92 Bottom surface

[0064] 93 Inlet Side

[0065] 931 Inlet

[0066] 94 Outlet Side

[0067] 941 Outlet

[0068] 95 Rear

[0069] 96 Front

[0070] D1 First Direction, Height Direction

[0071] D2 Second Direction, Length Direction, Air Cooling Direction

[0072] D3 Third Direction, Width Direction Detailed Implementation Manner

[0073] In order to make the technical problems, technical solutions and beneficial technical effects to be solved by the present application clearer and more understandable, the present application will be further described in detail below in conjunction with the drawings and multiple exemplary embodiments. It should be understood that the specific embodiments described herein are only used to explain the principle of the present application, rather than to limit the protection scope of the present application. In the drawings of the present application, features with the same structure or similar functions are represented by the same reference numerals.

[0074] Figures 1 to 8 Shows the domain controller 100 according to an exemplary embodiment of the present application and the radiator 1 inside it.

[0075] The domain controller 100 may include two circuit boards, namely the first circuit board 41 and the second circuit board 42 as shown in Figure 3 . At least one chip is held on each of the two circuit boards. When the domain controller 100 is operating, the chips generate heat as heat sources, and this heat needs to be quickly dissipated by means of the radiator 1 to ensure that the chips are not damaged due to overheating. For this purpose, the first circuit board 41 and the second circuit board 42 are respectively arranged on opposite sides of the radiator 1, so as to use a single radiator 1 to dissipate heat from both the first circuit board 41 and the second circuit board 42 at the same time.

[0076] As shown in Figure 4 and Figure 5 , the radiator 1 includes a first wall 11 and a second wall 12 that are oppositely arranged along the first direction (i.e., the height direction) D1. In particular, the first wall 11 and the second wall 12 extend parallel to each other. For example, the first wall 11 and the second wall 12 extend in a plane defined by the second direction (i.e., the length direction) D2 and the third direction (i.e., the width direction) D3 that is perpendicular to the first direction D1.

[0077] The first heating element 21 is thermally connected to the first wall 11, and the second heating element 22 is thermally connected to the second wall 12. Here, the first heating element 21 may be at least one chip integrated into the first circuit board 41, and the second heating element 22 may be at least one chip integrated into the second circuit board 42. That is to say, the first heating element 21 connected to the first wall 11 and the second heating element 22 connected to the second wall 12 may both be not limited to one, and the numbers may be the same or different. The first heating element 21 and the second heating element 22 are respectively connected to the first wall 11 and the second wall 12 of the heat sink 1 through thermal conductive adhesives 3. Thus, the heat generated by the first heating element 21 and the second heating element 22 can be correspondingly transferred to the first wall 11 and the second wall 12 of the heat sink 1 through the thermal conductive adhesives 3.

[0078] Inside the heat sink 1, the heat sink 1 further includes at least one heat dissipation part 13 extending between the first wall 11 and the second wall 12. Herein, each heat dissipation part 13 of the at least one heat dissipation part 13 has a discontinuous part 133 away from the first wall 11 and the second wall 12 within a first extension scale between the first wall 11 and the second wall 12. The heat respectively transferred to the first wall 11 and the second wall 12 can be further transferred to the heat dissipation part 13. The heat dissipation part may be, for example, a heat dissipation fin.

[0079] Herein, the discontinuous part 133 of each heat dissipation part 13 has a first extension scale and a second extension scale in a three-dimensional space. Among them, the expression "the first extension scale between the first wall 11 and the second wall 12" refers to the extension scale of a single heat dissipation part 13 in a plane perpendicular to the second direction D2 (defined by the first direction D1 and the third direction D3), that is, in any cross-section of the heat sink 1 as shown Figure 5 shown. The term "second extension scale" mentioned below refers to the extension scale of a single heat dissipation part 13 substantially parallel to the second direction D2, that is, the air-cooling direction D2 of the heat sink 1.

