Chemical vapor deposition equipment
By setting up an air collecting hood in the chemical vapor deposition equipment to collect plasma air flow, the problem of uneven film thickness on the glass substrate is solved, and a more uniform coating effect and higher coating quality are achieved.
Patent Information
- Application Number
- CN202422234001.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-12
AI Technical Summary
During the coating process of existing chemical vapor deposition equipment, due to the top-down distribution of plasma gas flow, the film thickness on the glass substrate is uneven, affecting the coating quality.
A chemical vapor deposition device is designed, by setting an air collecting hood between the upper electrode and the lower electrode, forming an air collecting chamber, collecting gases ejected from the upper electrode, so as to make the plasma concentrations in each area on the glass substrate similar, thereby improving the uniformity of the film thickness.
Through the design of the air collector hood, the uniformity of film thickness on the glass substrate is achieved, the coating quality is improved, and the plasma gas escape is reduced, simplifying the cleaning process inside the equipment.
Smart Images
Figure CN223016962U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of display device manufacturing, and particularly relates to a chemical vapor deposition device. Background Art
[0002] With the development of semiconductor technology, plasma enhanced chemical vapor deposition (PECVD) devices are increasingly widely developed and used. This device uses glow discharge to ionize chemical gases and then form a thin film structure on a glass substrate. Referring to Figure 1 As shown, an existing chemical vapor deposition device includes a housing 1′, an upper electrode 2′, and a lower electrode 3′. Among them, a deposition chamber 11′ for accommodating a glass substrate 4′ is provided inside the housing 1′. The upper electrode 2′ is disposed at the top of the deposition chamber 11′, and the lower electrode 3′ is vertically movable and disposed at the bottom of the deposition chamber 11′. During deposition coating, the glass substrate 4′ is placed on the lower electrode 3′ and faces the upper electrode 2′ above. After the chemical gas is ionized, it is ejected downward through the air holes of the upper electrode 2′ to the surface of the glass substrate 4′ to form a thin film structure. At the same time, an air extraction device is provided at the bottom of the housing 1′, and the deposition chamber 11′ is evacuated by the air extraction device to discharge the exhausted gas after deposition.
[0003] The prior art has the following deficiencies: During coating, the plasma is ejected downward along the gas flow to the surface of the glass substrate 4′. Under the pumping action of the air extraction device, the plasma concentration in the area around the glass substrate 4′ is often lower than that in the middle area, resulting in uneven thickness of the thin film deposited on the glass substrate 4′, that is, the situation of thick in the middle and thin around, which affects the thin film deposition quality of the glass substrate 4′. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a chemical vapor deposition device, which can promote the plasma concentration in each area on the glass substrate to be similar, improve the uniformity of the thin film deposition thickness, and ensure the coating quality.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A chemical vapor deposition device provided includes:
[0007] A housing, a deposition chamber for coating a glass substrate is formed inside the housing;
[0008] An upper electrode, the upper electrode is disposed at the top of the deposition chamber;
[0009] A lower electrode, which is vertically movable and disposed at the bottom of the deposition chamber. The lower electrode has a bearing surface for carrying the glass substrate, and the bearing surface faces the upper electrode.
[0010] An air collecting hood, one end of which is connected to the periphery of the upper electrode, and the other end is selectively connected to the periphery of the lower electrode, so as to form an air collecting chamber between the upper electrode, the lower electrode and the air collecting hood. An air outlet hole is penetrated through the side wall of the air collecting hood, and the air outlet hole is located at one end of the air collecting hood close to the upper electrode.
[0011] As a preferred solution of the chemical vapor deposition equipment, the air collecting hood includes a lower frame, a hood body and a sealing ring. The air outlet hole is opened on the hood body. One end of the hood body is connected to the periphery of the upper electrode, and the other end is connected to the lower frame. The sealing ring is disposed at the bottom of the lower frame, and the sealing ring is used for abutting against the lower electrode.
