Welding jig for IGBT (Insulated Gate Bipolar Translator)-34 mm inverted contact pin

Abstract

The utility model relates to the technical field of processing of IGBT-34 modules, in particular to an IGBT-34 mm flip-chip pin welding jig which comprises a copper bottom plate sintering base, a copper bottom plate is arranged on the inner bottom face of the copper bottom plate sintering base, two DBCs are fixedly arranged on the upper surface of the copper bottom plate, two first electrode plates and a second electrode plate are arranged between the upper surfaces of the two DBCs, and the two first electrode plates and the second electrode plate are arranged on the upper surface of the copper bottom plate sintering base. And a DBC positioning frame is arranged in the copper bottom plate sintering base. During machining, all parts are single, the parts are assembled in an auxiliary mode through an inverted tool jig to be sintered into an integral finished product in a vacuum furnace, meanwhile, the electrode plates and the signal terminals are inverted through the mechanism, the electrode plates and the signal terminals do not fall out in the positive and negative vertical state and are inserted in an inverted mode to be freely clamped, the parts have good stability, the phenomenon that the parts deviate is reduced, and the production efficiency is improved. And the subsequent processing quality can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT-34 module processing, and particularly relates to an IGBT-34mm flip-chip pin welding jig. Background Art

[0002] A welding jig is a fixture or tooling specifically designed for the welding process, used to ensure the positioning accuracy during welding, improve welding efficiency and quality. For the welding of precision electronic components such as IGBTs, the design of the jig is particularly important because it needs to meet requirements such as high precision, high stability, and easy operation. An IGBT flip-chip pin welding jig is a tool specifically used for positioning and fixing pins during the flip-chip welding process of IGBT modules. Selecting a suitable welding jig is of great significance for ensuring product quality and reducing costs.

[0003] After retrieval, the patent document with the publication number CN216298415U discloses an IGBT-34 module welding tooling, including a tooling bottom plate. The upper end of the tooling bottom plate is movably connected with a fixed mounting plate for positioning the substrate. The upper end of the fixed mounting plate is movably connected with a pressing plate. The inside of the fixed mounting plate is in threaded cooperation with an adjusting screw. A through hole for the adjusting screw to pass through is opened inside the pressing plate. This utility model can achieve the effects of stable welding, high adaptability, and convenient adjustment and fixation.

[0004] The above-mentioned existing technologies often have the following problems when in use:

[0005] When the existing technologies are in use, the overall structure is mostly fixed, which is not convenient for adjustment. At the same time, after welding is completed, the overall components are prone to offset, which will affect the welding quality. Also, during the welding process, it is not convenient to stably fix the components according to the actual situation, which will also affect the subsequent welding quality. Content of the Utility Model

[0006] In view of the above-mentioned drawbacks of the existing technologies, the utility model provides an IGBT-34mm flip-chip pin welding jig, which can effectively solve the problems that the overall structure of the existing technologies is not convenient for fixing components and the components are prone to offset during welding.

[0007] To achieve the above purposes, the utility model is realized through the following technical solutions:

[0008] The utility model provides an IGBT-34mm flip-chip pin welding jig, including a copper bottom plate sintered base;

[0009] The inner bottom surface of the copper base plate sintering base is provided with a copper base plate. Two DBCs are fixedly arranged on the upper surface of the copper base plate. Between the upper surfaces of the two DBCs, there are two first electrode plates and a second electrode plate. A DBC positioning frame is arranged inside the copper base plate sintering base. The two first electrode plates and the second electrode plate are all located inside the DBC positioning frame. The upper surface of the copper base plate sintering base is provided with two mounting grooves. Between the two mounting grooves, there is a flip-chip fixture cover cavity. The upper surface of the flip-chip fixture cover cavity is provided with a first groove and a second groove. A flip-chip clamp high-temperature layer is arranged in the first groove. A flip-chip titanium alloy plate is arranged in the second groove. Two signal terminals are arranged on the upper surface of each of the two DBCs. Four signal terminals are arranged on the upper surface of the flip-chip titanium alloy plate.

[0010] According to the above-mentioned IGBT-34mm flip-chip pin welding fixture, the upper surfaces of the two mounting grooves are both provided with first mounting holes. The two sides of the upper surface of the flip-chip fixture cover cavity are both provided with second mounting holes. The two first mounting holes are respectively matched with the two second mounting holes.