[0080] Therefore, by introducing the discontinuous part 133 in each heat dissipation part 13, the heat dissipation paths of the first heating element 21 and the second heating element 22 can be made independent of each other, avoiding the heat generated by one of the first heating element 21 and the second heating element 22 being transferred to the other or hindering the heat dissipation of the other, that is, avoiding the heat generated by the chips on the two circuit boards from affecting each other. Therefore, rapid heat dissipation of both the first heating element 21 and the second heating element 22 is achieved, the heat dissipation efficiency is improved, and it can also prevent the heat generated by the chips with higher power consumption on one circuit board from being transferred to the chips with lower power consumption on the other circuit board in some cases, thereby causing damage to the chips with lower power consumption. At the same time, it is also possible to allow as many heat dissipation parts 13 as possible to be arranged in a limited space, thereby providing a large heat dissipation area.

[0081] Preferably, the heat dissipation part 13 extends substantially perpendicular to the first wall 11 and the second wall 12, which can facilitate the manufacture of the heat dissipation part 13 and the entire radiator 1, especially for the radiator 1 manufactured by the squeeze casting process. However, it can be envisaged that within the scope of the present application, the heat dissipation part 13 can extend obliquely with respect to the first wall 11 and the second wall 12.

[0082] Preferably, the heat dissipation part 13 can be generally in a substantially wavy shape as a whole. Compared with a linear shape, the wavy shape can allow a larger surface area of the heat dissipation part 13 to be achieved within a limited distance between the first wall 11 and the second wall 12, thereby improving the heat dissipation efficiency of the heat dissipation part 13. Additionally or alternatively, for the same purpose, the second extension scale of the heat dissipation part 13 extends from one side of the radiator 1 to the other side. That is to say, along the second direction D2, the heat dissipation part 13 extends from one side of the radiator 1 to the other side, thus traversing the entire internal space of the radiator 1. During heat dissipation, air is forced to flow generally along the flow path in the second direction D2, so as to flow through the entire second extension scale of the heat dissipation part 13 to fully convectively exchange heat with the heat dissipation part 13. By one or more of these optional features, it is possible to provide as large a surface area of the heat dissipation part as possible inside the radiator 1 to improve the forced convection heat dissipation efficiency. However, it can be envisaged that within the scope of the present application, the heat dissipation part 13 can also additionally or alternatively have other structural features that can promote forced convection heat dissipation. For example, in an alternative embodiment, the heat dissipation part 13 can have a structure with only a locally increased surface area (e.g., relative to the remaining part or the linear heat dissipation part).

[0083] As Figure 5 shown, the heat dissipation part 13 can include a first heat dissipation part 131 extending from the first wall 11 to the second wall 12 and a second heat dissipation part 132 extending from the second wall 12 to the first wall 11. The distal end of the first heat dissipation part 131 away from the first wall 11 and the distal end of the second heat dissipation part 132 away from the second wall 12 are separated from each other and define an intermittent part 133 therebetween.

[0084] Preferably, in different heat dissipation parts 13, the relative lengths of the first heat dissipation part 131 and the second heat dissipation part 132 are the same or different, and the intermittent part 133 is formed at the same or different positions of the corresponding heat dissipation part 13. That is to say, the positions of the intermittent part 133 of each heat dissipation part 13 can be independent of each other. Here, the position refers to the formation position of the intermittent part 133 on the heat dissipation part 13, especially relative to the first wall or the second wall. Thus, greater structural flexibility can be provided to the heat dissipation part 13 to improve the heat dissipation effect.

[0085] In some cases, the intermittent portions 133 of different heat dissipation portions 13 are located at substantially the same position, such that in the second direction D2, the intermittent portions 133 extend in a substantially straight line from one side of the radiator 1 to the other side, so that the air flow through can be accelerated by the air ducts formed by the respective intermittent portions 133.

[0086] In other cases, for a plurality of continuously arranged heat dissipation portions 13, the positions of the intermittent portions 133 on the corresponding heat dissipation portions 13 have a periodic change. For example, in the cross-section as Figure 5 shown, the intermittent portions 133 may be arranged in an alternating offset manner. Thereby, local air turbulence can be increased, so as to adjust the adaptability of the air flow rate and convective heat transfer (if the air flow rate is too fast, it may not have enough time for sufficient convective heat transfer with the heat dissipation portion).