[0012] As a preferred solution of the chemical vapor deposition equipment, there are a plurality of air outlet holes, and the plurality of air outlet holes are spaced apart along the circumferential direction of the hood body.
[0013] As a preferred solution of the chemical vapor deposition equipment, the air collecting hood further includes an upper frame. The upper frame includes a frame body and a reel disposed on the frame body. The frame body is connected to the periphery of the upper electrode, and the top end of the hood body is wound around the reel. The reel is used for driving the hood body to move up and down.
[0014] As a preferred solution of the chemical vapor deposition equipment, a storage cavity is formed in the frame body. The reel is rotatably disposed in the storage cavity. A through hole communicating with the storage cavity is opened at the bottom of the frame body. The hood body passes through the through hole.
[0015] As a preferred solution of the chemical vapor deposition equipment, both the upper frame and the lower frame are square frame structures.
[0016] As a preferred solution of the chemical vapor deposition equipment, the hood body includes four sub-hood bodies. The four sub-hood bodies are sequentially connected end to end to form the air collecting chamber. A notch is provided at the connection between two adjacent sub-hood bodies, and the notch penetrates through the top end of the hood body.
[0017] As a preferred solution of the chemical vapor deposition equipment, the frame body is detachably connected to the upper electrode through a fastener.
[0018] As a preferred solution of the chemical vapor deposition equipment, an annular groove is provided on the bearing surface of the lower electrode, and the annular groove is used for inserting the bottom end of the air collecting hood.
[0019] As a preferred solution of the chemical vapor deposition equipment, a plurality of support rods are telescopically arranged on the lower electrode, and the support rods are used to drive the glass substrate to approach or move away from the bearing surface.
[0020] Advantages of the present utility model compared with the prior art:
[0021] In a chemical vapor deposition equipment of the present utility model, by arranging a gas collecting hood between the upper electrode and the lower electrode, the gas ejected from the upper electrode can be collected in the gas collecting chamber, so that the plasma concentrations in various regions on the glass substrate located at the bottom of the gas collecting chamber are similar, so as to form a thin film structure with uniform thickness on the glass substrate to ensure the coating quality of the glass substrate. Moreover, since the gas containing plasma is concentrated inside the gas collecting hood, a large amount of gas containing plasma can be prevented from escaping to the side wall of the deposition chamber. After the coating is completed, cleaning gas can be introduced into the gas collecting hood to clean the deposited film on the inner wall of the gas collecting hood, or the gas collecting hood can be replaced regularly. This method is beneficial to reducing the difficulty of cleaning the residual film inside the entire chemical vapor deposition equipment. Description of the drawings
[0022] The present utility model will be further described in detail below with reference to the drawings and embodiments.
[0023] Figure 1 It is a schematic diagram of a chemical vapor deposition equipment in the prior art.
[0024] Figure 2 It is a schematic diagram of a chemical vapor deposition equipment according to Embodiment 1 of the present utility model.
[0025] Figure 3 It is a schematic diagram of a gas collecting hood according to Embodiment 1 of the present utility model.
[0026] Figure 4 It is a cross-sectional view of a gas collecting hood according to Embodiment 1 of the present utility model.
[0027] Figure 5 It is a schematic diagram of a chemical vapor deposition equipment in the first state according to Embodiment 1 of the present utility model.
[0028] Figure 6 It is a schematic diagram of a chemical vapor deposition equipment in the second state according to Embodiment 1 of the present utility model.
[0029] Figure 7 It is a schematic diagram of a chemical vapor deposition equipment according to Embodiment 2 of the present utility model.
[0030] Figure 8 It is an exploded view of a gas collecting hood according to Embodiment 2 of the present utility model.
[0031] Figure 9 For Figure 8Enlarged view of part A in
[0032] Figure 10 This is a cross-sectional view of the storage frame according to the second embodiment of the present utility model.
