Photoelectric coupler

Abstract

An optocoupler packaging support comprises a first support body and a second support body, the first support body comprises a first base island and a first pin, a first glue grabbing hole is formed between the first base island and the first pin, shading glue can be solidified and penetrate through the first glue grabbing hole, and the second support body comprises a second base island and a second pin. A second glue grabbing hole for curing and penetrating the shading glue is formed between the second base island and the second pin; in the plastic packaging process of the photoelectric coupler, the shading glue can flow through the first glue grabbing hole of the first bracket, so that the combinability between the shading glue and the first bracket is improved; the shading glue can flow through a second glue grabbing hole of the second bracket, so that the bonding property between the shading glue and the second bracket is improved; the sealing performance of the photoelectric coupler can be improved, and delamination failure caused by poor combination performance is avoided.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of optocouplers, and particularly to an optocoupler. Background Art

[0002] In the packaging process of optocouplers, the main functions of the bracket include mechanical support, electrical connection, heat dissipation, etc. During the production and use of optocouplers, poor bonding between the light-shielding glue and the bracket will lead to delamination failure, which will in turn affect the insulation withstand voltage of the optocoupler and cause the device to fail. Summary of the Utility Model

[0003] The following is an overview of the subject matter described in detail in this article. This overview is not intended to limit the scope of protection of the claims.

[0004] An object of the present application is to solve at least to some extent one of the technical problems existing in the related art. The embodiments of the present application provide an optocoupler, which cures the light-shielding glue in the glue-grabbing holes of the bracket, thereby improving the bonding between the light-shielding glue and the bracket.

[0005] An embodiment of the present application, an optocoupler, includes a light emitter, a light receiver, a light-transmitting glue, a light-shielding glue, and an optocoupler packaging bracket. The light emitter is disposed on a first base island of a first bracket of the optocoupler packaging bracket, and the light receiver is disposed on a second base island of a second bracket of the optocoupler packaging bracket; the light-transmitting glue surrounds the first base island and the second base island, the light-shielding glue surrounds the outside of the light-transmitting glue, and the light-shielding glue penetrates through a first glue-grabbing hole of the first bracket and a second glue-grabbing hole of the second bracket; a first lead of the first bracket and a second lead of the second bracket are exposed outside the light-shielding glue.

[0006] According to some embodiments of the present application, the light-shielding glue forms a first glue column, the first glue column penetrates through the first glue-grabbing hole, and the shape of the first glue column is the same as the shape of the first glue-grabbing hole.

[0007] According to some embodiments of the present application, the light-shielding glue forms a second glue column, the second glue column penetrates through the second glue-grabbing hole, and the shape of the second glue column is the same as the shape of the second glue-grabbing hole.

[0008] According to some embodiments of the present application, the light emitter is an infrared light-emitting LED.

[0009] According to some embodiments of the present application, the light receiver is an infrared receiving chip.

[0010] According to some embodiments of the present application, the optocoupler packaging bracket includes:

[0011] The first bracket for installing a light emitter, the first bracket includes a first base island and a first lead, and a first glue-catching hole for the curing and passing of a light-shielding glue is provided between the first base island and the first lead;

[0012] The second bracket for installing a light receiver, the second bracket includes a second base island and a second lead, and a second glue-catching hole for the curing and passing of a light-shielding glue is provided between the second base island and the second lead.

[0013] According to some embodiments of the present application, the first glue-catching hole is a circular through-hole.

[0014] According to some embodiments of the present application, the second glue-catching hole is a circular through-hole.

[0015] According to some embodiments of the present application, there are two first glue-catching holes.

[0016] According to some embodiments of the present application, there are two second glue-catching holes.

[0017] The above solution has at least the following beneficial effects: During the plastic encapsulation process of the optocoupler, the light-shielding glue can flow through the first glue-catching hole of the first bracket, improving the bonding between the light-shielding glue and the first bracket; the light-shielding glue can flow through the second glue-catching hole of the second bracket, improving the bonding between the light-shielding glue and the second bracket; it can improve the sealing performance of the optocoupler and avoid delamination failure caused by poor bonding. Description of the Drawings

[0018] The drawings are used to provide a further understanding of the technical solutions of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solutions of the present application and do not constitute a limitation to the technical solutions of the present application.

[0019] Figure 1 It is a structural diagram of the first bracket provided by the embodiment of the present application;

[0020] Figure 2 It is a structural diagram of the second bracket provided by the embodiment of the present application;

[0021] Figure 3 It is a structural diagram of the optocoupler provided by the embodiment of the present application;

[0022] Figure 4 It is another structural diagram of the optocoupler provided by the embodiment of the present application. Detailed Embodiments

[0023] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] It should be noted that although the functional modules are divided in the schematic diagram of the device and the logical sequence is shown in the flowchart, in some cases, the steps shown or described may be executed in a different module division from that in the device or a different sequence from that in the flowchart. Terms such as "first" and "second" in the description, claims or the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence.