[0087] Additionally or alternatively, the positions of the intermittent portions 133 on the corresponding heat dissipation portions 13 may depend on the power consumptions of the first heating element 21 and the second heating element 22. Since the power consumptions of the first heating element 21 and the second heating element 22 determine the heat generation amount and heat dissipation requirements, heat dissipation portions 13 with a larger heat dissipation area can be provided for the heating element with a larger power consumption, while heat dissipation portions 13 with a smaller heat dissipation area can be provided for the heating element with a smaller power consumption, so as to optimize and balance the heat dissipation efficiencies for both the first heating element 21 and the second heating element 22, such that the overall heat dissipation efficiency of the radiator 1 reaches the best. Additionally, in some cases, it is also possible to allow the positions of the adjacent intermittent portions 133 to be adjusted correspondingly for different chips connected to the same wall 11 or 12.

[0088] Optionally, as Figures 6 to 8 shown, the first wall 11 may have a first receiving portion 111 adapted to receive the first heating element 21, and the second wall 12 may have a second receiving portion 121 adapted to receive the second heating element 22. Herein, the receiving portions 111 and 121 may be recessed portions or protruding portions depending on the heights of the corresponding heating elements for achieving height adaptation, and the receiving portions may be formed by machining.

[0089] Preferably, the radiator 1 may be an aluminum extrusion. Compared with aluminum die-castings, aluminum extrusions have better thermal conductivity.

[0090] Optionally, as Figures 3 to 5 shown, the radiator 1 may include lugs 14 adapted to connect the radiator 1 to a circuit board 41 or a circuit board 42 of the domain controller 100. For example, the lugs 14 may be connected to the second circuit board 42 by screws to fix the radiator 1 to the second circuit board 42. Thereby, simple installation of the radiator 1 is achieved.

[0091] The fan 5 of the domain controller 100 for forming an air flow within the radiator 1 to dissipate heat from the heat dissipation portion 13 may be arranged at one side of the radiator 1 and is arranged to be capable of forcing air to flow along the second extension dimension of the heat dissipation portion 13 through the radiator 1. For example, as Figure 4 shown, the fan 5 may provide an air flow flowing through the entire radiator 1 in the second direction D2, that is, the air cooling direction is oriented in the second direction D2. Here, the fan 5 may be a centrifugal fan for sending external air into the radiator 1 through it, or may be an axial flow fan for sucking the air within the radiator 1 out of the radiator 1 and forcing new external air to enter the radiator 1 in other ways.

[0092] Optionally, as Figure 4 shown, the fan 5 of the radiator 1 is electrically connected to a port in the second circuit board 42 through a plug connector 51 for driving the fan 5. In some cases, the fan 5 may also be alternatively electrically connected to the first circuit board 41. Thus, the fan 5 can be powered and operated by the connected circuit board, so that there is no need to provide a separate power supply or controller. Electrically connecting to the second circuit board located below the radiator 1 can simplify the installation.

[0093] The fan 5 may also have a holding portion 52 adapted to stably hold it within the domain controller 100. Further, a structure for cooperating with the holding portion 52 to fix the fan 5 may be provided on other components of the domain controller 100.

[0094] Optionally, as Figure 4 shown, both the first circuit board 41 and the second circuit board 42 have relief recesses 411, 421 for the fan 5 to allow the fan 5 to extend upward from the second circuit board 42 and protrude above the first circuit board 41. In this way, a compact structure of the radiator 1 especially in the first direction D1 and the second direction D2 can be achieved, thus allowing miniaturization of the domain controller 100.

[0095] On this basis, the top surface 91 of the housing 9 of the domain controller 100 may have an inward protrusion 911 protruding toward the inside. Thus, when the top surface 91 is installed downward onto the integral base, the inward protrusion 911 can press against the rubber frame of the fan, and further press the fan 5 downward against the bottom surface 92, thereby fixing the fan 5. The inward protrusions 911 are preferably provided in pairs. Further, the holding portion 52 of the fan 5 may be set as a pair of recesses located at the top of the fan 5 and corresponding to the inward protrusions 911, so that when the top surface 91 is installed, the inward protrusions 911 can be coupled into the recesses of the fan 5 to restrain the inward protrusions 911.