[0033] Figure 1 In which:
[0034] 1′, housing; 11′, deposition chamber; 2′, upper electrode; 3′, lower electrode; 4′, glass substrate;
[0035] Figures 2 to 10 In which:
[0036] 1, housing; 11, deposition chamber; 2, upper electrode; 3, lower electrode; 31, bearing surface; 4, gas collection hood; 40, gas collection chamber; 41, lower frame; 42, upper frame; 421, frame body; 422, storage cavity; 423, reel; 424, through hole; 43, cover body; 431, air outlet; 432, notch; 433, sub-cover body; 44, sealing ring; 5, base; 51, groove; 6, sleeve; 7, support rod; 8, lifting device; 9, glass substrate. Detailed implementation manners
[0037] Referring to the embodiments described in detail below in conjunction with the accompanying drawings, the advantages and features of the present utility model and the methods for realizing them will become apparent. However, the present utility model is not limited to the embodiments disclosed below, but can be implemented in various different forms. The provision of these embodiments is only for the purpose of completing the disclosure of the present utility model and enabling those skilled in the art to fully understand the scope of the present utility model, and the present utility model is only defined by the scope of the claims. The same reference numerals represent the same components throughout the specification.
[0038] Hereinafter, the present utility model will be described in detail with reference to the accompanying drawings.
[0039] Embodiment 1
[0040] As Figures 2 to 6As shown in the figure, a chemical vapor deposition device is provided for coating a glass substrate 9 to form a thin film structure on the glass substrate 9. The chemical vapor deposition device includes a housing 1, an upper electrode 2, a lower electrode 3, and a gas collection hood 4. Among them, the housing 1 is a hollow structure, and a deposition chamber 11 for coating the glass substrate 9 is formed inside the housing 1. The upper electrode 2 is arranged at the top of the deposition chamber 11, and the lower electrode 3 is arranged at the bottom of the deposition chamber 11. A lifting device 8 is connected to the bottom of the lower electrode 3. The lifting device 8 can be a hydraulic cylinder, a pneumatic cylinder, an electric telescopic member, etc., and the lower electrode 3 is driven to move up and down by the lifting device 8. The upper electrode 2 and the lower electrode 3 are prior arts. The upper electrode 2 and the lower electrode 3 are arranged parallel and spaced apart in the vertical direction. The lower electrode 3 has a bearing surface 31 for carrying the glass substrate 9. The bearing surface 31 is located at the top of the lower electrode 3 and faces the upper electrode 2. During the coating process, the glass substrate 9 is placed on the bearing surface 31 of the lower electrode 3. A heating wire is arranged inside the lower electrode 3 to heat the glass substrate 9 so that the temperature of the glass substrate 9 meets the process requirements. The upper electrode 2 inputs chemical gas into the deposition chamber 11. The upper electrode 2 is connected to a radio frequency current, and the lower electrode 3 is grounded. The chemical gas forms a plasma in the electric field and deposits on the glass substrate 9 to form a thin film structure. The top end of the gas collection hood 4 is connected to the periphery of the upper electrode 2, and the bottom end of the gas collection hood 4 is selectively connected to the periphery of the lower electrode 3. During the coating process, the bottom end of the gas collection hood 4 is connected to the lower electrode 3; when the coating process is not carried out, for example, when transporting the glass substrate 9, the bottom end of the gas collection hood 4 is separated from the lower electrode 3. When the bottom end of the gas collection hood 4 is connected to the lower electrode 3, a gas collection chamber 40 is formed between the upper electrode 2, the lower electrode 3, and the gas collection hood 4. During the coating process, the entire gas collection hood 4 surrounds the periphery of the glass substrate 9, so that the plasma-containing gas (hereinafter collectively referred to as gas) ejected from the upper electrode 2 is collected in the gas collection chamber 40. An air outlet hole 431 is formed through the side wall of the gas collection chamber 40, and the inside and outside of the gas collection chamber 40 are communicated through the air outlet hole 431. The air outlet hole 431 is located at one end of the gas collection hood 4 close to the upper electrode 2, and the gas in the gas collection chamber 40 can be discharged through the air outlet hole 431.