[0011] According to the above-mentioned IGBT-34mm flip-chip pin welding fixture, the flip-chip clamp high-temperature layer is located between the flip-chip titanium alloy plate and the flip-chip fixture cover cavity.

[0012] According to the above-mentioned IGBT-34mm flip-chip pin welding fixture, a positioning rod is fixedly connected between the inner walls of the DBC positioning frame. Positioning holes are arranged on the side walls of the two first electrode plates and the second electrode plate. The positioning rod penetrates through the positioning hole of the second electrode plate.

[0013] According to the above-mentioned IGBT-34mm flip-chip pin welding fixture, the four signal terminals on the upper surface of the flip-chip titanium alloy plate respectively correspond to the four signal terminals on the upper surfaces of the two DBCs.

[0014] According to the above-mentioned IGBT-34mm flip-chip pin welding fixture, three through grooves are arranged on the upper surfaces of the flip-chip fixture cover cavity, the flip-chip clamp high-temperature layer and the flip-chip titanium alloy plate. The second electrode plate and the two first electrode plates respectively correspond to the three through grooves.

[0015] The technical solution provided by the present utility model has the following beneficial effects compared with the known prior art:

[0016] When the present utility model is processed, the components are all individual. They are assembled by a flip-chip tooling fixture and sintered into an integral finished product in a vacuum furnace. At the same time, the mechanism flips the electrode plates and signal terminals, and they do not fall out in the positive and negative vertical states. They are freely clamped when flipped and inserted. The components themselves have good stability, reducing the phenomenon of component offset, and can effectively improve the subsequent processing quality. Description of the Drawings

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 is an exploded view of the present invention;

[0019] Figure 2 is an exploded view of the present invention from another perspective;

[0020] Figure 3 is a schematic three-dimensional structure diagram of the present invention;

[0021] Figure 4 is a schematic three-dimensional structure diagram of the present invention from another perspective.

[0022] Reference numerals: 1. Copper bottom plate sintering base; 2. Copper bottom plate; 3. DBC; 4. First electrode plate; 5. Second electrode plate; 6. DBC positioning frame; 7. Installation groove; 8. Cavity of the flip-chip fixture cover plate; 9. First groove; 10. Second groove; 11. High-temperature layer of the flip-chip clamp; 12. Flip-chip titanium alloy plate; 13. Signal terminal; 14. First installation hole; 15. Second installation hole; 16. Positioning hole; 17. Through groove. Specific embodiments

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0024] The following further describes the present invention with reference to the embodiments.

[0025] Embodiment: Refer to Figures 1 to 4, IGBT - 34mm flip - chip pin - in - hole soldering fixture, including a copper bottom plate sintered base 1. There is a copper bottom plate 2 on the inner bottom surface of the copper bottom plate sintered base 1. Two DBCs 3 are fixedly arranged on the upper surface of the copper bottom plate 2. Between the upper surfaces of the two DBCs 3, there are two first electrode plates 4 and a second electrode plate 5. A DBC positioning frame 6 is arranged inside the copper bottom plate sintered base 1. The two first electrode plates 4 and the second electrode plate 5 are all located inside the DBC positioning frame 6. There are two mounting grooves 7 on the upper surface of the copper bottom plate sintered base 1. There is a flip - chip fixture cover cavity 8 between the two mounting grooves 7. There is a first groove 9 and a second groove 10 on the upper surface of the flip - chip fixture cover cavity 8. There is a flip - chip clamp high - temperature layer 11 in the first groove 9, and a flip - chip titanium alloy plate 12 in the second groove 10. Two signal terminals 13 are arranged on the upper surface of each of the two DBCs 3. Four signal terminals 13 are arranged on the upper surface of the flip - chip titanium alloy plate 12;

[0026] There are first mounting holes 14 on the upper surfaces of the two mounting grooves 7. There are second mounting holes 15 on both sides of the upper surface of the flip - chip fixture cover cavity 8. The two first mounting holes 14 are respectively matched with the two second mounting holes 15. The flip - chip clamp high - temperature layer 11 is located between the flip - chip titanium alloy plate 12 and the flip - chip fixture cover cavity 8. A positioning rod is fixedly connected between the inner walls of the DBC positioning frame 6. Positioning holes 16 are arranged on the side walls of the two first electrode plates 4 and the second electrode plate 5. The positioning rod passes through the positioning hole 16 of the second electrode plate 5. The four signal terminals 13 on the upper surface of the flip - chip titanium alloy plate 12 respectively correspond to the four signal terminals 13 on the upper surfaces of the two DBCs 3. There are three through - slots 17 on the upper surfaces of the flip - chip fixture cover cavity 8, the flip - chip clamp high - temperature layer 11 and the flip - chip titanium alloy plate 12. The second electrode plate 5 and the two first electrode plates 4 respectively correspond to the three through - slots 17.