[0096] In particular, for example, as Figures 1 to 4 、 Figure 6 and Figure 7As shown, the domain controller 100 may have a housing 9, which has opposite top surface 91 and bottom surface 92, opposite air intake side surface 93 and air outlet side surface 94, and opposite front surface 96 and rear surface 95. Among them, the external interfaces of the first circuit board 41 and the second circuit board 42 are located at the rear surface 95. The domain controller 100 is generally in a cubic shape.

[0097] Preferably, the bottom surface 92, the air intake side surface 93, the air outlet side surface 94, and the front surface 96 may be integral, because they do not affect the assembly and mutual cooperation of the internal components. That is, they can be formed into an integral base. After that, after the internal components of the domain controller 100 are installed in place, the top surface 91 and the rear surface 95 are installed, especially by screwing the top surface 91 and the rear surface 95 to the base. The rear surface 95 is especially a shielding cover.

[0098] The air intake side surface 93 has a plurality of air inlets 931, and the air outlet side surface 94 has a plurality of air outlets 941. The air inlets 931 and the air outlets 941 can be arranged in a predetermined pattern respectively. Preferably, the air flow rate of all the air inlets 931 per unit time is approximately equal to the air flow rate of all the air outlets 941 per unit time. Preferably, the area where the air inlets 931 are located and the area where the air outlets 941 are located are substantially aligned along the second extension dimension of the heat dissipation part 13. In this way, the air flow path in the domain controller 100 can be shortened as much as possible, thereby improving the heat dissipation efficiency.

[0099] Optionally, the fan 5 can be arranged adjacent to the air outlet side surface 94, and the shape of the area where it is located is a substantially annular shape corresponding to the fan 5. Thus, the best performance of the fan 5 can be provided.

[0100] Through the radiator of the present application, the two circuit boards in the domain controller can be cooled simultaneously, and the required heat dissipation capacity can be preferably provided for circuit boards or chips with different power consumptions, so that the radiator as a whole has the best double-sided heat dissipation performance. In addition, through the optimization of the structure and arrangement, a domain controller with a compact structure and powerful functions is provided.

[0101] It should be understood that the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance, nor should they be construed as implicitly specifying the quantity of the indicated technical features. The features defined with "first" and "second" may explicitly or implicitly include at least one of the features.

[0102] In addition, it should be understood that in the description of this specification, the descriptions of terms such as "one embodiment", "some embodiments", and "exemplary embodiments" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment.

[0103] It should also be understood that in this text, terms indicating orientation or positional relationship such as "upper", "lower", "top", "bottom", "inner", "outer", etc. are used to illustrate the positional relationship of the corresponding components with reference to the drawings based on the orientation of the radiator and / or domain controller during actual use. This is only for the convenience of describing this specification and simplifying the description, rather than indicating or implying that the corresponding components have a specific orientation, are constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0104] Although specific embodiments of this application are described in detail herein, they are given only for the purpose of explanation and should not be considered as limiting the scope of this application. Various substitutions, changes, and modifications can be conceived without departing from the spirit and scope of this application.

Claims

1. A heat sink (1) for a domain controller, characterized in that: The radiator (1) comprises: A first wall (11) and a second wall (12) are arranged opposite to each other, a first heat generating body (21) is thermally connected to the first wall (11), and a second heat generating body (22) is thermally connected to the second wall (12); and at least one heat dissipation portion (13) extending between the first wall (11) and the second wall (12), Each of the at least one heat dissipation portion (13) has a discontinuity portion (133) away from the first wall (11) and the second wall (12) within a first extension dimension between the first wall (11) and the second wall (12).