[0041] It can be understood that by arranging a gas collecting hood 4 between the upper electrode 2 and the lower electrode 3, the gas ejected from the upper electrode 2 can be gathered in the gas collecting chamber 40, so that the plasma concentrations in various regions on the glass substrate 9 at the bottom of the gas collecting chamber 40 are similar, in order to form a thin film structure with uniform thickness on the glass substrate 9 to ensure the coating quality of the glass substrate 9. The gas after participating in the coating process is finally discharged through the air outlet hole 431 near the top of the gas collecting hood 4. Moreover, since the gas containing plasma is concentrated inside the gas collecting hood 4, a large amount of gas containing plasma can be prevented from escaping to the side wall of the deposition chamber 11. After the coating is completed, cleaning gas can be introduced into the gas collecting hood 4 to clean the deposited film on the inner wall of the gas collecting hood 4, or the gas collecting hood 4 can be replaced regularly. This method is beneficial to reducing the difficulty of cleaning the residual film inside the entire chemical vapor deposition equipment.
[0042] Specifically, referring to Figure 3 and Figure 4 As shown, the gas collecting hood 4 is in an overall square cylinder structure. The length direction of the gas collecting hood 4 is the X direction shown in the figure, the width direction is the Y direction shown in the figure, and the height direction is the Z direction shown in the figure. The gas collecting hood 4 includes a lower frame 41, a hood body 43, and a sealing ring 44. The hood body 43 is in a square cylinder structure and is made of aluminum sheets. The axial direction of the hood body 43 is the Z direction shown in the figure. The air outlet hole 431 is opened on the hood body 43, and the air outlet hole 431 is located at one end of the hood body 43 close to the upper electrode 2. There are multiple air outlet holes 431, and the multiple air outlet holes 431 are distributed at intervals along the circumferential direction of the hood body 43. The air outlet hole 431 can be a square hole or a round hole. Along the axial direction of the hood body 43, the top end of the hood body 43 is connected to the circumference of the upper electrode 2. The connection method here includes direct connection and indirect connection. The direct connection means directly fixing one end of the hood body 43 on the upper electrode 2, and the indirect connection means installing it on the upper electrode 2 through other transitional components. For example, a sealing member is arranged between the hood body 43 and the upper electrode 2. The bottom end of the hood body 43 is fixedly connected to the lower frame 41. The sealing ring 44 has elasticity and can be made of silicone rubber material. The sealing ring 44 is arranged at the bottom of the lower frame 41. When the bottom end of the gas collecting hood 4 is connected to the lower electrode 3, the sealing ring 44 abuts against the lower electrode 3 to make the two in close contact and avoid air leakage.
[0043] Specifically, an annular groove (not shown in the figure) is arranged on the bearing surface 31 of the lower electrode 3. The shape of the annular groove is arranged to match the shape of the lower frame 41. When the gas collecting hood 4 is connected to the lower electrode 3, the bottom end of the gas collecting hood 4 (i.e., the lower frame 41) can be inserted into the annular groove. This method is beneficial to improving the connection stability between the gas collecting hood 4 and the lower electrode 3 and preventing the gas collecting hood 4 from swinging under the action of air flow.
[0044] Specifically, referring to Figure 2 、 Figure 5 and Figure 6As shown, the chemical vapor deposition equipment also includes a base 5, a sleeve 6 and a support rod 7. The base 5 is arranged at the bottom of the deposition chamber 11, and the base 5 is located below the lower electrode 3. A plurality of grooves 51 are arranged on one side of the base 5 facing the lower electrode 3. A plurality of sleeves 6 are arranged on one side of the lower electrode 3 facing the base 5, and the number and position of the sleeves 6 correspond to the grooves 51 one by one. When the lower electrode 3 moves downward, the end of the sleeve 6 away from the lower electrode 3 can be plugged into the groove 51. There are multiple support rods 7, and the number and position of the support rods 7 correspond to the sleeve 6 one by one. The support rod 7 is inserted through the sleeve 6 and the lower electrode 3, and the support rod 7 can slide relative to the lower electrode 3 and the sleeve 6 in the vertical direction. It can also be understood that the support rod 7 is telescopically arranged on the lower electrode 3. Of course, in some embodiments, the sleeve 6 can also be eliminated, and the support rod 7 can be directly telescopically arranged on the lower electrode 3. Through the telescopic movement of the support rod 7, the glass substrate 9 is driven to approach or move away from the bearing surface 31 of the lower electrode 3.
