Vacuum evaporation equipment for semiconductor film production

Abstract

The utility model relates to vacuum evaporation equipment for semiconductor film production, which is applied to the field of semiconductor film production and comprises a vacuum box, the front end of the vacuum box is rotatably connected with a sealing door, the upper end of the vacuum box is fixedly connected with a motor, and the output end of the motor movably penetrates into the vacuum box and is fixedly connected with a mounting block. A mounting rod is arranged in the mounting block, the lower end of the mounting rod is fixedly connected with an umbrella-shaped jig, a screw rod is arranged on the right side of the mounting block, and the left end of the screw rod sequentially penetrates through the mounting block and the mounting rod in a threaded mode. The evaporation materials can be effectively prevented from being condensed into solids at the outlet, gas flow monitoring is conducted through the gas flow detector nozzle, the pressure sensor can monitor the capacity of the evaporation materials in the crucible, and the capacity of the evaporation materials in the crucible and the blockage condition of the nozzle can be conveniently monitored through matched use of the gas flow detector nozzle and the pressure sensor.

Description

Technical Field

[0001] The utility model relates to a vacuum evaporation coating device, in particular to a vacuum evaporation coating device for semiconductor thin film production applied to the field of semiconductor thin film production. Background Art

[0002] Vacuum evaporation coating refers to a method in which, under vacuum conditions, a coating material (or film material) is evaporated by a certain heating and evaporation method and vaporized, and the particles fly to the surface of the substrate and condense into a film. The vacuum evaporation coating of semiconductors is generally completed in a vacuum evaporation coater.

[0003] Generally, a vacuum evaporation coating device heats by setting resistance wires or heating rods around the crucible. Therefore, a temperature difference may occur between the lower part and the upper outlet of the crucible, resulting in the vaporized evaporation coating material being easily condensed into a solid at the outlet, making the outlet of the nozzle smaller, the amount of evaporated coating material ejected less, and thus affecting the thickness uniformity of the semiconductor thin film. After long-term use of the nozzle, the evaporation coating material accumulated at the outlet continues to accumulate, which is also likely to cause blockage of the nozzle. Summary of the Utility Model

[0004] Aiming at the above-mentioned prior art, the technical problem to be solved by the utility model is that when heating the crucible, a temperature difference may occur between the lower part and the upper outlet of the crucible, resulting in the vaporized evaporation coating material being easily condensed into a solid at the outlet, which not only affects the thickness uniformity of the semiconductor thin film but also easily causes blockage of the nozzle.

[0005] To solve the above problems, the utility model provides a vacuum evaporation coating device for semiconductor thin film production, including a vacuum chamber. A sealing door is rotatably connected to the front end of the vacuum chamber. A motor is fixedly connected to the upper end of the vacuum chamber. The output end of the motor movably penetrates into the vacuum chamber and is fixedly connected to a mounting block. An installation rod is arranged in the mounting block. The lower end of the installation rod is fixedly connected to an umbrella-shaped fixture. A screw rod is arranged on the right side of the mounting block. The left end of the screw rod sequentially threadedly penetrates through the mounting block and the installation rod. The inner bottom wall of the vacuum chamber is fixedly connected with a containing box. A support ring is fixedly connected to the inner bottom wall of the containing box. A pressure sensor is fixedly embedded in the middle of the upper end of the support ring. A crucible is fixedly connected to the upper end of the support ring. A heating coil is fixedly sleeved on the outer surface of the crucible. A heat insulation plate is fixedly sleeved on the outer surface of the heating coil. A heat preservation cover is inserted into the upper end of the crucible. A heating plate and a plurality of heating rods are fixedly connected to the inner bottom wall of the heat preservation cover. A nozzle fixedly penetrates through the upper end of the heat preservation cover. A gas flow detector is fixedly installed on the outer surface of the nozzle. A feed pipe is arranged on the right side of the vacuum chamber. The left end of the feed pipe sequentially fixedly penetrates through the vacuum chamber, the containing box, the heat insulation plate and the crucible and extends into the crucible.

