PHM printed board component heat dissipation device

Abstract

The utility model belongs to the technical field of printed boards, and particularly relates to a PHM printed board component heat dissipation device which comprises a printed circuit board and a fixing support, the side wall of the fixing support is fixedly connected with a plurality of positioning hole seats, the printed circuit board is installed in the fixing support, a cavity is formed in the fixing support, and the positioning hole seats are arranged in the cavity. A heat dissipation assembly is installed on the fixing support and comprises a draught fan, a ventilation channel, a plurality of air inlets and air outlets. According to the utility model, external airflow is driven by the fan to enter the interior of the fixed support through the ventilation channel, heat dissipation is carried out on the bottom area of the printed circuit board, then the airflow enters the interior of the cavity through the air inlet and is discharged through the air outlet holes, and heat dissipation is carried out on electronic components above the printed circuit board. And the heat dissipation area and the heat dissipation effect of the electronic component are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of printed circuit boards, and particularly to a heat dissipation device for PHM printed circuit board components. Background Technique

[0002] The vehicle pre-diagnosis and health management (PHM) system is a popular topic in the field of rail transit in recent years. The existing train PHM host analyzes and processes the corresponding train data through its built-in main control module to obtain the health status of the train. Among them, the printed circuit board is an important electronic component of the train PHM host and is the support and carrier of the main control module.

[0003] Since there are a large number of electronic components fixedly installed on the printed circuit board in the PHM host, the heat generated during operation also increases, and the heat dissipation efficiency is low, resulting in poor high-temperature resistance of the printed circuit board.

[0004] The existing Chinese patent with the publication number CN217445684U discloses a cooling plate for a printed circuit board, including a printed circuit board main body and threaded fasteners. The utility model cools and reduces the temperature of the printed circuit board by setting a cooling plate mechanism below the printed circuit board main body, arranging a cooling pipe made of a carbon fiber tube on the upper surface of the cooling plate mechanism plate body, filling a coolant in the cooling pipe, and installing a small cooling fan at the center position of the plate body through the cooperation of two cooling methods of air cooling and liquid cooling.

[0005] In view of the above and related prior arts, the inventor believes that there are often the following defects: the device dissipates heat from the bottom surface of the printed circuit board, and the heat dissipation effect on the side of the printed circuit board where electronic components are installed is relatively weak and needs to be improved; therefore, a heat dissipation device for PHM printed circuit board components is proposed for the above problems. Content of the Utility Model

[0006] In order to make up for the deficiencies of the prior art and solve the above-mentioned technical problems, the utility model proposes a heat dissipation device for PHM printed circuit board components.

[0007] The technical solution adopted by the present utility model to solve its technical problems is as follows: A PHM printed circuit board component heat dissipation device of the present utility model includes a printed circuit board and a fixing bracket. A number of positioning hole seats are fixedly connected to the side wall of the fixing bracket. The printed circuit board is installed inside the fixing bracket. A cavity is provided inside the fixing bracket. A heat dissipation component is installed on the fixing bracket. The heat dissipation component includes a fan, a ventilation channel, a number of air inlets, and air outlet holes. The fan is fixedly installed inside the fixing bracket. The ventilation channel is opened on the lower side wall of the fixing bracket. The air inlets are opened on the lower side wall of the cavity. The air outlet holes are opened on the upper side wall of the cavity. During installation, the fixing bracket is installed inside the PHM device. The fan is operated. The fan drives the external air flow to enter the inside of the fixing bracket through the ventilation channel to dissipate heat from the bottom area of the printed circuit board. Subsequently, the air flow enters the inside of the cavity through the air inlets and is discharged through the air outlet holes to dissipate heat from the electronic components above the printed circuit board. Compared with the prior art, the heat dissipation area and effect of the electronic components are improved.

[0008] Preferably, the air inlets are located below the printed circuit board, and the air outlet holes are located above the printed circuit board.

[0009] Preferably, the front and rear ends of the fan correspond to the ventilation channel and are fitted and fixed to the inner wall of the fixing bracket.

