Wafer cleaning machine

Abstract

The utility model relates to the technical field of wafer cleaning equipment, in particular to a wafer cleaning machine. Comprising a cleaning device, a transfer mechanism, a receiving turnover mechanism and a drying mechanism. The cleaning device comprises a medicament cleaning box and a water washing cleaning box; the agent cleaning box comprises a first box body, a second box body, a liquid inlet assembly and a temperature control assembly, the first box body is provided with a first containing cavity, the second box body and the first box body are connected and define a second containing cavity, and the first box body is located in the second containing cavity; the liquid inlet assembly is arranged in the first box body and extends into the first accommodating cavity; the temperature control assembly comprises a heating piece, the heating piece is located outside the first box body, and the first containing cavity communicates with the second containing cavity through the heating piece; the transferring mechanism is used for sequentially putting an external material box into the medicament cleaning box and the water washing cleaning box, and the material receiving turnover mechanism is used for receiving the external material box from the transferring mechanism and transferring the external material box to the drying mechanism; the purpose of heating the liquid medicine in the first containing cavity is achieved, the cleaning temperature condition is met, and the stability of production quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning equipment, in particular to a wafer cleaning machine. Background Art

[0002] During the cleaning process of wafers, chemical solution washing and pure water washing are carried out successively, or multiple chemical solution washings and multiple pure water washings are carried out according to needs. The following problems occur when the existing wafer cleaning machine processes wafers: First, the temperature of the chemical solution changes greatly during the cleaning process, resulting in poor stability of the wafer processing quality and affecting the qualification rate; Second, the chemical solution inevitably overflows, and the recovery of the overflow part is a direct factor affecting the working temperature of the chemical solution, which needs to be improved; Third, there is an energy-consuming phenomenon during the transfer and clamping process of wafers; In view of the above phenomena, equipment improvement is required. Summary of the Invention

[0003] In order to overcome the problems of unstable wafer processing quality and energy consumption during the cleaning process in the prior art, the purpose of the utility model is to provide a wafer cleaning machine to improve the stability of processing quality and ensure the production qualification rate.

[0004] To achieve the above purpose, the technical solution of the utility model is as follows:

[0005] A wafer cleaning machine includes a cleaning device, a transfer mechanism, a receiving and flipping mechanism, and a drying mechanism;

[0006] The cleaning device includes a chemical solution cleaning tank and a pure water cleaning tank;

[0007] The chemical solution cleaning tank includes a first box body, a second box body, a liquid inlet assembly, and a temperature control assembly. The first box body is provided with a first cavity, the second box body is connected to the first box body and encloses a second cavity, and the first box body is located in the second cavity;

[0008] The liquid inlet assembly is arranged in the first box body and extends into the first cavity;

[0009] The temperature control assembly includes a heating element, the heating element is located outside the first box body, and the heating element communicates the first cavity and the second cavity;

[0010] The transfer mechanism sequentially places an external material box into the chemical solution cleaning tank and the pure water cleaning tank, and the receiving and flipping mechanism is used to receive the external material box from the transfer mechanism and transfer it to the drying mechanism.

[0011] Further, the chemical solution cleaning tank further includes a first loading member, a first driving assembly, and a cover plate assembly;

[0012] The first loading member is arranged in the first cavity, and the first driving assembly drives the first loading member to move;

[0013] The cover plate assembly is disposed in the second box body and is used to cover the first cavity and the second cavity.

[0014] Further, the temperature control component further includes a cooling member and a temperature sensing member. The cooling member is disposed in the first box body, and the temperature sensing member is disposed in the first box body.

[0015] Further, the water washing cleaning box includes a third box body, a partition plate, a spraying assembly, and a valve assembly;

[0016] The third box body is provided with a third cavity;

[0017] The partition plate is disposed in the third cavity. The partition plate divides the third cavity into an upper cavity and a lower cavity. The upper cavity and the lower cavity are communicated. The spraying assembly includes a plurality of spray heads, and the spray heads are located above the third box body;

[0018] The third box body is provided with a liquid outlet, and the liquid outlet is located below the partition plate. The valve assembly includes a driving source and a hole cover plate. The driving source drives the hole cover plate to move so that the hole cover plate blocks the liquid outlet or moves away from the liquid outlet.

[0019] Further, the water washing cleaning box further includes a fourth box body. The fourth box body is connected to the third box body and encloses a fourth cavity. The fourth cavity is located outside the third box body.

