Double-in-line IC pin rib cutting device

Abstract

The utility model relates to the technical field of integrated circuit chip production, in particular to a dual in-line IC pin trimming device which comprises a stamping device body, the stamping device body comprises an upper die mounting seat capable of moving up and down, and an inverted L-shaped supporting frame is arranged on the side edge of the stamping device body. The end, away from the stamping device body, of the inverted-L-shaped supporting frame is provided with a telescopic strip used for supporting the multiple chip bodies, the inverted-L-shaped supporting frame is provided with a positioning mechanism used for clamping the multiple chip bodies, and the end, close to the stamping device body, of the inverted-L-shaped supporting frame is provided with a pushing positioning mechanism. The upper die mounting base is provided with a lower pressing strip plate used for pressing the plurality of chip bodies downwards, a conveying belt is arranged below the inverted-L-shaped supporting frame, and the conveying belt is used for conveying foam strips combined with the plurality of chip bodies. According to the utility model, pins of a plurality of chip main bodies can be protected and supported after rib cutting, rapid and convenient packaging operation can be conveniently carried out, and the working efficiency is relatively high.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chip production, in particular to a dual in-line IC pin cutting device. Background Art

[0002] Dual in-line package is a packaging form of integrated circuit with a unique shape and pin arrangement. Dual in-line package is a packaging form that encapsulates the integrated circuit chip in a rectangular shell and arranges two rows of pins in parallel on both sides of the shell. The shape is rectangular, and the pins are led out from the two sides of the package and arranged in two parallel rows of straight lines.

[0003] After the existing dual in-line IC pin cutting device cuts the pins, they are often pushed out directly and stacked in one place. At this time, the pins lack protection and are prone to bending and damage, which seriously affects the yield rate. In addition, they need to be manually picked up and packaged individually, and the overall work efficiency is low.

[0004] Therefore, we propose a dual in-line IC pin cutting device to solve the above problems. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a dual in-line IC pin cutting device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A dual in-line IC pin cutting device comprises a punching device body, the punching device body comprises an upper die mounting seat capable of lifting and moving, an inverted L-shaped support frame is provided on the side of the punching device body, and a telescopic strip for supporting a plurality of chip bodies is provided at one end of the inverted L-shaped support frame away from the punching device body;

[0008] The inverted L-shaped support frame is provided with a positioning mechanism for clamping a plurality of chip bodies, the end of the inverted L-shaped support frame close to the punching device body is provided with a pushing positioning mechanism, the upper mold mounting seat is provided with a pressing strip plate for pressing down a plurality of chip bodies, and a conveyor belt is provided under the inverted L-shaped support frame, and the conveyor belt is used to transport foam strips combined with the plurality of chip bodies.

[0009] Preferably, the punching device body is provided with a lower mold, the telescopic strip is aligned and matched with the side of the lower mold, a first cylinder is horizontally provided on the side of the punching device body, and the telescopic end of the first cylinder is fixedly connected to one end of the telescopic strip.

[0010] Preferably, the positioning mechanism comprises second cylinders symmetrically arranged at both ends of the inverted L-shaped support frame, and the telescopic ends of the two second cylinders are arranged opposite to each other and are both fixed with rubber clamping strips.

[0011] Preferably, the pushing and positioning mechanism includes a push plate horizontally arranged at one end of the inverted L-shaped support frame close to the stamping device body. Two third cylinders are symmetrically arranged on the inverted L-shaped support frame. The telescopic ends of the two third cylinders face the stamping device body and are fixed with sliders slidably matched with the inverted L-shaped support frame. Fourth cylinders are vertically fixed on both sliders. The telescopic ends of the two fourth cylinders face downward and are both fixedly connected to the push plate.

[0012] Preferably, the two rubber clamping strips correspond to the two side edges of the telescopic strip. The thickness of the rubber clamping strip is less than that of the telescopic strip. The bottom of the push plate abuts against the upper side of the telescopic strip.

[0013] Preferably, one end of the pressing strip plate close to the upper die mounting seat is bent, and there is a gap between it and the upper die mounting seat. A slide rail is vertically fixed in the middle of the inverted L-shaped support frame. One end of the pressing strip plate is slidably connected to the slide rail.