[0027] The working principle of the present utility model is as follows: When in use, since the second electrode plate 5, the two first electrode plates 4 and the four signal terminals of this fixture are for the flip - chip mechanism, they will not fall out in the positive and negative vertical states during use. And with the cooperation of the multiple through - slots 17, the second electrode plate 5 and the two first electrode plates 4 are flip - chip inserted and freely clamped. The flip - chip titanium alloy plate 12 realizes the stability of the whole fixture through the cooperation of the two second mounting holes 15 and the two first mounting holes 14 of the copper bottom plate sintered base 1. While ensuring the integrity of the fixture itself, it can also ensure the stability of each component. Since the components are all individual, with the assistance of the flip - chip tooling fixture for assembly, they are sintered into an integral finished product in a vacuum furnace, which can effectively improve the welding quality and the quality of the finished product.

[0028] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. IGBT- 34mm flip-chip pin welding fixture, characterized by: include: Copper base plate sintered base (1); The inner bottom surface of the copper bottom plate sintering base (1) is provided with a copper bottom plate (2), the upper surface of the copper bottom plate (2) is fixedly provided with two DBCs (3), two No. 1 electrode sheets (4) and one No. 2 electrode sheet (5) are provided between the upper surfaces of the two DBCs (3), a DBC positioning frame (6) is provided inside the copper bottom plate sintering base (1), the two No. 1 electrode sheets (4) and one No. 2 electrode sheet (5) are both located in the DBC positioning frame (6), and the upper surface of the copper bottom plate sintering base (1) is provided with two A mounting groove (7), a flip-chip jig cover plate cavity (8) is provided between the two mounting grooves (7), a first groove (9) and a second groove (10) are provided on the upper surface of the flip-chip jig cover plate cavity (8), a flip-chip clamping high-temperature layer (11) is provided in the first groove (9), a flip-chip titanium alloy plate (12) is provided in the second groove (10), two signal terminals (13) are provided on the upper surfaces of the two DBCs (3), and four signal terminals (13) are provided on the upper surface of the flip-chip titanium alloy plate (12).

2. The IGBT-34mm flip-chip pin welding fixture according to claim 1, characterized in that: The upper surfaces of the two mounting grooves (7) are each provided with a No. 1 mounting hole (14), and the two sides of the upper surface of the flip-chip fixture cover cavity (8) are each provided with a No. 2 mounting hole (15), and the two No. 1 mounting holes (14) respectively cooperate with the two No. 2 mounting holes (15).

3. The IGBT-34mm flip-chip pin welding fixture according to claim 1, characterized in that: The flip-chip high-temperature layer (11) is located between the flip-chip titanium alloy plate (12) and the flip-chip fixture cover plate cavity (8).

4. The IGBT-34mm flip-chip pin welding fixture according to claim 1, characterized in that: A positioning rod is fixedly connected between the inner walls of the DBC positioning frame (6), and the side walls of the two No. 1 electrode sheets (4) and the No. 2 electrode sheet (5) are each provided with a positioning hole (16), and the positioning rod passes through the positioning hole (16) of the No. 2 electrode sheet (5).

5. The IGBT-34mm flip-chip pin welding fixture according to claim 1, characterized in that: The four signal terminals (13) on the upper surface of the flip-chip titanium alloy plate (12) respectively correspond to the four signal terminals (13) on the upper surfaces of the two DBCs (3).

6. The IGBT-34mm flip-chip pin welding fixture according to claim 1, characterized in that: The upper surfaces of the flip-chip jig cover cavity (8), the flip-chip clamp high-temperature layer (11) and the flip-chip titanium alloy plate (12) are all provided with three through grooves (17), and the No. 2 electrode sheet (5) and the two No. 1 electrode sheets (4) correspond to the three through grooves (17), respectively.

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