[0020] Further, the transfer mechanism includes a guide rail, a manipulator assembly, and a feeding assembly. The feeding assembly is used to receive an external material box. The manipulator assembly is slidably connected to the guide rail and sequentially places the external material box into the chemical agent cleaning box and the water washing cleaning box. The material receiving and flipping mechanism is used to receive the external material box from the manipulator assembly and transfer it to the drying mechanism.

[0021] Further, the number of the cleaning devices is multiple, the number of the manipulator assemblies is multiple, and the wafer cleaning machine further includes a baffle assembly. The baffle assembly is disposed between two adjacent cleaning devices. One manipulator assembly moves back and forth between adjacent water washing cleaning boxes, chemical agent cleaning boxes, and water washing cleaning boxes.

[0022] Further, the baffle assembly includes a base, a lifting plate, and a second diversion plate. The lifting plate is slidably connected to the base. The second diversion plate is disposed at the top of the lifting plate and is inclined towards the cleaning device.

[0023] Further, the manipulator assembly includes a material clamping assembly, a swing driving assembly, and a lifting driving source;

[0024] The material clamping assembly includes a left swinging member and a right swinging member. The swing driving assembly opens and closes the left swinging member and the right swinging member. The lifting driving source is used to drive the swing driving assembly to lift;

[0025] Both the left decorative piece and the right decorative piece include a mounting base, a rotating member, a connecting rod, a movable member and a reset member. The mounting base is arranged at the output end of the lifting driving source. The rotating member is rotatably connected to the mounting base. Two ends of the connecting rod are respectively connected to the rotating member and the movable member. The swing driving assembly drives the movable member to move up and down;

[0026] Two ends of the reset member are respectively connected to the rotating members of the left decorative piece and the right decorative piece.

[0027] Further, the swing driving assembly includes a slider driving source and a slider. The slider is slidably connected to the mounting base. The slider is provided with a first inclined surface, and the movable member abuts against the first inclined surface.

[0028] The beneficial effects of the present utility model: By providing a medicament cleaning tank composed of a first box body, a second box body, a liquid inlet assembly and a temperature control assembly, the first box body and the second box body are connected to form a first cavity and a second cavity, and the heating member communicates with the first cavity and the second cavity, so as to achieve the purpose of heating the liquid medicine in the first cavity, meet the temperature conditions for cleaning, and improve the stability of production quality. Description of the Drawings

[0029] Figure 1-1 is a three-dimensional structural schematic diagram of the present utility model;

[0030] Figure 1-2 is a structural schematic diagram of the cleaning device of the present utility model;

[0031] Figure 2-1 is a structural schematic diagram of the medicament cleaning tank of the present utility model;

[0032] Figure 2-2 is a first split structural schematic diagram of the medicament cleaning tank of the present utility model;

[0033] Figure 2-3 is a three-dimensional sectional view of the medicament cleaning tank of the present utility model;

[0034] Figure 2-4 is a structural schematic diagram of the first driving assembly of the medicament cleaning tank of the present utility model;

[0035] Figure 2-5 is a second split structural schematic diagram of the medicament cleaning tank of the present utility model;

[0036] Figure 2-6 is a plane structural schematic diagram of the medicament cleaning tank of the present utility model;

[0037] Figure 3-1 is a structural schematic diagram of the water washing cleaning tank of the present utility model;

[0038] Figure 3-2Schematic diagram of the split structure of the water-washing cleaning box of the present utility model;

[0039] Figure 3-3 First-angle three-dimensional cross-sectional view of the water-washing cleaning box of the present utility model;

[0040] Figure 3-4 Second-angle three-dimensional cross-sectional view of the water-washing cleaning box of the present utility model;

[0041] Figure 4-1 Schematic diagram of the structure of the transfer mechanism of the present utility model;

[0042] Figure 4-2 Schematic diagram of the structure of the manipulator assembly of the present utility model;

[0043] Figure 4-3 Internal structure schematic diagram of the manipulator assembly of the present utility model;

[0044] Figure 4-4 Schematic diagram of the working principle structure of the manipulator assembly of the present utility model;

[0045] Figure 4-5 Partial cross-sectional view of the manipulator assembly of the present utility model;

[0046] Figure 4-6 Schematic diagram of the structure of the feeding assembly of the present utility model.