[0014] Preferably, the conveyor belt is horizontally arranged at the bottom of the inverted L-shaped support frame. The length of the foam strip is the same as the width of the conveyor belt.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] By setting the inverted L-shaped support frame, the telescopic strip and the pressing strip plate, and setting the positioning mechanism and the pushing and positioning mechanism, the present utility model can provide protection and support for a plurality of chip bodies after the bar cutting operation, can insert the pins of the plurality of chip bodies into the foam strip to achieve the protection effect, and can convey a plurality of foam strips at the same time, which is convenient for the subsequent rapid and convenient packaging operation, and effectively improves the overall working efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings;

[0018] Figure 1 It is the first axonometric drawing of the present utility model;

[0019] Figure 2 It is the second axonometric drawing of the present utility model;

[0020] Figure 3 It is the structural schematic diagram of the inverted L-shaped support frame of the present utility model;

[0021] Figure 4 It is the structural schematic diagram of the conveyor belt of the present utility model;

[0022] Figure 5 ForFigure 4 A partial enlarged view of point A in the middle.

[0023] In the figure: 1. Punching device body; 2. Upper mold mounting seat; 3. Inverted L-shaped support frame; 4. Telescopic strip; 5. Lower pressure strip plate; 6. Conveyor belt; 7. Foam strip; 8. Lower mold; 9. First cylinder; 10. Second cylinder; 11. Rubber clamping strip; 12. Push plate; 13. Third cylinder; 14. Fourth cylinder; 15. Slide rail; 16. Chip body. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be understood that terms such as "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] Reference Figures 1-5 , a dual in-line IC pin cutting device, comprising a punching device body 1, the punching device body 1 is a punching and cutting device for pins, and can perform cutting operations on dual in-line IC pins. The punching device body 1 comprises an upper mold mounting seat 2 that can be lifted and moved, an inverted L-shaped support frame 3 is provided on the side of the punching device body 1, and a telescopic strip 4 for supporting a number of chip bodies 16 is provided at one end of the inverted L-shaped support frame 3 away from the punching device body 1, after the several chip bodies 16 are punched and cut by the punching device body 1, the several chip bodies 16 and the pins on both sides are in a U shape as a whole, and then after being pushed onto the telescopic strip 4, the several chip bodies 16 are placed on the telescopic strip 4 in an inverted U shape, that is, the pins of the several chip bodies 16 face downward;

[0027] The inverted L-shaped support frame 3 is provided with a positioning mechanism for clamping a plurality of chip bodies 16. The end of the inverted L-shaped support frame 3 close to the stamping device body 1 is provided with a pushing positioning mechanism. The upper mold mounting seat 2 is provided with a pressing strip plate 5 for pressing down a plurality of chip bodies 16. A conveyor belt 6 is provided below the inverted L-shaped support frame 3. The conveyor belt 6 is used to convey foam strips 7 combined with the plurality of chip bodies 16. The pins generated after the plurality of chip bodies 16 are cut can be inserted into the foam strips 7 to achieve a protective effect.

[0028] For the above example, those skilled in the art should be aware that when implementing the above technical solution, a material sensing device can be installed on the conveyor belt 6 to sense the foam strip 7, and achieve precise positioning and conveying operations of the foam strip 7.

[0029] For the above example, those skilled in the art should be aware that when implementing the above technical solution, the upper die mounting seat 2 is used to mount the upper die for cutting the leads.

[0030] For the above example, those skilled in the art should be aware that when implementing the above technical solution, an oil cylinder device or a piston telescopic device is installed on the top of the upper die mounting seat 2, and the oil cylinder device or the piston telescopic device is used to lift and move the upper die mounting seat 2.

[0031] For the above example, those skilled in the art should be aware that when implementing the above technical solution, the length of the telescopic strip 4 can be set in multiple specifications to adapt to different specifications of the chip body 16 and place different numbers of chip bodies 16.

[0032] For the above example, those skilled in the art should be aware that when implementing the above technical solution, a existing pushing device is arranged on the side of the stamping device body 1 in a matching manner, which can push several chip bodies 16 into the stamping device body 1 for lead cutting operation, and can push several chip bodies 16 after lead cutting onto the telescopic strip 4.