[0006] In the above-mentioned vacuum evaporation equipment for semiconductor thin film production, by setting multiple groups of heating components to heat the upper and lower parts of the crucible, not only the heating efficiency is improved, but also the evaporation material can be effectively prevented from condensing into a solid at the outlet. The gas flow is monitored through the nozzle of the gas flow detector, and the pressure sensor can monitor the capacity of the evaporation material in the crucible. The combination of the two is convenient for monitoring the capacity of the evaporation material inside the crucible and the nozzle blockage situation.

[0007] As a further improvement of the present application, two pressing plates are provided at the upper end of the heating plate. The lower ends of the pressing plates are fixedly connected to the inner bottom wall of the heat preservation cover, and the longitudinal section of the pressing plate is U-shaped.

[0008] As a further improvement of the present application, multiple heating rods are distributed in a circular array around the central axis of the nozzle. The motor, pressure sensor, heating coil, heating plate, heating rods and gas flow detector are all signal-connected to an external controller.

[0009] As a further improvement of the present application, a plurality of limiting rods are fixedly connected to the lower end of the heat preservation cover. A plurality of limiting grooves corresponding to the plurality of limiting rods are respectively formed in the upper end of the crucible, and the lower ends of the limiting rods penetrate into the limiting grooves.

[0010] As another improvement of the present application, the limiting rod includes a round rod and a round head fixed to the lower end of the round rod. The cross-sectional diameter of the round head is larger than the diameter of the round rod. The limiting groove includes a circular hole and an arc hole communicating with the circular hole. The diameter of the circular hole is the same as the diameter of the round head, and the inner diameter of the arc hole is the same as the diameter of the round rod, and the lower end of the limiting rod extends into the accommodating box.

[0011] As another improvement of the present application, a baffle is rotatably connected to one end of the feed pipe close to the crucible. A tension spring and an inclined plate are also fixedly connected to the inner wall of the feed pipe. The inclined plate is located outside the tension spring, and the left end of the inclined plate is in contact with the baffle, and the other end of the tension spring is fixedly connected to the baffle.

[0012] To sum up, in the actual application process, the upper and lower parts of the crucible are heated by the heating coil and the heating plate, and the heating rods can heat the nozzle, so as to effectively reduce the temperature difference between the upper and lower parts of the crucible. The gas flow at the nozzle outlet can be monitored by the gas flow detector. At the same time, the pressure sensor can monitor the capacity of the evaporation material in the crucible. If the gas flow at the nozzle decreases and the pressure sensor shows that the capacity of the evaporation material in the crucible is small, feeding can be carried out through the feed pipe. If the gas flow at the nozzle decreases while the pressure sensor shows that the capacity of the evaporation material in the crucible is large, it means that there may be a phenomenon of gas condensation at the nozzle, and the staff can adjust the heating temperature to effectively avoid the situation of uneven evaporation. Description of the Drawings

[0013] Figure 1Schematic three-dimensional structure diagram of the first embodiment of the present application;

[0014] Figure 2 Cross-sectional structure view of the first embodiment of the present application;

[0015] Figure 3 Schematic structure diagram of the umbrella-shaped fixture of the first embodiment of the present application;

[0016] Figure 4 Schematic structure diagram of the accommodation box of the first embodiment of the present application;

[0017] Figure 5 Schematic structure diagram of the crucible of the first embodiment of the present application;

[0018] Figure 6 Exploded view of the heat preservation cover structure of the first embodiment of the present application;

[0019] Figure 7 Schematic structure diagram of the feed pipe of the second embodiment of the present application.