[0047] Reference numerals include:

[0048] 1 - Cleaning device 11 - Chemical cleaning box 111 - First box body

[0049] 112 - Second box body 113 - Liquid inlet assembly 1141 - Heating element

[0050] 1142 - Cooling element 1143 - Temperature sensing element 115 - First loading part

[0051] 116 - First driving assembly 1161 - Mounting plate 11611 - Long strip hole

[0052] 1162 - Shaft driving part 1163 - Rotating shaft 11631 - First inclined surface

[0053] 1164 - Lifting part 1165 - Rod body 117 - Cover plate assembly

[0054] 118 - Hollow frame body 1181 - Upper ring body 1182 - Lower ring body

[0055] 1183 - Middle vertical rod 1101 - First cavity 1102 - Second cavity

[0056] 12 - Water-washing cleaning box 121 - Third box body 1211 - Liquid outlet

[0057] 1201 - Third cavity 1202 - Fourth cavity 122 - Partition board

[0058] 123 - Spraying assembly 1231 - Nozzle 124 - Valve assembly

[0059] 1241 - Driving source 1242 - Hole cover plate 125 - Fourth box body

[0060] 126 - Resistance detection part 127 - Temperature sensing part 128 - Air pipe assembly

[0061] 129 - First flow guide plate

[0062] 2 - Transfer mechanism 21 - Guide rail 22 - Manipulator assembly

[0063] 221 - Material clamping assembly 2211 - Left swing part 2212 - Right swing part

[0064] 221a - Mounting seat 221b - Rotating part 221c - Connecting rod

[0065] 221d - Movable part 221e - Reset part 22 - Swing driving assembly

[0066] 222a - Slide block driving source 222b - Slide block 222c - First inclined plane

[0067] 223 - Lifting driving source 224 - Fiber optic sensing part 23 - Feeding assembly

[0068] 231 - Tray 232 - Horizontal cylinder 233 - Lifting cylinder

[0069] 3 - Receiving and flipping mechanism 4 - Drying mechanism 5 - Baffle assembly

[0070] 51 - Base 52 - Lifting plate 53 - Second flow guide plate

[0071] 100 - Material box. Detailed implementation mode

[0072] For the convenience of understanding by those skilled in the art, the following further describes the present utility model in conjunction with embodiments and the accompanying drawings. The content mentioned in the implementation mode does not limit the present utility model.

[0073] Please refer to Figures 1-1 to 2-6 , a wafer cleaning machine of the present utility model includes a cleaning device 1, a transfer mechanism 2, a receiving and flipping mechanism 3 and a drying mechanism 4;

[0074] The cleaning device 1 includes a chemical cleaning tank 11 and a water washing cleaning tank 12;

[0075] The medicament cleaning tank 11 includes a first tank body 111, a second tank body 112, a liquid inlet assembly 113 and a temperature control assembly. The first tank body 111 is provided with a first cavity 1101. The second tank body 112 is connected to the first tank body 111 and encloses a second cavity 1102. The first tank body 111 is located inside the second cavity 1102;

[0076] The liquid inlet assembly 113 is arranged on the first tank body 111 and extends into the first cavity 1101;

[0077] The temperature control assembly includes a heating element 1141. The heating element 1141 is located outside the first tank body 111. The heating element 1141 communicates the first cavity 1101 and the second cavity 1102;

[0078] The transfer mechanism 2 sequentially places the external material box 100 into the medicament cleaning tank 11 and the water washing cleaning tank 12. The material receiving and flipping mechanism 3 is used to receive the external material box 100 from the transfer mechanism 2 and transfer it to the drying mechanism 4.