[0045] The chemical vapor deposition device has a first state and a second state. In the first state, the lower electrode 3 is connected to the gas collecting hood 4. In this state, the chemical vapor deposition device performs a coating process on the glass substrate 9. In the second state, the lower electrode 3 is separated from the gas collecting hood 4. In this state, the glass substrate 9 can be transported into or out of the deposition chamber 11 by a manipulator. Specifically, during the coating process, the lifting device 8 drives the lower electrode 3 to rise, the support rod 7 is separated from the base 5 and moves downward under the action of its own gravity, and the glass substrate 9 loses the support of the support rod 7 and is placed on the bearing surface 31 of the lower electrode 3. The lower electrode 3 abuts against the bottom end of the gas collecting hood 4, so that the glass substrate 9 is located in the gas collecting chamber 40. The glass substrate 9 is then subjected to a coating process. After the coating process is completed, the lifting device 8 drives the lower electrode 3 to descend, and the lower electrode 3 is separated from the bottom end of the gas collecting hood 4. The lower electrode 3 continues to descend, and the sleeve 6 is inserted into the groove 51 of the base 5. At the same time, the bottom end of the support rod 7 abuts against the base 5, and the support rod 7 moves upward relative to the lower electrode 3. At this time, the support rod 7 lifts up the glass substrate 9 so that the glass substrate 9 is spaced apart from the carrying surface 31. Then, the glass substrate 9 can be clamped and transported by a robot.
[0046] Embodiment 2
[0047] like Figures 7 to 10As shown in the figure, a chemical vapor deposition device provided in this embodiment has a structure similar to that of the first embodiment, except that: the gas collection hood 4 further includes an upper frame 42. The upper frame 42 includes a frame body 421 and a reel 423. Both the upper frame 42 and the lower frame 41 are square frame structures to adapt to the overall shape of the upper electrode 2 and the lower electrode 3. It should be noted that both the upper electrode 2 and the lower electrode 3 are rectangular parallelepiped structures. A storage cavity 422 is formed inside the upper frame 42, and the reel 423 is rotatably arranged in the storage cavity 422. The reel 423 is drivingly connected to a motor to drive the reel 423 to rotate through the motor. A through hole 424 is provided at the bottom of the frame body 421, and the storage cavity 422 communicates with the outside of the frame body 421 through the through hole 424. The top end of the hood body 43 passes through the through hole 424 and is wound around the reel 423. The rotation of the reel 423 is used to drive the lifting movement of the hood body 43. After the film coating is completed, the reel 423 rotates to wind a part of the hood body 43 around the reel 423. At this time, the lower frame 41 moves upward accordingly to increase the distance between the gas collection hood 4 and the lower electrode 3, meeting the space requirements for the manipulator to transport the glass substrate 9.
[0048] Specifically, referring to Figure 8 and Figure 9 As shown in the figure, through holes 424 are correspondingly provided on both the two length sides and the two width sides of the upper frame 42. The through holes 424 are long holes, and the length directions of the through holes 424 extend along the length sides or the width sides respectively. A reel 423 is arranged in each through hole 424. Correspondingly, the hood body 43 includes four sub-hood bodies 433, and the four sub-hood bodies 433 are sequentially connected end to end to enclose a gas collection chamber 40. A notch 432 is provided at the connection part of two adjacent sub-hood bodies 433 (i.e., the corner of the hood body 43), and the length of the notch 432 extends along the height direction of the gas collection hood 4. One end of the notch 432 penetrates the top end of the hood body 43. This structure makes the top area of the hood body 43 not connected as a whole, and enables the top ends of the four sub-hood bodies 433 to respectively pass through the corresponding through holes 424 and be connected to the reels 423 on each side of the upper frame 42.