[0020] Explanation of the reference numerals in the figure:

[0021] 1 Vacuum box, 2 Sealing door, 3 Motor, 4 Mounting block, 5 Mounting rod, 6 Umbrella-shaped fixture, 7 Accommodation box, 8 Support ring, 9 Pressure sensor, 10 Crucible, 11 Heating coil, 12 Heat insulation board, 13 Heat preservation cover, 14 Heating plate, 15 Heating rod, 16 Nozzle, 17 Inclined plate, 18 Gas flow detector, 19 Feed pipe, 20 Limiting rod, 21 Limiting groove, 22 Baffle plate, 23 Tensile spring. Detailed implementation manners

[0022] The following will make a detailed description of the two embodiments of the present application with reference to the accompanying drawings.

[0023] The first embodiment:

[0024] Figure 1 , Figure 2 and Figure 3Shown: A vacuum evaporation device for semiconductor thin film production, including a vacuum chamber 1. A sealing door 2 is rotatably connected to the front end of the vacuum chamber 1. A motor 3 is fixedly connected to the upper end of the vacuum chamber 1. Those skilled in the art can select a suitable model of the motor 3 according to actual needs. For example: Y2-63M1-2-0.18KW. The output end of the motor 3 movably penetrates into the vacuum chamber 1 and is fixedly connected to a mounting block 4. An installation rod 5 is provided in the mounting block 4. The lower end of the installation rod 5 is fixedly connected to an umbrella-shaped fixture 6. The umbrella-shaped fixture 6 fixes the workpiece to be coated. The motor 3 can drive the umbrella-shaped fixture 6 to rotate, improving the uniformity of film formation. A screw rod is provided on the right side of the mounting block 4. The left end of the screw rod sequentially threadedly penetrates the mounting block 4 and the installation rod 5. The screw rod can fix the mounting block 4 and the installation rod 5, thereby improving the stability of the umbrella-shaped fixture 6. The motor 3, the pressure sensor 9, the heating coil 11, the heating plate 14, the heating rod 15, and the gas flow detector 18 are all signal-connected to an external controller. A feed pipe 19 is provided on the right side of the vacuum chamber 1. The left end of the feed pipe 19 sequentially fixedly penetrates the vacuum chamber 1, the accommodation box 7, the heat insulation plate 12, and the crucible 10 and extends into the crucible 10. The outer end of the feed pipe 19 is connected to a feeding assembly. This is prior art and will not be elaborated here.

[0025] Figure 4 and Figure 5 Shown: The inner bottom wall of the vacuum chamber 1 is fixedly connected to an accommodation box 7. The inner bottom wall of the accommodation box 7 is fixedly connected to a support ring 8. A pressure sensor 9 is fixedly embedded in the middle of the upper end of the support ring 8. Those skilled in the art can select a suitable model of the pressure sensor 9 according to actual needs. For example: SQB. The pressure sensor 9 can monitor the capacity of the evaporation material inside the crucible 10 in real time, facilitating timely addition, and can cooperate with the gas flow detector 18 to judge whether the nozzle 16 is blocked. The upper end of the support ring 8 is fixedly connected to a crucible 10. A heating coil 11 is fixedly sleeved on the outer surface of the crucible 10. Those skilled in the art can select a suitable model of the heating coil 11 according to actual needs. For example: jq-4344. The heating coil 11 can heat the outer surface of the crucible 10. A heat insulation plate 12 is fixedly sleeved on the outer surface of the heating coil 11. A heat preservation cover 13 is inserted into the upper end of the crucible 10. A heating plate 14 and a plurality of heating rods 15 are fixedly connected to the inner bottom wall of the heat preservation cover 13. Those skilled in the art can select a suitable model of the heating plate 14 according to actual needs. For example: YR20201. Those skilled in the art can select a suitable model of the heating rod 15 according to actual needs. For example: Q10X80. The heating plate 14 can heat the upper end of the crucible 10. The heating rod 15 can heat the nozzle 16. A nozzle 16 is fixedly penetrated through the upper end of the heat preservation cover 13. A gas flow detector 18 is fixedly installed on the outer surface of the nozzle 16. Those skilled in the art can select a suitable model of the gas flow detector 18 according to actual needs. For example: XG-RSL. The gas flow detector 18 can monitor the gas flow of the nozzle 16 in real time.