[0079] Specifically, in this embodiment, the first box body 111 is used to clean external wafers. First, a number of external wafers are neatly placed in the external material box 100. The cleaning device 1 includes a chemical cleaning box 11 and a water washing cleaning box 12. The transfer mechanism 2 clamps the external material box 100 and sequentially places it into the chemical cleaning box 11 and the water washing cleaning box 12 to perform chemical washing and water washing on the wafers. Then, under the action of the material receiving and flipping mechanism 3, the material box 100 is flipped by a preset angle and placed into the drying mechanism 4 to complete the processing of chemical washing, water washing, and drying of the wafers. Preferably, the chemical cleaning box 11 includes a first box body 111, a second box body 112, a liquid inlet assembly 113, and a temperature control assembly. The first box body 111 and the second box body 112 are connected to form a second cavity 1102. The first box body 111 is located inside the second cavity 1102, and the upper surface of the first box body 111 is lower than the upper surface of the second box body 112. Preferably, a notch is provided on the upper surface of the side wall of the first box body 111, and the notch is V-shaped. The first cavity 1101 is used to hold the liquid medicine. When the liquid medicine in the first cavity 1101 overflows, it overflows through the V-shaped notch on the upper surface of the first box body 111 and flows into the second cavity 1102 to achieve the purpose of collecting the overflowing liquid medicine. The heating element 1141 is arranged outside the first box body 111. The heating element 1141 includes a first pipe body, a pump body, a second pipe body, a heating box, and a third pipe body that are sequentially connected. The first pipe body is connected to the second cavity 1102, and the third pipe body is connected to the first cavity 1101 to form a circulation channel. The liquid medicine in the second cavity 1102 is pumped out by the pump body through the first pipe body, heated to a preset temperature by the heating of the heating box, and then enters the first cavity 1101 through the third pipe body to achieve the purpose of keeping the working temperature of the liquid medicine in the first cavity 1101 at the preset temperature state. Among them, the liquid inlet assembly 113 includes multiple fluororesin pipes. One end of each fluororesin pipe is installed with a corrosion-resistant PP joint for connecting to an external liquid supply tank, and the other end of the fluororesin pipe extends deep into the first cavity 1101. According to actual production requirements, different chemical agents are supplied. In this embodiment, some fluororesin pipes are used to transport concentrated sulfuric acid, and some fluororesin pipes are used to transport hydrogen peroxide to achieve the separate supply of concentrated sulfuric acid and hydrogen peroxide and mix them in the first cavity 1101 to form a liquid medicine to meet the production requirements.

[0080] By setting the chemical cleaning box 11 composed of the first box body 111, the second box body 112, the liquid inlet assembly 113, and the temperature control assembly, the first box body 111 and the second box body 112 are connected to form the first cavity 1101 and the second cavity 1102, and the heating element 1141 is connected to the first cavity 1101 and the second cavity 1102 to achieve the purpose of heating the liquid medicine in the first cavity 1101, meet the best temperature conditions for cleaning, and improve the stability of production quality.

[0081] The chemical cleaning tank 11 further includes a first loading member 115, a first driving assembly 116, and a cover plate assembly 117. The first loading member 115 is used to carry the external material box 100. The first driving assembly 116 drives the first loading member 115 to move up and down, which can increase the relative movement speed of the liquid medicine with respect to the wafer, and improve the cleaning speed and quality.

[0082] The first loading member 115 is disposed in the first cavity 1101. The first driving assembly 116 drives the first loading member 115 to move. Preferably, the first driving assembly 116 includes a mounting plate 1161, a shaft driving member 1162, a rotating shaft 1163, a lifting member 1164, and a rod body 1165. The mounting plate 1161 is disposed on the first box body 111. The shaft driving member 1162 is disposed on the first box body 111 and drives the rotating shaft 1163 to move up and down. The upper surface of the rotating shaft 1163 is processed with a first inclined surface 11631. The lifting member 1164 abuts against the first inclined surface 11631. The other end of the lifting member 1164 is connected to the rod body 1165. The rod body 1165 is fixedly connected to the first loading member 115. Under the drive of the shaft driving member 1162, the rotating shaft 1163 rotates, and the first inclined surface 11631 rotates synchronously, so that the lifting member 1164 drives the rod body 1165 to move up and down synchronously, and finally completes the lifting movement of the first loading member 115. Preferably, the mounting plate 1161 is provided with a long slot 11611, and the long slot 11611 is arranged longitudinally, which further ensures the stability of the rod body 1165 moving in the longitudinal direction.

[0083] The cover plate assembly 117 is disposed on the second box body 112 and is used to cover the first cavity 1101 and the second cavity 1102. The number of the cover plate assemblies 117 is two groups, and the two groups of cover plate assemblies 117 are symmetrically arranged. Each group of cover plate assemblies 117 includes a gas strut and a plate body. The gas strut drives the plate body to rotate, so as to achieve the purpose of covering the first cavity 1101 and the second cavity 1102.

[0084] The temperature control component further includes a cooling member 1142 and a temperature sensing member 1143. The cooling member 1142 is disposed in the first box body 111, and the temperature sensing member 1143 is disposed in the first box body 111. Preferably, the chemical agent cleaning box 11 further includes an inner hollow frame body 118. The hollow frame body 118 is in a cubic shape and includes an upper ring body 1181, a lower ring body 1182, and a plurality of middle vertical rods 1183. The plurality of middle vertical rods 1183 connect the upper ring body 1181 and the lower ring body 1182. The distance between adjacent two middle vertical rods 1183 is set. The hollow frame body 118 is placed in the first cavity 1101. The first loading member 115 is located inside the hollow frame body 118. The cooling member 1142 is wound around the hollow frame body 118. The middle vertical rod 1183 of the hollow frame body 118 is provided with a notch for fixing the cooling member 1142. A cooling medium is introduced into the cooling member 1142 to cool the liquid medicine in the first cavity 1101, ensuring that the working temperature of the liquid medicine is at a preset value. The temperature sensing member 1143 is used to sense the temperature of the liquid medicine in the first cavity 1101, facilitating timely adjustment of the heating member 1141 and the cooling member 1142 to meet the production requirements for the liquid medicine temperature within a preset range.