[0010] Preferably, baffles are respectively fitted and installed below the left and right ends of the fan, and the bottom ends of the baffles are at the same horizontal plane as the bottom end of the fixing bracket. The two ends of the baffles are fixedly connected to the fixing bracket. The air flow is blocked through the cooperation of the baffles, the fan, and the inner wall of the fixing bracket to prevent the air flow from flowing out of the fixing bracket below the fan.

[0011] Preferably, a limiting layer is installed below the printed circuit board, and the limiting layer is fixedly connected to the fixing bracket.

[0012] Preferably, a sealing gasket is fixedly connected to the bottom of the fixing bracket. By fitting the sealing gasket to the PHM device, it is prevented that the air flow overflows from the gap at the intersection of the fixing bracket and the PHM device, affecting the heat dissipation effect.

[0013] Preferably, a dust-proof net plate is installed inside the ventilation channel. A fixing component is installed inside the ventilation channel. The fixing component includes two fixing sockets, and the fixing sockets are fixedly installed at both ends of the ventilation channel. The dust in the air flow passing through the ventilation channel is filtered by the dust-proof net plate.

[0014] Preferably, a convex layer is fixedly connected to the side wall of the fixed socket, and the convex layer is used for limiting during the installation of the dust-proof net plate. Slots are formed on the surface of the fixed socket, and the clamping block is inserted into the interior of the slot by the elastic force of the spring, so as to fix the dust-proof net plate inside the ventilation channel for use. When the dust-proof net plate needs to be cleaned, the clamping block is pushed to move in the slot, and the dust-proof net plate can be quickly taken out for cleaning.

[0015] Preferably, the fixing assembly further includes two chutes, the chutes are formed on both sides of the dust-proof net plate, and the side walls of the chutes are slidably connected with clamping blocks.

[0016] Preferably, a spring is fixedly connected to the side wall of the clamping block, and the other end of the spring is fixedly installed inside the chute.

[0017] The beneficial effects of the present utility model are as follows:

[0018] 1. In the present utility model, an external air flow is driven by a fan to enter the interior of the fixed bracket through the ventilation channel, so as to dissipate heat from the bottom area of the printed circuit board. Subsequently, the air flow enters the interior of the cavity through the air inlet and is discharged through the air outlet holes, so as to dissipate heat from the electronic components above the printed circuit board. Compared with the prior art, the heat dissipation area and effect of the electronic components are improved.

[0019] 2. In the present utility model, the dust contained in the air flow passing through the ventilation channel is filtered by the dust-proof net plate, and the dust-proof net plate is installed inside the ventilation channel through the fixing assembly for use. When the dust-proof net plate needs to be cleaned, the dust-proof net plate can be quickly taken out for cleaning, which is convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0022] Figure 2 is the present utility model Figure 1 bottom view;

[0023] Figure 3 is a schematic diagram of the unfolded structure of the printed circuit board and the fixed bracket of the present utility model;

[0024] Figure 4 is a cross-sectional view of the fixed bracket of the present utility model;

[0025] Figure 5 This is an exploded view of the fixing component of the present utility model.

[0026] In the figure: 1, printed circuit board; 2, fixing bracket; 3, heat dissipation component; 31, fan; 32, ventilation channel; 33, air inlet; 34, air outlet hole; 35, baffle; 4, cavity; 5, limiting layer; 6, gasket; 7, dust-proof mesh board; 8, fixing component; 81, fixing socket; 82, convex layer; 83, slot; 84, chute; 85, clamping block; 86, spring. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Embodiment 1