[0026] Figure 6 It is shown that: Two pressing plates are provided at the upper end of the heating plate 14. The lower end of the pressing plate is fixedly connected to the inner bottom wall of the heat preservation cover 13. The longitudinal section of the pressing plate is U-shaped. The pressing plate can limit and fix the heating plate 14. A plurality of heating rods 15 are distributed in an annular array around the central axis of the nozzle 16. A plurality of limiting rods 20 are fixedly connected to the lower end of the heat preservation cover 13. A plurality of limiting grooves 21 corresponding to the plurality of limiting rods 20 are formed in the upper end of the crucible 10. The lower end of the limiting rod 20 penetrates into the limiting groove 21. The limiting rod 20 includes a round rod and a round head fixed to the lower end of the round rod. The cross-sectional diameter of the round head is larger than the diameter of the round rod. The limiting groove 21 includes a circular hole and an arc-shaped hole communicating with the circular hole. The diameter of the circular hole is the same as the diameter of the round head. The inner diameter of the arc-shaped hole is the same as the diameter of the round rod. And the lower end of the limiting rod 20 extends into the accommodating box 7. When the heat preservation cover 13 needs to be removed, the heat preservation cover 13 can be rotated so that the round rod is located in the circular hole, and then the heat preservation cover 13 can be taken out. When installing, the round head can be located below the arc-shaped hole, so as to limit the heat preservation cover 13 and improve the stability of the heat preservation cover 13.

[0027] During use, the upper and lower parts of the crucible 10 are heated by the heating coil 11 and the heating plate 14. The heating rod 15 can heat the nozzle 16, so as to effectively reduce the temperature difference between the upper and lower parts of the crucible 10. The gas flow rate detector 18 can monitor the gas flow rate at the outlet of the nozzle 16. At the same time, the pressure sensor 9 can monitor the capacity of the evaporation material in the crucible 10. If the gas flow rate at the nozzle 16 decreases and the pressure sensor 9 shows that the capacity of the evaporation material in the crucible 10 is small, feeding can be carried out through the feed pipe 19. If the gas flow rate at the nozzle 16 decreases while the pressure sensor 9 shows that the capacity of the evaporation material in the crucible 10 is large, it means that gas condensation may occur at the nozzle 16. The staff can adjust the heating temperature to effectively avoid the situation of uneven evaporation coating.

[0028] The second embodiment:

[0029] On the basis of the first embodiment, this embodiment adds an inclined plate 17, a baffle 22 and a tension spring 23, and the rest is the same as the first embodiment.

[0030] Figure 7 It is shown that: One end of the feed pipe 19 close to the crucible 10 is rotatably connected to a baffle 22. The inner wall of the feed pipe 19 is also fixedly connected with a tension spring 23 and an inclined plate 17. The inclined plate 17 is located outside the tension spring 23, and the left end of the inclined plate 17 is in contact with the baffle 22. The other end of the tension spring 23 is fixedly connected to the baffle 22.

[0031] When adding the evaporation material into the interior of the crucible 10 through the feed pipe 19, the evaporation material contacts the baffle 22, causing an impact force on the baffle 22, thereby rotating the baffle 22 and stretching the tension spring 23, so that the nozzle of the feed pipe 19 is exposed, and the evaporation material enters the interior of the crucible 10. After stopping the conveyance of the evaporation material, the tension spring 23 resets, causing the baffle 22 to reset, thus effectively preventing gas from entering the feed pipe 19 and extending the service life of the feed pipe 19.

[0032] Combined with the current actual requirements, the above-mentioned implementation manner adopted in this application, the scope of protection is not limited thereto. Within the scope of knowledge possessed by those skilled in the art, various changes made without departing from the concept of this application still fall within the scope of protection of this utility model.