[0085] Please refer to Figures 3-1 to 3-4 , the water washing cleaning box 12 includes a third box body 121, a partition plate 122, a spraying component 123, and a valve component 124;

[0086] The third box body 121 is provided with a third cavity 1201;

[0087] The partition plate 122 is disposed in the third cavity 1201. The partition plate 122 divides the third cavity 1201 into an upper cavity and a lower cavity. The upper cavity and the lower cavity are communicated. The spraying component 123 includes a plurality of spray heads 1231, and the spray heads 1231 are located above the third box body 121;

[0088] The third box body 121 is provided with a liquid outlet 1211. The liquid outlet 1211 is located below the partition plate 122. The valve component 124 includes a driving source 1241 and a hole cover plate 1242. The driving source 1241 drives the hole cover plate 1242 to move so that the hole cover plate 1242 blocks the liquid outlet 1211 or moves away from the liquid outlet 1211.

[0089] The partition plate 122 is installed in the third box body 121. The partition plate 122 divides the third box body 121 into an upper cavity and a lower cavity. The partition plate 122 is provided with a plurality of through holes which penetrate the partition plate 122 along the thickness direction of the partition plate 122 to connect the upper cavity and the lower cavity. The spraying assembly 123 includes two groups of water pipes, and a plurality of spray heads 1231 are installed on each group of water pipes. The two groups of water pipes are symmetrically arranged. Two liquid outlets 1211 are processed at the bottom of the third box body 121. The driving source 1241 is welded to the bottom plate of the third box body 121 and drives the hole cover plate 1242 to move to achieve the purpose of blocking the liquid outlet 1211. The working principle is as follows: The external material box 100 carrying the wafer is transported by the transfer mechanism 2 to the upper part of the third box body 121 and then moves downward and gradually enters the third box body 121. When it reaches the preset height, the spraying assembly 123 starts spraying to pre-rinse the wafer. The rinsed water flows into the third box body 121. The two groups of water pipes of the spraying assembly 123 are respectively located on opposite sides of the wafer. The setting of a plurality of spray heads 1231 realizes the purpose of uniformly spraying the wafer and achieves the purpose of uniform cleaning. When the pre-rinsing is completed, the driving source 1241 drives the hole cover plate 1242 to leave the liquid outlet 1211. The waste liquid after pre-rinsing quickly flows out through the liquid outlet 1211 under the action of gravity, and the residues in the waste liquid also flow out together. Then the driving source 1241 drives the hole cover plate 1242 to block the liquid outlet 1211. The external material box 100 is driven by the transfer mechanism 2 to move downward, and the material box 100 is placed on the partition plate 122. The cleaning liquid is injected into the third box body 121 again. The cleaning liquid performs surface cleaning on the wafer. When the cleaning is completed, the driving source 1241 drives the hole cover plate 1242 to leave the liquid outlet 1211, and the cleaning liquid quickly flows out through the liquid outlet 1211, that is, the residues and the cleaning liquid in the third box body 121 quickly flow out. The process of the quick outflow of the cleaning liquid avoids the appearance of residual liquid on the surface of the wafer, achieves the cleaning purpose, and meets the production requirements.

[0090] The third box body 121 further includes a first guide plate 129. The first guide plate 129 is located in the third box body 121. The first guide plate 129 is located below the partition plate 122. The first guide plate 129 is spaced from the liquid outlet 1211. The first guide plate 129 is inclined towards the direction of the liquid outlet 1211. The number of the first guide plates 129 is two, and the two first guide plates 129 are symmetrically arranged, so that the cleaning liquid in the third box body 121 quickly flows towards the liquid outlet 1211.