[0029] Please refer to Figures 1-4 As shown, a PHM printed circuit board component heat dissipation device includes a printed circuit board 1 and a fixing bracket 2. A plurality of positioning hole seats are fixedly connected to the side wall of the fixing bracket 2. The printed circuit board 1 is installed inside the fixing bracket 2. A cavity 4 is provided inside the fixing bracket 2. A heat dissipation component 3 is installed on the fixing bracket 2. The heat dissipation component 3 includes a fan 31, a ventilation channel 32, a plurality of air inlets 33 and air outlet holes 34. The fan 31 is fixedly installed inside the fixing bracket 2. The ventilation channel 32 is provided on the lower side wall of the fixing bracket 2. The air inlet 33 is provided on the lower side wall of the cavity 4. The air outlet hole 34 is provided on the upper side wall of the cavity 4. During installation, the fixing bracket 2 is installed inside the PHM device, and the fan 31 is operated. The fan 31 drives the external air flow to enter the inside of the fixing bracket 2 through the ventilation channel 32 to dissipate heat from the bottom area of the printed circuit board 1. Subsequently, the air flow enters the inside of the cavity 4 through the air inlet 33 and is discharged through the air outlet hole 34 to dissipate heat from the electronic components above the printed circuit board 1. Compared with the prior art, the heat dissipation area and effect of the electronic components are improved.

[0030] The air inlet 33 is located below the printed circuit board 1, and the air outlet hole 34 is located above the printed circuit board 1.

[0031] The front and rear ends of the fan 31 correspond to the ventilation channel 32 and are in contact with the inner wall of the fixing bracket 2.

[0032] Below the left and right ends of the fan 31, baffles 35 are respectively and fittingly installed, and the bottom ends of the baffles 35 are at the same horizontal plane as the bottom end of the fixed bracket 2. The two ends of the baffles 35 are fixedly connected to the fixed bracket 2. Through the cooperation of the baffles 35, the fan 31 and the inner wall of the fixed bracket 2, the airflow is blocked to prevent the airflow from flowing out of the fixed bracket 2 below the fan 31.

[0033] Below the printed circuit board 1, a limiting layer 5 is installed, and the limiting layer 5 is fixedly connected to the fixed bracket 2.

[0034] A sealing gasket 6 is fixedly connected to the bottom of the fixed bracket 2. By fitting the sealing gasket 6 to the PHM device, it prevents the airflow from overflowing through the gap at the intersection of the fixed bracket 2 and the PHM device, affecting the heat dissipation effect.

[0035] Embodiment Two

[0036] Comparing with Embodiment One, please refer to Figure 5 As shown, the present utility model provides another implementation manner. A dust-proof mesh plate 7 is installed inside the ventilation channel 32, and a fixing component 8 is installed inside the ventilation channel 32. The fixing component 8 includes two fixing sockets 81, and the fixing sockets 81 are fixedly installed at both ends of the ventilation channel 32. The dust contained in the airflow passing through the ventilation channel 32 is filtered by the dust-proof mesh plate 7.

[0037] A raised layer 82 is fixedly connected to the side wall of the fixing socket 81. When the dust-proof mesh plate 7 is installed, the raised layer 82 is used for limiting. A slot 83 is formed on the surface of the fixing socket 81. The block 85 is inserted into the inside of the slot 83 by the elastic force of the spring 86, and then the dust-proof mesh plate 7 is fixed inside the ventilation channel 32 for use. When it is necessary to clean the dust-proof mesh plate 7, the block 85 is pushed to move the slot 83, and the dust-proof mesh plate 7 can be quickly taken out for cleaning.

[0038] The fixing component 8 further includes two sliding grooves 84, the sliding grooves 84 are formed on both sides of the dust-proof mesh plate 7, and the side wall of the sliding groove 84 is slidably connected with a block 85.

[0039] A spring 86 is fixedly connected to the side wall of the block 85, and the other end of the spring 86 is fixedly installed inside the sliding groove 84.

[0040] For those skilled in the art, all the electrical components in this case are connected to their adapted power supplies through wires, and a suitable controller should be selected and electrically connected to the fan 31 according to the actual situation to meet the control requirements. For the specific connection and control sequence, reference should be made to the sequence of the electrical components working successively in the following working principle to complete the electrical connection. The detailed connection means are well-known techniques in the art. The following mainly introduces the working principle and process, and no further description of the electrical control will be given.

[0041] The parts not involved in this device are the same as the prior art or can be implemented using the prior art.