[0033] As a technical optimization solution of the present utility model, the stamping device body 1 is provided with a lower die 8, the telescopic strip 4 is aligned and matched with the side of the lower die 8, and a first cylinder 9 is horizontally arranged on the side of the stamping device body 1. The telescopic end of the first cylinder 9 is fixedly connected to one end of the telescopic strip 4. The first cylinder 9 is used to precisely control the movement of the telescopic strip 4.

[0034] For the above example, those skilled in the art should be aware that when implementing the above technical solution, the first cylinder 9 and the inverted L-shaped support frame 3 can be fixed to the existing ground.

[0035] As a technical optimization solution of the present utility model, the positioning mechanism includes second cylinders 10 symmetrically arranged at both ends of the inverted L-shaped support frame 3. The telescopic ends of the two second cylinders 10 are arranged oppositely and are both fixed with rubber clamping strips 11. The second cylinders 10 can precisely control the movement of the rubber clamping strips 11.

[0036] As a technical optimization solution of the present utility model, the pushing and positioning mechanism includes a push plate 12 horizontally arranged at one end of the inverted L-shaped support frame 3 close to the stamping device body 1. Two third cylinders 13 are symmetrically arranged on the inverted L-shaped support frame 3. The telescopic ends of the two third cylinders 13 face the stamping device body 1 and are fixed with sliders slidably matched with the inverted L-shaped support frame 3. Fourth cylinders 14 are vertically fixed on both sliders. The telescopic ends of the two fourth cylinders 14 face downward and are both fixedly connected to the push plate 12. The third cylinders 13 can ultimately accurately control the horizontal movement of the push plate 12, and the two fourth cylinders 14 can accurately control the up and down movement of the push plate 12.

[0037] As a technical optimization solution of the present utility model, two rubber clamping strips 11 correspond to both sides of the telescopic strip 4. The thickness of the rubber clamping strip 11 is less than the thickness of the telescopic strip 4. The bottom of the push plate 12 abuts against the upper side of the telescopic strip 4.

[0038] As a technical optimization solution of the present utility model, one end of the pressing strip plate 5 close to the upper die mounting seat 2 is bent, and there is a gap between it and the upper die mounting seat 2. A slide rail 15 is vertically fixed in the middle of the inverted L-shaped support frame 3. One end of the pressing strip plate 5 is slidably connected to the slide rail 15.

[0039] As a technical optimization solution of the present utility model, the conveyor belt 6 is horizontally arranged at the bottom of the inverted L-shaped support frame 3. The length of the foam strip 7 is the same as the width of the conveyor belt 6.

[0040] For the above example, those skilled in the art should know that when implementing the above technical solution, the foam strip 7 can be loaded through an existing robotic arm, that is, loaded onto the conveyor belt 6.

[0041] For the above example, those skilled in the art should know that when implementing the above technical solution, the above electrical equipment is all controlled by an existing PLC controller.

[0042] In the present utility model, the working principle of the device is as follows:

[0043] After the normal trimming operation, the device can perform protection and support settings for several chip bodies 16, and can insert the pins generated after trimming the several chip bodies 16 into the foam strip 7 to achieve the protection effect. A plurality of chip bodies 16 can be evenly arranged on one foam strip 7. After the several chip bodies 16 are inserted and fixed to the foam strip 7, fast and convenient packaging operations can be carried out, effectively improving the overall work efficiency.

[0044] The specific operation described above is as follows: After several chip bodies 16 are stamped and trimmed by the stamping device body 1, the shapes of the several chip bodies 16 are rectangular, and the pins are led out from two sides of the package body and arranged in two parallel straight lines. After being pushed onto the telescopic strip 4, the several chip bodies 16 are placed upside down in an inverted U shape on the telescopic strip 4, that is, the pins of the several chip bodies 16 are placed downward on the telescopic strip 4. Before this, first start two fourth cylinders 14 to precisely drive the push plate 12 to rise. After the several chip bodies 16 are placed on the telescopic strip 4, then start two third cylinders 13 to drive the push plate 12 to move to the end of the telescopic strip 4. Then control the push plate 12 to descend, and the push plate 12 abuts against the upper side of the telescopic strip 4. Start two third cylinders 13 to drive the push plate 12 to pull back, and several chip bodies 16 can be pushed towards the slide rail 15 and abut against the slide rail 15. Then reset the push plate 12, start two second cylinders 10, and the two second cylinders 10 precisely drive the corresponding rubber clamping strips 11 to move closer, so as to clamp several chip bodies 16 in between. At this time, the first cylinder 9 is started to drive the telescopic strip 4 to contract and move away from below the several chip bodies 16. After the conveyor belt 6 precisely conveys the foam strip 7 to move to directly below the several chip bodies 16, control the two rubber clamping strips 11 to separate, and then the pressing strip plate 5 presses down, and the pins of the several chip bodies 16 can be inserted into the foam strip 7. Then the conveyor belt 6 can precisely convey the foam strip 7.