[0025] In the packaging process of the optocoupler, the main functions of the bracket include mechanical support, electrical connection, heat dissipation, etc. During the production and use of the optocoupler, poor bonding between the light-shielding glue and the bracket will lead to delamination failure, which will further affect the insulation withstand voltage of the optocoupler and cause the device to fail.

[0026] To solve the above problems, an embodiment of the present application provides an optocoupler packaging bracket and an optocoupler.

[0027] The following further elaborates on the embodiments of the present application with reference to the accompanying drawings.

[0028] Refer to Figure 1 and Figure 2 , the optocoupler packaging bracket includes a first bracket 100 and a second bracket 200; the first bracket 100 includes a first base island 111 and a first lead 112, and a first glue-catching hole 120 for the light-shielding glue 400 to cure and pass through is provided between the first base island 111 and the first lead 112; the second bracket 200 includes a second base island 211 and a second lead 212, and a second glue-catching hole 220 for the light-shielding glue 400 to cure and pass through is provided between the second base island 211 and the second lead 212.

[0029] In this embodiment, during the plastic encapsulation process of the optocoupler, the light-shielding glue 400 can flow through the first glue-catching hole 120 of the first bracket 100 to improve the bonding between the light-shielding glue 400 and the first bracket 100; the light-shielding glue 400 can flow through the second glue-catching hole 220 of the second bracket 200 to improve the bonding between the light-shielding glue 400 and the second bracket 200; the sealing performance of the optocoupler can be improved, and delamination failure caused by poor bonding can be avoided.

[0030] The first bracket 100 is used to mount the light emitter 510, and the second bracket 200 is used to mount the light receiver 520.

[0031] In some feasible embodiments, the first glue-catching holes 120 and the second glue-catching holes 220 are circular through-holes. The circular through-holes facilitate the light-shielding glue 400 to flow through the glue-catching holes during the encapsulation process and fill the entire glue-catching holes, which enables the solidified light-shielding glue 400 to tightly combine with the bracket, improving the bonding property between the light-shielding glue 400 and the bracket. Of course, in other embodiments, the first glue-catching holes 120 and the second glue-catching holes 220 can be of other shapes, such as square, etc. The shapes of the first glue-catching holes 120 and the second glue-catching holes 220 can be set according to actual production requirements.

[0032] In some feasible embodiments, there are two first glue-catching holes 120 and two second glue-catching holes 220 respectively. It can be understood that an optical coupler including the first bracket 100 and the second bracket 200 is provided with four glue-catching holes. Of course, in other embodiments, the first glue-catching holes 120 and the second glue-catching holes 220 can be of other quantities, such as three, etc. The quantities of the first glue-catching holes 120 and the second glue-catching holes 220 can be set according to actual production requirements.

[0033] Referring to Figure 3 and Figure 4 , the optical coupler includes a light emitter 510, a light receiver 520, a light-transmitting glue 300, a light-shielding glue 400 and an optical coupler packaging bracket. The light emitter 510 is disposed on the first base island 111 of the first bracket 100 of the optical coupler packaging bracket, and the light receiver 520 is disposed on the second base island 211 of the second bracket 200 of the optical coupler packaging bracket; the light-transmitting glue 300 surrounds the first base island 111 and the second base island 211, the light-shielding glue 400 surrounds the outside of the light-transmitting glue 300, and the light-shielding glue 400 passes through the first glue-catching holes 120 of the first bracket 100 and the second glue-catching holes 220 of the second bracket 200; the first lead 112 of the first bracket 100 and the second lead 212 of the second bracket 200 are exposed outside the light-shielding glue 400.

[0034] During the encapsulation process of the optical coupler, the light-shielding glue 400 can flow through the first glue-catching holes 120 of the first bracket 100 and the second glue-catching holes 220 of the second bracket 200 and solidify in the first glue-catching holes 120 and the second glue-catching holes 220, making the bonding between the light-shielding glue 400 and the first bracket 100 and the second bracket 200 firmer and improving the sealing performance of the optical coupler.

[0035] Among them, the base island refers to the area in an integrated circuit that is used for laying out and connecting electronic devices. It is usually composed of multiple metal layers and insulating layers and is used to achieve electrical connections between electronic components.

[0036] The first base island 111 and the second base island 211 are in corresponding positions, and the light emitter 510 on the first base island 111 and the light receiver 520 on the second base island 211 are in corresponding positions, so that the light emitted by the light emitter 510 can be received by the light receiver 520 to the greatest extent, which is beneficial to improving the accuracy of the optocoupler.

[0037] Silicone is provided between the first bracket 100 and the second bracket 200 of the optocoupler.

[0038] The first pin 112 of the first bracket 100 constitutes the input end of the optocoupler, and the second pin 212 of the second bracket 200 constitutes the output end of the optocoupler. Specifically, there are two first pins 112 and two second pins 212, and the optocoupler is a four-pin optocoupler. Of course, in other embodiments, the optocoupler can also be of other types, such as a six-pin optocoupler, etc.

[0039] The light-shielding glue 400 forms a first glue column, and the first glue column passes through the first glue-gripping hole 120. The shape of the first glue column is the same as that of the first glue-gripping hole 120. The light-shielding glue 400 forms a second glue column, and the second glue column passes through the second glue-gripping hole 220. The shape of the second glue column is the same as that of the second glue-gripping hole 220.