[0042] Working principle: During installation, the fixing bracket 2 is installed inside the PHM device. The fan 31 is operated, and the fan 31 drives the external air flow to enter the inside of the fixing bracket 2 through the ventilation channel 32 to dissipate heat from the bottom area of the printed circuit board 1. Subsequently, the air flow enters the inside of the cavity 4 through the air inlet 33 and is discharged through the air outlet holes 34 to dissipate heat from the electronic components above the printed circuit board 1. Compared with the prior art, the heat dissipation area and effect of the electronic components are improved.

[0043] The dust contained in the air flow passing through the ventilation channel 32 is filtered by the dust-proof mesh plate 7, and the clamping block 85 is inserted into the inside of the slot 83 by the elastic force of the spring 86, thereby fixing the dust-proof mesh plate 7 inside the ventilation channel 32 for use. When it is necessary to clean the dust-proof mesh plate 7, the clamping block 85 is pushed to move out of the slot 83, and the dust-proof mesh plate 7 can be quickly taken out for cleaning.

[0044] In the description of this specification, the description with reference to terms such as "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0045] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. A PHM printed circuit board component heat dissipation device, comprising a printed circuit board (1) and a fixing bracket (2), characterized in that: The printed circuit board (1) is mounted inside a fixed bracket (2), a cavity (4) is provided inside the fixed bracket (2), a heat dissipation assembly (3) is mounted on the fixed bracket (2), the heat dissipation assembly (3) comprises a fan (31), a ventilation channel (32), a plurality of air inlets (33) and air outlets (34), the fan (31) is fixedly mounted inside the fixed bracket (2), the ventilation channel (32) is provided on the lower side wall of the fixed bracket (2), the air inlet (33) is provided on the lower side wall of the cavity (4), and the air outlet (34) is provided on the upper side wall of the cavity (4).

2. The PHM printed circuit board component heat sink according to claim 1, characterized in that: The air inlet (33) is located below the printed circuit board (1), and the air outlet (34) is located above the printed circuit board (1).

3. The PHM printed circuit board component heat dissipation device according to claim 1, characterized in that: The front and rear ends of the fan (31) correspond to the ventilation channel (32) and fit the inner wall of the fixed bracket (2).

4. The PHM printed circuit board component heat sink according to claim 1, characterized in that: Baffles (35) are respectively installed below the left and right ends of the fan (31), and the bottom end of the baffle (35) is in the same horizontal plane as the bottom end of the fixed bracket (2), and the two ends of the baffle (35) are fixedly connected to the fixed bracket (2).

5. The PHM printed circuit board component heat sink according to claim 1, characterized in that: A limiting layer (5) is installed below the printed circuit board (1), and the limiting layer (5) is fixedly connected to the fixed bracket (2).

6. The PHM printed circuit board component heat sink according to claim 1, characterized in that: A sealing pad (6) is fixedly connected to the bottom of the fixed bracket (2).

7. The PHM printed circuit board component heat sink according to claim 1, characterized in that: A dustproof screen (7) is installed inside the ventilation channel (32), and a fixing component (8) is installed inside the ventilation channel (32). The fixing component (8) comprises two fixing sockets (81), and the fixing sockets (81) are fixedly installed at two ends of the ventilation channel (32).

8. The PHM printed circuit board component heat sink according to claim 7, characterized in that: A protruding layer (82) is fixedly connected to the side wall of the fixed socket (81), and a slot (83) is provided on the surface of the fixed socket (81).

9. The PHM printed circuit board component heat sink according to claim 7, characterized in that: The fixing assembly (8) further comprises two slide grooves (84), wherein the slide grooves (84) are arranged on both sides of the dustproof mesh plate (7), and the side walls of the slide grooves (84) are slidably connected with a clamping block (85).

10. The PHM printed circuit board component heat sink according to claim 9, characterized in that: A spring (86) is fixedly connected to the side wall of the clamping block (85), and the other end of the spring (86) is fixedly installed inside the sliding groove (84).

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