Claims

1. A vacuum evaporation device for producing semiconductor thin films, comprising a vacuum box (1), characterized in that: The front end of the vacuum box (1) is rotatably connected to a sealing door (2); the upper end of the vacuum box (1) is fixedly connected to a motor (3); the output end of the motor (3) movably penetrates into the vacuum box (1) and is fixedly connected to a mounting block (4); a mounting rod (5) is provided in the mounting block (4); the lower end of the mounting rod (5) is fixedly connected to an umbrella-shaped fixture (6); a screw rod is provided on the right side of the mounting block (4); the left end of the screw rod is threadedly penetrated through the mounting block (4) and the mounting rod (5) in sequence; The inner bottom wall of the vacuum box (1) is fixedly connected to a containing box (7), the inner bottom wall of the containing box (7) is fixedly connected to a supporting ring (8), a pressure sensor (9) is fixedly embedded in the middle of the upper end of the supporting ring (8), the upper end of the supporting ring (8) is fixedly connected to a crucible (10), the outer surface of the crucible (10) is fixedly sleeved with a heating ring (11), the outer surface of the heating ring (11) is fixedly sleeved with a heat insulation plate (12), and the upper end of the crucible (10) is inserted with a heat insulation cover (13). The inner bottom wall of the heat-insulating cover (13) is fixedly connected to a heating plate (14) and a plurality of heating rods (15); a nozzle (16) is fixedly penetrated through the upper end of the heat-insulating cover (13); a gas flow detector (18) is fixedly mounted on the outer surface of the nozzle (16); a feed pipe (19) is provided on the right side of the vacuum box (1); a left end of the feed pipe (19) is fixedly penetrated through the vacuum box (1), the containing box (7), the heat-insulating plate (12) and the crucible (10) in sequence and extends into the crucible (10).

2. The vacuum evaporation equipment for semiconductor thin film production according to claim 1, characterized in that: Two pressing plates are provided at the upper end of the heating plate (14), the lower ends of the pressing plates are fixedly connected to the inner bottom wall of the heat-insulating cover (13), and the longitudinal section of the pressing plates is U-shaped.

3. The vacuum evaporation equipment for semiconductor thin film production according to claim 2, characterized in that: The plurality of heating rods (15) are distributed in a ring array around the central axis of the nozzle (16), and the motor (3), the pressure sensor (9), the heating coil (11), the heating plate (14), the heating rods (15) and the gas flow detector (18) are all connected to an external controller signal.

4. The vacuum evaporation equipment for semiconductor thin film production according to claim 1, characterized in that: A plurality of limiting rods (20) are fixedly connected to the lower end of the heat-insulating cover (13), a plurality of limiting grooves (21) corresponding to the plurality of limiting rods (20) are formed at the upper end of the crucible (10), and the lower ends of the limiting rods (20) penetrate into the limiting grooves (21).

5. The vacuum evaporation equipment for semiconductor thin film production according to claim 4, characterized in that: The limiting rod (20) comprises a round rod and a round head fixed at the lower end of the round rod, the cross-sectional diameter of the round head is larger than the diameter of the round rod, the limiting groove (21) comprises a circular hole and an arc-shaped hole connected to the circular hole, the diameter of the circular hole is consistent with the diameter of the round head, the inner diameter of the arc-shaped hole is consistent with the diameter of the round rod, and the lower end of the limiting rod (20) extends into the accommodating box (7).

6. The vacuum evaporation equipment for semiconductor thin film production according to claim 1, characterized in that: One end of the feed tube (19) close to the crucible (10) is rotatably connected to a baffle (22); the inner wall of the feed tube (19) is also fixedly connected to a tension spring (23) and an inclined plate (17); the inclined plate (17) is located outside the tension spring (23), and the left end of the inclined plate (17) is in contact with the baffle (22); the other end of the tension spring (23) is fixedly connected to the baffle (22).

Images