[0040] When the first glue-gripping hole 120 and the second glue-gripping hole 220 are circular through-holes, during the plastic encapsulation process of the optocoupler, the light-shielding glue 400 flows through the first glue-gripping hole 120 of the first bracket 100 and solidifies to form a first glue column. The shape of the first glue column is cylindrical, and the diameter of the first glue column is the same as that of the first glue-gripping hole 120. The light-shielding glue 400 flows through the second glue-gripping hole 220 of the second bracket 200 and solidifies to form a second glue column. The shape of the second glue column is cylindrical, and the diameter of the second glue column is the same as that of the second glue-gripping hole 220. The shape of the first glue column is the same as that of the first glue-gripping hole 120, and the shape of the second glue column is the same as that of the second glue-gripping hole 220, which improves the bonding property between the light-shielding glue 400 and the second bracket 200; it can improve the sealing performance of the optocoupler and avoid delamination failure caused by poor bonding property.

[0041] The light emitter 510 is an infrared light-emitting LED. The light receiver 520 is an infrared receiving chip. The infrared light emitted by the infrared light-emitting LED can be received by the infrared receiving chip, and the infrared receiving chip is provided with an infrared photosensitive transistor. The main structure of the optocoupler is to assemble the light emitter 510 and the light receiver 520 in a sealed housing, and then use the first pin 112 of the light emitter 510 as the input terminal, and use the second pin 212 of the light receiver 520 as the output terminal. When an electrical signal is applied to the input terminal, the light emitter 510 emits light. In this way, due to the photosensitive effect, the light receiver 520 generates a photocurrent after being irradiated with light and outputs it from the output terminal. Thus, the electrical signal transmission through light as a medium is realized, and the input and output ends of the device are electrically insulated. When an electrical signal is applied to the input terminal of the optocoupler to make the light emitter 510 emit light, the intensity of the light depends on the magnitude of the excitation current. After this light irradiates the light receiver 520 packaged together, a photocurrent is generated due to the photoelectric effect and is led out from the output terminal of the light receiver 520, thus realizing the electro-optical-electrical conversion.

[0042] Through the SAT ultrasonic scanning test, it is verified that the bonding effect between the light-shielding glue 400 and the bracket of the optocoupler is significantly improved, and through the red ink experiment, it is verified that the sealing performance of the optocoupler is good. The improvement of the bonding effect between the light-shielding glue 400 and the bracket of the optocoupler improves the sealing performance, which can increase the insulation withstand voltage of the optocoupler and reduce the ingress of water vapor to improve the reliability of the optocoupler.

[0043] The above is a specific description of the preferred embodiment of the present application, but the present application is not limited to the embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present application, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present application.

Claims

1. A photoelectric coupler, characterized in that: It includes a light emitter, a light receiver, a light-transmitting glue, a light-shielding glue and an optocoupler packaging bracket, wherein the light emitter is arranged on the first base island of the first bracket of the optocoupler packaging bracket, and the light receiver is arranged on the second base island of the second bracket of the optocoupler packaging bracket; the light-transmitting glue surrounds the first base island and the second base island, and the light-shielding glue surrounds the outside of the light-transmitting glue, and the light-shielding glue is penetrated into the first glue grabbing hole of the first bracket and the second glue grabbing hole of the second bracket; the first pin of the first bracket and the second pin of the second bracket are exposed on the outside of the light-shielding glue.

2. The photocoupler according to claim 1, characterized in that: The light-shielding glue forms a first glue column, the first glue column is penetrated through the first glue grabbing hole, and the shape of the first glue column is the same as the shape of the first glue grabbing hole.

3. The photocoupler according to claim 1, characterized in that: The light-shielding glue forms a second glue column, the second glue column is penetrated through the second glue grabbing hole, and the shape of the second glue column is the same as the shape of the second glue grabbing hole.

4. The photocoupler according to claim 1, characterized in that: The light emitter is an infrared light emitting LED.

5. The photocoupler according to claim 4, characterized in that: The light receiver is an infrared receiving chip.

6. The photocoupler according to claim 1, characterized in that: The optical coupler package bracket comprises: A first bracket for mounting the light emitter, the first bracket comprising a first base island and a first pin, a first glue grabbing hole for the light shielding glue to be cured and penetrated is provided between the first base island and the first pin; The second bracket is used for installing the light receptor, wherein the second bracket comprises a second base island and a second pin, and a second glue grabbing hole for the light shielding glue to be cured and penetrated is arranged between the second base island and the second pin.

7. The photocoupler according to claim 6, characterized in that: The first glue grabbing hole is a circular through hole.

8. The photoelectric coupler according to claim 6, characterized in that: The second glue grabbing hole is a circular through hole.

9. The photoelectric coupler according to claim 6, characterized in that: There are two first glue grabbing holes.

10. The photoelectric coupler according to claim 6, characterized in that: The second glue grabbing holes have two.

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