[0091] The water washing cleaning box 12 also includes a fourth box body 125, and the fourth box body 125 is connected to the third box body 121 and is surrounded by a fourth cavity 1202. The fourth cavity 1202 is located outside the third box body 121. The fourth box body 125 is provided with a plurality of holes, and the plurality of holes are connected to each other. The fourth cavity 1202 is located outside the third box body 121. The fourth box body 125 is provided with a plurality of holes, and the plurality of holes are connected to each other. The fourth cavity 1202 is located outside the third box body 121. The fourth box body 125 is provided with a plurality of holes, and the plurality of holes are connected to each other. The fourth cavity 1202 is located outside the third box body 121. The fourth box body 125 is provided with a plurality of holes, and the plurality of holes are connected to each other.

[0092] The water cleaning box also includes a temperature sensing component 127, which is disposed in the third box body 121 to timely monitor the working temperature of the cleaning liquid in the third chamber 1201, further ensuring the cleaning efficiency of the wafers and meeting the processing requirements.

[0093] The water cleaning box also includes an air pipe assembly 128, which is disposed in the third cavity 1201 and extends into the third cavity 1201. Nitrogen is filled into the third cavity 1201 through the air pipe assembly 128, so that the cleaning liquid in the third cavity 1201 is in a boiling and rolling state, thereby accelerating the cleaning speed.

[0094] See also Figures 4-1 to 4-6 The transfer mechanism 2 includes a guide rail 21, a manipulator assembly 22 and a feed assembly 23. The feed assembly 23 is used to receive an external material box 100. The manipulator assembly 22 is slidably connected to the guide rail 21 and places the external material box 100 in the agent cleaning box 11 and the water washing cleaning box 12 in sequence. The material receiving and turning mechanism 3 is used to receive the external material box 100 from the manipulator assembly 22 and transfer it to the drying mechanism 4. The feed assembly 23 is located at the feed end of the transfer mechanism 2. The feed assembly 23 is used to receive the external material box 100. The feed assembly 23 includes a tray 231, a lifting cylinder 233 and Horizontal cylinder 222, horizontal cylinder 222 drives lifting cylinder 233 to move horizontally, lifting cylinder 233 drives tray 231 to move up and down, tray 231 is used to carry external material box 100, so as to achieve the purpose of transferring external material box 100 to manipulator assembly 22, avoiding direct contact between the operator and manipulator assembly 22 contaminated with chemical reagents, avoiding the occurrence of unsafe accidents, after passing through the chemical cleaning box 11 and the water washing cleaning box 12, the manipulator assembly 22 slides along the guide rail 21 to the material receiving and turning mechanism 3, the material receiving and turning mechanism 3 clamps the external material box 100 and turns it at a preset angle to send it into the drying mechanism 4.

[0095] The number of the cleaning devices 1 is multiple, the number of the manipulator assemblies 22 is multiple, the wafer cleaning machine further includes a baffle assembly 5, the baffle assembly 5 is arranged between two adjacent cleaning devices 1, and one manipulator assembly 22 moves back and forth between the adjacent water washing tanks 12, chemical agent cleaning tanks 11 and water washing tanks 12. The number of the cleaning devices 1 is multiple, and different chemical agent cleaning tanks 11 of different cleaning devices 1 are injected with different liquid medicines, and then water washing is carried out to complete the cleaning and processing of the wafers. The baffle assembly 5 is installed between two adjacent cleaning devices 1, and the baffle assembly 5 effectively intercepts the volatile gases of different chemical agent cleaning tanks 11 to improve the cleaning quality.

[0096] The baffle assembly 5 includes a base 51, a lifting plate 52 and a second diversion plate 53. The lifting plate 52 is slidably connected to the base 51, and the second diversion plate 53 is arranged at the top of the lifting plate 52 and is inclined towards the cleaning device 1. When the manipulator assembly 22 holds the material box 100 and moves back and forth between two adjacent cleaning devices 1, the lifting plate 52 makes a lifting movement relative to the base 51, so that the manipulator assembly 22 reduces energy consumption in the lifting direction and reduces the production cost.