[0045] In the above operations, all are controlled by the PLC controller, which can be completed in a short time. Moreover, the pressing down of the pressing strip plate 5 acts as the upper die mounting seat 2 descends, and the descent of the upper die mounting seat 2 can realize the stamping and trimming operation of the chip body 16. Therefore, during production, the trimming operation can be carried out while the insertion operation of several chip bodies 16 and the foam strip 7 is realized.

[0046] As mentioned above, the above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent replacements or changes, and all should be covered by the protection scope of the present invention.

Claims

1. A dual in-line IC pin cutting device, comprising a punching device body (1), wherein the punching device body (1) comprises an upper die mounting seat (2) capable of being raised and lowered, and characterized in that: An inverted L-shaped support frame (3) is provided on the side of the punching device body (1), and a telescopic strip (4) for supporting a plurality of chip bodies (16) is provided on one end of the inverted L-shaped support frame (3) away from the punching device body (1); The inverted L-shaped support frame (3) is provided with a positioning mechanism for clamping a plurality of chip bodies (16); one end of the inverted L-shaped support frame (3) close to the punching device body (1) is provided with a pushing positioning mechanism; the upper mold mounting seat (2) is provided with a pressing strip plate (5) for pressing down a plurality of chip bodies (16); a conveyor belt (6) is provided below the inverted L-shaped support frame (3); and the conveyor belt (6) is used to convey a foam strip (7) combined with the plurality of chip bodies (16).

2. The dual in-line IC pin cutting device according to claim 1, characterized in that: The punching device body (1) is provided with a lower mold (8), the telescopic strip (4) is aligned and matched with the side of the lower mold (8), and a first cylinder (9) is horizontally provided on the side of the punching device body (1), and the telescopic end of the first cylinder (9) is fixedly connected to one end of the telescopic strip (4).

3. The dual in-line IC pin cutting device according to claim 1, characterized in that: The positioning mechanism comprises second cylinders (10) symmetrically arranged at both ends of the inverted L-shaped support frame (3); the telescopic ends of the two second cylinders (10) are arranged opposite to each other and are both fixed with rubber clamping strips (11).

4. The dual in-line IC pin cutting device according to claim 3, characterized in that: The pushing and positioning mechanism comprises a push plate (12) which is laterally arranged on an end of an inverted L-shaped support frame (3) close to a punching device body (1); two third cylinders (13) are symmetrically arranged on the inverted L-shaped support frame (3); the telescopic ends of the two third cylinders (13) face the punching device body (1) and are fixed with sliders which are slidably matched with the inverted L-shaped support frame (3); fourth cylinders (14) are vertically fixed on the two sliders; the telescopic ends of the two fourth cylinders (14) face downward and are fixedly connected to the push plate (12).

5. The dual in-line IC pin cutting device according to claim 4, characterized in that: The two rubber clamping strips (11) correspond to the two side edges of the telescopic strip (4), the thickness of the rubber clamping strip (11) is smaller than the thickness of the telescopic strip (4), and the bottom of the push plate (12) abuts against the upper side of the telescopic strip (4).

6. The dual in-line IC pin cutting device according to claim 1, characterized in that: One end of the lower pressing strip plate (5) close to the upper mold mounting seat (2) is bent and a gap is provided between the lower pressing strip plate (5) and the upper mold mounting seat (2). A slide rail (15) is vertically fixed in the middle of the inverted L-shaped support frame (3), and one end of the lower pressing strip plate (5) is slidably connected to the slide rail (15).

7. The dual in-line IC pin cutting device according to claim 1, characterized in that: The conveyor belt (6) is transversely arranged at the bottom of the inverted L-shaped support frame (3), and the length of the foam strip (7) is the same as the width of the conveyor belt (6).

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