[0049] Specifically, the frame body 421 is detachably connected to the periphery of the upper electrode 2 through fasteners. The fasteners can be common standard parts such as screws and bolts. The frame body 421 and the upper electrode 2 are set as a detachable structure to facilitate the removal of the entire gas collection hood 4 for replacement, cleaning, etc., and to prevent the residual film on the gas collection hood 4 from falling onto the glass substrate 9.
[0050] Although the embodiments of the present utility model have been described above with reference to the accompanying drawings, the present utility model is not limited to the above embodiments, but can be manufactured in various forms, and those skilled in the art will understand that the present utility model can be implemented in other specific forms without changing the technical spirit or basic features of the present utility model. Therefore, it should be understood that the above embodiments are exemplary in all aspects and not restrictive.
Claims
1. A chemical vapor deposition device, characterized in that: include: A housing, wherein a deposition chamber for coating a glass substrate is formed in the housing; An upper electrode, the upper electrode being disposed on the top of the deposition chamber; A lower electrode, the lower electrode is arranged at the bottom of the deposition chamber in a liftable manner, the lower electrode having a carrying surface for carrying the glass substrate, the carrying surface facing the upper electrode; A gas collecting hood, one end of which is connected to the periphery of the upper electrode, and the other end is selectively connected to the periphery of the lower electrode, so that a gas collecting chamber is surrounded by the upper electrode, the lower electrode and the gas collecting hood, and a gas outlet hole is opened through the side wall of the gas collecting hood, and the gas outlet hole is located at one end of the gas collecting hood close to the upper electrode.
2. The chemical vapor deposition equipment according to claim 1, characterized in that: The gas collecting hood includes a lower frame, a hood body and a sealing ring. The air outlet is opened on the hood body. One end of the hood body is connected to the periphery of the upper electrode, and the other end is connected to the lower frame. The sealing ring is arranged at the bottom of the lower frame, and the sealing ring is used to abut against the lower electrode.
3. The chemical vapor deposition equipment according to claim 2, characterized in that: There are a plurality of air outlet holes, and the plurality of air outlet holes are distributed at intervals along the circumference of the cover body.
4. The chemical vapor deposition equipment according to claim 2, characterized in that: The gas collecting hood also includes an upper frame, which includes a frame body and a reel arranged on the frame body, the frame body is connected to the periphery of the upper electrode, the top end of the hood body is wound on the reel, and the reel is used to drive the hood body to move up and down.
5. The chemical vapor deposition equipment according to claim 4, characterized in that: A storage cavity is formed in the frame body, the reel is rotatably disposed in the storage cavity, a through hole communicating with the storage cavity is opened at the bottom of the frame body, and the cover body is penetrated through the through hole.
6. The chemical vapor deposition equipment according to claim 4, characterized in that: The upper frame and the lower frame are both square frame structures.
7. The chemical vapor deposition equipment according to claim 4, characterized in that: The cover body comprises four sub-cover bodies, which are connected in sequence to enclose the gas collecting chamber, and a notch is arranged at the connection between two adjacent sub-cover bodies, and the notch passes through the top of the cover body.
8. The chemical vapor deposition equipment according to claim 4, characterized in that: The frame body is detachably connected to the upper electrode via a fastener.
9. The chemical vapor deposition apparatus according to any one of claims 1 to 8, characterized in that: An annular groove is arranged on the bearing surface of the lower electrode, and the annular groove is used for plugging with the bottom end of the gas collecting hood.
10. The chemical vapor deposition device according to any one of claims 1 to 8, characterized in that: A plurality of support rods are retractably disposed on the lower electrode, and the support rods are used to drive the glass substrate to approach or move away from the carrying surface.