[0097] The manipulator assembly 22 includes a material clamping assembly 221, a swing driving assembly 222 and a lifting driving source 223;

[0098] The material clamping assembly 221 includes a left swing member 2211 and a right swing member 2212. The swing driving assembly 222 opens and closes the left swing member 2211 and the right swing member 2212, and the lifting driving source 223 is used to drive the swing driving assembly 222 to lift;

[0099] Both the left swing member 2211 and the right swing member 2212 include a mounting seat 221a, a rotating member 221b, a connecting rod 221c, a movable member 221d and a reset member 221e. The mounting seat 221a is arranged at the output end of the lifting driving source 223, the rotating member 221b is rotatably connected to the mounting seat 221a, two ends of the connecting rod 221c are respectively connected to the rotating member 221b and the movable member 221d, and the swing driving assembly 222 drives the movable member 221d to lift;

[0100] Two ends of the reset member 221e are respectively connected to the rotating member 221b of the left swing member 2211 and the rotating member 221b of the right swing member 2212;

[0101] The structures of the left pendulum 2211 and the right pendulum 2212 are the same. The swing drive assembly 222 is located between the left pendulum 2211 and the right pendulum 2212. Both the left pendulum 2211 and the right pendulum 2212 include a mounting base 221a, a rotating member 221b, a connecting rod 221c, and a movable member 221d. The mounting base 221a includes side plates and a bottom plate. The number of side plates is two, and the two side plates are arranged in parallel at a certain distance. The side plates are processed with side through holes. The rotating member 221b passes through the side through holes and is rotatably connected to the side through holes. One end of the connecting rod 221c is fixedly connected to the rotating member 221b, and the other end of the connecting rod 221c is fixedly connected to the movable member 221d. The swing drive assembly 2 drives the movable member 221d to move up and down. During the up and down movement of the movable member 221d, it drives the rotating member 221b at the other end of the connecting rod 221c to swing. Finally, the swing drive assembly 2 drives the left pendulum 2211 and the right pendulum 2212 to open and close, meeting the purpose of clamping. Preferably, the rotating member 221b includes a shaft body and a shaft sleeve. The shaft sleeve is fixedly connected to the shaft body. The connecting rod 221c is fixedly connected to the shaft sleeve. The shaft body is rotatably connected to the side plates of the mounting base 221a. The shaft sleeve is in a cube shape, which is convenient for connecting with the connecting rod 221c. The clamping component 221 further includes a reset member 221e. The two ends of the reset member 221e are respectively connected to the rotating members 221b of the left pendulum 2211 and the right pendulum 2212. The reset member 221e adopts a tension spring structure to drive the left pendulum 2211 and the right pendulum 2212 to reset.

[0102] The swing drive assembly 222 includes a slider drive source 222a and a slider 222b. The slider 222b is slidably connected to the mounting base 221a. The slider 222b is provided with a first inclined surface 222c. The movable member 221d abuts against the first inclined surface 222c. During the process of the slider drive source 222a driving the slider 222b to slide, the movable member 221d contacts different height parts of the first inclined surface 222c, so as to achieve the purpose of the up and down movement of the movable member 221d and realize the swing of the rotating member 221b. Therefore, the purpose of clamping the external material box 100 is achieved during the swing process. The movable member 221d includes a runner. The movable member 221d is rotatably connected to the connecting rod 221c. The movable member 221d is set as a runner structure, so that the movable member 221d is in line contact with the first inclined surface 221c, reducing the frictional resistance.

[0103] The manipulator assembly 22 further includes an optical fiber sensing member 224. The optical fiber sensing member 224 is installed on the mounting base 221a. The light beam emitted by the optical fiber sensing member 224 is inclined, which is used to sense whether there are wafers in the external material box 100 to ensure the smooth progress of production.

[0104] The above content is only a preferred embodiment of the present utility model. For those of ordinary skill in the art, based on the idea of the present utility model, there will be changes in the specific implementation manner and application scope, and the content of this specification should not be construed as a limitation on the present utility model.

Claims

1. A wafer cleaning machine, characterized in that: It comprises a cleaning device (1), a transfer mechanism (2), a material collection and turning mechanism (3) and a drying mechanism (4); The cleaning device (1) comprises a chemical cleaning box (11) and a water cleaning box (12); The drug cleaning box (11) comprises a first box body (111), a second box body (112), a liquid inlet component (113) and a temperature control component; the first box body (111) is provided with a first cavity (1101); the second box body (112) is connected to the first box body (111) and encloses a second cavity (1102); the first box body (111) is located in the second cavity (1102); The liquid inlet assembly (113) is disposed in the first box body (111) and extends into the first cavity (1101); The temperature control component comprises a heating element (1141), the heating element (1141) is located outside the first box (111), and the heating element (1141) connects the first cavity (1101) and the second cavity (1102); The transfer mechanism (2) places the external material box (100) into the chemical cleaning box (11) and the water washing box (12) in sequence, and the material receiving and turning mechanism (3) is used to receive the external material box (100) from the transfer mechanism (2) and transfer it to the drying mechanism (4).