2. The heat sink (1) for a domain controller according to claim 1, characterized in that: The heat dissipation portion (13) extends substantially perpendicularly to the first wall (11) and the second wall (12); and / or The heat dissipation portion (13) is generally wavy in shape; and / or The second extension dimension of the heat dissipation portion (13) extends from one side of the heat sink (1) to the other side, and the second extension dimension is substantially parallel to the air cooling direction (D2) of the heat sink (1); and / or The heat dissipation portion (13) comprises a first heat dissipation portion (131) extending from the first wall (11) to the second wall (12) and a second heat dissipation portion (132) extending from the second wall (12) to the first wall (11), wherein the distal end of the first heat dissipation portion (131) and the distal end of the second heat dissipation portion (132) are separated from each other and define the discontinuity portion (133) therebetween.

3. The heat sink (1) for a domain controller according to claim 2, characterized in that: In different heat dissipation parts (13), the relative lengths of the first heat dissipation part (131) and the second heat dissipation part (132) are the same or different, and the discontinuity part (133) is formed at the same or different positions of the corresponding heat dissipation parts (13).

4. The heat sink (1) for a domain controller according to claim 3, characterized in that: For a plurality of the heat dissipation portions (13) arranged continuously, the positions of the discontinuous portions (133) on the corresponding heat dissipation portions (13) vary periodically.

5. The heat sink (1) for a domain controller according to claim 3 or 4, characterized in that: The position of the discontinuous portion (133) on the corresponding heat dissipation portion (13) depends on the power consumption of the first heating element (21) and the second heating element (22).

6. The radiator (1) for a domain controller according to any one of claims 1 to 4, characterized in that: The first wall (11) has a first receiving portion (111) suitable for receiving the first heating element (21); and / or The second wall (12) has a second receiving portion (121) suitable for receiving the second heating element (22); and / or The radiator (1) is an aluminum extrusion; and / or The heat sink (1) further comprises lugs (14) suitable for connecting the heat sink (1) to a circuit board (41, 42) of a domain controller (100).

7. A domain controller (100), characterized in that: The domain controller (100) comprises: The radiator (1) according to any one of claims 1 to 6; a first circuit board (41) adapted to hold a first heating element (21); and a second circuit board (42) adapted to hold a second heating element (22), The first circuit board (41) and the second circuit board (42) are respectively arranged on two opposite sides of the heat sink (1).

8. The domain controller (100) according to claim 7, characterized in that: The first heating element (21) and the second heating element (22) are respectively connected to the first wall (11) and the second wall (12) of the heat sink (1) via a heat conductive adhesive (3); and / or The domain controller (100) further comprises a fan (5) arranged at one side of the radiator (1).

9. The domain controller (100) according to claim 8, characterized in that: The fan (5) of the heat sink (1) is electrically connected to a port in the second circuit board (42) via a plug connector (51) for driving the fan (5); and / or The first circuit board (41) and the second circuit board (42) both have recessed portions (411, 421) for accommodating the fan (5), so as to allow the fan (5) to extend upward from the second circuit board (42) and protrude from the first circuit board (41); and / or The fan (5) also has a holding portion (52) suitable for stably holding the fan (5) in the domain controller (100).

10. The domain controller (100) according to claim 8 or 9, characterized in that: The domain controller (100) has a housing (9), wherein the housing (9) has a top surface (91) and a bottom surface (92) opposite to each other, and an air inlet side surface (93) and an air outlet side surface (94) opposite to each other. The top surface (91) has an inner convex portion (911) protruding inwardly, and the inner convex portion (911) is suitable for coupling to a retaining portion (52) of the fan (5) so as to press the fan (5) downward onto the bottom surface (92); and / or The air inlet side surface (93) has a plurality of air inlets (931), the air outlet side surface (94) has a plurality of air outlets (941), and the area where the air inlets (931) are located and the area where the air outlets (941) are located are roughly aligned along the second extension dimension of the heat dissipation portion (13); and / or The fan (5) is arranged adjacent to the air outlet side (94), and the shape of the area where the air outlet (941) is located is substantially annular corresponding to the fan (5); and / or The bottom surface (92), the air inlet side surface (93) and the air outlet side surface (94) are formed integrally.

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