2. The wafer cleaning machine according to claim 1, characterized in that: The medicine cleaning box (11) further comprises a first material carrier (115), a first driving assembly (116) and a cover assembly (117); The first material carrier (115) is disposed in the first cavity (1101), and the first driving component (116) drives the first material carrier (115) to move; The cover plate assembly (117) is arranged on the second box body (112) and is used to cover the first cavity (1101) and the second cavity (1102).

3. The wafer cleaning machine according to claim 1, characterized in that: The temperature control component also includes a cooling component (1142) and a temperature sensing component (1143); the cooling component (1142) is disposed in the first box body (111); and the temperature sensing component (1143) is disposed in the first box body (111).

4. The wafer cleaning machine according to claim 1, characterized in that: The water washing and cleaning box (12) comprises a third box body (121), a partition (122), a spray assembly (123) and a valve assembly (124); The third box body (121) is provided with a third cavity (1201); The partition (122) is arranged in the third chamber (1201), and the partition (122) divides the third chamber (1201) into an upper chamber and a lower chamber, and the upper chamber and the lower chamber are connected. The spray assembly (123) includes a plurality of spray heads (1231), and the spray heads (1231) are located above the third box body (121); The third box body (121) is provided with a liquid outlet (1211), and the liquid outlet (1211) is located below the partition (122). The valve assembly (124) comprises a driving source (1241) and a hole cover plate (1242). The driving source (1241) drives the hole cover plate (1242) to move so that the hole cover plate (1242) blocks the liquid outlet (1211) or moves away from the liquid outlet (1211).

5. The wafer cleaning machine according to claim 4, characterized in that: The water washing and cleaning box (12) further comprises a fourth box body (125), wherein the fourth box body (125) is connected to the third box body (121) and is arranged to form a fourth cavity (1202), and the fourth cavity (1202) is located outside the third box body (121).

6. The wafer cleaning machine according to claim 1, characterized in that: The transfer mechanism (2) comprises a guide rail (21), a manipulator assembly (22) and a feed assembly (23); the feed assembly (23) is used to receive an external material box (100); the manipulator assembly (22) is slidably connected to the guide rail (21) and places the external material box (100) in a pharmaceutical cleaning box (11) and a water washing cleaning box (12) in sequence; the material receiving and turning mechanism (3) is used to receive the external material box (100) from the manipulator assembly (22) and transfer it to the drying mechanism (4).

7. The wafer cleaning machine according to claim 6, characterized in that: The number of the cleaning devices (1) is multiple, the number of the robot assemblies (22) is multiple, and the wafer cleaning machine also includes a baffle assembly (5), the baffle assembly (5) is arranged between two adjacent cleaning devices (1), and one robot assembly (22) moves back and forth between adjacent water washing tanks (12), chemical washing tanks (11) and water washing tanks (12).

8. The wafer cleaning machine according to claim 7, characterized in that: The baffle assembly (5) comprises a base (51), a lifting plate (52) and a second guide plate (53); the lifting plate (52) is slidably connected to the base (51); and the second guide plate (53) is arranged on the top of the lifting plate (52) and is inclined toward the cleaning device (1).

9. The wafer cleaning machine according to claim 6, characterized in that: The robot arm assembly (22) comprises a material clamping assembly (221), a swing driving assembly (222) and a lifting driving source (223); The material clamping component (221) comprises a left swinging piece (2211) and a right swinging piece (2212); the left swinging piece (2211) and the right swinging piece (2212) of the swing driving component (222) are opened and closed; and the lifting driving source (223) is used to drive the swing driving component (222) to lift and lower; The left swing member (2211) and the right swing member (2212) both comprise a mounting seat (221a), a rotating member (221b), a connecting rod (221c), a movable member (221d) and a reset member (221e); the mounting seat (221a) is arranged at the output end of the lifting drive source (223); the rotating member (221b) is rotatably connected to the mounting seat (221a); ​​two ends of the connecting rod (221c) are respectively connected to the rotating member (221b) and the movable member (221d); and the swing drive assembly (222) drives the movable member (221d) to lift and lower; The two ends of the reset member (221e) are respectively connected to the rotating member (221b) of the left swing member (2211) and the rotating member (221b) of the right swing member (2212).

10. The wafer cleaning machine according to claim 9, characterized in that: The swing drive assembly (222) comprises a slider drive source (222a) and a slider (222b), wherein the slider (222b) is slidably connected to the mounting seat (221a), the slider (222b) is provided with a first inclined surface (222c), and the movable member (221d) is in contact with the first inclined surface (222c).

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